CN105323953A - 印刷线路板及其制造方法 - Google Patents

印刷线路板及其制造方法 Download PDF

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Publication number
CN105323953A
CN105323953A CN201510367385.XA CN201510367385A CN105323953A CN 105323953 A CN105323953 A CN 105323953A CN 201510367385 A CN201510367385 A CN 201510367385A CN 105323953 A CN105323953 A CN 105323953A
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region
conductor layer
pattern
insulation board
circuit pattern
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佐伯真理
石冈卓
中村聪
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Kyocera Corp
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Kyocera Circuit Solutions Inc
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Publication of CN105323953A publication Critical patent/CN105323953A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
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    • B32B15/00—Layered products comprising a layer of metal
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    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23C18/1601—Process or apparatus
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Abstract

本发明提供一种印刷线路板及其制造方法。印刷线路板具备在绝缘树脂的两面形成了导电性金属层的绝缘板、以及形成在绝缘板的两面且根据区域而不同的电路图案的导体层，形成在绝缘板的两面的电路图案包含线宽精度为±10μm以下的图案，并且电路图案的面积密集的区域的导体层厚度和稀疏的区域的导体层厚度具有下式的关系：密集的区域的导体层厚度/稀疏的区域的导体层厚度＝0.7～1.0。

Description

印刷线路板及其制造方法
技术领域
本发明涉及形成于正反面的导体层的厚度差较小的印刷线路板及其制造方法。
背景技术
在基板上形成电路时，存在减成法(サブトラクティブ法)和加成法(アディティブ法)。如JP特开2010-87213号公报所记载的那样，对于减成法而言，电路宽度的精度由导体厚度来决定，因而形成精细图案是有限度的。
与此相对，对于加成法而言，电路宽度的精度不易受导体厚度影响，所以例如在电路宽度为50μm以下，尤其±10μm的高精度的精细图案形成方面优异。在加成法中，有全加成法(フルアディティブ法)和半加成法(セミアディティブ法)，主流的技术是半加成法。进而在半加成法中，衍生技术有MSAP(ModifiedSemiAdditiveProcess，改进型半加成法)。
