CN104640700A - Release film - Google Patents
Release film Download PDFInfo
- Publication number
- CN104640700A CN104640700A CN201380048036.0A CN201380048036A CN104640700A CN 104640700 A CN104640700 A CN 104640700A CN 201380048036 A CN201380048036 A CN 201380048036A CN 104640700 A CN104640700 A CN 104640700A
- Authority
- CN
- China
- Prior art keywords
- release film
- mold release
- film
- release layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Laminated Bodies (AREA)
Abstract
Provided is a release film that improves releasability at the time of bonding a CL film onto a circuit-exposed film (and particularly reduces peeling failures due to excessive adhesion between the release film and a CL adhesive), and that can achieve excellent embeddability as with conventional release films. This release film comprises: a release layer including a polybutylene terephthalate-based resin and slip additive particles; and a cushion layer. The release film is characterized in that the slip additive particles each include an ester group and a nonpolar group.
Description
Technical field
The present invention relates to mold release film.
The Japanese Patent Application 2012-204660 CLAIM OF PRIORITY that the application proposed in Japan based on September 18th, 2012, and here cite and add its content.
Background technology
Propose one in the past and " possess the mold release film (hereinafter referred to as " PBT mold release film ") of the release layer be made up of polybutylene terephthalate (PBT) resin " (No. 4099355th, Japan Patent).Such mold release film such as uses when making flexible printed circuit substrate (hereinafter referred to as " FPC "), to be adhered to by covering layer film (hereinafter referred to as " CL film ") on the flexible membrane (hereinafter referred to as " circuit exposes film ") exposing circuit by hot pressing via bonding agent.So, such mold release film, CL film be adhered to circuit expose film time, can prevent release layer from exposing the excessively closely sealed of film, CL film and CL bonding agent and release layer fusion each other to circuit, and show good imbedibility (adaptability to the circuit pattern part do not covered by CL film (jog)), circuit can be exposed the bonding agent between film and CL film and control in allowed band to the seepage discharge of its circuit pattern part.
But when as described in Patent Document 1 PBT monomer being used for release layer, the closing force of PBT and FPC is strong, deposits the problem being difficult to mold release film to be peeled off from FPC after hot-pressing.
Prior art document
Patent document
Patent document 1: Japan Patent No. 4099355 publication
Summary of the invention
Invent problem to be solved
The object of the present invention is to provide a kind of mold release film, when CL film being adhered to circuit and exposing film, improve release property (excessively closely sealed the caused stripping particularly reduced due to mold release film and CL bonding agent is bad), and good imbedibility can be obtained in the same manner as existing mold release film.For solving the technical scheme of problem
Such object can be realized by the present invention described in following (1) ~ (9).
(1) mold release film, is characterized in that, has release layer and cushion, and above-mentioned release layer contains polybutylene terephthalate (PBT) system resin and lubricant particles, and above-mentioned lubricant particles has ester group and non-polar group.
(2) mold release film according to above-mentioned (1), the difference of the solubility parameter of above-mentioned lubricant particles and above-mentioned release layer is less than 8.0.
(3) mold release film according to above-mentioned (1) or (2), the average grain diameter of above-mentioned lubricant particles is more than 0.05 μm less than 10.0 μm.
(4) mold release film according to any one of above-mentioned (1) ~ (3), the addition of above-mentioned lubricant particles is more than 0.01wt% below 5wt%.
(5) mold release film according to any one of above-mentioned (1) ~ (4), the surface free energy E of above-mentioned release layer is 50mJ/m
2below.
(6) mold release film according to any one of above-mentioned (1) ~ (5), above-mentioned cushion has polyester based resin and polyolefin-based resins.
(7) mold release film according to above-mentioned (6), the polyester based resin of above-mentioned cushion is polybutylene terephthalate (PBT).
(8) mold release film according to above-mentioned (6) or (7), the polyolefin-based resins of above-mentioned cushion is more than any one in maleic acid modified polyethylene, polypropylene, methylmethacrylate copolymer.
(9) mold release film according to any one of above-mentioned (1) ~ (8), above-mentioned mold release film is 2 kinds of 3-tier architectures in the both sides of cushion with release layer.
Invention effect
Mold release film of the present invention, can prevent release layer and circuit from exposing each other closely sealed of the closely sealed and CL bonding agent of film and CL film, release layer in the same manner as existing PBT mold release film, and circuit can be reduced expose the seepage discharge of the bonding agent between film and CL film to its circuit pattern part compared with existing PBT mold release film.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of an example of the mold release film representing embodiments of the present invention.
Fig. 2 is the schematic cross-section of an example of the mold release film representing variation (A).
Fig. 3 is the figure of an example of the manufacturing installation of the mold release film representing embodiments of the present invention.
Fig. 4 is the figure of an example of the using method of the mold release film representing embodiments of the present invention.
Fig. 5 is the figure of an example of the heating mode of the hot pressing represented when using the mold release film of embodiments of the present invention to make CL film be sealed at the jog of circuit pattern.
Fig. 6 is the figure of an example of the heating mode of the hot pressing represented when using the mold release film of embodiments of the present invention to make CL film be sealed at the jog of circuit pattern.
Detailed description of the invention
Below, with reference to accompanying drawing, the present invention is described in detail, but the present invention is not limited thereto, and suitably can change and implement in the scope not changing its main points.
