CN104892905B - 热固性树脂组合物、固化物及改性酚树脂的制造方法 - Google Patents

热固性树脂组合物、固化物及改性酚树脂的制造方法 Download PDF

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Publication number
CN104892905B
CN104892905B CN201510067709.8A CN201510067709A CN104892905B CN 104892905 B CN104892905 B CN 104892905B CN 201510067709 A CN201510067709 A CN 201510067709A CN 104892905 B CN104892905 B CN 104892905B
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CN
China
Prior art keywords
resin
compositions
modified phenolic
thermosetting resin
hydrogen atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201510067709.8A
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English (en)
Chinese (zh)
Other versions
CN104892905A (zh
Inventor
泷本进
泷本进一
山腰千巳
新美仁志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eike Kogyo K. K.
Original Assignee
Agfa Sdk Phenol Co Ltd
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Publication date
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Publication of CN104892905A publication Critical patent/CN104892905A/zh
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Publication of CN104892905B publication Critical patent/CN104892905B/zh
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
CN201510067709.8A 2014-03-04 2015-02-09 热固性树脂组合物、固化物及改性酚树脂的制造方法 Expired - Fee Related CN104892905B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014041807A JP6497639B2 (ja) 2014-03-04 2014-03-04 熱硬化性樹脂組成物、硬化物及び変性フェノール樹脂の製造方法
JP2014-041807 2014-03-04

Publications (2)

Publication Number Publication Date
CN104892905A CN104892905A (zh) 2015-09-09
CN104892905B true CN104892905B (zh) 2018-09-11

Family

ID=54025902

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CN201510067709.8A Expired - Fee Related CN104892905B (zh) 2014-03-04 2015-02-09 热固性树脂组合物、固化物及改性酚树脂的制造方法

Country Status (4)

Country Link
JP (1) JP6497639B2 (ko)
KR (1) KR20150104026A (ko)
CN (1) CN104892905B (ko)
TW (1) TW201544538A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019198378A1 (ja) * 2018-04-13 2021-02-12 株式会社Moresco 化合物およびその利用
KR20200135696A (ko) 2019-05-25 2020-12-03 이한울 하차알림 기능을 구비한 버스의자

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101045839A (zh) * 2007-04-10 2007-10-03 深圳市容大电子材料有限公司 一种液态感光防焊油墨及其在电路板印制的应用
CN101220224A (zh) * 2008-01-23 2008-07-16 深圳市容大电子材料有限公司 一种uv固化抗碱性蚀刻油墨组合物及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0551507A (ja) * 1991-08-26 1993-03-02 Soken Kagaku Kk 熱硬化性アクリレート系組成物
JPH10180403A (ja) * 1996-12-26 1998-07-07 Sumitomo Bakelite Co Ltd 樹脂組成物、永久レジスト樹脂組成物及びこれらの硬化物
JP4244421B2 (ja) * 1999-01-06 2009-03-25 住友ベークライト株式会社 硬化性樹脂組成物及びその増粘方法
JP4514011B2 (ja) * 2001-09-13 2010-07-28 日本化薬株式会社 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2005082782A (ja) * 2003-09-11 2005-03-31 Showa Highpolymer Co Ltd 導電性硬化性樹脂組成物
US20090156715A1 (en) * 2007-12-14 2009-06-18 Thomas Eugene Dueber Epoxy compositions comprising at least one elastomer and methods relating thereto
KR101248008B1 (ko) * 2012-05-02 2013-03-27 주식회사 이녹스 반도체 패키지용 접착필름

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101045839A (zh) * 2007-04-10 2007-10-03 深圳市容大电子材料有限公司 一种液态感光防焊油墨及其在电路板印制的应用
CN101220224A (zh) * 2008-01-23 2008-07-16 深圳市容大电子材料有限公司 一种uv固化抗碱性蚀刻油墨组合物及其应用

Also Published As

Publication number Publication date
JP6497639B2 (ja) 2019-04-10
KR20150104026A (ko) 2015-09-14
CN104892905A (zh) 2015-09-09
TW201544538A (zh) 2015-12-01
JP2015166437A (ja) 2015-09-24

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TA01 Transfer of patent application right

Effective date of registration: 20151120

Address after: Gunma

Applicant after: Agfa SDK phenol Co Ltd

Address before: Tokyo, Japan, Japan

Applicant before: Showa Denko K. K.

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GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20190218

Address after: Aichi

Patentee after: Eike Kogyo K. K.

Address before: Gunma

Patentee before: Agfa SDK phenol Co Ltd

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180911

Termination date: 20200209