对于半加成法而言，如JP特开2003-8222号公报以及JP特开2007-88476号公报所记载的那样，在整个绝缘树脂上形成化学镀的种子层，在其上形成镀覆阻剂(めっきレジスト)。接着，使镀覆阻剂进行曝光、显影，去除想要形成电路图案、导通孔等的部位的镀覆阻剂。接着，在去除了镀覆阻剂的部分，通过图案电镀来形成电路图案、导通孔等。最后，去除镀覆阻剂，通过闪蚀刻(flashetching)去除种子层(化学镀层)，去除化学镀的催化剂，由此形成电路。
对于MSAP而言，如JP特开2007-88476号公报所记载的那样，除了使用层叠在绝缘树脂层上的铜作为种子层、不需要去除催化剂以外，与半加成法相同。对于MSAP而言，在形成了导通孔的情况下，虽然需要至少在导通孔下孔(空穴)内壁进行化学镀作为种子层，但无需像半加成法那样在整个绝缘树脂表面进行化学镀。因此，能够比较容易地形成种子层。而且，无需去除在化学镀时作为催化剂来使用的钯。根据这些特征，MSAP与半加成法相比能够比较容易地形成微细电路。
在JP特开2010-87213号公报所记载的减成法中，成为电路的下部向两侧拉得较长的裙摆(裾引き)状。裙摆量由导体层的厚度决定，电路越精细，裙摆量与电路宽度的比率越高。因此，若力图形成微细电路，则形成电路的导体层的剖面形状接近于梯形。若是更加精细的电路则成为三角形，作为极端的示例而言，裙摆大到不能构成三角形的顶点的程度，导体厚度和电路宽度小于设计值，变得不再能说是正常的电路形成。对于这样的形状的电路而言，还存在电气特性不稳定的问题。
对于在JP特开2003-8222号公报以及特开2007-88476号公报所记载的半加成法、MSAP中进行的图案电镀，可以举出如下的(I)、(II)那样的问题点。
(I)导体层的厚度(镀覆厚度)受图案的疏密影响较大
用于实施图案电镀的电流的密度受到电路图案的面积的疏密影响，所以在面内有图案面积密集的区域和稀疏的区域的情况下，镀覆厚度的分布变差。因此，难以使面内成为均匀的镀覆厚度。尤其是在绝缘板的正反两面上电路图案的面积不相同、且电路图案的疏密较大不同的情况等下，在图案疏的面，电流密度较高，导体层(镀覆厚度)较厚。相反地，图案密的面存在电流密度较低、导体层(镀覆厚度)较薄这样的问题点。
(II)电流值的绕流所引起的镀覆厚度的减少
在图案电镀时，在基板的正反两面电路图案的面积较大不同、且在正反施加了不同的电流值的情况下，在电流值较低的一方会发生电流值的绕流现象。因此在连续投入了基板时，镀覆厚度按照镀覆投入顺序而减少的倾向得到确认。为了缓和该现象，需要使比通常的虚设板的块数更多的块数通过，但问题并未完全消除。
在正反施加了不同的电流值的情况下，电流值的绕流量根据投入块数而不同。由于该影响，因而发生各面板的镀覆厚度根据所投入的块数而变化的现象。
发明内容
本发明的课题在于，提供一种在印刷线路板的每个区域电路图案的面积不同的情况下，抑制了各区域的电路图案的疏密给导体层的厚度带来的影响的印刷线路板及其制造方法。
本实施方式所涉及的印刷线路板具备：在绝缘树脂的两面形成了导电性金属层的绝缘板、和形成在绝缘板的两面并且根据区域而不同的电路图案的导体层。形成在绝缘板的两面的电路图案包含线宽精度为±10μm以下的图案，并且电路图案的面积密集的区域的导体层厚度和稀疏的区域的导体层厚度具有下式的关系：
密集的区域的导体层厚度/稀疏的区域的导体层厚度＝0.7～1.0。
本实施方式所涉及的印刷线路板的制造方法包括：制作在绝缘树脂的两面形成了导电性金属层的绝缘板的工序；在绝缘板的两面形成镀覆阻剂，接着进行曝光以及显影，在两面分别形成不同的阻剂图案的工序；在形成了阻剂图案的绝缘板的两面实施图案电镀，形成构成线宽精度为±10μm以下、并且图案根据区域而不同的电路图案的导体层的工序；从绝缘板的两面去除所述镀覆阻剂以及所述导电性金属层，接着在绝缘板的两面形成焊接阻剂(ソルダ一レジスト)层的工序；以及在电路图案的面积稀疏的区域与所述电路图案一起形成虚设图案，使得绝缘板的两面中电路图案的面积密集的区域的电路图案面积与稀疏的区域的电路图案面积相比成为1.0～1.2倍，在所述图案电镀后，从虚设图案处去除导体层的工序。
