CN105265028A - 混合互连 - Google Patents
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- CN105265028A CN105265028A CN201480032495.4A CN201480032495A CN105265028A CN 105265028 A CN105265028 A CN 105265028A CN 201480032495 A CN201480032495 A CN 201480032495A CN 105265028 A CN105265028 A CN 105265028A
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Abstract
一种用于到集成电路的端子(18)的连接的连接器(12)。该连接器包括具有第一面和第二面的电介质基板(40)。该连接器具有焊线端子(50),所述焊线端子(50)附接到所述基板的所述第一面并且被构造为接纳连接到所述集成电路的第一组端子的焊线。该连接器还具有焊料凸块端子(60),所述焊料凸块端子(60)附接到所述基板的所述第二面,以便与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球(64)与所述集成电路的第二组端子连接。
Description
技术领域
本发明总体涉及连接装置,并且具体涉及所使用的空间是高价(premium)的装置。
背景技术
在集成电路利用领域中的空间要求是使用集成电路的系统的设计的关键特征。对于给定尺寸的硅晶片来说,集成电路和辅助组件(诸如,到集成电路的传导迹线)被制造得越小,能够产生的集成电路越多。对于减小尺寸的集成电路的其它优点包括用于操作电路的功率需求的减少。
发明内容
本发明的实施方式提供用于到集成电路的端子的连接的连接器,所述连接器包括:
电介质基板,所述电介质基板具有第一面和第二面;
焊线端子(wirebondterminal),所述焊线端子附接到所述基板的所述第一面,并且被构造为接纳连接到所述集成电路的第一组端子的焊线;以及
焊料凸块端子(solderbumpterminal),所述焊料凸块端子附接到所述基板的所述第二面,以便与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球与所述集成电路的第二组端子连接。
通常,所述焊料凸块端子被布置为焊料凸块端子构造,并且所述集成电路的所述第二组端子被布置为与所述焊料凸块端子构造一致的集成电路端子构造。在一个实施方式中,所述焊料凸块端子构造是直线的。另选地,所述焊料凸块端子构造是非直线的。
在所公开的实施方式中,所述焊料凸块端子是等距的。另选地,所述焊料凸块端子是非等距的。
在另一个所公开的实施方式中,所述焊线端子和所述焊料凸块端子在数量上相等。通常,所述焊线端子和所述焊料凸块端子对齐。
在还有的又一所公开的实施方式中,所述焊线端子和所述焊料凸块端子不对准。
根据本发明的实施方式,还提供了一种用于连接到集成电路的端子的方法,所述方法包括如下步骤:
设置具有第一面和第二面的电介质基板;
将焊线端子附接到所述基板的所述第一面,所述焊线端子被构造为接纳连接到所述集成电路的第一组端子的焊线;以及
将焊料凸块端子附接到所述基板的所述第二面,以便与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球与所述集成电路的第二组端子连接。
根据本发明的实施方式,还提供了一种内窥镜,所述内窥镜包括:
集成电路;
成像装置,所述成像装置形成在所述集成电路上;以及
连接器,所述连接器用于到所述集成电路的端子的连接,所述连接器包括:
电介质基板,所述电介质基板具有第一面和第二面;
焊线端子,所述焊线端子附接到所述基板的所述第一面,并且被构造为接纳连接到所述集成电路的第一组端子的焊线;以及
焊料凸块端子,所述焊料凸块端子附接到所述基板的所述第二面,以便与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球与所述集成电路的第二组端子连接。
根据本发明的实施方式,还提供了一种用于形成内窥镜的方法,所述方法包括如下步骤:
设置具有多个端子的集成电路;
在所述集成电路上实现成像装置;
将焊线端子附接到电介质基板的第一面,所述焊线端子被构造为接纳连接到所述集成电路的第一组端子的焊线;以及
将焊料凸块端子附接到所述电介质基板的第二面,以便与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球与所述集成电路的第二组端子连接。
根据结合附图获得的本发明的实施方式的以下详细描述,将更充分地理解本发明,在附图中:
附图说明
