JP2017516877A - 触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 - Google Patents
触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 Download PDFInfo
- Publication number
- JP2017516877A JP2017516877A JP2016559219A JP2016559219A JP2017516877A JP 2017516877 A JP2017516877 A JP 2017516877A JP 2016559219 A JP2016559219 A JP 2016559219A JP 2016559219 A JP2016559219 A JP 2016559219A JP 2017516877 A JP2017516877 A JP 2017516877A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- weight
- conductive composition
- polymer thick
- organic medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/12—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor of articles having inserts or reinforcements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2231—Oxides; Hydroxides of metals of tin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/96015—Constructional details for touch switches
- H03K2217/96019—Constructional details for touch switches using conductive paint
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/96062—Touch switches with tactile or haptic feedback
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960755—Constructional details of capacitive touch and proximity switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31605—Next to free metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
Abstract
Description
(a)インジウムスズ酸化物粉末、アンチモンスズ酸化物粉末およびそれらの混合物からなる群から選択される導電性酸化物粉末10〜70重量%と、
(b)第1の有機溶剤に溶解された10〜50重量%の熱可塑性ウレタン樹脂を含む第1の有機媒体10〜50重量%(熱可塑性ウレタン樹脂の重量パーセントが第1の有機媒体の全重量に基づいている)と、
(c)第2の有機溶剤に溶解された10〜50重量%の熱可塑性ポリヒドロキシエーテル樹脂を含む第2の有機媒体10〜50重量%(熱可塑性ポリヒドロキシエーテル樹脂の重量パーセントが第2の有機媒体の全重量に基づいている)と、
(d)第3の有機溶剤中に少なくとも1つの電気活性ポリマーを含む第3の有機媒体10〜50重量%と、を含む触覚応答機能を有する第1のポリマー厚膜透明導電性組成物に関し、
導電性充填剤、第1の有機媒体、第2の有機媒体および第3の有機媒体の重量パーセントは、ポリマー厚膜導電性組成物の全重量に基づいている。
(e)第4の有機溶剤1〜20重量%をさらに含み、第4の有機溶剤はジアセトンアルコールであり、重量パーセントはポリマー厚膜導電性組成物の全重量に基づいている。
(a)インジウムスズ酸化物粉末、アンチモンスズ酸化物粉末およびそれらの混合物からなる群から選択される導電性酸化物粉末10〜70重量%と、
(b)第1の有機溶剤に溶解された10〜50重量%の熱可塑性ウレタン樹脂を含む第1の有機媒体10〜50重量%(熱可塑性ウレタン樹脂の重量パーセントが第1の有機媒体の全重量に基づいている)と、
(c)第2の有機溶剤中に少なくとも1つの電気活性ポリマーを含む第2の有機媒体10〜50重量%と、を含む触覚応答を有する第2のポリマー厚膜透明導電性組成物に関し、
導電性充填剤、第1の有機媒体および第2の有機媒体の重量パーセントは、ポリマー厚膜導電性組成物の全重量に基づいている。
(d)第3の有機溶剤1〜20重量%をさらに含み、第3の有機溶剤がジアセトンアルコールであり、重量パーセントは、ポリマー厚膜導電性組成物の全重量に基づいている。
当該厚膜組成物中の導体は、ITO粉末、ATO粉末、またはそれらの混合物である。粉末粒子の様々な粒径および形状が考えられる。実施形態において、導電性粉末粒子は、球状粒子、フレーク、棒状体、円錐体、板状体、およびそれらの混合物など、任意の形状を包含してもよい。一実施形態において、ITOはフレークの形態である。
触覚応答を有する第1のポリマー厚膜透明導電性組成物
第1の有機媒体は、第1の有機溶剤中に溶解された熱可塑性ウレタン樹脂からなる。ウレタン樹脂は、下地基材に対する十分な接着性を達成しなければならない。それは、熱成形後に回路の性能に適合しなければならず、それに悪影響を与えてはならない。
第1の有機媒体は、第1の有機溶剤中に溶解された熱可塑性ウレタン樹脂からなる。ウレタン樹脂は、下地基材に対する十分な接着性を達成しなければならない。それは、熱成形後に回路の性能に適合しなければならず、それに悪影響を与えてはならない。
他の実施形態において第1および第2のポリマー厚膜透明導電性組成物は、別の有機溶剤、ジアセトンアルコールをさらに含む。一実施形態においてジアセトンアルコールはPTF導電性組成物の全重量の1〜20重量%である。別の実施形態においてジアセトンアルコールはPTF導電性組成物の全重量の3〜12重量%であり、さらに別の実施形態においてジアセトンアルコールはPTF導電性組成物の全重量の4〜6重量%である。
様々な粉末をPTF導体組成物に添加して接着性を改良し、レオロジーを変え、低剪断粘度を増加させ、それによって印刷適性を改良してもよい。
「ペースト」とも称される、PTF導体は典型的に、ガスおよび湿気に対して不透質である、ポリカーボネートなどの基材上に堆積される。また、基材は、プラスチックシートとその上に堆積される任意選択の金属または誘電体層との組合せから構成される複合材料のシートであり得る。また、透明導体が、DuPont 5042または5043(DuPont Co.,Wilmington,DE)などの熱成形可能なAg導体の上に、または熱成形可能な誘電体層の上に堆積されてもよい。あるいは、熱成形可能なAg導体が、透明導体の上に形成されてもよい。
容量性スイッチ回路については使用される基礎基材は典型的に、厚さ10ミルのポリカーボネートである。導体組成物を上に記載された条件の通りに印刷し、乾燥させた。いくつかの層を印刷して乾燥させることができる。後続の工程は、ユニット全体を熱成形(190℃、750psi)する工程を包含してもよく、それは3D容量性スイッチ回路の製造において典型的である。一実施形態において、乾燥されたPTF導電性組成物、すなわち、透明導体の上に封入層が堆積され、次に、乾燥される。
Claims (6)
- (a)インジウムスズ酸化物粉末、アンチモンスズ酸化物粉末およびそれらの混合物からなる群から選択される導電性酸化物粉末10〜70重量%と、
(b)第1の有機溶剤に溶解された10〜50重量%の熱可塑性ウレタン樹脂を含む第1の有機媒体10〜50重量%(前記熱可塑性ウレタン樹脂の重量パーセントが前記第1の有機媒体の全重量に基づく)と、
(c)第2の有機溶剤に溶解された10〜50重量%の熱可塑性ポリヒドロキシエーテル樹脂を含む第2の有機媒体10〜50重量%(前記熱可塑性ポリヒドロキシエーテル樹脂の重量パーセントが前記第2の有機媒体の全重量に基づく)と、
(d)第3の有機溶剤中に少なくとも1つの電気活性ポリマーを含む第3の有機媒体10〜50重量%と、を含む触覚応答機能を有するポリマー厚膜透明導電性組成物であって、
前記導電性充填剤、前記第1の有機媒体、前記第2の有機媒体および前記第3の有機媒体の重量パーセントが、前記ポリマー厚膜導電性組成物の全重量に基づいている、ポリマー厚膜透明導電性組成物。 - (e)第4の有機溶剤1〜20重量%、
をさらに含む請求項1に記載のポリマー厚膜透明導電性組成物であって、
前記第4の有機溶剤がジアセトンアルコールであり、前記重量パーセントが、前記ポリマー厚膜導電性組成物の全重量に基づいている、請求項1に記載のポリマー厚膜透明導電性組成物。 - (a)インジウムスズ酸化物粉末、アンチモンスズ酸化物粉末およびそれらの混合物からなる群から選択される導電性酸化物粉末10〜70重量%と、
(b)第1の有機溶剤に溶解された10〜50重量%の熱可塑性ウレタン樹脂を含む第1の有機媒体10〜50重量%(前記熱可塑性ウレタン樹脂の重量パーセントが前記第1の有機媒体の全重量に基づく)と、
(c)第2の有機溶剤中に少なくとも1つの電気活性ポリマーを含む第2の有機媒体10〜50重量%と、を含む触覚応答機能を有するポリマー厚膜透明導電性組成物であって、
前記導電性充填剤、前記第1の有機媒体および前記第2の有機媒体の重量パーセントが、前記ポリマー厚膜導電性組成物の全重量に基づいている、ポリマー厚膜透明導電性組成物。 - (d)第3の有機溶剤1〜20重量%、
をさらに含む、請求項3に記載のポリマー厚膜透明導電性組成物であって、
前記第3の有機溶剤がジアセトンアルコールであり、前記重量パーセントが前記ポリマー厚膜導電性組成物の全重量に基づいている、ポリマー厚膜透明導電性組成物。 - 前記導電性酸化物粉末が、フレークの形態の粒子からなる、請求項1〜4のいずれか一項に記載のポリマー厚膜透明導電性組成物。
- 前記熱可塑性ウレタン樹脂が、ウレタンホモポリマーまたはポリエステル系コポリマーである、請求項1〜4のいずれか一項に記載のポリマー厚膜透明導電性組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461971063P | 2014-03-27 | 2014-03-27 | |
US61/971,063 | 2014-03-27 | ||
PCT/US2015/021494 WO2015148264A1 (en) | 2014-03-27 | 2015-03-19 | Thermoformable polymer thick film transparent conductor with haptic response and its use in capacitive switch circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017516877A true JP2017516877A (ja) | 2017-06-22 |
Family
ID=52815303
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016559295A Expired - Fee Related JP6568100B2 (ja) | 2014-03-27 | 2015-03-19 | 触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 |
JP2016559219A Pending JP2017516877A (ja) | 2014-03-27 | 2015-03-19 | 触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016559295A Expired - Fee Related JP6568100B2 (ja) | 2014-03-27 | 2015-03-19 | 触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9779851B2 (ja) |
EP (2) | EP3123481B1 (ja) |