根据本实施方式，即使在每个区域电路图案的面积的疏密较大不同的情况下，构成各区域的电路图案的导体层的厚度也大致均匀。因此，电流密度也均匀，具有制造成品率以及可靠性提高这样的效果。
根据本实施方式的印刷线路板的制造方法，关于印刷线路板的每个区域中的电路图案的面积不同的情况，通过在电路图案的面积稀疏的区域追加虚设图案，能够使各区域的电路图案的面积的疏密降低并均匀化。因此，导体层的厚度稳定、均匀。
此外，现有技术中为了减轻电路图案的疏密所带来的影响，从1块面板切割出的印刷线路板(产品)的数量受到了限制。在本发明中，通过对产品中的电路图案的面积稀疏的区域赋予虚设图案，能够提高从1块面板切割出的印刷线路板(产品)的数量，实现生产性提高、成本下降。对于因电气特性等理由而不能在出厂的产品内赋予虚设图案的产品也能够应用。
在印刷线路板的两面(正反)施加不同的电流值的情况下，发生电流的绕流。由此，按照镀覆的投入顺序发生镀覆厚度(导体层的厚度)的减少。与此相对，通过如上所述降低正反的图案的疏密之差，能够在正反施加相同的电流值。由此，不发生电流的绕流而能够防止按照投入顺序的镀覆厚度的减少。通过该效果，无需通过虚设板来缓和镀覆厚度的减少，通过大幅削减虚设板的投入数，从而能够实现生产性提高、成本下降。而且，由于不发生电流的绕流，因此镀覆厚度能够与投入块数无关地得到相同厚度。因此，印刷线路板的品质均匀，能够实现制造成品率以及可靠性的提高。
而且，即使应用不适于图案镀覆的镀覆浴也能够得到均匀的镀覆厚度。
附图说明
图1是表示本发明的一实施方式所涉及的印刷线路板的剖视图。
图2A～K是表示本发明的一实施方式所涉及的印刷线路板的制造方法的剖视图。
具体实施方式
如图1所示，本发明的一实施方式所涉及的印刷线路板100由绝缘板10、贯通所述绝缘板10的导通孔3、导体层6和焊接阻剂8形成，其中所述绝缘板10由绝缘树脂1和在其两面形成的导电性金属箔2(导电性金属层)构成，所述导体层6由在所述绝缘板10的上部和所述导通孔3的内壁面形成的电镀图案构成。在所述绝缘板10的两面，形成有由导体层6构成、且图案的面积不同的电路图案5、5’。
作为形成绝缘树脂1的原材料，可以列举出例如环氧树脂、双马来酰亚胺-三嗪树脂、聚酰亚胺树脂、聚苯醚(PPE)树脂等的有机树脂等。这些有机树脂也可以将2种以上进行混合来使用。在使用有机树脂作为绝缘树脂1的情况下，优选在有机树脂中混合加强材料来使用。作为加强材料，可以列举出例如玻璃纤维、玻璃无纺布、芳纶无纺布、芳纶纤维、聚酯纤维等。这些加强材料也可以将2种以上同时使用。绝缘树脂1进一步优选为由玻璃纤维等的含有玻璃材料的有机树脂形成。而且，在绝缘树脂1中，也可以包含二氧化硅、硫酸钡、滑石、粘土、玻璃、碳酸钙、氧化钛等的无机填充材料。
例如在通过MSAP来形成电路图案的情况下，在所述绝缘树脂1的表面，粘贴导电性金属箔2作为电解镀覆的种子层，并通过冲压处理等而成为绝缘板10。作为该导电性金属箔2，优选例如薄铜箔。
在绝缘板10上形成用于形成电路图案5的导体层6，并且形成了贯通绝缘板10的导通孔3。在导通孔3的内壁面也形成导体层6。作为所述导体层6，可以例举出例如导电性树脂层、金属镀覆层等，特别是从蚀刻等的加工的容易度出发最好是镀铜层。电路图案5、5’在一部分或整体包含对于减成法而言制作困难的线宽为50μm以下的纤细的图案。线宽的精度最好是±10μm以下。
电路图案5、5’彼此为不同的图案，形成在绝缘板10的两面。而且，电路图案5、5’的面积密集的区域的导体层6的厚度、和稀疏的区域的导体层6的厚度大致均匀，具体来说具有下述关系式。
密集的区域的导体层厚度/稀疏的区域的导体层厚度＝0.7～1.0
在此，所谓区域，若就本实施方式的示例而言，则意味着分别具有电路图案5、5’的绝缘板10的正反面。但是，本发明并不限定于此，例如，也可以是在绝缘板的面内图案面积不同的区域。在该情况下，图案面积密集的区域和稀疏的区域无需一定相邻。所谓密集的区域和稀疏的区域既可以是按两个区域将整个面分成两部分，也可以是面内的一部分。