图1A是根据本发明的实施方式的附接到混合连接器的集成电路的示意性分解图,并且图1B是附接到连接器的集成电路的示意性装配图;
图2A、图2B和图2C分别是根据本发明的实施方式的混合连接器的示意性透视图、示意性侧视图和示意性正视图;
图3是示出根据本发明的另选实施方式的集成电路的一部分和连接到集成电路的连接器的一部分的示意图;
图4是示出根据本发明的又一另选实施方式的集成电路的一部分和连接到集成电路的连接器的一部分的示意图;
图5是示出根据本发明的还有的又一另选实施方式的集成电路的一部分和连接到集成电路的连接器的一部分的示意图;以及
图6是示出根据本发明的实施方式的使用混合连接器的内窥镜的示意图。
具体实施方式
概述
在特定领域中,诸如侵入性医疗过程,所使用的设备的小型化是非常有利的。由此,存在对减小集成电路的元件(包括到电路的连接)的尺寸的持续压力。
因此,减少连接的空间需求的、到集成电路的连接将是有利的。
本发明的实施方式提供一种以有效方式使用连接器上的空间的集成电路连接器。该连接器(在此也称作混合连接器)形成在电介质基板上,电介质基板通常是平面的且柔性的。焊线端子附接到基板的一面,焊线端子被构造为经由焊线连接到集成电路的第一组端子。焊料凸块端子附接到基板的第二面,以便与焊线端子绝缘。焊料凸块端子经由相应焊料球连接到集成电路的第二组端子。通常,为了将焊料凸块端子连接到集成电路的第二组端子,将两组端子布置为一致构造。
通常,虽然不是必须的,但是存在相等数量的焊线端子和焊料凸块端子,并且这两种类型的端子可以对齐,使得每个焊线端子与相应焊料凸块端子“相对”。这样的构造产生混合连接器上的空间的有效使用。例如,如果相邻焊线端子之间以及相邻焊料凸块端子之间的间隔为60μm,则连接器具有节距为60μm的两个端子。
由本发明的实施方式提供的空间需求的减少在多个领域是有利的,例如,在电子设备可能需要插入到病人体内的侵入性或微创医疗过程的领域中。作为特定示例,在微创过程中,可能需要将内窥镜插入到病人体内,以便结合混合连接器(如在此所描述的)使得能够改进内窥镜的小型化,随之给病人带来益处。
详细描述
图1A是根据本发明的实施方式的附接到混合连接器12的集成电路(IC)10的示意性分解图,并且图1B是附接到连接器的IC的示意性装配图。IC10通常被构造为绝缘基板14上的管芯(die),并且存在多条传导迹线16,该多条传导迹线16从管芯通往在基板的边缘处的通常相似的IC传导端子18。使用在基板的边缘处的IC传导端子(如下面进一步解释的),将管芯的元件连接到基板14外部的组件。连接经由混合连接器12。为了简单起见,在图1A和图1B未示出与迹线16所连接的管芯,并且图示出了IC10的边缘。
在本发明的实施方式中,假设IC传导端子18形成在基板的上表面20上作为第一行22并且作为第二行24。通常,行22和24是直线的,即,为一条直线,为了IC10制造的简单起见,并且除非另外阐述,在以下描述中假设为这种构造。然而,不要求行22和24是直线的,并且在本发明的一些实施方式中,至少一行是非直线的。因此,通过举例,在图1A和图1B中,假设在每行中存在8个传导端子,假设行是直线的,并且在一行内的相邻端子之间存在间隔p。然而,将理解的是,本发明的实施方式可以被实现用于每行中的任何合适数量的端子。
为了简单起见,以下描述涉及混合连接器12的部分30,混合连接器12的该部分30与在行22和24中的每行中具有四个传导端子18的IC12对应,但是本领域普通技术人员将能够使以下描述适用于每行中具有八个传导端子的IC12,或者适用于每行中具有任何合适数量的端子的IC。虽然混合连接器12的一些元件在图1A和图1B中用数字识别,但是为了清楚起见,将这些元件的解释留到在下面针对图2A、图2B和图2C提供的描述。
图2A、图2B和图2C是根据本发明的实施方式的混合连接器12的部分30的示意视图。图2A是部分30的示意性透视图,图2B是部分30的示意性侧视图,并且图2C是部分30的示意性正视图。假设混合连接器与绝缘的电介质基板40一起形成,该基板40为具有上表面42、下表面44、前表面46和侧表面48的平行六面体的形式。在以下描述中,为了清楚起见,针对附图使用名称上部、下部、前部和侧部,并且将理解,连接器12可以基本上在任何方位被使用。通常,虽然不是必须的,但是基板40是柔性基板。
基本相似的焊线传导端子50形成在上表面42上,并且这些端子连接到相应传导迹线52;针对部分30示出了连接到四条迹线52的四个端子50。通过举例,假设端子50为矩形。
基本相似的焊料凸块传导端子60形成在下表面44上,并且焊料凸块端子连接到相应传导迹线62;针对部分30示出了连接到四条迹线62的四个端子60。通过举例,假设端子60为圆形。相应焊料球64附接到每个焊料凸块传导端子60。焊料球还被已知为焊料凸块或焊接点。
焊料凸块端子60布置在表面44上,以便在数量和几何构造上与行24中的传导端子18对应。因此,在部分30中,四个焊料凸块端子60沿着直线行66布置,端子之间具有间隔p。
