CN104842621A - Mould release film - Google Patents
Mould release film Download PDFInfo
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- CN104842621A CN104842621A CN201510236543.8A CN201510236543A CN104842621A CN 104842621 A CN104842621 A CN 104842621A CN 201510236543 A CN201510236543 A CN 201510236543A CN 104842621 A CN104842621 A CN 104842621A
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- film
- release layer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- Engineering & Computer Science (AREA)
- Laminated Bodies (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Provided is a mould release film that has embedding characteristics superior to previous PBT-type mould release films while preventing clinging between the circuit exposure film of a mould release layer and a cover lay (CL) film and between mould release layers, when the CL film is adhered to the circuit exposure film. The disclosed mould release film (100) is provided with a release layer (110) that includes, at least, a polybutylene terephthalate homopolymer (A) and a polybutylene terephthalate (PBT)/polytetramethylene glycol (PTMG) copolymer (B).
Description
The application is the divisional application that the name submitted on March 30th, 2011 is called 201180017280.1 applications for a patent for invention of " mold release film ".
Technical field
The present invention relates to mold release film.
Background technology
Propose in prior art " mold release film (hereinafter referred to as " PBT mold release film ") with the release layer formed by polybutylene terephthalate (PBT) resin " (such as, see No. 05/030466 International Publication text etc.).This kind of mold release film such as uses when making flexible printed circuit board (hereinafter referred to as " FPC "), is made covering layer film (hereinafter referred to as " CL film ") adhere on the flexible membrane (hereinafter referred to as " circuit exposes film ") that circuit exposes via adhesive in described flexible printed circuit board by hot press.Therefore, CL film adhere to circuit expose film time, closely sealed and the release layer that this kind of mold release film can prevent release layer from exposing film and CL film to circuit each other closely sealed, demonstrate reasonable embeddability (with the conformability of the unlapped circuit pattern part of CL film (jog)), and circuit is exposed the seepage discharge of oozing to described circuit pattern part of adhesive between film and CL film and control in allowed band.
prior art document
patent document
Patent document 1: the No. 05/030466 International Publication text
Summary of the invention
invent problem to be solved
Therefore, in this FPC manufacture field, it is further desirable that the mold release film of embedded performance excellence.
The object of this invention is to provide a kind of circuit that adhered to by CL film when exposing film, the closely sealed and release layer that can prevent release layer from exposing film and CL film to circuit mold release film that is closely sealed, that obtain embeddability more better than existing PBT class mold release film each other.
the means of dealing with problems
(1)
Mold release film of the present invention comprises the release layer as at least one side surface layer.In addition, described mold release film can only be formed by release layer.The main component of release layer is the mixture of the copolymer (B) of polybutylene terephthalate (PBT) homopolymers (A) and polybutylene terephthalate (PBT) and polytetramethylene glycol.
By being combined the copolymer (B) of polybutylene terephthalate (PBT) homopolymers (A) and polybutylene terephthalate (PBT) and polytetramethylene glycol on release layer, the adhesive that mold release film of the present invention can reduce the CL film existed in existing mold release film oozes the seepage discharge to described circuit pattern part, and it is excessively closely sealed to suppress with CL adhesive, improves release property further.
(2)
In the mold release film of above-mentioned (1), the weight ratio (A/B) of the polybutylene terephthalate (PBT) homopolymers (A) in preferred release layer and copolymer (B) is for more than A/B=25/75 and less than 80/20.
(3)
In the mold release film of above-mentioned (2), the weight ratio (A/B) of the polybutylene terephthalate (PBT) homopolymers (A) in preferred release layer and copolymer (B) is for more than A/B=25/75 and less than 50/50.
(4)
In the mold release film any one of above-mentioned (1)-(3), the copolymerization ratio (PBT/PTMG) of the polybutylene terephthalate (PBT) in preferred copolymer (B) and polytetramethylene glycol is for more than PBT/PTMG=80/20 and less than 90/10.
(5)
In the mold release film any one of above-mentioned (1)-(4), preferably also there is cushion.
(6)
In the mold release film of above-mentioned (5), the thickness of preferred release layer is less than 15 μm.
(7)
Mold release film of the present invention comprises the release layer as at least superficial layer of side.In addition, described mold release film can only be formed by release layer.The resin that release layer can be polyetherester block copolymer by main component is formed.Polyetherester block copolymer is formed primarily of polyester segment and polyether segment.
If the resin that release layer is polyetherester block copolymer by main component is formed, then this mold release film closely sealed and release layer each other closely sealed that can prevent the release layer that exists in existing PBT mold release film from exposing film and CL film to circuit, and compared with existing PBT mold release film, the circuit adhesive exposed between film and CL film can be reduced and ooze seepage discharge to described circuit pattern part.
(8)
Mold release film of the present invention comprises the release layer as at least superficial layer of side.In addition, described mold release film can only be formed by release layer.Release layer is that the resinoid resin of polybutylene terephthalate (PBT) is formed by main component.In addition, the thickness of this kind of release layer is for being greater than 0 μm and less than 15 μm.
Closely sealed and the release layer that above-mentioned mold release film can prevent the release layer that exists in existing PBT class mold release film from exposing film and CL film to circuit each other closely sealed, compared with existing PBT class mold release film, the circuit adhesive exposed between film and CL film can be reduced and ooze seepage discharge to described circuit pattern part.In addition, usual release layer is thinner, easilier when mechanical load cracks on release layer, but even if this mold release film also can not crack when mechanical load on release layer.
In addition, in described mold release film, the thickness of release layer is greater than 0 μm and below 15 μm, thinner than the release layer in existing PBT class mold release film.Therefore, compared with existing PBT class mold release film, described mold release film can be reduced in the amount of the resin used when release layer is formed.Therefore, described mold release film can contribute to reduction carrying capacity of environment and manufacturing cost.
(9)
In the mold release film of above-mentioned (8), the thickness of preferred release layer is greater than 0 μm and below 10 μm.
(10)
In the mold release film of above-mentioned (8) or (9), preferred polybutylene terephthalate (PBT) resinoid is polybutylene terephthalate (PBT) resin.
(11)
In the mold release film of above-mentioned (8) or (9), preferred polybutylene terephthalate (PBT) resinoid is polyetherester block copolymer.Polyetherester block copolymer is formed primarily of polyether segment and polyester segment.
(12)
In the mold release film of above-mentioned (7) or (11), the weight ratio of preferred polyester segment and polyether segment is in the scope of 80:20 to 90:10.
