CN105164794B - 用于声学监视及控制穿透硅的通孔显露处理的设备及方法 - Google Patents

用于声学监视及控制穿透硅的通孔显露处理的设备及方法 Download PDF

Info

Publication number
CN105164794B
CN105164794B CN201480024607.1A CN201480024607A CN105164794B CN 105164794 B CN105164794 B CN 105164794B CN 201480024607 A CN201480024607 A CN 201480024607A CN 105164794 B CN105164794 B CN 105164794B
Authority
CN
China
Prior art keywords
hole
substrate
sonic transducer
polishing pad
pressing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480024607.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN105164794A (zh
Inventor
X·Y·周
K·苏布拉马尼亚姆
U·玛哈简
B·A·斯韦德克
R·巴贾杰
J·唐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN105164794A publication Critical patent/CN105164794A/zh
Application granted granted Critical
Publication of CN105164794B publication Critical patent/CN105164794B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201480024607.1A 2013-05-01 2014-04-28 用于声学监视及控制穿透硅的通孔显露处理的设备及方法 Active CN105164794B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/874,495 US20140329439A1 (en) 2013-05-01 2013-05-01 Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing
US13/874,495 2013-05-01
PCT/US2014/035756 WO2014179241A1 (en) 2013-05-01 2014-04-28 Apparatus and methods for acoustical monitoring and control of through-silicon-via reveal processing

Publications (2)

Publication Number Publication Date
CN105164794A CN105164794A (zh) 2015-12-16
CN105164794B true CN105164794B (zh) 2019-01-11

Family

ID=51841646

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480024607.1A Active CN105164794B (zh) 2013-05-01 2014-04-28 用于声学监视及控制穿透硅的通孔显露处理的设备及方法

Country Status (6)

Country Link
US (1) US20140329439A1 (enExample)
JP (1) JP6397896B2 (enExample)
KR (1) KR102242321B1 (enExample)
CN (1) CN105164794B (enExample)
TW (1) TWI686264B (enExample)
WO (1) WO2014179241A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9403254B2 (en) * 2011-08-17 2016-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for real-time error detection in CMP processing
US10478937B2 (en) * 2015-03-05 2019-11-19 Applied Materials, Inc. Acoustic emission monitoring and endpoint for chemical mechanical polishing
KR102333209B1 (ko) 2015-04-28 2021-12-01 삼성디스플레이 주식회사 기판 연마 장치
US11077536B2 (en) * 2016-06-24 2021-08-03 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing
KR102420044B1 (ko) * 2016-09-15 2022-07-11 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱 스마트 링
US10695907B2 (en) * 2017-09-29 2020-06-30 Intel Corporation Methods and apparatus for monitoring robot health in manufacturing environments
US11565365B2 (en) * 2017-11-13 2023-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring chemical mechanical polishing
CN108188931A (zh) * 2017-12-22 2018-06-22 华侨大学 双面行星磨削/研磨加工中工件破碎的在线控制系统
CN111684571A (zh) * 2018-02-05 2020-09-18 应用材料公司 用于3d打印的cmp垫的压电终点指示
JP7354131B2 (ja) 2018-03-13 2023-10-02 アプライド マテリアルズ インコーポレイテッド 化学機械研磨中の振動のモニタリング
JP7116645B2 (ja) * 2018-09-12 2022-08-10 キオクシア株式会社 研磨装置
JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
US11289387B2 (en) * 2020-07-31 2022-03-29 Applied Materials, Inc. Methods and apparatus for backside via reveal processing
JP7682641B2 (ja) * 2021-02-22 2025-05-26 株式会社荏原製作所 基板処理装置
JP7690297B2 (ja) 2021-02-22 2025-06-10 キオクシア株式会社 基板処理の制御方法
KR102937575B1 (ko) 2021-03-03 2026-03-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 음향 모니터링 및 센서들
CN117597215A (zh) 2021-07-06 2024-02-23 应用材料公司 使用光学传感器的化学机械抛光振动测量
TWI879629B (zh) * 2021-07-06 2025-04-01 美商應用材料股份有限公司 用於化學機械拋光之包含聲學窗口的拋光墊、包含其之化學機械拋光設備及製造其之方法
US12403561B2 (en) 2022-03-09 2025-09-02 Applied Materials, Inc. Eddy current monitoring to detect vibration in polishing
KR20250018544A (ko) * 2022-06-03 2025-02-06 어플라이드 머티어리얼스, 인코포레이티드 음향 신호들을 이용한 기판 배향 결정