As shown in Figure 1, the mold release film 100 of embodiments of the present invention is formed primarily of release layer 110 and cushion 120.Wherein, in the present embodiment, the thickness of mold release film 100 is preferably more than 25 μm less than 300 μm, is more preferably more than 50 μm less than 200 μm, more preferably more than 80 μm less than 120 μm.
When the thickness of mold release film is less than above-mentioned lower range, not enough with the release property of FPC, likely in FPC circuit face, there is resin residue.On the other hand, when being greater than above-mentioned higher limit, likely cause increasing the imbedibility of FPC circuit part seepage discharge that is not enough, CL bonding agent.
Below, these layers are described in detail respectively.
The details > of the constituting layer of < mold release film
1. release layer
Release layer 110 is containing polybutylene terephthalate (PBT) and the lubricant particles with ester group and non-polar group.
Ester group and polybutylene terephthalate (PBT) have intermiscibility, when lubricant particles does not have ester group, the lubricant particles do not mixed may come off because of hot pressing, be needed on FPC surface and pollute.
On the other hand, the non-polar group of lubricant particles is compared with ester group, low with the intermiscibility of polybutylene terephthalate (PBT).Therefore, the non-polar group part in lubricant particles is partially the near surface of release layer 110 or exposes, and thus the surface free energy of release layer 110 reduces, and contributes to the release property improving mold release film 100.
As the resinous principle that can be included in except polybutylene terephthalate (PBT) in release layer 110, such as, can enumerate polybutylene terephthalate (PBT) and polytetramethylene copolymer or elastomer resin, polyolefin-based resins, polystyrene resin, polyester based resin, polyamide series resin, polyphenylene oxide, polyphenylene sulfide (PPS) etc.Wherein, these resins can be used alone, or are used in combination.
Wherein, as elastomer resin, such as, natural rubber can be enumerated, polybutadiene, polyisoprene, polyisobutene, chlorobutadiene, polysulfide rubber (polysulfide rubber), thiokol (thiokol rubber), acrylic rubber, polyurethane rubber, silicon rubber, ECD, styrene-butadiene block copolymer (SBR), hydrogenated styrene-butadiene block copolymer (SEB), SBS (SBS), hydrogenated styrene-butadiene-styrene block copolymers (SEBS), styrene-isoprene block copolymer (SIR), hydrogenated styrene isoprene block copolymer (SEP), SIS (SIS), hydrogenated styrene isoprene-styrene block copolymer (SEPS) or ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPDM), the olefin-based rubber such as straight-chain low density polyethylene (LDPE) based elastomers, or butadiene-acrylonitrile-styrene-core shell rubber (ABS), MBS-core shell rubber (MBS), methyl methacrylate-butyl acrylate-styrene-core shell rubber (MAS), 2-ethyl hexyl acrylate-butadiene-styrene-core shell rubber (MABS), alkyl acrylate-butadiene-acrylonitrile-styrene-core shell rubber (AABS), butadiene-styrene-core shell rubber (SBR), the granulated elastomeric body of the core-shell-types such as the core shell rubber containing siloxanes such as methyl methacrylate-butyl acrylate-siloxanes, or the rubber etc. that their modifications are obtained.
As polyolefin-based resins, such as can enumerate straight-chain high density polyethylene (HDPE), straight-chain low density polyethylene (LDPE), high-pressure process low-density polyethylene, isotactic polypropylene, syndiotactic polypropylenes, block polypropylene, random polypropylene, polybutene, 1,2-polybutadiene, 4-methylpentene, cyclic polyolefin and their copolymer (such as ethylene methyl methacrylate copolymer etc.) etc.
As polystyrene resin, such as random isotactic polystyrene can be enumerated, isotactic polystyrene, syndiotactic polystyrene, high high impact polystyrene (HIPS), acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitritrile-styrene resin (AS), Styrene-methyl Acrylic Acid Copolymer, styrene-t alkyl ester copolymer, styrene-t glycidyl ester copolymer, Styrene-acrylic copolymer, styrene-alkyl acryl ate copolymer, styrene-maleic acid copolymer, styrene-fumaric acid copolymer etc.
As polyester based resin, such as, can enumerate Merlon, PETG, PBN etc.
As polyamide series resin, such as, can enumerate nylon (registration mark) 6, nylon (registration mark) 6,6 etc.
Also the various additives beyond lubricant particles can be coordinated, such as anti-blocking agent, antioxidant, nucleator, antistatic additive, process oil, plasticizer, fire retardant, flame retardant, pigment etc. in release layer 110.
Wherein, as anti-blocking agent, following inorganic particle or organic granular can be enumerated.As inorganic particle, IA race, IIA race, IVB race, group vib, VIIB race, group VIIIB, IB race, IIB race, IIIA race, the oxide of IVA race element, hydroxide, sulfide, nitride, halide, carbonate, sulfate, acetate, phosphate, phosphite, organic carboxylate, silicate, titanate, borate and their hydrate can be enumerated, and complex chemical compound centered by them and natural mineral particles.