(13)
In the mold release film of above-mentioned (12), the construction unit of preferred, polyethers segment is mainly oxygen butylidene unit, and the construction unit of preferred polyester segment is mainly the ester units shown in following chemical formula (I).
Chemical constitution 1
invention effect
CL film is adhered to circuit when exposing film, the closely sealed and release layer that mold release film of the present invention can prevent release layer from exposing film and CL film to circuit each other closely sealed, meanwhile, obtains embeddability more better than existing PBT class mold release film.
Accompanying drawing explanation
The longitudinal sectional drawing of the laminated film of Fig. 1 embodiment of the present invention.
The longitudinal sectional drawing of the laminated film of Fig. 2 variant embodiment (A).
Fig. 3 is the figure of an example of the manufacturing installation of the laminated film that embodiment of the present invention is shown.
Fig. 4 is the figure of an example of the using method of the laminated film that embodiment of the present invention is shown.
Fig. 5 is the figure of the heating mode of hot press when laminated film when the application of the invention embodiment being shown and CL film being sealed at the jog of circuit pattern.
description of reference numerals
100,100A laminated film (mold release film)
110 release layers
110a first release layer (release layer)
110b second release layer (release layer)
120 cushions
Detailed description of the invention
-the first embodiment-
As shown in Figure 1, the laminated film 100 of the first embodiment of the present invention is formed primarily of release layer 110 and cushion 120.In addition, in this embodiment, the thickness of preferably layer press mold 100 is more than 25 μm and less than 300 μm.Below these layers are described in detail respectively.
The detailed description > of < laminate film structure layer
1. release layer
Release layer 110 is made up of the resin of the copolymer (B) containing polybutylene terephthalate (PBT) homopolymers (A) and polybutylene terephthalate (PBT) composition and polytetramethylene glycol composition.
In release layer 110, the weight ratio (A/B) of homopolymers (A) and copolymer (B) is preferably more than A/B=10/90 and less than 90/10, be more preferably more than A/B=20/80 and less than 80/20, more preferably more than A/B=25/75 and less than 80/20.As more than A/B=10/90 and less than 90/10 time, owing to not having strong with CL adhesive closely sealed, therefore the release property of release layer 110 did not reduce, and can prevent the increase of the seepage discharge of CL adhesive in addition.Especially, from improving the viewpoint of embeddability, preferred more than A/B=25/75 and less than 50/50.
Polybutylene terephthalate (PBT) composition in the copolymer (B) contained in release layer 110 and the copolymerization ratio (PBT/PTMG) of polytetramethylene glycol composition are preferably more than PBT/PTMG=80/20 and less than 90/10.As more than PBT/PTMG=80/20 and less than 90/10 time, can prevent the seepage discharge of CL adhesive from increasing, can prevent the adaptation of CL adhesive from worsening in addition.
As the resinous principle that also can be included in except homopolymers (A) and copolymer (B) in release layer formation resin, such as, can enumerate elastomer resin, polyolefin resin, polystyrene resins, polyester resin, polyamide-based resin, polyphenylene oxide, polyphenylene sulfide (PPS) etc.In addition, these resins can be used alone, or are used in combination.
In addition, as elastomer resin, such as, natural rubber can be enumerated, polybutadiene, polyisoprene, polyisobutene, neoprene, polysulfide rubber, polysulfide rubber (チ オ コ ー Le go system), acrylic rubber, polyurethane rubber, silicon rubber, epichlorohydrin rubber, styrene-butadiene block copolymer (SBR), hydrogenated styrene-butadiene block copolymer (SEB), SBS (SBS), hydrogenated styrene-butadiene-styrene block copolymers (SEBS), styrene-isoprene block copolymer (SIR), hydrogenated styrene isoprene block copolymer (SEP), SIS (SIS), hydrogenated styrene isoprene-styrene block copolymer (SEPS), or ethylene-propylene rubber (EPM), Ethylene-Propylene-Diene rubber (EPDM), the olefin rubbers such as LLDPE class elastomer, or butadiene-acrylonitrile-styrene-core shell rubber (ABS), MBS-core shell rubber (MBS), methyl methacrylate-butyl acrylate-styrene-core shell rubber (MAS), 2-ethyl hexyl acrylate-butadiene-styrene-core shell rubber (MABS), alkyl acrylate-butadiene-acrylonitrile-styrene-core shell rubber (AABS), butadiene-styrene-core shell rubber (SBR), the granulated elastomeric body of the core shell rubber such as core shell rubber containing siloxanes such as methyl methacrylate-butyl acrylate-siloxanes, or by rubber etc. that its modification obtains.
As polyolefin resin, such as can enumerate linear high-density polyethylene, LLDPE, hp-ldpe, isotactic polypropylene, syndiotactic polypropylene, block polypropylene, random polypropylene, polybutene, 1,2-polybutadiene, poly-(4-methylpentene), cyclic polyolefin and copolymer (such as ethylene methyl methacrylate copolymer etc.) thereof etc.
As polystyrene resins, such as, can enumerate random isotactic polystyrene, isotactic polystyrene, high high impact polystyrene (HIPS), acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitritrile-styrene resin (AS), Styrene-methyl Acrylic Acid Copolymer, styrene-t alkyl ester copolymer, styrene-t glycidyl ester copolymer, Styrene-acrylic copolymer, styrene-alkyl acryl ate copolymer, styrene-maleic acid copolymer, styrene-fumaric acid copolymer etc.
As polyester resin, such as, Merlon, PETG etc. can be enumerated.
As polyamide-based resin, such as, can enumerate nylon (registration mark) 6, nylon (registration mark) 6,6 etc.
Formed in resin at release layer, can multiple additives be mixed, such as anticaking agent, antioxidant, nucleator, antistatic additive, process oil, plasticizer, releasing agent, fire retardant, flame retardant, pigment etc.
In addition, as anticaking agent, inorganic particle or the organic granular of the following stated can be enumerated.As inorganic particle, IA race, IIA race, IVA race, VIA race, VIIA race, VIII, IB race, IIB race, IIIB race, the oxide of IVB race element, hydroxide, sulfide, nitride, halide, carbonate, sulfate, acetate, phosphate, phosphite, organic carboxylate, silicate, titanate, borate and hydrate thereof can be enumerated, and complex compound centered by it and natural mineral particles.
