JP6568100B2 - 触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 - Google Patents
触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 Download PDFInfo
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- JP6568100B2 JP6568100B2 JP2016559295A JP2016559295A JP6568100B2 JP 6568100 B2 JP6568100 B2 JP 6568100B2 JP 2016559295 A JP2016559295 A JP 2016559295A JP 2016559295 A JP2016559295 A JP 2016559295A JP 6568100 B2 JP6568100 B2 JP 6568100B2
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- thick film
- conductive composition
- electrical circuit
- weight
- film conductive
- Prior art date
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Classifications
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-
- H—ELECTRICITY
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- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
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- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/96062—Touch switches with tactile or haptic feedback
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
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Description
(a)インジウムスズ酸化物粉末、アンチモンスズ酸化物粉末およびそれらの混合物からなる群から選択される導電性酸化物粉末10〜70重量%と、
(b)第1の有機溶剤に溶解された10〜50重量%の熱可塑性ウレタン樹脂を含む第1の有機媒体10〜50重量%(熱可塑性ウレタン樹脂の重量パーセントが第1の有機媒体の全重量に基づいている)と、
(c)第2の有機溶剤に溶解された10〜50重量%の熱可塑性ポリヒドロキシエーテル樹脂を含む第2の有機媒体10〜50重量%(熱可塑性ポリヒドロキシエーテル樹脂の重量パーセントが第2の有機媒体の全重量に基づいている)と、
(d)第3の有機溶剤中に少なくとも1つの電気活性ポリマーを含む第3の有機媒体10〜50重量%とを含む触覚応答機能を有する第1のポリマー厚膜透明導電性組成物に関し、
導電性充填剤、第1の有機媒体、第2の有機媒体および第3の有機媒体の重量パーセントは、ポリマー厚膜導電性組成物の全重量に基づいている。
(e)第4の有機溶剤1〜20重量%をさらに含み、第4の有機溶剤はジアセトンアルコールであり、重量パーセントはポリマー厚膜導電性組成物の全重量に基づいている。
(a)インジウムスズ酸化物粉末、アンチモンスズ酸化物粉末およびそれらの混合物からなる群から選択される導電性酸化物粉末10〜70重量%と、
(b)第1の有機溶剤に溶解された10〜50重量%の熱可塑性ウレタン樹脂を含む第1の有機媒体10〜50重量%(熱可塑性ウレタン樹脂の重量パーセントが第1の有機媒体の全重量に基づいている)と、
(c)第2の有機溶剤中に少なくとも1つの電気活性ポリマーを含む第2の有機媒体10〜50重量%とを含む触覚応答を有する第2のポリマー厚膜透明導電性組成物に関し、
導電性充填剤、第1の有機媒体および第2の有機媒体の重量パーセントは、ポリマー厚膜導電性組成物の全重量に基づいている。
(d)第3の有機溶剤1〜20重量%をさらに含み、第3の有機溶剤がジアセトンアルコールであり、重量パーセントは、ポリマー厚膜導電性組成物の全重量に基づいている。