As the concrete example of such inorganic particle, the compound of the IA race element such as lithium fluoride, borax (the moisture salt of Boratex) can be enumerated; The compound of the IIA race elements such as magnesium carbonate, magnesium phosphate, magnesia (magnesia), magnesium chloride, magnesium acetate, magnesium fluoride, magnesium titanate, magnesium silicate, the moisture salt of magnesium silicate (talcum), calcium carbonate, calcium phosphate, Arizona bacilli, calcium sulfate (gypsum), calcium acetate, terephthalic acid (TPA) calcium, calcium hydroxide, calcium silicates, calcirm-fluoride, calcium titanate, strontium titanates, brium carbonate, barium phosphate, barium sulfate, barium sulfite; The compound of the IVB race elements such as titanium dioxide (titania), titanium monoxide, titanium nitride, zirconium dioxide (zironia), a zirconia; The compound of the group vib elements such as molybdenum dioxide, molybdenum trioxide, molybdenum sulfide; The compound of the VIIB such as manganese chloride, manganese acetate race element; The compound of the group VIIIB such as cobalt chloride, cobalt acetate element; The compound of the IB race elements such as cuprous iodide; The compound of the IIB such as zinc oxide, zinc acetate race element; The compound of the IIIA race elements such as aluminium oxide (alumina), aluminium hydroxide, aluminum fluoride, aluminosilicate (silicic acid aluminium oxide, kaolin, kaolinite); The compound of the IVA race elements such as silica (silica, silica gel), graphite, carbon, blacklead (graphite), glass; The particle of the natural minerals such as carnallite, kainite, mica (mica, phlogopite), pyrolusite.
As organic granular, fluororesin, melamine series resin, styrene diethylene benzene copoly mer, acrylic resin silicones and their crosslinked can be enumerated.
The average grain diameter of above-mentioned inorganic particle and organic granular preferably more than 0.1 μm less than 10 μm, addition is preferably more than 0.01 % by weight less than 15 % by weight.
Wherein, these anti-blocking agents can be used alone, or are used in combination.
As antioxidant, phosphorous antioxidant, phenol system antioxidant, sulphur system antioxidant, 2-[(1-hydroxyl-3,5-di-tert-pentyl-phenyl) ethyl]-4,6-di-tert-pentyl-phenyl acrylate etc. can be enumerated.Wherein, these antioxidants can be used alone, or are used in combination.
As nucleator, the slaine, talcum, phthalocyanine derivates etc. of the phosphoric acid such as slaine, di-2-ethylhexylphosphine oxide (2,4-DTBP) sodium acid phosphate of the carboxylic acids such as two (p-tert-butyl benzoic acid) aluminium can be enumerated.Wherein, these nucleators can be used alone, or are used in combination.
As plasticizer, polyethylene glycol, polyamide oligomer as well as, ethylenebisstearamide, phthalic acid ester, polystyrene oligomer, Tissuemat E, silicone oil etc. can be enumerated.Wherein, these plasticizer can be used alone, or are used in combination.
As process oil, paraffin series oil can be enumerated, cycloalkanes hydrocarbon system is oily, aromatic series is oily.Wherein, in these process oils, the carbon number relevant to paraffin (straight chain) calculated preferably by n-d-M method is the paraffin series oil of more than 60%Cp relative to the percentage of total carbon number.
About operation oil viscosity, preferably 40 DEG C time dynamic viscosity at more than 15cs below 600cs, preferred at more than 15cs below 500cs further.In addition, form resin 100 weight portion relative to release layer, the addition of process oil is preferably more than 0.01 weight portion below 1.5 weight portions, more preferably more than 0.05 weight portion below 1.4 weight portions, preferred more than 0.1 weight portion below 1.3 weight portions further.Wherein, these process oils can be used alone, or are used in combination.
Further, lubricant particles has ester group and the non-polar group with release layer resin with intermiscibility, is preferably less than 8.0, is more preferably less than 6.0 with the difference of the solubility parameter of above-mentioned release layer, and more preferably less than 4.0.At this, solubility parameter (δ) is defined as the square root of the density of the per unit volume of intermolecular cohesion energy E, defines especially by following formula.
δ＝(E/V)
1/2
E: mole cohesion energy V: mole volume
When the difference of above-mentioned solubility parameter is greater than above-mentioned range higher limit, not enough with the intermiscibility of above-mentioned release layer resin, likely cause the lubricant particles do not mixed to come off because of hot pressing, be transferred to FPC surface, pollute.
The average grain diameter of above-mentioned lubricant particles is preferably more than 0.05 μm less than 10.0 μm, is more preferably more than 0.1 μm less than 8.0 μm, more preferably more than 0.5 μm less than 6.0 μm.
When above-mentioned average grain diameter is lower than above-mentioned lower range limit, not enough with the release property of FPC, likely there is resin residue at circuit surface.On the other hand, when above-mentioned average grain diameter is higher than above-mentioned range higher limit, likely cause the surface state of release layer resin to be deteriorated, its surface configuration of transfer printing because of hot pressing, FPC surface is also deteriorated.
The addition of above-mentioned lubricant particles is more than 0.001wt% below 15.0wt%, is preferably more than 0.01wt% below 5.0wt%, is more preferably more than 0.1wt% below 1.0wt%, more preferably more than 0.3wt% below 0.5wt%.When above-mentioned addition is lower than above-mentioned lower range limit, not enough with the release property of FPC, likely there is resin residue at circuit surface.On the other hand, when above-mentioned addition is higher than above-mentioned range higher limit, likely cause extruding masking difficulty and lubricant itself and FPC because the melt viscosity of release layer resin entirety is too low closely sealed.
The thickness of release layer 110 is preferably set to more than 5 μm less than 40 μm, is more preferably set to more than 10 μm less than 35 μm, is preferably set to more than 15 μm less than 30 μm further.