As the instantiation of this kind of inorganic particle, the compound of the IA race element such as lithium fluoride, borax (Boratex salt hydrate) can be enumerated; The compound of the IIA race elements such as magnesium carbonate, magnesium phosphate, magnesia, magnesium chloride, magnesium acetate, magnesium fluoride, magnesium titanate, magnesium silicate, magnesium silicate hydrate (talcum), calcium carbonate, calcium phosphate, Arizona bacilli, calcium sulfate (gypsum), calcium acetate, terephthalic acid (TPA) calcium, calcium hydroxide, calcium silicates, calcirm-fluoride, calcium titanate, strontium titanates, brium carbonate, barium phosphate, barium sulfate, barium sulfite; The compound of the IVA race elements such as titanium dioxide, titanium monoxide, titanium nitride, zirconium dioxide, a zirconia; The compound of the VIA race elements such as molybdenum dioxide, molybdenum trioxide, molybdenum sulfide; The compound of the VIIA such as manganese chloride, manganese acetate race element; The compound of the VIII such as cobalt chloride, cobalt acetate element; The compound of the IB race elements such as cuprous iodide; The compound of the IIB such as zinc oxide, zinc acetate race element; The compound of the IIIB race elements such as aluminium oxide, aluminium hydroxide, aluminum fluoride, alumina silicate (kaolin, kaolinite); The compound of the IVB race element such as silica (silica, silica gel), graphite, carbon, graphite, glass; The natural mineral particles such as carnallite, kainite, mica (phlogopite), baked ore.
As organic granular, fluororesin, melamine resinoid, styrene diethylene benzene copoly mer, acrylic resin siloxanes and crosslinked thereof can be enumerated.
The average grain diameter of above-mentioned inorganic particle and organic granular is preferably more than 0.1 μm and less than 10 μm, and addition is preferably more than 0.01 % by weight and less than 15 % by weight.
In addition, these anticaking agents can be used alone, or are two or morely combined.
As antioxidant, phosphorus antioxidants, phenol antioxidant, sulphur class antioxidant, acrylic acid 2-[(1-hydroxyl-3,5-di-tert-pentyl-phenyl) ethyl]-4,6-di-tert-pentyl-phenyl esters etc. can be enumerated.In addition, these antioxidants can be used alone, or are two or morely combined.
As nucleator, phosphate metal salt, talcum, the phthalocyanine derivates etc. such as carboxylic metallic salt, di-2-ethylhexylphosphine oxide (2,4-DTBP) sodium acid phosphate such as two (p-tert-butyl benzoic acid) aluminium can be enumerated.In addition, these nucleators can be used alone, or are two or morely combined.
As plasticizer, polyethylene glycol, polyamide oligomer as well as, ethylenebisstearamide, phthalic acid ester, polystyrene oligomer, Tissuemat E, silicone oil etc. can be enumerated.In addition, these plasticizer can be used alone, or are two or morely combined.
As releasing agent, Tissuemat E, silicone oil, long-chain carboxylic acid, long-chain carboxylic acid's slaine etc. can be enumerated.In addition, these releasing agents can be used alone, or are two or morely combined.
As process oil, paraffin class oil can be enumerated, naphthenic is oily, aromatic species is oily.In addition, in these process oils, the carbon number relevant to the paraffin (straight chain) calculated by n-d-M method is preferred relative to the paraffin class oil that the percentage of total carbon number is more than 60%Cp.
About operation oil viscosity, preferably 40 DEG C time dynamic viscosity at more than 15cs and below 600cs, preferred at more than 15cs and below 500cs further.In addition, 100 weight portions of resin are formed relative to release layer, the addition of process oil is preferably more than 0.01 weight portion and below 1.5 weight portions, more preferably more than 0.05 weight portion and below 1.4 weight portions, preferred more than 0.1 weight portion and below 1.3 weight portions further.In addition, these process oils can be used alone, or are two or morely combined.
2. cushion
In the present embodiment, the resin (hereinafter referred to as " cushion forms resin ") that cushion 120 is ethylene methyl methacrylate copolymer by main component is formed.In addition, cushion formation resin can only be formed by ethylene methyl methacrylate copolymer.In order to improve the adhesiveness with release layer 110, can form at described cushion the resin adding in resin and form resin same composition with above-mentioned release layer.In order to prevent the outflow when heating, can be formed in resin at described cushion and adding polyolefin resin.In addition, as polyolefin resin, such as can enumerate linear high-density polyethylene, LLDPE, hp-ldpe, isotactic polypropylene, syndiotactic polypropylene, block polypropylene, random polypropylene, polybutene, 1,2-polybutadiene, poly-(4-methylpentene), cyclic polyolefin and copolymer thereof etc.In this embodiment, the thickness of cushion 120 is preferably more than 3 times of the thickness of release layer 110, is more preferably more than 5 times, more preferably more than 8 times.In the present embodiment, when release layer 110 and the adhesiveness of cushion 120 are bad, anchor layer or prime coat (adhesive layer) can be inserted between, the layers.
In addition, as required, not deviating from the scope of the object of the invention, can be formed in resin to described cushion and being mixed into above-mentioned elastomer resin and additive.
The manufacture method > of < laminated film
The laminated film 100 of the present embodiment can pass through the method manufacture such as coetrusion, extruding layer platen press.
In coetrusion, by use feed block and compound multimode head (multimanifold die), release layer 110 and cushion 120 are extruded fabrication layer press mold 100 simultaneously.In addition, as shown in Figure 3, in coetrusion, guided by the first roller 230 by the fused mass M of die head 210, cooled by the first roller 230 during till disengaging the first roller 230, form laminated film 100.Thereafter, this laminated film 100 is transmitted by the downstream of the second roller 240 to film direction of transfer (arrow see Fig. 3), is finally wound in take up roll (not shown).In addition, now, the temperature of the first roller 230 is preferably more than 30 DEG C and less than 100 DEG C, and the peripheral speed of relative first roller 230 of the second roller 240 is than preferably more than 0.990 and less than 0.998.In addition, as required, contact roller can be set near the first roller.
In extruding layer platen press, the temperature of extruder cylinder is set in more than 225 DEG C and less than 250 DEG C, to extrude release layer 110, and merges this release layer 110 and cushion 120, thus lamination release layer 110 and cushion 120 fabrication layer press mold 100.In addition, as shown in Figure 3, in extruding layer platen press, form the fused mass M of resin by the guiding of the first roller 230 by the release layer of die head 210, cooled by the first roller 230 during till disengaging the first roller 230, form demoulding tunic F.Thereafter, this demoulding tunic F is transmitted by the downstream of the second roller 240 to film direction of transfer (arrow see Fig. 3).Then, the fused mass (not shown) forming the resin compound of cushion 120 is merged with the demoulding tunic F transmitted to film direction of transfer downstream, makes it become to be integrated with demoulding tunic F, thus fabrication layer press mold 100.In addition, the laminated film 100 so manufactured is wound on the take up roll (not shown) being arranged at film direction of transfer downstream.In addition, now, the temperature of the first roller 230 is preferably more than 30 DEG C and less than 100 DEG C, the second roller 240 relative to the peripheral speed of the first roller 230 than preferably more than 0.990 and less than 0.998.In addition, as required, contact roller can be set near the first roller.
In addition, when being difficult to form thin release layer 110 by said method, adopting the manufacturing process such as solution-cast forming process, forming resin solution by release layer and also can to form release layer 110.
The use embodiment > of a < laminated film
CL film being adhered to circuit when exposing film, for making the closely sealed jog at circuit pattern of CL film, therefore the laminated film 100 of embodiment of the present invention being configured in the mode of coated CL film, and with circuit expose film and CL film together pressurized device pressurize.Particularly, as shown in Figure 4, laminated film 100 is sandwiched in the mode that release layer 110 is opposite and circuit is exposed by adhesive the parts 340 that film and CL film temporarily fix, afterwards, sandwich with the order of Teflon (registration mark) sheet 330, rubber blanket 320 and corrosion resistant plate 310, and pressed (hollow arrow see in Fig. 4) by hot plate 300.In addition, as utilizing the heating means of described hot plate 300 as shown in Figure 5.In other words, hot plate 300 from pressurization with 15 minutes, temperature is risen to 170 DEG C by normal temperature, maintain thereafter this temperature 35 minutes.Then, hot plate 300 was cooled to normal temperature through 50 minutes from 170 DEG C.In addition, utilize the pressurization of hot plate 300 to be from the time point of 0 minute, decontrol at the time points of 100 minutes.In addition, now moulding pressure suitably regulates at more than 5MPa and below 15MPa.
< variant embodiment >
(A)
In the first embodiment, the second following embodiment or the 3rd embodiment, describe the laminated film 100 that release layer 110 is only set on the side of cushion 120, but the laminated film 100A as shown in Figure 2, the both sides of cushion 120 being arranged release layer 110a and 110b is also contained in one embodiment of the invention.In addition, below, the release layer of Reference numeral 110a is called " the first release layer ", and the release layer of Reference numeral 110b is called " the second release layer ".
First release layer 110a has the structure identical with above-mentioned release layer 110.On the other hand, the second release layer 110b can have the structure identical with the first release layer 110a, also can have the structure different from the first release layer 110a.
When the second release layer 110b has the structure identical with the first release layer 110a, the thickness of the second release layer 110b is preferably greater than 0 μm and below 15 μm, more preferably greater than 0 μm and below 12 μm, be preferably greater than 0 μm further and below 10 μm, be preferably greater than 0 μm further and below 8 μm, be preferably greater than 0 μm further and below 6 μm, be preferably greater than 0 μm further and be less than 5 μm, be preferably greater than 0 μm further and below 4 μm, be preferably greater than 0 μm further and below 3 μm, be preferably greater than 0 μm further and below 2 μm, be preferably greater than 0 μm further and below 1 μm.
When the second release layer 110b has the structure different from the first release layer 110a, the second release layer 110b such as by main component be acrylic resin, the resin of polymethylpentene resin, methylpentene-alpha olefin copolymer or the polystyrene resins with syndiotactic structure formed.In addition, polymethylpentene resin or methylpentene-alpha olefin copolymer are sold from Mitsui Chemicals Co., Ltd with trade name TPX (registration mark).In addition, the polystyrene resins with syndiotactic structure is sold from bright dipping Xing Chan Co., Ltd with trade name XAREC (registration mark).In this case, the bonding force of the second release layer 110b and cushion 120 may reduce, but when this occurs, can insert anchor layer and prime coat (adhesive layer) between the second release layer 110b and cushion 120.In addition, when the resin that the second release layer 110b is acrylic resin by main component is formed, the cohesive of described cushion 120 and the second release layer 110b is good, does not therefore need between these layers to insert anchor layer or prime coat (adhesive layer).In addition, in this case, the thickness of the second release layer 110b preferably more than 5 μm, more preferably more than 10 μm.
(B)
In an embodiment of the laminated film of use first embodiment, the second following embodiment or the 3rd embodiment, sandwich with the order of Teflon (registration mark) sheet 330, rubber blanket 320 and corrosion resistant plate 310 successively between laminated film 100 and hot plate 300, but Teflon (registration mark) sheet 330, rubber blanket 320 and corrosion resistant plate 310 can save.
Embodiment
Below, as shown in embodiment and reference example, more detailed description is done to the present invention.
Embodiment 1
1. the manufacture of laminated film
The raw material of (1) first release layer
As the raw material of the first release layer, use the resin combination that the polymerization of polybutylene terephthalate (PBT) homopolymers (A) and copolymer (B) is A/B=80/20 than (A/B).
Polybutylene terephthalate (PBT) homopolymers (A):
Mitsubishi Engineering-Plastics Co., Ltd NOVADURAN 5020
The copolymer (B) of polybutylene terephthalate (PBT) composition and polytetramethylene glycol composition:
Mitsubishi Engineering-Plastics Co., Ltd NOVADURAN 5505S
(copolymerization ratio: PBT composition/PTMG composition=90/10)
(2) raw material of cushion
As the raw material of cushion, use ethylene methyl methacrylate copolymer (methyl methacrylate derived units content: 5 % by weight) (ACRYFT (registration mark) WD106 of Sumitomo Chemical Co., Ltd).
The raw material of (3) second release layers
As the raw material of the second release layer, use polypropylene (NoblenFS2011DG2 of Sumitomo Chemical Co., Ltd).
(4) adhesive layer
As the resin of adhesive layer forming bonding first release layer and cushion, use modified poly ethylene (MODIC (registration mark) F515A of Co., Ltd of Mitsubishi Chemical).
(5) making of laminated film
Use coetrusion, the front and back being produced on cushion has the laminated film (see Fig. 2) of the first release layer and the second release layer.
In addition, particularly, use feed block and compound multimode head to extrude polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer, modified poly ethylene, ethylene methyl methacrylate copolymer and polypropylene and making layer press mold simultaneously.In addition, at this moment use the device shown in Fig. 3, but the temperature of the first roller 230 is 60 DEG C, the peripheral speed ratio of relative first roller 230 of the second roller 240 is 1.
