CN105339429B - 用于电路的柔性白色反光电介质 - Google Patents

用于电路的柔性白色反光电介质 Download PDF

Info

Publication number
CN105339429B
CN105339429B CN201480037386.1A CN201480037386A CN105339429B CN 105339429 B CN105339429 B CN 105339429B CN 201480037386 A CN201480037386 A CN 201480037386A CN 105339429 B CN105339429 B CN 105339429B
Authority
CN
China
Prior art keywords
weight
white reflection
organic media
thick film
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480037386.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN105339429A (zh
Inventor
J·R·多尔夫曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celanese Mercury Holdings Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN105339429A publication Critical patent/CN105339429A/zh
Application granted granted Critical
Publication of CN105339429B publication Critical patent/CN105339429B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960705—Safety of capacitive touch and proximity switches, e.g. increasing reliability, fail-safe
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Led Device Packages (AREA)
CN201480037386.1A 2013-07-31 2014-07-30 用于电路的柔性白色反光电介质 Active CN105339429B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361860293P 2013-07-31 2013-07-31
US61/860,293 2013-07-31
PCT/US2014/048770 WO2015017490A1 (en) 2013-07-31 2014-07-30 Flexible white reflective dielectric for electronic circuits

Publications (2)

Publication Number Publication Date
CN105339429A CN105339429A (zh) 2016-02-17
CN105339429B true CN105339429B (zh) 2019-01-22

Family

ID=51301369

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480037386.1A Active CN105339429B (zh) 2013-07-31 2014-07-30 用于电路的柔性白色反光电介质

Country Status (6)

Country Link
US (2) US9303828B2 (https=)
EP (1) EP3027687B1 (https=)
JP (1) JP2016528346A (https=)
CN (1) CN105339429B (https=)
TW (1) TW201510073A (https=)
WO (1) WO2015017490A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9685270B2 (en) * 2014-07-07 2017-06-20 E I Du Pont De Nemours And Company High K dielectric composition for thermoformable capacitive circuits

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083606A (en) * 1997-04-25 2000-07-04 Tdk Corporation Lapping tape
CN101379161A (zh) * 2006-02-01 2009-03-04 徐光锡 碱性溶液可清洗的抗静电组合物和使用其而制得的聚合物产品
WO2012141124A1 (ja) * 2011-04-13 2012-10-18 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物及びそれらを用いたプリント配線板
US20130068512A1 (en) * 2011-09-20 2013-03-21 Ei Du Pont De Nemours And Company Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000094343A (ja) * 1998-09-28 2000-04-04 Fuji Photo Film Co Ltd 研磨体
JP3083817B1 (ja) * 1999-05-14 2000-09-04 株式会社ティ−アンドケイ東華 印刷インキ組成物
JP3167694B2 (ja) * 1999-06-18 2001-05-21 株式会社ティ−アンドケイ東華 印刷インキ組成物
JP2005132871A (ja) * 2003-10-28 2005-05-26 Three M Innovative Properties Co ポリカプロラクトンジオールを含有するインク塗料及び装飾用フィルム
US20090169724A1 (en) * 2007-12-27 2009-07-02 Toshiaki Ogiwara Conductive paste for use in membrane touch switch applications
US8207261B2 (en) * 2009-03-25 2012-06-26 E.I. Du Pont De Nemours And Company Plastic articles, optionally with partial metal coating
JP2010031297A (ja) 2009-11-16 2010-02-12 Kansai Paint Co Ltd 耐食性に優れた塗料組成物
JP2013053243A (ja) 2011-09-05 2013-03-21 Dic Corp 硬化性表面コーティング組成物、積層ポリエステル樹脂フィルム及び太陽電池バックシート
JP5887106B2 (ja) * 2011-11-15 2016-03-16 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083606A (en) * 1997-04-25 2000-07-04 Tdk Corporation Lapping tape
CN101379161A (zh) * 2006-02-01 2009-03-04 徐光锡 碱性溶液可清洗的抗静电组合物和使用其而制得的聚合物产品
WO2012141124A1 (ja) * 2011-04-13 2012-10-18 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化物及びそれらを用いたプリント配線板
US20130068512A1 (en) * 2011-09-20 2013-03-21 Ei Du Pont De Nemours And Company Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits

Also Published As

Publication number Publication date
JP2016528346A (ja) 2016-09-15
TW201510073A (zh) 2015-03-16
US20160169457A1 (en) 2016-06-16
US9303828B2 (en) 2016-04-05
US20150038638A1 (en) 2015-02-05
US9574720B2 (en) 2017-02-21
EP3027687B1 (en) 2021-07-14
WO2015017490A1 (en) 2015-02-05
CN105339429A (zh) 2016-02-17
EP3027687A1 (en) 2016-06-08

Similar Documents

Publication Publication Date Title
US9540551B2 (en) Heat-curable polyorganosiloxane composition and use thereof
TWI729149B (zh) 透明導電性膜及觸控面板
CN105339429B (zh) 用于电路的柔性白色反光电介质
TWI536876B (zh) 電路板及其製作方法
JP6553705B2 (ja) 熱成形可能容量性回路のための高ｋ誘電組成物
JP6125905B2 (ja) 熱形成性回路のための水分障壁層誘電体
JP6568100B2 (ja) 触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用
JP6523280B2 (ja) 熱成形可能回路のための熱伝導性誘電体
TW202103931A (zh) 耐高溫且抗硫化之銀反射膜結構
TW201527406A (zh) 光硬化性樹脂組成物及使用其而成之光硬化性樹脂組成物製片材
KR20140137845A (ko) 보호필름의 점착제 조성물
KR102034445B1 (ko) 적층체
TWM591916U (zh) 耐高溫且抗硫化之銀反射膜結構
KR20150087079A (ko) 고투명 폴리에틸렌나프탈레이트(pen) 기판 및 그 제조방법
JP2018079584A (ja) 透明導電性フィルムおよびタッチパネル
WO2017213046A1 (ja) 透明導電性フィルムおよびタッチパネル

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20221116

Address after: Delaware

Patentee after: DuPont Electronics

Address before: Delaware

Patentee before: E.I. Nemours DuPont

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20250508

Address after: Delaware, USA

Patentee after: dupont china Ltd.

Country or region after: U.S.A.

Address before: Delaware, USA

Patentee before: DuPont Electronics

Country or region before: U.S.A.

TR01 Transfer of patent right