迹线52和62通常在迹线到焊线端子50和焊料凸块端子60的相对端处连接到使用IC10的设备。该连接可以直接到设备,或者另选地经由在迹线的相对端与设备之间连接的线缆连接到设备。为了简单起见,在图1A、图1B、图2A、图2B和图2C中未示出线缆和设备。
返回图1A和图1B,为了将连接器12附接到IC10,基板40被定位成使得焊料球64与集成电路的行24的传导端子18对齐并且接触。然后,通常使用超声波或另选地使用回流焊接工艺,可以使焊料球再熔化以产生电连接。然后,在连接器的下表面44与IC的上表面20之间剩余的空间通常可以被填充有电绝缘粘合剂,这与仅再熔化的焊料球相比,在IC10与连接器12之间提供了更好的机械连接。
为了完成IC10与连接器12之间的连接,然后使用焊线80将混合连接器的端子50连接到行22中的相应IC端子18。
通常,焊线端子50在数量上与焊料凸块端子60的数量对应。此外,焊线端子通常与焊料凸块端子对齐,这是由于数量上的对应关系和对齐产生在连接器12中可用的空间的有效使用。在图2A、图2B和图2C中示出了空间的这种有效使用。在一个实施方式中,焊线端子和焊料凸块端子对齐,并且p=60μm。这种布置提供了(在与迹线正交的方向上测量的)每60μm两条迹线52、62。
然而,虽然连接器12上的焊线端子50的数量与IC10的行22中的焊线端子18的数量对应,但是不要求在焊线端子50与焊料凸块端子60的数量之间存在对应关系。在连接器12中,也不要求焊线端子50和焊料凸块端子60对齐。因此,在本发明的一些实施方式中,焊线端子的数量不等于焊料凸块端子60的数量,和/或这两组端子不对准。
以上描述的实施方式假设连接器12的焊料凸块端子60以直线方式布置(即,为一条直线),并且相邻端子沿着该直线是等距的。相同布置(即,沿着直线是等距的)被假设用于IC10的行24中的端子18。然而,对于本发明的实施方式来说,不要求这样的直线等距布置,并且以下描述焊料凸块端子60和行24的端子18的其它可能布置的示例。
图3是示出根据本发明的实施方式的IC110的一部分和连接到IC110的连接器112的一部分的示意图。除了以下描述的差异之外,IC110和连接器112的操作通常与IC10和连接器12(图1A、图1B、图2A、图2B和图2C)的操作相似,并且在IC110和10中、以及在连接器112和12中由相同附图标记指示的元件在构造和操作上通常相似。为了简单起见,图3仅示出IC110的上表面20的一部分、以及连接器112的基板40的下表面44的相应部分。从自上面查看IC110和连接器112的人的视点绘制附图,使得上表面20上的元件在纸的平面上方,而下表面44上的元件在连接器112“下方”,即,在纸的平面的下面。为了清楚起见,在连接器112的图解中,仅示出连接器的下表面44上的元件。
在IC110中,上表面20具有第一行端子22,第一行端子22包括连接到相应迹线16的传导端子18。IC110包括第二行124端子18,其中,与IC10的行24不同,端子沿着曲线114A布置。通常,虽然不是必须的,但是沿着线114A布置的端子18是等距的,并且在以下描述中,假设行124的相邻端子之间的间距为“q”。
连接器112包括连接到迹线62的一行166焊料凸块端子60,并且焊料球64被安装在端子60上。与连接器12的行66不同,行166中的焊料凸块端子60沿着与曲线114A一致的曲线114B布置。此外,焊料凸块端子60沿着线114B的布置与端子18沿着线114A的布置一致,使得行166中的端子60在相邻端子60之间具有间距q。
针对连接器12和IC10,在将连接器12附接到IC110时,基板40被定位成使得行166中的焊料球64与IC110的行124的传导端子18对齐并且接触。然后,将焊料球再熔化以形成端子10与端子60之间的电连接。
图4是示出根据本发明的实施方式的IC210的一部分和连接到IC210的连接器212的一部分的示意图。除了以下描述的差异之外,IC210和连接器212的操作与IC10和连接器12(图1A、图1B、图2A、图2B、图2C和图3)的操作通常相似,并且在IC210和10中、以及在连接器212和12中由相同附图标记指示的元件在构造和操作上通常相似。
IC210和连接器212的图解基本与IC110和连接器112(图3)相同,使得从自上面查看IC210和连接器212的人的视点绘制IC210和连接器212。针对图3,在图4中,在连接器212的图解中,仅示出连接器的下表面44上的元件。
在IC210中,上表面20具有第一行端子22,第一行端子22包括连接到相应迹线16的传导端子18。IC210包括第二行224端子18,与IC10的行24(以及IC110的行124)不同,第二行224端子18沿着不规则“之字形”线214A布置。通常,虽然不是必须的,但是如果沿着与迹线16正交的线216测量,端子18被布置为等距的,并且在以下描述中,假设沿着线216的间距为“r”。