The thickness of the first release layer of this laminated film is 12 μm, and the thickness of adhesive layer is 10 μm, and the thickness of cushion is 88 μm, and the thickness of the second release layer is 10 μm.
2.CL film adhesive test
In fact, the coated circuit being temporarily fixed with CL film by adhesive exposes film from both sides to expose the described laminated film of the opposite mode of film with the first release layer and circuit, is pressurizeed carry out hot pressing with the heating mode shown in Fig. 5 by hot plate.Its result, the seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is less than 90 μm (see table 1).In addition, laminated film easily can expose film from circuit and peel off, and stripping bad (film on circuit remains, and the adheres to) incidence of the laminated film after hot pressing is less than 1.0% (see table 1).
3. from the disbonded test CL adhesive
First release layer is directly bonded in the CL adhesive layer surface formed on polyimide film, 170 DEG C, carry out the pressurized treatments of 10 minutes under 4MPa.Thereafter, between the film by release adhesive, confirm whether the first release layer and CL adhesive can easily be peeled off.Its result, can easily peel off, and the adhesion (see table 1) of mold release film does not occur.
(embodiment 2)
As the raw material of the first release layer, use the resin combination that the polymerization of polybutylene terephthalate (PBT) homopolymers (A) and copolymer (B) is A/B=70/30 than (A/B), in addition, making layer press mold in the same manner as example 1, carries out the evaluation identical with embodiment 1 to this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is less than 90 μm (see table 1).In addition, the laminated film after hot pressing easily can expose film from circuit and peel off, and the bad incidence of the demoulding of laminated film is less than 1.0% (see table 1).About from the disbonded test on CL adhesive, easily can peel off, the adhesion (see table 1) of mold release film does not occur.
(embodiment 3)
As the raw material of the first release layer, use the resin combination that the polymerization of polybutylene terephthalate (PBT) homopolymers (A) and copolymer (B) is A/B=50/50 than (A/B), in addition, making layer press mold in the same manner as example 1, carries out the evaluation identical with embodiment 1 to this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is less than 80 μm (see table 1).In addition, laminated film easily can expose film from circuit and peel off, and the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0% (see table 1).About from the disbonded test on CL adhesive, easily can peel off, adhere to (see table 1).
(embodiment 4)
As the raw material of the first release layer, use the resin combination that the polymerization of polybutylene terephthalate (PBT) homopolymers (A) and copolymer (B) is A/B=25/75 than (A/B), in addition, making layer press mold in the same manner as example 1, carries out the evaluation identical with embodiment 1 to this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is less than 80 μm, more excellent than existing PBT mold release film (see table 1).In addition, laminated film easily can expose film from circuit and peel off, and the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT mold release film good (see table 1).About from the disbonded test on CL adhesive, easily can peel off, adhere to (see table 1).
(reference example 1)
As the raw material of the first release layer, only use copolymer (the Mitsubishi Engineering-Plastics Co., Ltd NOVADURAN 5505S of polybutylene terephthalate (PBT) composition and polytetramethylene glycol composition, copolymerization ratio: PBT composition/PTMG composition=90/10), in addition, making layer press mold in the same manner as example 1, evaluates this laminated film.In addition, the effect of reference example just in order to support embodiment, not illustrates the example of prior art as comparative example.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is less than 80 μm (see table 1).The bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0% (see table 1).But, easily cannot peel off from CL adhesive, adhere to (see table 1).
Table 1
In addition, in table 1, " homopolymerization PBT " represents polybutylene terephthalate (PBT) homopolymers, and " copolymerization PBT " represents the copolymer of polybutylene terephthalate (PBT) composition and polytetramethylene glycol composition.
-the second embodiment-
The laminated film 100 of the second embodiment of the present invention is described.The main distinction of the laminated film 100 of the second embodiment and the laminated film 100 of the first embodiment described is that necessity of release layer 110 forms different this point.In addition, about the composition that the laminated film 100 of the second embodiment is identical with the laminated film 100 of the first embodiment described, suitable omission has been carried out in the explanation for them.In addition, in the present embodiment, the thickness of laminated film 100 is preferably more than 25 μm and less than 300 μm.Below, these layers are described in detail respectively.
The resin (hereinafter referred to as " release layer forms resin ") that release layer 110 is polyetherester block copolymer by main component is formed.The content of the polyetherester block copolymer that release layer is formed in resin is more than 90 % by weight, preferably more than 95 % by weight.In addition, release layer 110 also can only be formed by polyetherester block copolymer.Below, the constituent of release layer formation resin is described in detail.
(1) polyetherester block copolymer
Polyetherester block copolymer is formed primarily of polyether segment and polyester segment.In addition, the weight ratio of polyester segment and polyether segment is preferably in the scope of 80:20 to 90:10.In addition, the construction unit of polyether segment is preferably mainly oxygen butylidene unit, and the construction unit of polyester segment is preferably mainly the ester units shown in following chemical formula (I).In addition, this kind of polyetherester block copolymer is sold from Mitsubishi Engineering-Plastics Co., Ltd with trade name NOVADURAN (registration mark) 5505S, 5510S.
Chemical constitution 2
(2) resin except polyetherester block copolymer
As the resin outside the polyetherester block copolymer of formation release layer formation resin, such as, can enumerate elastomer resin, polyolefin resin, polystyrene resins, polyester resin, polyamide-based resin, polyphenylene oxide resin, polyphenylene sulfide (PPS) etc.In addition, these resins can be used alone, or are used in combination.
In addition, as elastomer resin, polyolefin resin, polystyrene resins, polyamide-based resin, the resin identical with the first embodiment described can be enumerated.As polyester resin, such as, can enumerate Merlon, PETG, polybutylene terephthalate (PBT) etc.
(3) other
Formed in resin at release layer, the multiple additives identical with the first embodiment described can be mixed, such as anticaking agent, antioxidant, nucleator, antistatic additive, process oil, plasticizer, releasing agent, fire retardant, flame retardant, pigment etc.
2. cushion
Cushion 120 is formed in the mode identical with the first embodiment described.
The manufacture of < laminated film, use >
The laminated film 100 of the present embodiment can be identical with the first embodiment described mode manufacture and use.
Below, by illustrating that embodiment and comparative example are described in more detail the present invention.
(embodiment 1)
1. the manufacture of laminated film
The raw material of (1) first release layer
As the raw material of the first release layer, use polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer (polybutylene terephthalate (PBT) construction unit/polytetramethylene glycol construction unit: 90 weight portion/10 weight portions) (NOVADURAN (registration mark) 5505S of Mitsubishi Engineering-Plastics Co., Ltd).