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6488569B1 (en) * 1999-07-23 2002-12-03 Florida State University Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
US6585562B2 (en) * 2001-05-17 2003-07-01 Nevmet Corporation Method and apparatus for polishing control with signal peak analysis
US7118457B2 (en) * 2000-05-19 2006-10-10 Applied Materials, Inc. Method of forming a polishing pad for endpoint detection
US7537511B2 (en) * 2006-03-14 2009-05-26 Micron Technology, Inc. Embedded fiber acoustic sensor for CMP process endpoint

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2600001B1 (fr) * 1986-06-11 1988-09-09 Meseltron Sa Dispositif pour la commande de la vitesse d'avance d'un outil vers une piece a usiner
JP2011249833A (ja) * 1995-03-28 2011-12-08 Applied Materials Inc Ｃｍｐプロセス中のインシチュウ終点検出に用いるポリッシングパッド
JP3431115B2 (ja) * 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US6910942B1 (en) * 1997-06-05 2005-06-28 The Regents Of The University Of California Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus
JPH11183447A (ja) * 1997-12-19 1999-07-09 Nippei Toyama Corp 被加工材の割れ発生予知方法及びこれを利用したウエハの加工方法並びに研削盤
JPH11254311A (ja) * 1998-03-09 1999-09-21 Super Silicon Kenkyusho:Kk 研磨時の薄板状ワーク破損防止方法
JPH11254304A (ja) * 1998-03-10 1999-09-21 Super Silicon Kenkyusho:Kk センサを組み込んだ定盤
JP2000306963A (ja) * 1999-04-22 2000-11-02 Mitsubishi Electric Corp 半導体装置及びその製造方法並びに半導体製造装置及び製造システム
JP3292243B2 (ja) * 1999-06-30 2002-06-17 日本電気株式会社 研磨終点検出装置
US6924641B1 (en) * 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US6485354B1 (en) * 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
US6424137B1 (en) * 2000-09-18 2002-07-23 Stmicroelectronics, Inc. Use of acoustic spectral analysis for monitoring/control of CMP processes
US20020090889A1 (en) * 2001-01-10 2002-07-11 Crevasse Annette M. Apparatus and method of determining an endpoint during a chemical-mechanical polishing process
TW536454B (en) * 2001-02-14 2003-06-11 Taiwan Semiconductor Mfg Apparatus and method for detecting polishing endpoint of chemical-mechanical planarization/polishing of wafer
JP2003086551A (ja) * 2001-09-07 2003-03-20 Mitsubishi Electric Corp 半導体研磨装置、半導体研磨の終点検出方法および研磨ヘッドのドレスの終点検出方法
US6646737B2 (en) * 2001-09-24 2003-11-11 Kla-Tencor Technologies Submicron dimensional calibration standards and methods of manufacture and use
US6660539B1 (en) * 2001-11-07 2003-12-09 Advanced Micro Devices, Inc. Methods for dynamically controlling etch endpoint time, and system for accomplishing same
US6586337B2 (en) * 2001-11-09 2003-07-01 Speedfam-Ipec Corporation Method and apparatus for endpoint detection during chemical mechanical polishing
US6722946B2 (en) * 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US6878039B2 (en) * 2002-01-28 2005-04-12 Speedfam-Ipec Corporation Polishing pad window for a chemical-mechanical polishing tool
US6808590B1 (en) * 2002-06-28 2004-10-26 Lam Research Corporation Method and apparatus of arrayed sensors for metrological control
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US6991514B1 (en) * 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
US20090298388A1 (en) * 2006-05-03 2009-12-03 Yuzhou Li Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die
US7887392B2 (en) * 2007-06-06 2011-02-15 Novellus Systems, Inc. Platen assembly and work piece carrier head employing flexible circuit sensor
US8106651B2 (en) * 2008-04-17 2012-01-31 Novellus Systems, Inc. Methods and apparatuses for determining thickness of a conductive layer
KR101618354B1 (ko) * 2008-05-08 2016-05-04 어플라이드 머티어리얼스, 인코포레이티드 Cmp 패드 두께 및 프로파일 모니터링 시스템
KR101601346B1 (ko) * 2008-12-12 2016-03-08 아사히 가라스 가부시키가이샤 연마 장치 및 연마 방법, 및 유리판의 제조 방법
DE102009015718B4 (de) * 2009-03-31 2012-03-29 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Testsystem und Verfahren zum Verringern der Schäden in Saatschichten in Metallisierungssystemen von Halbleiterbauelementen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6488569B1 (en) * 1999-07-23 2002-12-03 Florida State University Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
US7118457B2 (en) * 2000-05-19 2006-10-10 Applied Materials, Inc. Method of forming a polishing pad for endpoint detection
US6585562B2 (en) * 2001-05-17 2003-07-01 Nevmet Corporation Method and apparatus for polishing control with signal peak analysis
US7537511B2 (en) * 2006-03-14 2009-05-26 Micron Technology, Inc. Embedded fiber acoustic sensor for CMP process endpoint