JP (2) | JP6568100B2 (ja) |
CN (2) | CN106459577B (ja) |
WO (2) | WO2015148264A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9245666B2 (en) * | 2011-09-20 | 2016-01-26 | E I Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03110712A (ja) * | 1989-09-22 | 1991-05-10 | Toyobo Co Ltd | 透明導電性樹脂組成物 |
JPH03134906A (ja) * | 1989-10-19 | 1991-06-07 | Toyobo Co Ltd | 透明導電性樹脂組成物、透明導電性塗料および透明導電性積層体 |
JP2009176728A (ja) * | 2007-12-27 | 2009-08-06 | E I Du Pont De Nemours & Co | メンブレン・タッチ・スイッチ用途に用いるための導電性ペースト |
WO2013043619A1 (en) * | 2011-09-20 | 2013-03-28 | E. I. Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2530651B2 (ja) * | 1987-05-22 | 1996-09-04 | 触媒化成工業 株式会社 | メンブレン式タッチパネル |
KR20040111580A (ko) * | 2002-05-07 | 2004-12-31 | 레베오 인코포레이티드 | 도전성 잉크 |
US20040009398A1 (en) | 2002-06-19 | 2004-01-15 | Dorfman Jay Robert | Zinc polymer thick film composition |
US6939484B2 (en) | 2003-12-04 | 2005-09-06 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions for use in membrane switch applications |
US8623265B2 (en) * | 2007-02-06 | 2014-01-07 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
JP5056207B2 (ja) * | 2007-06-28 | 2012-10-24 | Tdk株式会社 | インモールド成形用導電性フィルム及び透明導電層付きプラスチック成形品の製造方法 |
JP5012340B2 (ja) * | 2007-09-07 | 2012-08-29 | Tdk株式会社 | タッチスイッチ用中間体製造方法 |
TW201203041A (en) * | 2010-03-05 | 2012-01-16 | Canatu Oy | A touch sensitive film and a touch sensing device |
US9056584B2 (en) * | 2010-07-08 | 2015-06-16 | Gentex Corporation | Rearview assembly for a vehicle |
KR20140008416A (ko) * | 2011-03-01 | 2014-01-21 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | 변형가능한 중합체 장치 및 필름을 제조하기 위한 자동화 제조 방법 |
AU2012222413A1 (en) * | 2011-03-01 | 2013-10-24 | Printechnologics Gmbh | Input element for operating a touch-screen |
KR20140053849A (ko) * | 2011-03-09 | 2014-05-08 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | 전기활성 중합체 작동기 피드백 장치 시스템 및 방법 |
US20130069016A1 (en) * | 2011-09-20 | 2013-03-21 | E. I. Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor for capacitive switches |
US9245666B2 (en) | 2011-09-20 | 2016-01-26 | E I Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
US8692131B2 (en) | 2011-09-20 | 2014-04-08 | E I Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
JP6162717B2 (ja) | 2011-12-21 | 2017-07-12 | スリーエム イノベイティブ プロパティズ カンパニー | 銀ナノワイヤベースの透明な導電性コーティングのレーザーパターニング |
US9051493B2 (en) * | 2013-03-28 | 2015-06-09 | Nokia Technologies Oy | Method and apparatus for joining together multiple functional layers of a flexible display |
US20140354570A1 (en) * | 2013-06-01 | 2014-12-04 | Senseg Ltd. | Haptic companion device |
US9587132B2 (en) * | 2014-03-20 | 2017-03-07 | E I Du Pont De Nemours And Company | Thermoformable polymer thick film transparent conductor and its use in capacitive switch circuits |