When the thickness of release layer 110 is less than above-mentioned lower range, not enough with the release property of FPC, likely there is resin residue at circuit surface.When higher than above-mentioned higher limit, the seepage discharge of CL bonding agent is likely deteriorated.
In addition, the surface free energy of release layer is preferably 50mJ/m
2below, more preferably 45mJ/m
2below, 40mJ/m most preferably is
2below.
2. cushion
As shown in Figure 1, mold release film 100 of the present invention possesses cushion 120, and what can make with adherend thus is closely sealed even more ideal.As long as cushion 120 has the flexibility of the appropriateness demonstrating resiliency, known resin can be used.As concrete example, such as can enumerate the alpha-olefin such as polyethylene, polypropylene based polymer and have the mylar such as the engineering plastics such as polyolefin-based resins, polyether sulfone, polyphenylene sulfide system resin, polybutylene terephthalate (PBT) as the alpha-olefin based copolymer etc. of copolymer composition such as ethene, propylene, butylene, amylene, hexene, methylpentene, they can be used alone or and with multiple.
Wherein, preferably containing polyolefin-based resins and polyester based resin.When not containing polyolefin-based resins, resiliency becomes insufficient sometimes, insufficient to the product having shape-following-up properties of FPC circuit.When not containing mylar, cushion resin may be caused to flow out from the end of film and pollute platen.
As said polyolefins system resin, the copolymer of the copolymer of the alpha-olefins such as ethene and (methyl) acrylate, ethene and vinyl acetate, ethene and (methyl) acrylic acid copolymer (EMMA) and their part ion cross-linking agent etc. can be enumerated.
Wherein, (methyl) acrylic acid is the general name of acrylic acid and methacrylic acid.
Wherein, more than any one in the copolymer preferably containing ethene and methacrylic acid, polypropylene and maleic acid modified polyethylene, further preferably containing whole.By containing ethene and (methyl) acrylic acid copolymer, resiliency strengthens; By containing polypropylene, resin can be suppressed to flow out from the film end face of cushion; By containing maleic acid modified polyethylene, can improve with the adhesive strength of release layer and improve the intermiscibility with polyester based resin.
As above-mentioned mylar, be preferably made up of polybutylene terephthalate (PBT).By using polybutylene terephthalate (PBT), the intermediate layer when hot pressing can be suppressed to ooze out from end, and improve the adhesive strength with release layer 110.
In addition, in the present embodiment, in order to obtain the more excellent adaptation with adherend, the thickness of cushion 120 is preferably more than 3 times of the thickness of release layer 110, is more preferably more than 5 times, more preferably more than 8 times.In the present embodiment, when release layer 110 and the cementability of cushion 120 are bad, anchor layer or priming coat (adhesive linkage) can also be there is between, the layers.
In addition, formed in resin at this cushion, other above-mentioned elastomer resin or additive can be coordinated as required in the scope of main points not damaging invention.
As mentioned above, when arranging cushion 120, the thickness of cushion 120 is not particularly limited, and is preferably more than 10 μm less than 100 μm, is more preferably more than 20 μm less than 80 μm, more preferably more than 30 μm less than 60 μm.When the thickness of cushion 120 is lower than above-mentioned lower limit, not enough to the imbedibility of FPC circuit part in hot pressing process, the seepage discharge of CL bonding agent may be caused to increase; In addition, when the thickness of cushion 120 exceedes above-mentioned higher limit, resin in hot pressing process may be caused to increase from oozing out of cushion, be attached on the heat dish of compression bonding apparatus, operability reduces.
The manufacture method > of < mold release film
The mold release film 100 of Fig. 1 of present embodiment can pass through the method manufacture such as coetrusion or extruding layer platen press.
When utilizing coetrusion, using feed block and branch manifold die head, the first release layer 1 and cushion 2 being extruded simultaneously, manufactures mold release film 100 thus.In addition, in coetrusion, the liquefactent M that have passed die head 510 is directed to the first roller 530 as shown in Figure 3, and is fixed in the first roller 530 by contact roller 520, until cooled by the first roller 530 from the process that the first roller 530 departs from, become mold release film 200.Then, this mold release film 200 is sent to film throughput direction (arrow with reference to Fig. 3) downstream by the second roller 540, is finally wound in take up roll (not shown).Wherein, now, the temperature of the first roller 530 is preferably 30 ~ 50 DEG C, and the temperature of contact roller 520 is preferably 30 ~ 100 DEG C, and the second roller 540 is preferably 0.990 ~ 0.998 relative to the peripheral speed ratio of the first roller 530.
When utilizing extruding layer platen press, the temperature of extruder barrel being set as 225 ~ 250 DEG C are extruded release layer 110, collaborating by making this release layer 110 and cushion 120, by release layer 110 and cushion 120 lamination, to manufacture mold release film 100.In addition, in extruding layer platen press, the liquefactent M that have passed the release layer formation resin of die head 510 is directed to the first roller 530 as shown in Figure 3, until cooled by the first roller 530 from the process that the first roller 530 departs from, becomes demoulding tunic F.Then, this demoulding tunic F is sent to film throughput direction (arrow with reference to Fig. 3) downstream by the second roller 540.Then, the fused mass of the resin blend of formation cushion 120 (not shown) is made to collaborate, in being sent to the demoulding tunic F of film conveyance direction downstream side and integrated with demoulding tunic F, to manufacture mold release film 100.In addition, the mold release film 100 manufactured as mentioned above is wound in the take up roll (not shown) that film conveyance direction downstream side is arranged further.Wherein, now, the temperature of the first roller 530 is also preferably 30 ~ 50 DEG C, and the second roller 540 is preferably 0.990 ~ 0.998 relative to the peripheral speed ratio of the first roller 530.In addition, also contact roller can be arranged as required near the first roller.