当該厚膜組成物中の導体は、ITO粉末、ATO粉末、またはそれらの混合物である。粉末粒子の様々な粒径および形状が考えられる。実施形態において、導電性粉末粒子は、球状粒子、フレーク、棒状体、円錐体、板状体、およびそれらの混合物など、任意の形状を包含してもよい。一実施形態において、ITOはフレークの形態である。
触覚応答を有する第1のポリマー厚膜透明導電性組成物
第1の有機媒体は、第1の有機溶剤中に溶解された熱可塑性ウレタン樹脂からなる。ウレタン樹脂は、下地基材に対する十分な接着性を達成しなければならない。それは、熱成形後に回路の性能に適合しなければならず、それに悪影響を与えてはならない。
第1の有機媒体は、第1の有機溶剤中に溶解された熱可塑性ウレタン樹脂からなる。ウレタン樹脂は、下地基材に対する十分な接着性を達成しなければならない。それは、熱成形後に回路の性能に適合しなければならず、それに悪影響を与えてはならない。
他の実施形態において第1および第2のポリマー厚膜透明導電性組成物は、別の有機溶剤、ジアセトンアルコールをさらに含む。一実施形態においてジアセトンアルコールはPTF導電性組成物の全重量の1〜20重量%である。別の実施形態においてジアセトンアルコールはPTF導電性組成物の全重量の3〜12重量%であり、さらに別の実施形態においてジアセトンアルコールはPTF導電性組成物の全重量の4〜6重量%である。
様々な粉末をPTF導体組成物に添加して接着性を改良し、レオロジーを変え、低剪断粘度を増加させ、それによって印刷適性を改良してもよい。
「ペースト」とも称される、PTF導体は典型的に、ガスおよび湿気に対して不透質である、ポリカーボネートなどの基材上に堆積される。また、基材は、プラスチックシートとその上に堆積される任意選択の金属または誘電体層との組合せから構成される複合材料のシートであり得る。また、透明導体が、DuPont 5042または5043(DuPont Co.,Wilmington,DE)などの熱成形可能なAg導体の上に、または熱成形可能な誘電体層の上に堆積されてもよい。あるいは、熱成形可能なAg導体が、透明導体の上に形成されてもよい。
容量性スイッチ回路については使用される基礎基材は典型的に、厚さ10ミルのポリカーボネートである。導体組成物を上に記載された条件の通りに印刷し、乾燥させた。いくつかの層を印刷して乾燥させることができる。後続の工程は、ユニット全体を熱成形(190℃、750psi)する工程を包含してもよく、それは3D容量性スイッチ回路の製造において典型的である。一実施形態において、乾燥されたPTF導電性組成物、すなわち、透明導体の上に封入層が堆積され、次に、乾燥される。
Claims (14)
- 触覚応答を有する透明導体を含む電気回路であって、
前記透明導体が、触覚応答機能を有するポリマー厚膜導電性組成物から形成され、
前記ポリマー厚膜導電性組成物が、
(a)インジウムスズ酸化物粉末、アンチモンスズ酸化物粉末およびそれらの混合物からなる群から選択される導電性酸化物粉末10〜70重量%と、
(b)第1の有機溶剤に溶解された10〜50重量%の熱可塑性ウレタン樹脂を含む、第1の有機媒体10〜50重量%(前記熱可塑性ウレタン樹脂の重量パーセントが前記第1の有機媒体の全重量に基づく)と、
(c)第2の有機溶剤に溶解された10〜50重量%の熱可塑性ポリヒドロキシエーテル樹脂を含む第2の有機媒体10〜50重量%(前記熱可塑性ポリヒドロキシエーテル樹脂の重量パーセントが前記第2の有機媒体の全重量に基づく)と、
(d)第3の有機溶剤中に少なくとも1の電気活性ポリマーを含む第3の有機媒体10〜50重量%と、を含み、
前記導電性酸化物粉末、前記第1の有機媒体、前記第2の有機媒体および前記第3の有機媒体の重量パーセントが前記ポリマー厚膜導電性組成物の全重量に基づいており、
前記ポリマー厚膜導電性組成物が乾燥されて前記透明導体を形成する、電気回路。 - 封入剤層をさらに含む、請求項1に記載の電気回路であって、
前記封入剤層が、
(i)前記ポリマー厚膜導電性組成物の第1および第2の有機媒体中に存在するのと同じポリマーを、同じ比または異なった比で含む、乾燥された封入剤層(前記封入剤層が堆積および乾燥される前に、前記ポリマー厚膜導電性組成物が乾燥される)、および
(ii)1または複数の紫外線硬化性ポリマーを含む紫外線硬化された封入剤層(前記封入剤層が堆積および紫外線硬化される前に、前記ポリマー厚膜導電性組成物が乾燥される)、からなる群から選択される、電気回路。 - 熱成形可能な銀導体をさらに含む、請求項1に記載の電気回路であって、
前記透明導体が、前記熱成形可能な銀導体上に形成されているか、または、前記ポリマー厚膜導電性組成物を乾燥させて前記透明導体を形成した後、前記熱成形可能な銀導体が前記透明導体の上に形成される、電気回路。 - 熱成形可能な銀導体をさらに含む、請求項2に記載の電気回路であって、
前記透明導体が、前記熱成形可能な銀導体上に形成されており、