连接器212包括连接到迹线62的一行266焊料凸块端子60,并且焊料球64被安装在端子60上。与连接器12的行66不同,行266中的焊料凸块端子60沿着与不规则线214A一致的不规则线214B布置。此外,焊料凸块端子60沿着线214B的布置与端子18沿着线214A的布置一致,使得行266中的端子60具有关于线216测量的间距r。
为了将连接器212附接到IC210,基板40被定位成使得行266中的焊料球64与IC110的行224的传导端子18对齐并且接触。然后,将焊料球再熔化以形成端子18与端子60之间的电连接。
图5是示出根据本发明的实施方式的IC310的一部分和连接到IC310的连接器312的一部分的示意图。除了以下描述的差异之外,IC310和连接器312的操作基本与IC10和连接器12(图1A、图1B、图2A、图2B和图2C)的操作相似,并且在IC310和10中、以及在连接器312和12中的由相同附图标记指示的元件在构造和操作上通常相似。
IC310和连接器312的图解与IC110和连接器112(图3)基本相同,使得从自上面查看IC310和连接器312的人的视点绘制IC310和连接器312。在图5中,在连接器312的图解中,仅示出连接器的下表面44上的元件。
在IC310中,上表面20具有第一行端子22,第一行端子22包括连接到相应迹线16的传导端子18。IC310包括第二行324端子18,第二行324端子18沿着不规则非线性线314A布置。除了被布置在非线性线314A上之外,端子18被布置为在相邻端子18之间是不等距的。
连接器312包括连接到迹线62的一行366焊料凸块端子60,并且焊料球64被安装在端子60上。行366中的焊料凸块端子60沿着与不规则非线性线314A一致的不规则非线性线314B布置。此外,焊料凸块端子60沿着线314B的布置与端子18沿着线314A的布置一致。因此,相邻凸块端子60之间的不同间隔与相邻端子18之间的不同间隔一致。
连接器312到IC310的附接与以上描述的将连接器212附接到IC210基本相同。
图6是示出根据本发明的实施方式的使用混合连接器的内窥镜400的示意图。为了清楚起见并且通过举例,在以下描述中,假设内窥镜400使用连接到IC10的混合连接器12(如上所述),并且本领域普通技术人员能够使该描述适用于本发明的其它实施方式,诸如混合连接器112、212和312、以及除了IC10以外的集成电路。
成像装置402形成在IC10上,成像装置通常包括CCD(电荷耦合器件),CCD(电荷耦合器件)获取使用内窥镜查看的目标的图像。(成像装置402通常包括相应光学器件,但是为了简单起见,在图6中未示出这些光学器件。)成像装置402位于内窥镜的末端404处,并且该末端经由套管针406被插入到病人的体腔408中,使得装置402获取病人的体腔的壁410的图像。另外,位于末端404处的是混合连接器12,混合连接器12连接到IC10,如上所述,混合连接器的迹线(在迹线的与端子50和60相对的端部处)连接到内窥镜线缆420。
与现有技术内窥镜的末端相比,由混合连接器12提供的小型化允许末端404的直径减小,并且减小的直径对于其体腔被成像的病人是有益的。
内窥镜模块430连接到线缆420,该模块用于经由线缆和混合连接器12将电力和驱动信号提供到IC10和成像装置402。该模块还经由线缆和混合连接器接收来自装置402的图像信号,并且该模块处理信号以便在屏幕440上显示壁410的图像。诸如模块430的内窥镜模块在本领域中是众所周知,并且为了简单起见,这里将不再进一步描述。
虽然以上描述涉及混合连接器在内窥镜中的使用,但是将理解,由本发明的实施方式提供的减小的尺寸可以在其它领域中有利地被实现,诸如但不限于组件的尺寸减小很重要的非医学领域。因此,将想到,以上描述的实施方式通过举例被引用,并且本发明不限于在上文特别示出并且描述的内容。而是,本发明的范围包括在上文描述的各种特征的组合和子组合二者,以及当阅读前面的描述时对于本领域技术人员将发生的并且在现有技术中未公开的各种特征的变形和改变。
Claims (20)
1.一种用于到集成电路的端子的连接的连接器,该连接器包括:
电介质基板,所述电介质基板具有第一面和第二面;
焊线端子,所述焊线端子附接到所述基板的所述第一面,并且被构造为接纳连接到所述集成电路的第一组端子的焊线;以及
焊料凸块端子,所述焊料凸块端子附接到所述基板的所述第二面,以与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球与所述集成电路的第二组端子连接。
2.根据权利要求1所述的连接器,其中,所述焊料凸块端子被布置为焊料凸块端子构造,并且所述集成电路的所述第二组端子被布置为与所述焊料凸块端子构造一致的集成电路端子构造。
3.根据权利要求2所述的连接器,其中,所述焊料凸块端子构造是直线的。
