CN104640700A - 脱模膜 - Google Patents

脱模膜 Download PDF

Info

Publication number
CN104640700A
CN104640700A CN201380048036.0A CN201380048036A CN104640700A CN 104640700 A CN104640700 A CN 104640700A CN 201380048036 A CN201380048036 A CN 201380048036A CN 104640700 A CN104640700 A CN 104640700A
Authority
CN
China
Prior art keywords
release film
mold release
film
release layer
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380048036.0A
Other languages
English (en)
Chinese (zh)
Inventor
谷口裕人
八束太一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN104640700A publication Critical patent/CN104640700A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Laminated Bodies (AREA)
CN201380048036.0A 2012-09-18 2013-09-05 脱模膜 Pending CN104640700A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012204660 2012-09-18
JP2012-204660 2012-09-18
PCT/JP2013/073962 WO2014045888A1 (ja) 2012-09-18 2013-09-05 離型フィルム

Publications (1)

Publication Number Publication Date
CN104640700A true CN104640700A (zh) 2015-05-20

Family

ID=50341205

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380048036.0A Pending CN104640700A (zh) 2012-09-18 2013-09-05 脱模膜

Country Status (5)

Country Link
JP (1) JP6222095B2 (ko)
KR (1) KR20150058179A (ko)
CN (1) CN104640700A (ko)
TW (1) TWI609781B (ko)
WO (1) WO2014045888A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109863024A (zh) * 2016-08-25 2019-06-07 东丽薄膜先端加工股份有限公司 脱模膜
CN110461594A (zh) * 2017-03-22 2019-11-15 住友电木株式会社 脱模膜及挠性印刷电路基板的制造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015202662A (ja) * 2014-04-16 2015-11-16 住友ベークライト株式会社 離型フィルムの製造方法
JP6352034B2 (ja) * 2014-04-21 2018-07-04 三井化学東セロ株式会社 多層離型フィルム
JP2015221849A (ja) * 2014-05-22 2015-12-10 帝人株式会社 離形フィルム
JP2016168688A (ja) * 2015-03-11 2016-09-23 住友ベークライト株式会社 離型フィルム
JP7277092B2 (ja) * 2017-08-31 2023-05-18 積水化学工業株式会社 離型フィルム

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006104361A (ja) * 2004-10-06 2006-04-20 Toray Ind Inc ポリエステル樹脂組成物
JP2007084760A (ja) * 2005-09-26 2007-04-05 Taihei Kagaku Seihin Kk 離型フィルムおよびその製造方法
JP2008105319A (ja) * 2006-10-26 2008-05-08 Sekisui Chem Co Ltd 多層離型フィルム
JP2009066984A (ja) * 2007-09-14 2009-04-02 Mitsubishi Engineering Plastics Corp 熱プレス成形用離型フィルム
JP2010209234A (ja) * 2009-03-11 2010-09-24 Wintech Polymer Ltd 芳香族ポリエステル組成物
JP2010234794A (ja) * 2009-03-10 2010-10-21 Dainippon Printing Co Ltd 離型フィルムおよびその製造方法
JP2011230363A (ja) * 2010-04-27 2011-11-17 Sumitomo Bakelite Co Ltd 離型フィルム
JP2012135935A (ja) * 2010-12-27 2012-07-19 Sumitomo Bakelite Co Ltd 離型フィルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2051823A (en) * 1979-06-19 1981-01-21 Ici Ltd Polyethyleneterephthalates
CN101175637B (zh) * 2005-05-13 2012-07-25 三井化学株式会社 含有4-甲基-1-戊烯类聚合物的层合体及由其构成的脱模膜
JP5354858B2 (ja) * 2006-05-09 2013-11-27 株式会社Ａｄｅｋａ スルホンアミド化合物の金属塩を含有するポリエステル樹脂組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006104361A (ja) * 2004-10-06 2006-04-20 Toray Ind Inc ポリエステル樹脂組成物
JP2007084760A (ja) * 2005-09-26 2007-04-05 Taihei Kagaku Seihin Kk 離型フィルムおよびその製造方法
JP2008105319A (ja) * 2006-10-26 2008-05-08 Sekisui Chem Co Ltd 多層離型フィルム
JP2009066984A (ja) * 2007-09-14 2009-04-02 Mitsubishi Engineering Plastics Corp 熱プレス成形用離型フィルム
JP2010234794A (ja) * 2009-03-10 2010-10-21 Dainippon Printing Co Ltd 離型フィルムおよびその製造方法
JP2010209234A (ja) * 2009-03-11 2010-09-24 Wintech Polymer Ltd 芳香族ポリエステル組成物
JP2011230363A (ja) * 2010-04-27 2011-11-17 Sumitomo Bakelite Co Ltd 離型フィルム
JP2012135935A (ja) * 2010-12-27 2012-07-19 Sumitomo Bakelite Co Ltd 離型フィルム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109863024A (zh) * 2016-08-25 2019-06-07 东丽薄膜先端加工股份有限公司 脱模膜
CN109863024B (zh) * 2016-08-25 2020-12-25 东丽薄膜先端加工股份有限公司 脱模膜
CN112519373A (zh) * 2016-08-25 2021-03-19 东丽薄膜先端加工股份有限公司 脱模膜
CN110461594A (zh) * 2017-03-22 2019-11-15 住友电木株式会社 脱模膜及挠性印刷电路基板的制造方法
CN110461594B (zh) * 2017-03-22 2021-02-12 住友电木株式会社 脱模膜及挠性印刷电路基板的制造方法

Also Published As

Publication number Publication date
KR20150058179A (ko) 2015-05-28
WO2014045888A1 (ja) 2014-03-27
JPWO2014045888A1 (ja) 2016-08-18
JP6222095B2 (ja) 2017-11-01
TW201420340A (zh) 2014-06-01
TWI609781B (zh) 2018-01-01

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20150520