接着，说明本发明的一实施方式所涉及的印刷线路板的制造方法。本发明的一实施方式所涉及的印刷线路板的制造方法包括下述的工序(i)～(viii)。
(i)制作在绝缘树脂的两面层叠了导电性金属箔的绝缘板的工序。
(ii)制作贯通所述绝缘板的导通孔下孔的工序。
(iii)在所述绝缘板的两面形成镀覆阻剂，进行曝光以及显影，在两面分别形成不同的阻剂图案的工序。
(iv)在绝缘板的两面实施图案电镀，在两面形成构成图案不同的电路图案以及虚设图案的导体层的工序。
(v)在所述图案电镀后，通过减成法来去除虚设图案的工序。
(vi)剥离镀覆阻剂和蚀刻阻剂(エツチングレジスト)的工序。
(vii)去除导电性金属箔(种子层)的工序。
(viii)形成焊接阻剂的工序。
基于图2A～K来说明本发明的一实施方式所涉及的印刷线路板的制造方法。绝缘树脂1、导电性金属箔2、导通孔3等如上所述，省略详细说明。
首先，如图2A所示，准备在绝缘树脂1的两面形成了导电性金属箔2的绝缘板10。作为导电性金属箔2，可以使用例如厚度3μm左右的薄铜箔。绝缘板10的形成方法，可以例如将带树脂铜箔层叠于绝缘树脂板，还可以例如将由厚度3μm的薄铜箔和厚度18μm的载体箔构成的带载体铜箔通过预浸料坯(prepreg)层叠于绝缘树脂。在使用了带载体铜箔的情况下，在层叠后去除载体箔。而且，绝缘板10也可以是预先形成了薄铜箔的覆铜层压板。
接着，如图2B所示，形成贯通绝缘板10的导通孔下孔3a。导通孔下孔3a可以通过钻具或者激光来形成。在通过激光形成的情况下，也可以将导通孔下孔3a正上方的导电性金属箔2同时进行开口。
对于导通孔下孔3a而言，无论使用钻具或激光的哪一种方法，有时都会在内壁面等残留树脂残渣。在这种情况下，通过去污处理来去除树脂残渣。
进而，至少在导通孔下孔3a的内壁面，通过化学镀来形成种子层31。
接着，如图2C所示，在两面形成用于进行后述的图案电镀的镀覆阻剂4。作为镀覆阻剂4，使用图案电镀专用的干膜(例如日立化成(株)制RY-3525等)，将其层压于绝缘板10。
接着，如图2D所示，使镀覆阻剂4曝光、显影，形成用于制作后述的电路图案部分以及虚设图案的镀覆阻剂图案11。在此，用符号51a表示虚设图案用镀覆阻剂开口。
接着，如图2E所示，在导通孔下孔3a的内壁面以及绝缘板10的两面实施图案电镀来形成导体层6，并形成导通孔3以及电路图案5、5’以及虚设图案51。导体层6的镀覆厚度(导体厚度)例如设为15μm。
如上所述，电路图案5、5’虽然是彼此面积不同的图案，但面积密集的区域的导体层6的厚度和稀疏的区域的导体层6的厚度大致均匀。为了形成这样的电路图案5、5’，在电路图案面积稀疏的区域与所述电路图案5一起形成虚设图案51，使得绝缘板10的各区域中电路图案面积较大的密集的区域的电路图案5’的面积与稀疏的区域的电路图案5的面积相比为1.2倍以下，优选为1.2倍～1.0倍。由此，绝缘板10的各区域的电路图案面积大致均匀，能够实现上述关系式：密集的区域的导体层厚度/稀疏的区域的导体层厚度＝0.7～1.0。
在尺寸为50mm×50mm～150mm×150mm的印刷线路板中，在电路图案5、5’的疏密的面积比为密集的导体面积/稀疏的导体面积＝5以上的情况下，密集的区域的导体层厚度/稀疏的区域的导体层厚度＝0.4～1.0。对此，通过导入虚设图案51，将该比例抑制在1.2以下，能够降低各区域的导体层厚度之差。
接着，如图2F所示，在导体层6、导通孔3、电路图案5、5’以及虚设图案51的表面形成干膜(例如旭化成电子材料(株)制AQ-1558等)的蚀刻阻剂7。之后，如图2G所示，进行曝光、显影，使虚设图案51露出。
接着，如图2H所示，使用减成法通过蚀刻将虚设图案51选择性地去除。此时，虚设图案51下表面的导电性金属箔2也被去除。
接着，如图2I所示，剥离蚀刻阻剂7和镀覆阻剂图案11。
接着，如图2J所示，通过闪蚀刻来去除从导体层6露出的导电性金属箔2。
