JP6381997B2 - 印刷配線板の製造方法 - Google Patents
印刷配線板の製造方法 Download PDFInfo
- Publication number
- JP6381997B2 JP6381997B2 JP2014134829A JP2014134829A JP6381997B2 JP 6381997 B2 JP6381997 B2 JP 6381997B2 JP 2014134829 A JP2014134829 A JP 2014134829A JP 2014134829 A JP2014134829 A JP 2014134829A JP 6381997 B2 JP6381997 B2 JP 6381997B2
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- Prior art keywords
- pattern
- plating
- conductor layer
- insulating plate
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 229910052623 talc Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
それに対して、アディティブ法は導体厚に回路幅の精度が左右されにくいため、例えば回路幅50μm以下で±10μmの高精度なファインパターン形成に優れている。アディティブ法には、フルアディティブ法とセミアディティブ法があり、主流の技術はセミアディティブ法である。更にセミアディティブ法には、派生技術にMSAP(Modified Semi Additive Process)がある。
(I)導体層の厚さ(めっき厚)はパターンの疎密に大きく影響される。
電解パターンめっきを施すための電流の密度は、回路パターンの面積の疎密に影響を受けるため、面内にパターン面積が密な領域と疎な領域があった場合、めっき厚の分布が悪くなる。そのため、面内を均一なめっき厚にすることは困難である。特に絶縁板の表裏両面において回路パターンの面積が同一でなく、回路パターンの疎密が大きく異なる場合などは、パターンが疎の面に電流密度が高くなり導体層(めっき厚)が厚くなり、パターンが密な面は電流密度が低くなり導体層(めっき厚)が薄くなるという問題点が存在する。
(II)電流値の回りこみによるめっき厚の減少
電解パターンめっき時に、基板の表裏両面で回路パターンの面積が大きく異なり、表裏で違う電流値をかけた場合、電流値の低いほうに電流値の回り込み現象が生じる。そのため基板を連続投入した際、めっき投入順に従ってめっき厚が減少する傾向が確認される。その現象の緩和のために通常のダミー板の枚数よりも枚数を多く流す必要があるが、完全な問題解消とはならない。
また、表裏で異なる電流値をかけた場合、投入枚数により電流値の回り込み量が異なる。その影響から投入する枚数によって、各パネルのめっき厚が変化する現象が生じる。
(1) 絶縁樹脂の両面に導電性金属層を形成した絶縁板を作製する工程と、絶縁板の両面にめっきレジストを形成し、ついで露光および現像して、両面にそれぞれ異なるレジストパターンを形成する工程と、レジストパターンが形成された絶縁板の両面に電解パターンめっきを施して、線幅精度が±10μm以下で、かつ領域によってパターンが異なる回路パターンを構成する導体層を形成する工程と、前記めっきレジストおよび前記導電性金属層を絶縁板の両面から除去し、ついで絶縁板の両面にソルダーレジスト層を形成する工程と、を含む印刷配線板の製造方法であって、絶縁板の両面のうち、回路パターンの面積が密な領域の回路パターン面積が、疎な領域の回路パターン面積より1.0〜1.2倍となるように、回路パターンの面積が疎な領域に前記回路パターンと共にダミーパターンを形成し、前記電解パターンめっき後に、前記めっきレジストが絶縁板の両面に付着した状態で、導体層からダミーパターンを除去する工程を含む、ことを特徴とする印刷配線板の製造方法。
(2) 導体層の面積が密な領域の導体層厚さと、疎な領域の導体層厚さとが下記式の関係を有する(1)に記載の印刷配線板の製造方法。
密な領域の導体層厚さ/疎な領域の導体層厚さ=0.7〜1.0