(2) raw material of cushion
As the raw material of cushion, use ethylene methyl methacrylate copolymer (methyl methacrylate derived units content: 5 % by weight) (ACRYFT (registration mark) WD106 of Sumitomo Chemical Co., Ltd).
The raw material of (3) second release layers
As the raw material of the second release layer, use polypropylene (NoblenFS2011DG2 of Sumitomo Chemical Co., Ltd).
(4) adhesive layer
As the resin of adhesive layer forming bonding first release layer and cushion, use modified poly ethylene (MODIC (registration mark) F515A of Co., Ltd of Mitsubishi Chemical).
(5) making of laminated film
Use coetrusion, the front and back being produced on cushion has the laminated film (see Fig. 2) of the first release layer and the second release layer.
In addition, particularly, use feed block and compound multimode head to extrude polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer, modified poly ethylene, ethylene methyl methacrylate copolymer and polypropylene and making layer press mold simultaneously.In addition, at this moment use the device shown in Fig. 3, but the temperature of the first roller 230 is 60 DEG C, the peripheral speed ratio of relative first roller 230 of the second roller 240 is 1.
The thickness of the first release layer of this laminated film is 28 μm, and the thickness of adhesive layer is 10 μm, and the thickness of cushion is 72 μm, and the thickness of the second release layer is 10 μm.
2.CL film adhesive test
In fact, the coated circuit being temporarily fixed with CL film by adhesive exposes film from both sides to expose the described laminated film of the opposite mode of film with the first release layer and circuit, is pressurizeed carry out hot pressing with the heating mode shown in Fig. 5 by hot plate.Its result, the seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is less than 80 μm, than existing PBT mold release film (see comparative example 1) more excellent (see table 2).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT mold release film good (see table 2).
(embodiment 2)
As the raw material of the first release layer, use polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer (polybutylene terephthalate (PBT) construction unit/polytetramethylene glycol construction unit: 80 weight portion/20 weight portions) (NOVADURAN (registration mark) 5510S of Mitsubishi Engineering-Plastics Co., Ltd), in addition, making layer press mold in the same manner as example 1, evaluates this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is less than 80 μm, than existing PBT mold release film (see comparative example 1) more excellent (see table 2).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT mold release film good (see table 2).
(comparative example 1)
As the raw material of the first release layer, use polybutylene terephthalate (PBT) (NOVADURAN (registration mark) 5020 of Mitsubishi Engineering-Plastics Co., Ltd), in addition, making layer press mold in the same manner as example 1, evaluates this laminated film.
The circuit adhesive exposed between film and CL film oozes the seepage discharge (see table 2) more than 150 μm to circuit pattern.The bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0% (see table 2).
Table 2
In addition, in table 2, " PBT/PTMG (90/10) " represents polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer (polybutylene terephthalate (PBT) segment/polytetramethylene glycol segment: 90 weight portion/10 weight portions), " PBT/PTMG (80/20) " represents polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer (polybutylene terephthalate (PBT) segment/polytetramethylene glycol segment: 80 weight portion/20 weight portions), " PBT " represents polybutylene terephthalate (PBT), " modified PE " represents modified poly ethylene, " EMMA " represents ethylene methyl methacrylate copolymer (methyl methacrylate derived units content: 5 % by weight), " PP " represents polypropylene.
-the third embodiment-
The laminated film 100 of the third embodiment of the present invention is described.The main distinction of the laminated film 100 of the third embodiment and the laminated film 100 of the first embodiment described and the second embodiment is that necessity of release layer 110 forms different this point.In addition, about the composition that the laminated film 100 of the third embodiment is identical with the laminated film 100 of the first embodiment described, suitable omission has been carried out in the explanation for them.In addition, in the present embodiment, the thickness of laminated film 100 is preferably more than 25 μm and less than 300 μm.Below, these layers are described in detail respectively.
The detailed description > of < laminate film structure layer
1. release layer
Release layer 110 is that the resinoid resin of polybutylene terephthalate (PBT) (hereinafter referred to as " release layer forms resin ") is formed by main component.In addition, in the present embodiment, the thickness of release layer 110 is greater than 0 μm and below 15 μm.In addition, the thickness of release layer is preferably greater than 0 μm and below 12 μm, more preferably greater than 0 μm and below 10 μm, be preferably greater than 0 μm further and below 8 μm, be preferably greater than 0 μm further and below 6 μm, be preferably greater than 0 μm further and be less than 5 μm, be preferably greater than 0 μm further and below 4 μm, be preferably greater than 0 μm further and below 3 μm, be preferably greater than 0 μm further and below 2 μm, be preferably greater than 0 μm further and below 1 μm.In addition, in No. 05/030466 International Publication text [0052] section, describe " lower limit of preferred described release layer thickness is 5 μm ", but only disclose 25 μm of thick release layers in an embodiment.Below, the constituent of release layer formation resin is described in detail.
(1) polybutylene terephthalate (PBT) resinoid
So-called polybutylene terephthalate (PBT) resinoid refers to, such as polybutylene terephthalate (PBT) resin or main component are the copolymer etc. of mutual-phenenyl two acid bromide two alcohol ester's unit (see following chemical formula (I)).As " main component is the copolymer of mutual-phenenyl two acid bromide two alcohol ester's unit ", such as, can enumerate the polyetherester block copolymer etc. formed primarily of polybutylene terephthalate (PBT) segment and polyoxybutylene segment.In addition, the weight ratio of polybutylene terephthalate (PBT) segment and polyoxybutylene segment is preferably in the scope of 80:20 to 90:10.In addition, this kind of polyetherester block copolymer is sold from Mitsubishi Engineering-Plastics Co., Ltd with trade name NOVADURAN (registration mark) 5505S, 5510S.
Chemical constitution 3
In the present embodiment, release layer forms the resinoid content of polybutylene terephthalate (PBT) in resin more than 90 % by weight, but preferably more than 95 % by weight.In addition, release layer 110 also can only be formed by polybutylene terephthalate (PBT) resinoid.
(2) resin except polybutylene terephthalate (PBT) resinoid
As the resin outside the polybutylene terephthalate (PBT) resinoid of formation release layer formation resin, such as, can enumerate elastomer resin, polyolefin resin, polystyrene resins, polyester resin, polyamide-based resin, polyphenylene oxide resin and polyphenylene sulfide (PPS) etc.In addition, these resins can be used alone, or are used in combination.