An example > of the use of < mold release film
(Hot-Hot compacting)
In order to make the jog of CL film and circuit pattern closely sealed being adhered to by CL film when circuit exposes film, the mold release film 100 of embodiments of the present invention configures in the mode of coated CL film, and exposes film and CL film with circuit and be together pressed device and pressurize.
Specifically, mold release film 100 as shown in Figure 4, clamps in the mode that the release layer of mold release film 100 is relative and circuit is exposed film and CL film temporarily fixing parts 340 by bonding agent, afterwards, clamp with rubber blanket 320, and utilize heat dish 300 pressurization.Wherein, as the heating means utilizing this heat to coil 300, as shown in Figure 5.That is, heat dish 300 is warming up to 170 ~ 200 DEG C, pressurizes 1 ~ 3 minute.Pressing pressure now suitably can regulate in the scope of 3 ~ 15MPa.
(Cold-Hot compacting)
In order to make the jog of CL film and circuit pattern closely sealed being adhered to by CL film when circuit exposes film, the mold release film 100 of embodiments of the present invention configures in the mode of coated CL film, and exposes film and CL film with circuit and be together pressed device and pressurize.Specifically, mold release film 100 as shown in Figure 4, clamp in the mode that the release layer 110 of mold release film 100 is relative and circuit exposed film and CL film temporarily fixing parts 340 by bonding agent, afterwards, utilize Teflon (registration mark) sheet 330, rubber blanket 320 and corrosion resistant plate 310 to clamp successively, utilize heat dish 300 pressurization (blank arrowhead with reference to Fig. 4).Wherein, as the heating means utilizing this heat to coil 300, as shown in Figure 6.That is, heat dish 300 is from starting to be warming up to 170 DEG C through 15 minutes from normal temperature pressurization, afterwards, maintains this temperature 35 minutes.Then, heat dish 300 was cooled to normal temperature through 50 minutes from 170 DEG C.Wherein, what utilize heat dish 300 adds the moment being pressed in 0 minute, open the moment of 100 minutes.In addition, pressing pressure now suitably can regulate in the scope of 5 ~ 15MPa.
< variation >
(A)
In embodiment before, describe only in the one-sided mold release film 100 being provided with release layer 110 of cushion 120, but the mold release film 100A as shown in Figure 2, being provided with release layer 110a, 110b in the both sides of cushion 120 is also included within an embodiment of the invention.Wherein, below the release layer of symbol 110a is called " the first release layer ", the release layer of symbol 110b is called " the second release layer ".
First release layer 110a has the structure identical with the release layer 110 in embodiment before.On the other hand, the second release layer 110b can have the structure identical with the first release layer 110a, also can have the structure different from the first release layer 110a.In the latter case, the second release layer 110b such as can by with acrylic resin, polymethylpentene resin, methylpentene-alpha olefin copolymer, there is the resin that the polystyrene resin of syndiotactic structure is main component formed.Wherein, polymethylpentene resin and methylpentene-alpha olefin copolymer are sold with trade name TPX (registration mark) by Mitsui Chemicals, Inc.In addition, the polystyrene resin with syndiotactic structure is sold with trade name Xarec (registration mark) by Idemitsu Kosen Co., Ltd..In this case, although the bonding force of the second release layer 110b and cushion 120 may reduce, under these circumstances, anchor layer or priming coat (adhesive linkage) can be there is between the second release layer 110b and cushion 120.In addition, when the second release layer 110b is formed by the resin taking acrylic resin as main component, the cementability of above-mentioned cushion and the second release layer 110b is good, therefore, does not need to there is anchor layer or priming coat (adhesive linkage) between, the layers.
Embodiment
Below, the present invention will be described in more detail to enumerate embodiment.
(embodiment 1)
1. the manufacture of mold release film
The raw material of (1) first release layer and the second release layer
First release layer and the second release layer use the resin combination containing following raw material with the weight ratio shown in table 1.
Polybutylene terephthalate (PBT): CHANG CHUN PLASTICS CO., LTD.1100-211S
Lubricant particles: Clariant Japan Inc. Licowax E (montanic acid ester type waxes)
(2) raw material of cushion
Cushion uses the resin combination containing following raw material with the weight ratio shown in table 1.
Ethylene methyl methacrylate copolymer: methyl methacrylate derived units content 5 % by weight Sumitomo Chemical Co ACRYFT (registration mark) WD106
Polypropylene: Sumitomo Chemical Co Nobrene FH1016
Maleic acid modified polyethylene: Mitsubishi chemical Co., Ltd Modic F515A
Polybutylene terephthalate (PBT): CHANG CHUN PLASTICS CO., LTD.1100-211S
(5) making of mold release film
Utilize coetrusion, the surface back side being produced on cushion has the mold release film of the first release layer and the second release layer (with reference to Fig. 2).
Wherein, specifically, use branch manifold die head, the blending resin, the cushion that first release layer, the second release layer are polybutylene terephthalate (PBT) and lubricant particle are ethylene methyl methacrylate copolymer, the blend of maleic acid modified polyethylene, polypropylene and polybutylene terephthalate (PBT) is extruded simultaneously, make mold release film.Wherein, now, use the device shown in Fig. 3, the temperature of the first roller 530 is 30 DEG C, and the second roller 540 is 0.998 relative to the peripheral speed ratio of the first roller 530.
The thickness of the first release layer of this mold release film is 25 μm, and the thickness of cushion is 70 μm, and the thickness of the second release layer is 25 μm.Wherein, each layer thickness by cut out film cross section, use microscope measure from cross-wise direction.
The surface free energy of this mold release film is determined by sessile drop method.
(compacting evaluation method)
Use the mold release film obtained by above-mentioned preparation method, with the pressing structure of the order of heat dish/rubber blanket/mold release film/CL (having pool to make the CL of made CV type)/FPC/ mold release film/rubber blanket/heat dish, utilize pressure level press to suppress.When suppressing, making temperature of heat plate be warming up to 185 DEG C, pressurizeing 3 minutes under the pressurized conditions of 10MPa.
Then, by following project and benchmark, compacting sample is evaluated.Wherein, the JPCA standard (design guidance handbook one side and double-side flexible printed circuit board JPCA-DG02) of NEC of following Appreciation gist civic organization circuit industry meeting (hereinafter referred to as JPCA), is undertaken by project as described below and benchmark.
(assessment item)
Release property: release property 1 evaluates the release property of mold release film from FPC.Specifically, according to " attachment on JPCA standard 7.5.7.1 item surface ", by the stripping state of the mold release film after visual assessment CL pressurization lamination from FPC.
Assess sample number is set as that each n=100 evaluates, by FPC surface occur the sample number of resin residue lower than assess sample number 5% situation be set to qualified.
◎: damaged incidence is lower than 3%
Zero: damaged incidence more than 3% and lower than 5%
×: damaged incidence more than 5%
The seepage discharge of CL bonding agent:
Whether there is oozing out of the bond layer of CL on circuit substrate, according to " flowing of the tectal bonding agent of 7.5.3.6 item of JPCA standard and the seepage of seal coat ", evaluate the seepage discharge to circuit terminal portion.It is qualified seepage discharge to be set to lower than 150 μm.
◎: seepage discharge is lower than 100 μm
Zero: seepage discharge more than 100 μm and lower than 150 μm
×: seepage discharge more than 150 μm
Formability: formability, according to " bubble of the 7.5.3.3 item of JPCA standard ", is evaluated by range estimation.Each symbol is as described below.Assess sample number is set as that each n=100 evaluates, by confirm at sample surfaces to have the sample number in space lower than assess sample number 2% situation be set to qualified.
◎: space incidence is lower than 1.0%
Zero: space incidence more than 1.0% and lower than 2.0%
×: space incidence more than 2.0%
Film end face seepage discharge: ooze out length (measuring the maximum length of the resin oozed out from film 4 direction end face) by mold release film end face and evaluate.To ooze out length be set to lower than 3mm qualified.
◎: ooze out length lower than 1mm
Zero: ooze out more than length 1mm and lower than 3mm
×: ooze out more than length 3mm
Outward appearance: evaluated by the outward appearance of the film of branch manifold die head coextrusion by visualization.It is qualified that film entirety does not have the good sample of the outward appearance of current mark or the bad order such as foreign matter, flake to be evaluated as.
◎: do not have bad order
Zero: only a part exists bad order
×: whole exists bad order
In embodiment 1, the circuit bonding agent exposed between film and CL film oozes out into the amount of circuit pattern lower than 80 μm.In addition, the mold release film after hot pressing easily can be exposed film from circuit and peel off, and the bad incidence of stripping of mold release film is lower than 1.0%.The incidence in space is lower than 2%.In addition, length is oozed out also lower than 1mm from film end face.Bad order is not had about outward appearance.
(embodiment 2)
Weight resin in the resin combination used by release layer, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 3)
Weight resin in the resin combination used by release layer, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 4)
Weight resin in the resin combination used by release layer, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 5)
Weight resin in the resin combination used by release layer, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 6)
Weight resin in the resin combination used by cushion, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 7)
Weight resin in the resin combination used by cushion, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 8)
Weight resin in the resin combination used by release layer, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 9)
Weight resin in the resin combination used by cushion, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 10)
Weight resin in the resin combination used by cushion, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 11)
Weight resin in the resin combination used by cushion, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 12)
Weight resin in the resin combination used by cushion, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(embodiment 13)
Weight resin in the resin combination used by cushion, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(comparative example 1)
Weight resin in the resin combination used by release layer, than being set to the weight ratio shown in table 1, in addition, makes mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
(comparative example 2)
Remove cushion and the second release layer, and the thickness of the first release layer is set to 120 μm, in addition, make mold release film similarly to Example 1, and to the evaluation that this mold release film is carried out similarly to Example 1.Show the result in table 1.
[table 1]
Utilizability in industry
The feature of mold release film of the present invention is, can prevent release layer and circuit from exposing each other closely sealed of the closely sealed and CL bonding agent of film and CL film, release layer in the same manner as existing PBT mold release film, and, compared with existing PBT mold release film, circuit can be reduced and expose the seepage discharge of the bonding agent between film and CL film to its circuit pattern part.Being particularly suitable as when by pressurization compacting CL film being adhered to circuit and exposing film, being sealed at the jog of circuit pattern and the mold release film that uses in the mode of coated covering layer film to make CL film.