前記封入剤層が前記透明導体上に堆積されるか、または、前記ポリマー厚膜導電性組成物を乾燥させて前記透明導体を形成した後、前記封入剤層が前記熱成形可能な銀導体上に堆積される前に、前記熱成形可能な銀導体が前記透明導体の上に形成される、電気回路。 - 前記ポリマー厚膜導電性組成物が
(e)第4の有機溶剤1〜20重量%をさらに含み、
前記第4の有機溶剤がジアセトンアルコールであり、
前記重量パーセントが、前記ポリマー厚膜導電性組成物の全重量に基づいている、請求項1〜4のいずれか一項に記載の電気回路。 - 前記電気回路が熱成形される、請求項5に記載の電気回路。
- 前記電気回路が、熱成形された後に、射出成形法に供せられる、請求項6に記載の電気回路。
- 触覚応答を有する透明導体を含む電気回路であって、
前記透明導体が、触覚応答機能を有するポリマー厚膜導電性組成物から形成され、
前記ポリマー厚膜導電性組成物が、
(a)インジウムスズ酸化物粉末、アンチモンスズ酸化物粉末およびそれらの混合物からなる群から選択される導電性酸化物粉末10〜70重量%と、
(b)第1の有機溶剤に溶解された10〜50重量%の熱可塑性ウレタン樹脂を含む第1の有機媒体10〜50重量%(前記熱可塑性ウレタン樹脂の重量パーセントが前記第1の有機媒体の全重量に基づく)と、
(c)第2の有機溶剤中に少なくとも1の電気活性ポリマーを含む第2の有機媒体10〜50重量%と、を含み、
前記導電性酸化物粉末、前記第1の有機媒体および前記第2の有機媒体の重量パーセントが、前記ポリマー厚膜導電性組成物の全重量に基づいており、
前記ポリマー厚膜導電性組成物が乾燥されて前記透明導体を形成する、電気回路。 - 封入剤層をさらに含む、請求項8に記載の電気回路であって、
前記封入剤層が、
(i)前記ポリマー厚膜導電性組成物の前記第1の有機媒体中に存在するのと同じポリマーを含む乾燥された封入剤層(前記封入剤層が堆積および乾燥される前に、前記ポリマー厚膜導電性組成物が乾燥される)、および
(ii)1または複数の紫外線硬化性ポリマーを含む紫外線硬化された封入剤層(前記封入剤層が堆積および紫外線硬化される前に、前記ポリマー厚膜導電性組成物が乾燥される)、からなる群から選択される、電気回路。 - 熱成形可能な銀導体をさらに含む、請求項8に記載の電気回路であって、
前記透明導体が、前記熱成形可能な銀導体上に形成されているか、または、前記ポリマー厚膜導電性組成物を乾燥させて前記透明導体を形成した後、前記熱成形可能な銀導体が前記透明導体の上に形成される、電気回路。 - 熱成形可能な銀導体をさらに含む、請求項9に記載の電気回路であって、
前記透明導体が、前記熱成形可能な銀導体上に形成されており、
前記封入剤層が前記透明導体上に堆積されるか、または、前記ポリマー厚膜導電性組成物を乾燥させて前記透明導体を形成した後、前記封入剤層が前記熱成形可能な銀導体上に堆積される前に、前記熱成形可能な銀導体が前記透明導体の上に形成される、電気回路。 - 前記ポリマー厚膜導電性組成物が、
(d)第3の有機溶剤1〜20重量%、をさらに含み、
前記第3の有機溶剤がジアセトンアルコールであり、
前記重量パーセントが前記ポリマー厚膜導電性組成物の全重量に基づいている、請求項8〜11のいずれか一項に記載の電気回路。 - 前記電気回路が熱成形されている、請求項12に記載の電気回路。
- 前記電気回路が、熱成形された後に、射出成形法に供せられる、請求項13に記載の電気回路。
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2015
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CN106459577A (zh) | 2017-02-22 |
CN106133059A (zh) | 2016-11-16 |
US9779851B2 (en) | 2017-10-03 |
WO2015148263A1 (en) | 2015-10-01 |
CN106459577B (zh) | 2019-07-23 |
US20150279508A1 (en) | 2015-10-01 |
JP2017516877A (ja) | 2017-06-22 |
EP3123482A1 (en) | 2017-02-01 |
WO2015148264A1 (en) | 2015-10-01 |
CN106133059B (zh) | 2019-07-23 |
EP3123482B1 (en) | 2018-10-03 |
EP3123481B1 (en) | 2018-09-12 |
JP2017520879A (ja) | 2017-07-27 |
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