Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
  • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
  • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
  • C08L71/12—Polyphenylene oxides
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
  • C08L75/04—Polyurethanes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
  • C09D175/04—Polyurethanes
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/20—Light sources comprising attachment means
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
  • F21K9/68—Details of reflectors forming part of the light source
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/307—Other macromolecular compounds
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
  • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
  • H03K17/96—Touch switches
  • H03K17/962—Capacitive touch switches
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/285—Permanent coating compositions
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications
  • C08L2203/20—Applications use in electrical or conductive gadgets
  • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2115/00—Light-generating elements of semiconductor light sources
  • F21Y2115/10—Light-emitting diodes [LED]
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
  • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
  • H03K2217/96—Touch switches
  • H03K2217/9607—Capacitive touch switches
  • H03K2217/960705—Safety of capacitive touch and proximity switches, e.g. increasing reliability, fail-safe
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
  • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
  • H03K2217/96—Touch switches
  • H03K2217/9607—Capacitive touch switches
  • H03K2217/960755—Constructional details of capacitive touch and proximity switches
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Definitions

• This invention is directed to a polymer thick film white reflective flexible dielectric composition.
• Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to provide reflectance to maximize LED lighting.
• Dielectrics have long been used to protect electrical elements. They have also been used as isolating layers. Although they have been used for years in these types of applications, the use of dielectrics as reflective elements is not common. This is particularly important in circuits containing LED lighting where one wants to maximize the available brightness through reflectivity. Additionally, more and more circuitry is being developed where the base substrate that the LED's are attached to needs to be bent and shaped in a non-planar fashion. Thus, the white reflective dielectric must also be flexible i.e., it must withstand a 90 degree bend with no cracking. One of the purposes of this invention is to alleviate this issue and produce a flexible reflective construction in which the light generated from LED's can be maximized.
• This invention relates to a polymer thick film white reflective flexible dielectric composition
• a polymer thick film white reflective flexible dielectric composition comprising:
• urethane resin dissolved in 50-90 wt% first organic solvent, wherein the weight percent of the urethane resin and the first organic solvent are based on the total weight of the first organic medium;
• thermoplastic phenoxy resin 15-50 wt% of a second organic medium comprising 10-50 wt% thermoplastic phenoxy resin dissolved in 50-90 wt% second organic solvent wherein the weight percent of the thermoplastic (c) phenoxy resin and the second organic solvent are based on the total weight of the second organic medium;
• weight percent of the first organic medium, the second organic medium and the white reflective powder are based on the total weight of the composition.
• the invention is further directed to using the white reflective flexible dielectric to form a protective and/or insulating layer in electrical circuits.
• the invention relates to a polymer thick film white reflective flexible dielectric composition for use in electrical circuits.
• the substrate commonly used in the types of circuits considered here is usually polyimide or a polyimide laminate construction such as DuPontTM CooLam® (DuPont Co., Wilmington, DE).
• DuPontTM CooLam® is used for thermal conductivity purposes when high-brightness LED's are present.
• DuPontTM CooLam® 3D is used for circuits which are non-planar.
• the polymer thick film white reflective flexible dielectric composition can also be used in thermoforming electrical circuits, e.g., capacitive switch circuits.
• the substrate commonly used in polymer thick film thermoformable capacitive circuits is polycarbonate (PC).
• PC is generally preferred since it can be readily thermoformed.
• PC is very sensitive to the solvents used in the layers deposited on it.
• the final step will often be a molding step in which the finished circuit is formed by injection molding using a resin such as polycarbonate.
• a resin such as polycarbonate.
• This process is referred to as in-molding and involves higher temperatures. Depending on the resin chosen, these temperatures can typically exceed 250°C for 10-30 sec.
• the choice of the resins used in the PTF composition is critical. The combination of the resins used in the instant PTF composition has been shown to survive the in- mold process and produce fully functional circuitry whereas most resins typically used in PTF compositions will not.
• the polymer thick film (PTF) white reflective flexible dielectric composition is comprised of (i) two organic mediums comprising two polymer resins dissolved in a first organic solvent and a second organic solvent, respectively, and (ii) white reflective powder. Additionally, powders and printing aids may be added to improve the composition.
• weight percent will be written as wt%.
• the first organic medium is comprised of a urethane elastomer resin dissolved in a first organic solvent.
• the urethane resin must help achieve good adhesion to the underlying substrate.
• the urethane elastomer must also provide flexibility for the required bending of the circuit. It must be compatible with and not adversely affect the
• the urethane resin is 10-50 wt% and the first organic solvent is 50-90 wt% of the total weight of the first organic medium. In another embodiment the urethane resin is 25-45 wt% and the first organic solvent is 55-75 wt% of the total weight of the first organic medium. In still another embodiment the urethane resin is 15-25 wt% and the first organic solvent is 75-85 wt% of the total weight of the first organic medium. In one embodiment the urethane resin is a urethane elastomer. In another embodiment urethane resin is a polyester-based copolymer.
• the second organic medium is composed of a phenoxy resin dissolved in a second organic solvent that may be the same as the first organic solvent. Different solvents may also be used.
• the phenoxy resin adds high temperature capability to the composition which aids in the use of this dielectric as a solder mask if required, and also improves moisture permeability. That is, it helps impede the progress of moisture through the composition.
• the phenoxy resin is 10-50 wt% and the second organic solvent is 50-90 wt% of the total weight of the second organic medium.
• the phenoxy resin is 20-35 wt% and the second organic solvent is 65-80 wt% of the total weight of the second organic medium.