最后，如图2K所示，在表面的给定位置形成焊接阻剂8，得到印刷线路板100。对于焊接阻剂8的形成方法的而言，首先，使用喷涂、辊涂、幕涂、丝网法等来涂敷感光性液状焊接阻剂并进行干燥、或者通过辊层压来粘贴感光性干膜、焊接阻剂。然后，只要进行曝光以及显影使焊盘部分开口并进行加热固化、实施外形加工即可。焊接阻剂厚度例如设为20μm。
在形成焊接阻剂8之前，也可以对形成面进行CZ处理等的铜的粗糙化处理。也可以在焊接阻剂8的开口部，形成3μm以上的厚度的化学镀镍，在其上形成0.03μm以上(优选为0.05μm以上，丝焊用途的情况下为0.3μm以上)的厚度的化学镀金。进而，还存在其上实施焊料预涂的情况。也可以不通过化学镀而通过电解镀覆来形成。也可以不是镀覆而是形成水溶性防锈有机被膜(例如四国化成工业(株)制Tafuesu等)，或者还可以形成化学镀银、化学镀锡。
本发明并不限定于上述的一实施方式，在权利要求书所记载的范围内能够进行各种变更、改良。
例如，本实施例所示的印刷线路板的制造方法以双面板为例进行了说明，但并不限于双面板，毋庸置疑当然也能够适用于多层板、积层多层板等，能够适用于外层电路、内层电路等所有印刷线路板的电路面。
上述以MSAP来说明了电路形成方法，但并不限定于MSAP，也能够应用半加成法。
导通孔并不限于贯通孔，也能够应用非贯通孔。

Claims (10)

1.一种印刷线路板，其特征在于，
具备在绝缘树脂的两面形成了导电性金属层的绝缘板、和形成在绝缘板的两面并且根据区域而不同的电路图案的导体层，
形成在绝缘板的两面的电路图案包含线宽精度为±10μm以下的图案，并且电路图案的面积密集的区域的导体层厚度和稀疏的区域的导体层厚度具有下式的关系：
密集的区域的导体层厚度/稀疏的区域的导体层厚度＝0.7～1.0。
2.根据权利要求1所述的印刷线路板，其中，
所述印刷线路板的尺寸为50mm×50mm～150mm×150mm。
3.根据权利要求1所述的印刷线路板，其中，
所述绝缘板具有在内壁面形成了导体层的导通孔。
4.根据权利要求1所述的印刷线路板，其中，
所述电路图案包含线宽为50μm以下的图案。
5.根据权利要求1所述的印刷线路板，其中，
所述区域是具有相互不同的电路图案的所述绝缘板的正反面。
6.根据权利要求1所述的印刷线路板，其中，
所述区域是在所述绝缘板的面内电路图案的面积不同的区域。
7.一种印刷线路板的制造方法，其特征在于包括：
制作在绝缘树脂的两面形成了导电性金属层的绝缘板的工序；
在绝缘板的两面形成镀覆阻剂，接着进行曝光以及显影，在两面分别形成不同的阻剂图案的工序；
在形成了阻剂图案的绝缘板的两面实施图案电镀，形成构成线宽精度为±10μm以下、并且图案根据区域而不同的电路图案的导体层的工序；以及
从绝缘板的两面去除所述镀覆阻剂以及所述导电性金属层，接着在绝缘板的两面形成焊接阻剂层的工序，
其中，所述印刷线路板的制造方法还包括：
在电路图案的面积稀疏的区域与所述电路图案一起形成虚设图案，使得绝缘板的两面中电路图案的面积密集的区域的电路图案面积与稀疏的区域的电路图案面积相比成为1.0～1.2倍，在所述图案电镀后，从虚设图案处去除导体层的工序。
8.根据权利要求7所述的印刷线路板的制造方法，其中，
导体层的面积密集的区域的导体层厚度和稀疏的区域的导体层厚度具有下式的关系：
密集的区域的导体层厚度/稀疏的区域的导体层厚度＝0.7～1.0。
9.根据权利要求7所述的印刷线路板的制造方法，其中，
通过减成法从虚设图案处去除导体层。
10.根据权利要求7所述的印刷线路板的制造方法，其中，
所述印刷线路板的制造方法包括：
在所述绝缘板形成导通孔下孔，在该导通孔下孔的内壁面以及绝缘板的两面实施图案电镀来形成导体层的工序。
CN201510367385.XA 2014-06-30 2015-06-29 印刷线路板及其制造方法 Pending CN105323953A (zh)

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