Also Published As

Publication number Publication date
TWI686264B (zh) 2020-03-01
WO2014179241A1 (en) 2014-11-06
US20140329439A1 (en) 2014-11-06
TW201503995A (zh) 2015-02-01
KR102242321B1 (ko) 2021-04-21
CN105164794A (zh) 2015-12-16
JP6397896B2 (ja) 2018-09-26
KR20160003247A (ko) 2016-01-08
JP2016517185A (ja) 2016-06-09

Similar Documents

Publication Publication Date Title
KR102242321B1 (ko) 관통 실리콘 비아 노출 처리의 음향 모니터링 및 제어를 위한 장치 및 방법
US6488569B1 (en) Method and apparatus for detecting micro-scratches in semiconductor wafers during polishing process
US12521836B2 (en) System and method for monitoring chemical mechanical polishing
TW316248B (enExample)
CN102956521B (zh) 用于在cmp加工中实时差错检测的装置和方法
US6709314B2 (en) Chemical mechanical polishing endpoinat detection
US20160013085A1 (en) In-Situ Acoustic Monitoring of Chemical Mechanical Polishing
US6424137B1 (en) Use of acoustic spectral analysis for monitoring/control of CMP processes
TW556282B (en) CMP process involving frequency analysis-based monitoring
TWI720443B (zh) 用於化學機械研磨的保持環及包括此之承載頭
JP2018508123A (ja) アコースティックエミッションモニタリング及び化学機械研磨の終点
US20190283204A1 (en) Monitoring of Vibrations During Chemical Mechanical Polishing
TW201018544A (en) Polishing method and apparatus
JP3292243B2 (ja) 研磨終点検出装置
JP2006500768A (ja) 複数工程の手順内での金属残留物の検出およびマッピングのためのシステムおよび方法
CN108858834B (zh) 切削装置
JP2003236749A (ja) 研磨装置及び研磨方法
JP2024509546A (ja) 化学機械研磨のための音響モニタリングおよびセンサ
TWI837735B (zh) 用於偵測拋光中振動的渦電流監測的方法、電腦程式產品以及系統
TW536454B (en) Apparatus and method for detecting polishing endpoint of chemical-mechanical planarization/polishing of wafer
TW202610766A (zh) 用於資料分析和處理控制的波形訊號封裝
WO2023234973A1 (en) Acoustic monitoring of cmp retaining ring
CN119609936A (zh) 晶圆研磨设备及晶圆研磨方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant