CN105358734B - 溅镀靶材 - Google Patents
溅镀靶材 Download PDFInfo
- Publication number
- CN105358734B CN105358734B CN201580001209.2A CN201580001209A CN105358734B CN 105358734 B CN105358734 B CN 105358734B CN 201580001209 A CN201580001209 A CN 201580001209A CN 105358734 B CN105358734 B CN 105358734B
- Authority
- CN
- China
- Prior art keywords
- copper
- sputtered target
- powder
- target material
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 239000013077 target material Substances 0.000 title claims abstract description 71
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 114
- 239000010949 copper Substances 0.000 claims abstract description 108
- 229910052802 copper Inorganic materials 0.000 claims abstract description 102
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 50
- 239000001301 oxygen Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000000843 powder Substances 0.000 claims description 68
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 238000005245 sintering Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 21
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 18
- 229910000431 copper oxide Inorganic materials 0.000 claims description 15
- 229960004643 cupric oxide Drugs 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 239000005751 Copper oxide Substances 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 9
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 9
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 claims description 8
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 229910000905 alloy phase Inorganic materials 0.000 claims description 3
- 229910002064 alloy oxide Inorganic materials 0.000 claims 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000010408 film Substances 0.000 description 34
- 239000010410 layer Substances 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 16
- 239000002994 raw material Substances 0.000 description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000010304 firing Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000000803 paradoxical effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 241001596784 Pegasus Species 0.000 description 1
- OLBVUFHMDRJKTK-UHFFFAOYSA-N [N].[O] Chemical compound [N].[O] OLBVUFHMDRJKTK-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000009867 copper metallurgy Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000012856 weighed raw material Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014096515 | 2014-05-08 | ||
| JP2014-096515 | 2014-05-08 | ||
| PCT/JP2015/060441 WO2015170534A1 (ja) | 2014-05-08 | 2015-04-02 | スパッタリングターゲット材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105358734A CN105358734A (zh) | 2016-02-24 |
| CN105358734B true CN105358734B (zh) | 2017-03-29 |
Family
ID=54392387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580001209.2A Active CN105358734B (zh) | 2014-05-08 | 2015-04-02 | 溅镀靶材 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5808513B1 (ko) |
| KR (1) | KR20160017101A (ko) |
| CN (1) | CN105358734B (ko) |
| TW (1) | TWI525208B (ko) |
| WO (1) | WO2015170534A1 (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6876268B2 (ja) * | 2016-03-22 | 2021-05-26 | 三菱マテリアル株式会社 | スパッタリングターゲット |
| WO2017164168A1 (ja) * | 2016-03-22 | 2017-09-28 | 三菱マテリアル株式会社 | スパッタリングターゲット |
| JP6932908B2 (ja) * | 2016-09-26 | 2021-09-08 | 住友金属鉱山株式会社 | 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法 |
| WO2018159753A1 (ja) * | 2017-03-01 | 2018-09-07 | 三菱マテリアル株式会社 | スパッタリングターゲット及びスパッタリングターゲットの製造方法 |
| JP6447761B2 (ja) * | 2017-03-01 | 2019-01-09 | 三菱マテリアル株式会社 | スパッタリングターゲット及びスパッタリングターゲットの製造方法 |
| JP6533805B2 (ja) * | 2017-03-31 | 2019-06-19 | Ｊｘ金属株式会社 | スパッタリングターゲット、スパッタリングターゲットの製造方法、非晶質膜、非晶質膜の製造方法、結晶質膜及び結晶質膜の製造方法 |
| WO2019167564A1 (ja) * | 2018-03-01 | 2019-09-06 | 三菱マテリアル株式会社 | Ｃｕ－Ｎｉ合金スパッタリングターゲット |
| JP6627993B2 (ja) * | 2018-03-01 | 2020-01-08 | 三菱マテリアル株式会社 | Ｃｕ−Ｎｉ合金スパッタリングターゲット |
| JP6853440B2 (ja) * | 2019-03-11 | 2021-03-31 | 三菱マテリアル株式会社 | 金属銅及び酸化銅含有粉、金属銅及び酸化銅含有粉の製造方法、及び、スパッタリングターゲット材、スパッタリングターゲット材の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3779856B2 (ja) * | 2000-04-10 | 2006-05-31 | 株式会社日鉱マテリアルズ | 光ディスク保護膜形成用スパッタリングターゲット |
| JP2010030824A (ja) * | 2008-07-28 | 2010-02-12 | Idemitsu Kosan Co Ltd | 金属相含有酸化インジウム焼結体及びその製造方法 |
| JP2010077530A (ja) * | 2008-08-26 | 2010-04-08 | Hitachi Metals Ltd | スパッタリングターゲットの製造方法及びスパタリングターゲット |
| JP2011084754A (ja) * | 2009-10-13 | 2011-04-28 | Hitachi Metals Ltd | スパッタリングターゲットの製造方法 |
| JP5641402B2 (ja) * | 2010-02-01 | 2014-12-17 | 学校法人 龍谷大学 | 酸化物膜及びその製造方法、並びにターゲット及び酸化物焼結体の製造方法 |
-
2015
- 2015-04-02 CN CN201580001209.2A patent/CN105358734B/zh active Active
- 2015-04-02 WO PCT/JP2015/060441 patent/WO2015170534A1/ja active Application Filing
- 2015-04-02 JP JP2015533359A patent/JP5808513B1/ja active Active
- 2015-04-02 KR KR1020167001775A patent/KR20160017101A/ko not_active Application Discontinuation
- 2015-04-30 TW TW104113853A patent/TWI525208B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201542849A (zh) | 2015-11-16 |
| JPWO2015170534A1 (ja) | 2017-04-20 |
| JP5808513B1 (ja) | 2015-11-10 |
| CN105358734A (zh) | 2016-02-24 |
| TWI525208B (zh) | 2016-03-11 |
| WO2015170534A1 (ja) | 2015-11-12 |
| KR20160017101A (ko) | 2016-02-15 |
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