CN104862767B - 镀铜槽 - Google Patents
镀铜槽 Download PDFInfo
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- CN104862767B CN104862767B CN201510291938.8A CN201510291938A CN104862767B CN 104862767 B CN104862767 B CN 104862767B CN 201510291938 A CN201510291938 A CN 201510291938A CN 104862767 B CN104862767 B CN 104862767B
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- anode
- copper plating
- overflow
- plating
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CN201510291938.8A CN104862767B (zh) | 2015-05-29 | 2015-05-29 | 镀铜槽 |
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CN201510291938.8A CN104862767B (zh) | 2015-05-29 | 2015-05-29 | 镀铜槽 |
Publications (2)
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CN104862767A CN104862767A (zh) | 2015-08-26 |
CN104862767B true CN104862767B (zh) | 2017-05-10 |
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CN201510291938.8A Active CN104862767B (zh) | 2015-05-29 | 2015-05-29 | 镀铜槽 |
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CN (1) | CN104862767B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102057258B1 (ko) * | 2019-05-24 | 2019-12-18 | (주)엠앤에스코리아 | 도금장치 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105063709B (zh) * | 2015-09-18 | 2018-02-23 | 安捷利电子科技(苏州)有限公司 | 印刷电路板用电镀装置 |
CN106637331A (zh) * | 2015-10-28 | 2017-05-10 | 东莞市希锐自动化科技股份有限公司 | 一种带送板装置和喷流机构的pcb软板电镀铜缸 |
GB2564893B (en) * | 2017-07-27 | 2020-12-16 | Semsysco Gmbh | Distribution system for chemical and/or electrolytic surface treatment |
JP6779547B2 (ja) * | 2017-09-20 | 2020-11-04 | 株式会社アルメックステクノロジーズ | 電解処理アッセンブリー及びそれを用いた表面処理装置 |
JP6875758B2 (ja) * | 2017-10-20 | 2021-05-26 | 株式会社アルメックステクノロジーズ | 表面処理装置 |
CN109852996B (zh) * | 2019-04-12 | 2024-02-23 | 株洲稷维环保有限公司 | 一种电沉积回收铜装置及应用其的铜回收产线 |
CN110804757B (zh) * | 2019-11-27 | 2024-02-20 | 镇江耐丝新型材料有限公司 | 一种用于镀铜槽内的铜粒平整工装 |
CN112593267B (zh) * | 2020-11-13 | 2022-04-29 | 吴勇军 | 一种电镀设备 |
CN114808084A (zh) | 2021-01-29 | 2022-07-29 | 泰科电子(上海)有限公司 | 电镀装置和电镀系统 |
CN114808057A (zh) * | 2021-01-29 | 2022-07-29 | 泰科电子(上海)有限公司 | 电镀装置和电镀系统 |
CN115613106B (zh) * | 2022-11-28 | 2023-04-07 | 罗博特科智能科技股份有限公司 | 一种插片式太阳能电池片铜电极电镀装置及方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4828654A (en) * | 1988-03-23 | 1989-05-09 | Protocad, Inc. | Variable size segmented anode array for electroplating |
CN2525104Y (zh) * | 2002-02-28 | 2002-12-11 | 亚智科技股份有限公司 | 阳极装置改良结构 |
US7368042B2 (en) * | 2004-12-30 | 2008-05-06 | United Microelectronics Corp. | Electroplating apparatus including a real-time feedback system |
CN101220499B (zh) * | 2007-08-29 | 2010-06-02 | 中国电子科技集团公司第二研究所 | 预镀铜导电极保护装置 |
CN201729900U (zh) * | 2010-05-11 | 2011-02-02 | 上海元豪表面处理有限公司 | 微电子元件框架高速电镀用电镀槽 |
CN201801621U (zh) * | 2010-09-29 | 2011-04-20 | 苏州创峰光电科技有限公司 | 电镀薄板的装置 |
CN203007457U (zh) * | 2012-11-30 | 2013-06-19 | 东莞市富默克化工有限公司 | 一种pcb电镀槽 |
CN204058631U (zh) * | 2014-07-01 | 2014-12-31 | 东莞宇宙电路板设备有限公司 | 电镀设备及电镀设备的导电装置 |
CN204874804U (zh) * | 2015-05-29 | 2015-12-16 | 东莞市开美电路板设备有限公司 | 镀铜槽 |
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2015
- 2015-05-29 CN CN201510291938.8A patent/CN104862767B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102057258B1 (ko) * | 2019-05-24 | 2019-12-18 | (주)엠앤에스코리아 | 도금장치 |
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Publication number | Publication date |
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CN104862767A (zh) | 2015-08-26 |
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PB01 | Publication | ||
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Jiang Xinde Inventor after: Shu Yingchun Inventor after: Tu Yigui Inventor after: Gao Zhensheng Inventor before: Jiang Xinde Inventor before: Shu Yingchun |
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CB03 | Change of inventor or designer information | ||
CP02 | Change in the address of a patent holder |
Address after: Yongji Industrial Park No. 189 523690 Guangdong city of Dongguan province Fenggang Zhen Zhu Tian Cun Wei Patentee after: DONGGUAN KAIMEI CIRCUIT BOARD EQUIPMENT CO.,LTD. Address before: 523697, 189-3, Feng deep road, bamboo tail village, Fenggang Town, Guangdong, Dongguan Patentee before: DONGGUAN KAIMEI CIRCUIT BOARD EQUIPMENT CO.,LTD. |
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CP02 | Change in the address of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230828 Address after: 334000, 025, Anxia Group, Yinbaohu Township, Poyang County, Shangrao City, Jiangxi Province Patentee after: Jiang Xinde Address before: Yongji Industrial Park, No. 189 Zhuweitian Village, Fenggang Town, Dongguan City, Guangdong Province, 523690 Patentee before: DONGGUAN KAIMEI CIRCUIT BOARD EQUIPMENT CO.,LTD. |
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TR01 | Transfer of patent right |