-
2015
- 2015-03-17 US US14/660,356 patent/US9779851B2/en active Active
- 2015-03-19 CN CN201580015575.3A patent/CN106459577B/zh active Active
- 2015-03-19 EP EP15715028.5A patent/EP3123481B1/en active Active
- 2015-03-19 WO PCT/US2015/021494 patent/WO2015148264A1/en active Application Filing
- 2015-03-19 WO PCT/US2015/021483 patent/WO2015148263A1/en active Application Filing
- 2015-03-19 EP EP15717995.3A patent/EP3123482B1/en active Active
- 2015-03-19 JP JP2016559295A patent/JP6568100B2/ja not_active Expired - Fee Related
- 2015-03-19 CN CN201580015579.1A patent/CN106133059B/zh active Active
- 2015-03-19 JP JP2016559219A patent/JP2017516877A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03110712A (ja) * | 1989-09-22 | 1991-05-10 | Toyobo Co Ltd | 透明導電性樹脂組成物 |
JPH03134906A (ja) * | 1989-10-19 | 1991-06-07 | Toyobo Co Ltd | 透明導電性樹脂組成物、透明導電性塗料および透明導電性積層体 |
JP2009176728A (ja) * | 2007-12-27 | 2009-08-06 | E I Du Pont De Nemours & Co | メンブレン・タッチ・スイッチ用途に用いるための導電性ペースト |
WO2013043619A1 (en) * | 2011-09-20 | 2013-03-28 | E. I. Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
Also Published As
Publication number | Publication date |
---|---|
CN106459577A (zh) | 2017-02-22 |
EP3123481A1 (en) | 2017-02-01 |
US20150279508A1 (en) | 2015-10-01 |
CN106133059A (zh) | 2016-11-16 |
US9779851B2 (en) | 2017-10-03 |
JP2017520879A (ja) | 2017-07-27 |
EP3123481B1 (en) | 2018-09-12 |
JP6568100B2 (ja) | 2019-08-28 |
WO2015148263A1 (en) | 2015-10-01 |
CN106459577B (zh) | 2019-07-23 |
CN106133059B (zh) | 2019-07-23 |
WO2015148264A1 (en) | 2015-10-01 |
EP3123482A1 (en) | 2017-02-01 |
EP3123482B1 (en) | 2018-10-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6050365B2 (ja) | 熱成形可能なポリマー厚膜銀導体と容量性スイッチ回路においてのその使用 | |
JP6636938B2 (ja) | 熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 | |
US8692131B2 (en) | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits | |
US9245666B2 (en) | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits | |
JP6592080B2 (ja) | 熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 | |
JP6568100B2 (ja) | 触覚応答を有する熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用 | |
US20130069016A1 (en) | Thermoformable polymer thick film silver conductor for capacitive switches | |
EP3027687B1 (en) | Flexible white reflective dielectric for electronic circuits |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180306 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190109 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190212 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190315 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190806 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191025 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200204 |