4.根据权利要求2所述的连接器,其中,所述焊料凸块端子构造是非直线的。
5.根据权利要求1所述的连接器,其中,所述焊料凸块端子是等距的。
6.根据权利要求1所述的连接器,其中,所述焊料凸块端子是非等距的。
7.根据权利要求1所述的连接器,其中,所述焊线端子和所述焊料凸块端子在数量上相等。
8.根据权利要求7所述的连接器,其中,所述焊线端子和所述焊料凸块端子对准。
9.根据权利要求1至8中任一项所述的连接器,其中,所述焊线端子和所述焊料凸块端子不对准。
10.一种用于连接到集成电路的端子的方法,所述方法包括如下步骤:
设置具有第一面和第二面的电介质基板;
将焊线端子附接到所述基板的所述第一面,所述焊线端子被构造为接纳连接到所述集成电路的第一组端子的焊线;以及
将焊料凸块端子附接到所述基板的所述第二面,以与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球与所述集成电路的第二组端子连接。
11.根据权利要求10所述的方法,所述方法包括以下步骤:
将所述焊料凸块端子布置为焊料凸块端子构造;以及
将所述集成电路的所述第二组端子布置为与所述焊料凸块端子构造一致的集成电路端子构造。
12.根据权利要求11所述的方法,其中,所述焊料凸块端子构造是直线的。
13.根据权利要求11所述的方法,其中,所述焊料凸块端子构造是非直线的。
14.根据权利要求10所述的方法,其中,所述焊料凸块端子是等距的。
15.根据权利要求10所述的方法,其中,所述焊料凸块端子是非等距的。
16.根据权利要求10所述的方法,其中,所述焊线端子和所述焊料凸块端子在数量上是相等的。
17.根据权利要求16所述的方法,其中,所述焊线端子和所述焊料凸块端子对准。
18.根据权利要求10至17中任一项所述的方法,其中,所述焊线端子和所述焊料凸块端子不对准。
19.一种内窥镜,所述内窥镜包括:
集成电路;
成像装置,所述成像装置形成在所述集成电路上;以及
连接器,所述连接器用于到所述集成电路的端子的连接,所述连接器包括:
电介质基板,所述电介质基板具有第一面和第二面;
焊线端子,所述焊线端子附接到所述基板的所述第一面,并且被构造为接纳连接到所述集成电路的第一组端子的焊线;以及
焊料凸块端子,所述焊料凸块端子附接到所述基板的所述第二面,以与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球与所述集成电路的第二组端子连接。
20.一种用于形成内窥镜的方法,所述方法包括如下步骤:
设置具有多个端子的集成电路;
在所述集成电路上实现成像装置;
将焊线端子附接到电介质基板的第一面,所述焊线端子被构造为接纳连接到所述集成电路的第一组端子的焊线;以及
将焊料凸块端子附接到所述电介质基板的第二面,以与所述焊线端子绝缘,所述焊料凸块端子被构造为经由焊料球与所述集成电路的第二组端子连接。
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2013
- 2013-07-02 US US13/933,145 patent/US9257763B2/en active Active
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2014
- 2014-06-18 CN CN201480032495.4A patent/CN105265028B/zh not_active Expired - Fee Related
- 2014-06-18 WO PCT/US2014/042825 patent/WO2015002735A1/en active Application Filing
- 2014-06-18 EP EP14737123.1A patent/EP3017665B1/en not_active Not-in-force
- 2014-06-18 JP JP2015563153A patent/JP2016528933A/ja active Pending
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US9257763B2 (en) | 2016-02-09 |
CN105265028B (zh) | 2016-08-24 |
EP3017665A1 (en) | 2016-05-11 |
WO2015002735A1 (en) | 2015-01-08 |
EP3017665B1 (en) | 2017-11-08 |
US20150011832A1 (en) | 2015-01-08 |
JP2016528933A (ja) | 2016-09-23 |
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