In addition, as elastomer resin, polyolefin resin, polystyrene resins, polyamide-based resin, the resin identical with the first embodiment described can be enumerated.As polyester resin, such as, Merlon, PETG etc. can be enumerated.
(3) other
Formed in resin at release layer, the multiple additives identical with the first embodiment described can be mixed, such as anticaking agent, antioxidant, nucleator, antistatic additive, process oil, plasticizer, releasing agent, fire retardant, flame retardant, pigment etc.
2. cushion
Cushion 120 is formed in the mode identical with the first embodiment described.
The manufacture of < laminated film, use >
The laminated film 100 of this embodiment can be identical with the first embodiment described mode manufacture and use.
Below, by illustrating that embodiment is described in more detail the present invention.
(embodiment 1)
1. the manufacture of laminated film
The raw material of (1) first release layer
As the raw material of the first release layer, use polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer (polybutylene terephthalate (PBT) construction unit/polytetramethylene glycol construction unit: 80 weight portion/20 weight portions) (NOVADURAN (registration mark) 5510S of Mitsubishi Engineering-Plastics Co., Ltd).
(2) raw material of cushion
As the raw material of cushion, use ethylene methyl methacrylate copolymer (methyl methacrylate derived units content: 5 % by weight) (ACRYFT (registration mark) WD106 of Sumitomo Chemical Co., Ltd).
The raw material of (3) second release layers
As the raw material of the second release layer, use polypropylene (NoblenFS2011DG2 of Sumitomo Chemical Co., Ltd).
(4) adhesive layer
As the resin of the adhesive layer formed for bonding the first release layer and cushion, use modified poly ethylene (MODIC (registration mark) F515A of Co., Ltd of Mitsubishi Chemical).
(5) making of laminated film
Use coetrusion, the front and back being produced on cushion has the laminated film (see Fig. 2) of the first release layer and the second release layer.
In addition, particularly, use feed block and compound multimode head to extrude polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer, modified poly ethylene, ethylene methyl methacrylate copolymer and polypropylene and making layer press mold simultaneously.In addition, at this moment use the device shown in Fig. 3, but the temperature of the first roller 230 is 60 DEG C, the peripheral speed ratio of relative first roller 230 of the second roller 240 is 1.
The thickness of the first release layer of this laminated film is 6 μm, and the thickness of adhesive layer is 10 μm, and the thickness of cushion is 94 μm, and the thickness of the second release layer is 10 μm.
2.CL film adhesive test
In fact, the coated circuit being temporarily fixed with CL film by adhesive exposes film from both sides to expose the described laminated film of the opposite mode of film with the first release layer and circuit, is pressurizeed carry out hot pressing with the heating mode shown in Fig. 5 by hot plate.Its result, the seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is 60 μm, than existing PBT class mold release film more excellent (see table 3).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT class mold release film good (see table 3).
(embodiment 2)
As the raw material of the first release layer, use polybutylene terephthalate (PBT) resin (NOVADURAN (registration mark) 5020 of Mitsubishi Engineering-Plastics Co., Ltd), in addition, making layer press mold in the same manner as example 1, evaluates this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is 70 μm, than existing PBT class mold release film more excellent (see table 3).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT class mold release film good (see table 3).
(embodiment 3)
As the raw material of the first release layer, use polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer (polybutylene terephthalate (PBT) construction unit/polytetramethylene glycol construction unit: 90 weight portion/10 weight portions) (NOVADURAN (registration mark) 5505S of Mitsubishi Engineering-Plastics Co., Ltd), in addition, making layer press mold in the same manner as example 1, evaluates this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is 70 μm, than existing PBT class mold release film more excellent (see table 3).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT class mold release film good (see table 3).
(embodiment 4)
Thickness except the first release layer is set to 12 μm, and the thickness of cushion is set to 98 μm, does not arrange outside the second release layer, in the same manner as example 1 making layer press mold, evaluates this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is 90 μm, than existing PBT class mold release film more excellent (see table 3).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT class mold release film good (see table 3).
(embodiment 5)
Thickness except the first release layer is set to 12 μm, and the thickness of cushion is set to outside 88 μm, and making layer press mold in the same manner as example 1, evaluates this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is 90 μm, than existing PBT class mold release film more excellent (see table 3).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT class mold release film good (see table 3).
(embodiment 6)
Thickness except the first release layer is set to 4 μm, and the thickness of cushion is set to 62 μm, and the thickness of the second release layer is set to 7 μm, and the thickness of adhesive layer is set to outside 7 μm, and making layer press mold in the same manner as example 1, evaluates this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is 70 μm, than existing PBT class mold release film more excellent (see table 3).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT class mold release film good (see table 3).
(embodiment 7)
Thickness except the first release layer is set to 5 μm, and the thickness of cushion is set to 79 μm, and the thickness of the second release layer is set to 8 μm, and the thickness of adhesive layer is set to outside 8 μm, and making layer press mold in the same manner as example 1, evaluates this laminated film.
The seepage discharge that the circuit adhesive exposed between film and CL film oozes to circuit pattern is 70 μm, than existing PBT class mold release film more excellent (see table 3).In addition, the bad incidence of the demoulding of the laminated film after hot pressing is less than 1.0%, same with existing PBT class mold release film good (see table 3).
Table 3
In addition, in table 3, " PBT/PTMG (90/10) " represents polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer (polybutylene terephthalate (PBT) segment/polytetramethylene glycol segment: 90 weight portion/10 weight portions), " PBT/PTMG (80/20) " represents polybutylene terephthalate (PBT)/polytetramethylene glycol block copolymer (polybutylene terephthalate (PBT) segment/polytetramethylene glycol segment: 80 weight portion/20 weight portions), " PBT " represents polybutylene terephthalate (PBT), " modified PE " represents modified poly ethylene, " EMMA " represents ethylene methyl methacrylate copolymer (methyl methacrylate derived units content: 5 % by weight), " PP " represents polypropylene.
industrial application
The feature of mold release film of the present invention is, each other closely sealed of its closely sealed and release layer that can prevent release layer from exposing film and CL film to circuit in the same manner as existing PBT mold release film, compared with existing PBT mold release film, it can reduce the circuit adhesive exposed between film and CL film and ooze seepage discharge to described circuit pattern part.Mold release film of the present invention especially as by pressurizeing CL film adhered to circuit expose film time, be sealed at the jog of circuit pattern and the mold release film that uses in the mode of coated cover layer for making CL film.