As mold release film, the mold release film having (1) to use when manufacturing laminated plate known in addition, (2) mold release film used when manufacturing front end composite product, (3) mold release film used when manufacturing physical culture, leisure goods, mold release film of the present invention can use as these mold release film.Wherein, the so-called mold release film used when manufacturing laminated plate refers to: in compressing when manufacturing multilayer printed board, in order to the film preventing printed base plate and bonding between dividing plate or other printed base plates from arranging between which.The mold release film used during so-called manufacture front end composite product refers to: the film used when making the prepreg be such as made up of glass cloth, carbon fiber or aramid fiber and epoxy resin solidify and manufacture various goods.The so-called mold release film used when manufacturing physical culture, leisure goods refers to: such as manufacture fishing rod, the club of golf, board sailing bar etc. time, prepreg is rolled into the film rolled up on this prepreg when cylindrical shape makes it solidify in autoclave.
This mold release film also can be used as the stripping film of jointing tape, two-sided tape, masking tape, label, sealing strip, paster, skin paste Wet-dressing agent etc. in addition.
This mold release film also can be used as the engineering film used when manufacturing tellite or ceramic electronic components, heat reactive resin goods, decorative panel etc.Wherein, so-called engineering film refers to herein: when manufacturing printed base plate or ceramic electronic components, thermoset resin article, decorative panel etc., in order to not make metallic plate bonding each other with resin each other when forming process at metallic plate each other or the film that sandwiches each other of resin.Be particularly suitable for when laminated plate manufactures, flexible printed board manufacture time, front end composite products manufacture time, Leisure Sport articles for use manufacture time use.
This mold release film also can be used as packaging film.
Symbol description
100,100A: mold release film; 110: release layer; 110a: the first release layer (release layer); 110b: the second release layer (release layer); 120: cushion; 510: die head; 520: contact roller; 530: the first rollers; 540: the second rollers; 300: heat dish; 310: corrosion resistant plate; 320: rubber blanket; 330: Teflon (registration mark) sheet; 340: circuit exposed film and CL film temporarily fixing parts by bonding agent.
Claims (10)
1. a mold release film, is characterized in that:
Described mold release film has release layer and cushion, and described release layer contains polybutylene terephthalate (PBT) system resin and lubricant particles,
Described lubricant particles has ester group and non-polar group.
2. mold release film according to claim 1, is characterized in that:
The difference of the solubility parameter of described lubricant particles and described release layer is less than 8.0.
3. mold release film according to claim 1 and 2, is characterized in that:
The average grain diameter of described lubricant particles is more than 0.05 μm less than 10.0 μm.
4. the mold release film according to any one of claims 1 to 3, is characterized in that:
The addition of described lubricant particles is more than 0.01wt% below 5wt%.
5. the mold release film according to any one of Claims 1 to 4, is characterized in that:
The surface free energy E of described release layer is 50mJ/m
2below.
6. the mold release film according to any one of Claims 1 to 5, is characterized in that:
Described cushion has polyester based resin and polyolefin-based resins.
7. mold release film according to claim 6, is characterized in that:
The polyester based resin of described cushion is polybutylene terephthalate (PBT).
8. the mold release film according to claim 6 or 7, is characterized in that:
The polyolefin-based resins of described cushion is more than any one in the copolymer of maleic acid modified polyethylene, polypropylene, ethene and methacrylic acid.
9. the mold release film according to any one of claim 1 ~ 8, is characterized in that:
Described mold release film is 2 kinds of 3-tier architectures in the both sides of cushion with described release layer.
10. the mold release film according to any one of claim 1 ~ 8, is characterized in that:
Described mold release film has the first release layer in the side of described cushion, the second release layer is provided with in the opposition side of described cushion, first release layer is described release layer, and the second release layer is formed by the resin being main component with acrylic resin or polystyrene resin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012204660 | 2012-09-18 | ||
| JP2012-204660 | 2012-09-18 | ||
| PCT/JP2013/073962 WO2014045888A1 (en) | 2012-09-18 | 2013-09-05 | Release film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640700A true CN104640700A (en) | 2015-05-20 |
Family
ID=50341205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380048036.0A Pending CN104640700A (en) | 2012-09-18 | 2013-09-05 | Release film |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6222095B2 (en) |
| KR (1) | KR20150058179A (en) |
| CN (1) | CN104640700A (en) |
| TW (1) | TWI609781B (en) |