• each medium is 15-50 wt% based on the total weight of the composition. In another embodiment, each medium is 15-40 wt% based on the total weight of the composition. In still another embodiment, the first organic medium is 15-25 wt% and the second organic medium is 25-45 wt% based on the total weight of the
• solvents suitable for use in the polymer thick film composition are recognized by one of skill in the art and include acetates and terpenes such as carbitol acetate and alpha- or beta-terpineol or mixtures thereof with other solvents such as kerosene, butyl carbitol, butyl carbitol acetate, hexylene glycol and high boiling alcohols and alcohol esters.
• volatile liquids for promoting rapid hardening after application on the substrate may be included.
• solvents such as glycol ethers, ketones, esters and other solvents of like boiling points (in the range of 180°C to 250°C), and mixtures thereof may be used.
• solvents are formulated to obtain the viscosity and volatility requirements desired.
• the solvents used must solubilize the resin.
• the white reflective powder includes such powders as titanium dioxide, barium titanate, alumina, or mixtures thereof.
• the amount of white reflective powder is 1 -70% of the total weight of the entire composition.
• the white reflective powder is 20-60 wt% of the total weight of the entire composition and in still another embodiment the white reflective powder is 30-55 wt% of the total weight of the entire composition.
• the powder is titanium dioxide. It is preferable to keep the particle size of the reflective powder in the range of 0.3-5 microns so as to avoid any cracking issues.
• Various powders may be added to the PTF dielectric composition to improve adhesion, modify the rheology and increase the low shear viscosity thereby improving the printability.
• One such powder is fumed silica where it has been found to significantly improve the resistance to moisture penetration.
• the PTF white reflective flexible dielectric composition also referred to as a "paste" is typically deposited on a substrate, such as polyimide or a laminate of polyimide, such as DuPontTM CooLam® 3D, that is somewhat impermeable to gases and moisture.
• a substrate such as polyimide or a laminate of polyimide, such as DuPontTM CooLam® 3D, that is somewhat impermeable to gases and moisture.
• the white reflective flexible dielectric may be deposited over an existing silver/dielectric construction.
• the deposition of the PTF white reflective flexible dielectric composition is performed typically by screen printing, but other deposition techniques such as stencil printing, syringe dispensing or coating techniques can be utilized. In the case of screen-printing, the screen mesh size controls the thickness of the deposited thick film.
• a thick film composition comprises a functional phase that imparts appropriate functional properties to the
• the functional phase comprises functional powders dispersed in an organic medium that acts as a carrier for the
• the composition is fired to burn out both the polymer and the solvent of the organic medium and to
• the PTF white reflective flexible dielectric composition is processed for a time and at a temperature necessary to remove all solvent.
• the deposited thick film is dried by exposure to heat at 130°C for typically 10-15 min.
• the substrate used is typically polyimide-based as further processing steps involve exposure to soldering temperatures.
• the white reflective flexible dielectric is printed and dried as per the conditions described above. Several layers can be printed and dried. A subsequent step which may include bending of the entire unit is typical in the
• the circuit is used as a solder mask.
• the PTF white reflective flexible dielectric composition was prepared in the following manner.
• the first organic medium was prepared by mixing 20.0 wt% Desmocoll 540 polyurethane (Bayer MaterialScience LLC, Pittsburgh, PA) with 80.0 wt% dibasic esters (DuPont Co.,
• the molecular weight of the resin was approximately 40,000. This mixture was heated at 90°C for 1 -2 hours to dissolve all the resin.
• the second organic medium was prepared by adding 27.0 wt% PKHH (phenoxy) resin (InChem Corp.) to 73.0 wt% dibasic esters and heating as above. The above weight percent are based on the total weight of each of the media, respectively. All following weight percent are based on the total weight of the PTF white reflective flexible dielectric composition. 40.0 wt% titanium dioxide powder (DuPont Co., Wilmington, DE) was then added as the white reflective powder and the entire composition was mixed. The composition was then subjected to the three-roll-mill for two cycles at 150 psi.
• composition based on the total weight of the composition, was:
• a circuit was then fabricated as follows: On a DuPontTM CooLam® 3D substrate, a blanket print of the white reflective flexible dielectric composition prepared as described above was printed with a 200 stainless steel screen and dried at 130°C for 10 min. A second print of the composition was then printed and dried. The part was inspected and no evidence of crazing or deformation of the underlying substrate was found. The circuit was then subjected to a 90 degree bend and tested for cracking/adhesion. No visible signs of cracking were detected, and adhesion before and after the bend was outstanding (5B on ASTM Tape Test). Reflectivity was measured at 90%.
• a circuit was produced exactly as described in Example 1 .
• the only difference was that the white reflective flexible dielectric composition was not used. Instead, a standard PTF dielectric, DuPont 5036 (DuPont Co., Wilmington, DE), was used. Here, cracking and adhesion loss was observed after the 90 degree bending. Additionally, reflectivity was only 30%.

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• Chemical & Material Sciences (AREA)
• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Organic Chemistry (AREA)
• Optics & Photonics (AREA)
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• Polymers & Plastics (AREA)
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• Wood Science & Technology (AREA)
• Materials Engineering (AREA)
• Life Sciences & Earth Sciences (AREA)
• Non-Metallic Protective Coatings For Printed Circuits (AREA)
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• 2014
  • 2014-07-09 US US14/326,836 patent/US9303828B2/en active Active
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  • 2014-07-30 EP EP14750291.8A patent/EP3027687B1/en active Active
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