As mold release film, the mold release film having (1) to manufacture for laminate known in addition, (2) for the mold release film that advanced composite material goods manufacture, the mold release film that (3) manufacture for physical culture, leisure goods, mold release film of the present invention can be used as these mold release film.In addition, the mold release film used when laminate manufactures is, in the press molding when manufacturing multilayer board, in order to the film preventing the adhesion between printed circuit board (PCB) and dividing plate or other printed circuit board (PCB)s from arranging between which.The mold release film that advanced composite material goods use when manufacturing is, the film such as, used when manufacturing various goods at the prepreg that solidification is made up of epoxy resin and glass cloth, carbon fiber or aramid fiber.The mold release film that physical culture, leisure goods use when manufacturing is, such as, when manufacture fishing rod, golf clubs, surfboard etc., prepreg is rolled into the film rolled up on this prepreg when cylindrical shape is solidified in autoclave.
Described mold release film also can be used as the stripping film of adhesive tape, two-sided tape, masking belt, label, sealing strip, paster, skin paste poultice etc. in addition.
Described mold release film can be used as the processing of films used when manufacturing printed circuit board (PCB), ceramic electronic assembly, heat reactive resin goods or decorative panel etc.In addition, when manufacture printed circuit board (PCB), ceramic electronic assembly, heat reactive resin goods or decorative panel etc., in order to make metallic plate each other or resin do not adhere to each other, when formed machining can by mentioned herein and processing of films be placed between metallic plate or between resin, be particularly suitable for laminate manufacture, flexible printed circuit board manufacture, the manufacture of advanced composite material goods, physical culture, leisure goods manufacture.In addition, described mold release film also can be used as packaging film.
Claims (5)
1. a mold release film, it comprises the release layer as at least superficial layer of side, and described release layer is that the resinoid resin of polybutylene terephthalate (PBT) is formed by main component, and thickness is lower than 5 μm.
2. the mold release film of claim 1, wherein said polybutylene terephthalate (PBT) resinoid is polybutylene terephthalate (PBT) resin.
3. the mold release film of claim 1, wherein said polybutylene terephthalate (PBT) resinoid is the polyetherester block copolymer formed primarily of polyether segment and polyester segment.
4. the mold release film of claim 3, the weight ratio of wherein said polyester segment and polyether segment is in the scope of 80:20 to 90:10.
5. the mold release film of claim 4, the construction unit of wherein said polyether segment is mainly oxygen butylidene unit, and the construction unit of described polyester segment is mainly the ester units shown in following chemical formula (I)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010080324A JP2011212848A (en) | 2010-03-31 | 2010-03-31 | Mold release film |
| JP2010-080324 | 2010-03-31 | ||
| JP2010102577A JP5652743B2 (en) | 2010-04-27 | 2010-04-27 | Release film |
| JP2010-102577 | 2010-04-27 | ||
| JP2010-161488 | 2010-07-16 | ||
| JP2010161488A JP2012021109A (en) | 2010-07-16 | 2010-07-16 | Mold release film |
| CN2011800172801A CN102821956A (en) | 2010-03-31 | 2011-03-30 | Taniguchi hirohito |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2011800172801A Division CN102821956A (en) | 2010-03-31 | 2011-03-30 | Taniguchi hirohito |
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| CN104842621A true CN104842621A (en) | 2015-08-19 |
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| CN201510236543.8A Pending CN104842621A (en) | 2010-03-31 | 2011-03-30 | Mould release film |
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| CN2011800172801A Pending CN102821956A (en) | 2010-03-31 | 2011-03-30 | Taniguchi hirohito |
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| CN (2) | CN102821956A (en) |
| SG (1) | SG184259A1 (en) |
| TW (1) | TWI494219B (en) |
| WO (1) | WO2011122023A1 (en) |
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| JP5832480B2 (en) * | 2012-10-19 | 2015-12-16 | 三井化学東セロ株式会社 | Release film |
| WO2014178151A1 (en) * | 2013-04-30 | 2014-11-06 | 住友ベークライト株式会社 | Release film and method for using release film |
| JP5874768B2 (en) * | 2013-04-30 | 2016-03-02 | 住友ベークライト株式会社 | Release film and method of using release film |
| JP5874774B2 (en) * | 2013-06-06 | 2016-03-02 | 住友ベークライト株式会社 | Release film and method of using release film |
| US10030138B2 (en) | 2013-07-01 | 2018-07-24 | Kaneka Corporation | High thermal conductivity thermoplastic resin composition with excellent injection moldability |
| CN103434231B (en) * | 2013-07-19 | 2016-04-13 | 胡宇翔 | A kind of printed circuit board forming mould release membrance and manufacture method thereof |
| CN110997319B (en) * | 2017-07-24 | 2022-09-09 | 东丽株式会社 | Film |
| WO2024075700A1 (en) * | 2022-10-07 | 2024-04-11 | 積水化学工業株式会社 | Release film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006148081A (en) * | 2004-10-19 | 2006-06-08 | Sumitomo Bakelite Co Ltd | Mold release film and method of manufacturing circuit board |
| JP2007098816A (en) * | 2005-10-05 | 2007-04-19 | Sumitomo Bakelite Co Ltd | Releasing film and method for manufacturing circuit board |
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2011
- 2011-03-30 CN CN2011800172801A patent/CN102821956A/en active Pending
- 2011-03-30 KR KR1020127023396A patent/KR20130018237A/en not_active Application Discontinuation
- 2011-03-30 WO PCT/JP2011/001910 patent/WO2011122023A1/en active Application Filing
- 2011-03-30 SG SG2012071155A patent/SG184259A1/en unknown
- 2011-03-30 CN CN201510236543.8A patent/CN104842621A/en active Pending
- 2011-03-31 TW TW100111348A patent/TWI494219B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006148081A (en) * | 2004-10-19 | 2006-06-08 | Sumitomo Bakelite Co Ltd | Mold release film and method of manufacturing circuit board |
| JP2007098816A (en) * | 2005-10-05 | 2007-04-19 | Sumitomo Bakelite Co Ltd | Releasing film and method for manufacturing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011122023A1 (en) | 2011-10-06 |
| TW201202035A (en) | 2012-01-16 |
| CN102821956A (en) | 2012-12-12 |
| SG184259A1 (en) | 2012-10-30 |
| TWI494219B (en) | 2015-08-01 |
| KR20130018237A (en) | 2013-02-20 |
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Application publication date: 20150819 |