| WO (1) | WO2014045888A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109863024A (en) * | 2016-08-25 | 2019-06-07 | 东丽薄膜先端加工股份有限公司 | Mold release film |
| CN110461594A (en) * | 2017-03-22 | 2019-11-15 | 住友电木株式会社 | The manufacturing method of mold release film and flexible printed wiring board |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015202662A (en) * | 2014-04-16 | 2015-11-16 | 住友ベークライト株式会社 | Production method of release film |
| JP6352034B2 (en) * | 2014-04-21 | 2018-07-04 | 三井化学東セロ株式会社 | Multi-layer release film |
| JP2015221849A (en) * | 2014-05-22 | 2015-12-10 | 帝人株式会社 | Release film |
| JP2016168688A (en) * | 2015-03-11 | 2016-09-23 | 住友ベークライト株式会社 | Release film |
| JP7277092B2 (en) * | 2017-08-31 | 2023-05-18 | 積水化学工業株式会社 | release film |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006104361A (en) * | 2004-10-06 | 2006-04-20 | Toray Ind Inc | Polyester resin composition |
| JP2007084760A (en) * | 2005-09-26 | 2007-04-05 | Taihei Kagaku Seihin Kk | Mold-release film and method for producing the same |
| JP2008105319A (en) * | 2006-10-26 | 2008-05-08 | Sekisui Chem Co Ltd | Multi-layer release film |
| JP2009066984A (en) * | 2007-09-14 | 2009-04-02 | Mitsubishi Engineering Plastics Corp | Mold release film for heat press forming |
| JP2010209234A (en) * | 2009-03-11 | 2010-09-24 | Wintech Polymer Ltd | Aromatic polyester composition |
| JP2010234794A (en) * | 2009-03-10 | 2010-10-21 | Dainippon Printing Co Ltd | Release film and production method thereof |
| JP2011230363A (en) * | 2010-04-27 | 2011-11-17 | Sumitomo Bakelite Co Ltd | Mold release film |
| JP2012135935A (en) * | 2010-12-27 | 2012-07-19 | Sumitomo Bakelite Co Ltd | Mold release film |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2051823A (en) * | 1979-06-19 | 1981-01-21 | Ici Ltd | Polyethyleneterephthalates |
| KR100927514B1 (en) * | 2005-05-13 | 2009-11-17 | 미쓰이 가가쿠 가부시키가이샤 | Laminate comprising 4-methyl-1-pentene polymer and release film comprising the same |
| JP5354858B2 (en) * | 2006-05-09 | 2013-11-27 | 株式会社Ａｄｅｋａ | Polyester resin composition containing metal salt of sulfonamide compound |
-
2013
- 2013-09-05 KR KR1020157005686A patent/KR20150058179A/en not_active Application Discontinuation
- 2013-09-05 JP JP2014536740A patent/JP6222095B2/en active Active
- 2013-09-05 WO PCT/JP2013/073962 patent/WO2014045888A1/en active Application Filing
- 2013-09-05 CN CN201380048036.0A patent/CN104640700A/en active Pending
- 2013-09-10 TW TW102132655A patent/TWI609781B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006104361A (en) * | 2004-10-06 | 2006-04-20 | Toray Ind Inc | Polyester resin composition |
| JP2007084760A (en) * | 2005-09-26 | 2007-04-05 | Taihei Kagaku Seihin Kk | Mold-release film and method for producing the same |
| JP2008105319A (en) * | 2006-10-26 | 2008-05-08 | Sekisui Chem Co Ltd | Multi-layer release film |
| JP2009066984A (en) * | 2007-09-14 | 2009-04-02 | Mitsubishi Engineering Plastics Corp | Mold release film for heat press forming |
| JP2010234794A (en) * | 2009-03-10 | 2010-10-21 | Dainippon Printing Co Ltd | Release film and production method thereof |
| JP2010209234A (en) * | 2009-03-11 | 2010-09-24 | Wintech Polymer Ltd | Aromatic polyester composition |
| JP2011230363A (en) * | 2010-04-27 | 2011-11-17 | Sumitomo Bakelite Co Ltd | Mold release film |
| JP2012135935A (en) * | 2010-12-27 | 2012-07-19 | Sumitomo Bakelite Co Ltd | Mold release film |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109863024A (en) * | 2016-08-25 | 2019-06-07 | 东丽薄膜先端加工股份有限公司 | Mold release film |
| CN109863024B (en) * | 2016-08-25 | 2020-12-25 | 东丽薄膜先端加工股份有限公司 | Mold release film |
| CN112519373A (en) * | 2016-08-25 | 2021-03-19 | 东丽薄膜先端加工股份有限公司 | Mold release film |
| CN110461594A (en) * | 2017-03-22 | 2019-11-15 | 住友电木株式会社 | The manufacturing method of mold release film and flexible printed wiring board |
| CN110461594B (en) * | 2017-03-22 | 2021-02-12 | 住友电木株式会社 | Release film and method for manufacturing flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201420340A (en) | 2014-06-01 |
| JP6222095B2 (en) | 2017-11-01 |
| TWI609781B (en) | 2018-01-01 |
| JPWO2014045888A1 (en) | 2016-08-18 |
| WO2014045888A1 (en) | 2014-03-27 |
| KR20150058179A (en) | 2015-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104640700A (en) | Release film | |
| TWI815578B (en) | Release film and method for manufacturing flexible circuit board | |
| CN104842621A (en) | Mould release film | |
| CN103492289B (en) | Coverlay | |
| CN103153811B (en) | Cover film | |
| CN102971227B (en) | Cover tape | |
| JP5245497B2 (en) | Release film | |
| JP2014221558A (en) | Mold release film | |
| JP2011161747A (en) | Laminated film | |
| CN102762376B (en) | Laminated film | |
| JP2004051688A (en) | Resin composition for bonding, and laminate | |
| JP5765018B2 (en) | Release film | |
| JP5685930B2 (en) | Release film | |
| JP6380727B1 (en) | Release film and method for producing flexible printed circuit board | |
| JP5652743B2 (en) | Release film | |
| JP2011212848A (en) | Mold release film | |
| JP2020140775A (en) | Battery packaging film and battery | |
| JP5488809B2 (en) | Laminated film | |
| JP2014121830A (en) | Mold release film | |
| JP2011212853A (en) | Mold release film | |
| CN114132026A (en) | Composite sheet | |
| JP2004345159A (en) | Release multilayered film and coverlay molding method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150520 |