(3) 導体層からダミーパターンをサブトラクティブ法により除去し、サブトラクティブ法には、めっきレジストおよびエッチングレジストを剥離する工程を含む(1)または(2)に記載の印刷配線板の製造方法。
本発明の印刷配線板の製造方法によれば、印刷配線板の領域毎における回路パターンの面積が異なることに関して、面積が疎な領域にダミーパターンを追加することで、各領域の回路パターンの面積の疎密を低減し均一化することが可能となる。そのため、導体層の厚みが安定し均一となる。
さらに、パターンめっきに適さないめっき浴を適用しても均一なめっき厚を得ることが可能である。
密な領域の導体層厚さ/疎な領域の導体層厚さ=0.7〜1.0
ここで、領域とは、本実施形態の例でいえば、回路パターン5、5’をそれぞれ有する絶縁板の表裏面を意味する。しかし、本発明はこれのみに限定されず、例えば、絶縁板の面内においてパターン面積が異なる領域であってもよい。この場合、パターン面積が密な領域と、疎な領域とは必ずしも隣接している必要はない。また、密な領域と疎な領域とは、全面を両領域で二分していてもよいし、面内の一部であってもよい。
(i)絶縁樹脂の両面に導電性金属箔を積層した絶縁板を作製する工程。
(ii)前記絶縁板を貫通するビアホール下孔を作製する工程。
(iii)前記絶縁板の両面にめっきレジストを形成し、露光および現像して、両面にそれぞれ異なるレジストパターンを形成する工程。
(iv)絶縁板の両面に電解パターンめっきを施して、両面でパターンが異なる回路パターンおよびダミーパターンを構成する導体層を形成する工程。
(v)前記電解パターンめっき後に、ダミーパターンをサブトラクティブ法により除去する工程。
(vi)めっきレジストとエッチングレジストを剥離する工程。
(vii)導電性金属箔(シード層)を除去する工程。
(viii)ソルダーレジストを形成する工程。
ビアホール下孔3aは、ドリルまたはレーザのいずれの方法を使用しても、孔壁等に樹脂残渣(図示せず)が残ることがある。その場合は、デスミア処理により樹脂残渣を除去する。
さらに、少なくともビアホール下孔3aの壁面に、無電解めっきでシード層31を形成する。
上記は、回路形成方法をMSAPで説明したが、MSAPに限定するものではなく、セミアディティブ法であっても適用可能である。
ビアホールは、貫通孔に限らず、非貫通孔でも適用可能である。
2 導電性金属箔(導電性金属層)
3 ビアホール
3a ビアホール下孔
4 めっきレジスト
5、5’ 回路パターン
6 導体層
7 エッチングレジスト
8 ソルダーレジスト
10 絶縁板
11 めっきレジストパターン
31 シード層
51 ダミーパターン
51a ダミーパターン用めっきレジスト開口
100 印刷配線板
Claims (3)
- 絶縁樹脂の両面に導電性金属層を形成した絶縁板を作製する工程と、
絶縁板の両面にめっきレジストを形成し、ついで露光および現像して、両面にそれぞれ異なるレジストパターンを形成する工程と、
レジストパターンが形成された絶縁板の両面に電解パターンめっきを施して、線幅精度が±10μm以下で、かつ領域によってパターンが異なる回路パターンを構成する導体層を形成する工程と、
前記めっきレジストおよび前記導電性金属層を絶縁板の両面から除去し、ついで絶縁板の両面にソルダーレジスト層を形成する工程と、を含む印刷配線板の製造方法であって、
絶縁板の両面のうち、回路パターンの面積が密な領域の回路パターン面積が、疎な領域の回路パターン面積より1.0〜1.2倍となるように、回路パターンの面積が疎な領域に前記回路パターンと共にダミーパターンを形成し、前記電解パターンめっき後に、前記めっきレジストが絶縁板の両面に付着した状態で、導体層からダミーパターンを除去する工程とを含む、ことを特徴とする印刷配線板の製造方法。 - 導体層の面積が密な領域の導体層厚さと、疎な領域の導体層厚さとが下記式の関係を有する請求項1に記載の印刷配線板の製造方法。
密な領域の導体層厚さ/疎な領域の導体層厚さ=0.7〜1.0 - 導体層からダミーパターンをサブトラクティブ法により除去し、サブトラクティブ法には、めっきレジストおよびエッチングレジストを剥離する工程を含む請求項1または2に記載の印刷配線板の製造方法。
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