CN104576899A - 发光装置的制造方法 - Google Patents

发光装置的制造方法 Download PDF

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Publication number
CN104576899A
CN104576899A CN201410769338.3A CN201410769338A CN104576899A CN 104576899 A CN104576899 A CN 104576899A CN 201410769338 A CN201410769338 A CN 201410769338A CN 104576899 A CN104576899 A CN 104576899A
Authority
CN
China
Prior art keywords
light
phosphor
emitting device
manufacturing
phosphor dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410769338.3A
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English (en)
Chinese (zh)
Inventor
小岛健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Konica Minolta Advanced Layers Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of CN104576899A publication Critical patent/CN104576899A/zh
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201410769338.3A 2010-08-17 2011-08-02 发光装置的制造方法 Pending CN104576899A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010182211 2010-08-17
JP2010-182211 2010-08-17

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201180040060.0A Division CN103081142B (zh) 2010-08-17 2011-08-02 发光装置的制造方法

Publications (1)

Publication Number Publication Date
CN104576899A true CN104576899A (zh) 2015-04-29

Family

ID=45605081

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201180040060.0A Expired - Fee Related CN103081142B (zh) 2010-08-17 2011-08-02 发光装置的制造方法
CN201410769338.3A Pending CN104576899A (zh) 2010-08-17 2011-08-02 发光装置的制造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201180040060.0A Expired - Fee Related CN103081142B (zh) 2010-08-17 2011-08-02 发光装置的制造方法

Country Status (6)

Country Link
US (3) US8835192B2 (enExample)
EP (1) EP2608284A1 (enExample)
JP (3) JP5299577B2 (enExample)
KR (1) KR101478472B1 (enExample)
CN (2) CN103081142B (enExample)
WO (2) WO2012023425A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN107611241A (zh) * 2017-10-23 2018-01-19 苏州创思得新材料有限公司 一种多相复合的Re,Ce:YAG陶瓷荧光片及其制备方法

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JP5310700B2 (ja) * 2010-10-27 2013-10-09 パナソニック株式会社 Ledパッケージ製造システムおよびledパッケージ製造システムにおける樹脂塗布方法
JP5310699B2 (ja) * 2010-10-27 2013-10-09 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
US9260654B2 (en) * 2011-03-11 2016-02-16 Konica Minolta, Inc. Manufacturing method for light emitting device and phosphor mixture
JP5413404B2 (ja) 2011-05-30 2014-02-12 パナソニック株式会社 Ledパッケージ製造システムおよびledパッケージ製造システムにおける樹脂塗布方法
JP5413405B2 (ja) * 2011-05-30 2014-02-12 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
EP2752897A4 (en) * 2011-10-07 2015-04-29 Konica Minolta Inc MANUFACTURING METHOD FÜRLED DEVICE AND FLUORESCENT FABRICED DISPERSED SOLUTION USING THEREOF
WO2013121646A1 (ja) * 2012-02-16 2013-08-22 コニカミノルタ株式会社 発光装置の製造方法及び蛍光体塗布装置
JP2013258339A (ja) * 2012-06-13 2013-12-26 Konica Minolta Inc 発光装置及びその製造方法
EP2853577A4 (en) 2012-08-13 2016-01-06 Konica Minolta Inc METHOD FOR PRODUCING A PHOSPHORDISPERSION LIQUID AND METHOD FOR PRODUCING AN LED DEVICE
DE102012112316A1 (de) * 2012-12-14 2014-06-18 Osram Opto Semiconductors Gmbh Verfahren und Vorrichtung zur Herstellung eines Strahlung emittierenden Halbleiterbauelements und Strahlung emittierendes Halbleiterbauelement
JP5994628B2 (ja) * 2012-12-26 2016-09-21 日亜化学工業株式会社 発光装置の製造方法およびスプレーコーティング装置
EP2940744A4 (en) * 2012-12-27 2016-06-29 Konica Minolta Inc PHOSPHORDISPERSION, LED DEVICE AND METHOD FOR THE PRODUCTION THEREOF
WO2014199926A1 (ja) * 2013-06-13 2014-12-18 旭硝子株式会社 蛍光体分散シートの色度座標検査方法、蛍光体分散シートの製造方法、光変換部材の製造方法およびledパッケージの製造方法
KR101474376B1 (ko) * 2013-11-28 2014-12-18 주식회사 말콤 온도표시기능을 구비하는 led패키지용 시린지 및 이를 이용하는 led패키지 제조방법
CN103840068B (zh) * 2013-12-31 2017-09-19 杨毅 波长转换装置和发光装置
TWI575778B (zh) * 2014-05-07 2017-03-21 新世紀光電股份有限公司 發光二極體封裝結構
KR102237112B1 (ko) 2014-07-30 2021-04-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 광원 모듈
KR20180011398A (ko) 2016-07-21 2018-02-01 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR102053614B1 (ko) * 2018-06-19 2019-12-09 주식회사 네모엘텍 퀀텀닷 led 조명 및 제조 장치
CN108962798B (zh) * 2018-08-03 2024-07-05 华南理工大学 三基色rgb-led全自动荧光粉胶高速智能涂覆设备及方法

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JP2004153109A (ja) * 2002-10-31 2004-05-27 Matsushita Electric Works Ltd 発光装置及びその製造方法
CN100358164C (zh) * 2003-08-12 2007-12-26 斯坦雷电气株式会社 波长变换型发光二极管
CN101494271A (zh) * 2009-02-20 2009-07-29 隆达电子股份有限公司 发光二极管装置的制造方法及喷涂设备
CN101679861A (zh) * 2007-03-28 2010-03-24 国立大学法人广岛大学 M-c-n-o系荧光体

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KR100862532B1 (ko) * 2007-03-13 2008-10-09 삼성전기주식회사 발광 다이오드 패키지 제조방법
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JP2004153109A (ja) * 2002-10-31 2004-05-27 Matsushita Electric Works Ltd 発光装置及びその製造方法
CN100358164C (zh) * 2003-08-12 2007-12-26 斯坦雷电气株式会社 波长变换型发光二极管
CN101679861A (zh) * 2007-03-28 2010-03-24 国立大学法人广岛大学 M-c-n-o系荧光体
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107611241A (zh) * 2017-10-23 2018-01-19 苏州创思得新材料有限公司 一种多相复合的Re,Ce:YAG陶瓷荧光片及其制备方法

Also Published As

Publication number Publication date
JP5870923B2 (ja) 2016-03-01
CN103081142A (zh) 2013-05-01
JP2013229621A (ja) 2013-11-07
KR101478472B1 (ko) 2014-12-31
WO2012023424A1 (ja) 2012-02-23
JPWO2012023425A1 (ja) 2013-10-28
KR20130028148A (ko) 2013-03-18
US8835192B2 (en) 2014-09-16
CN103081142B (zh) 2015-01-14
US20130149801A1 (en) 2013-06-13
US9153752B2 (en) 2015-10-06
US20130143343A1 (en) 2013-06-06
WO2012023425A1 (ja) 2012-02-23
JPWO2012023424A1 (ja) 2013-10-28
US9306130B2 (en) 2016-04-05
JP5900425B2 (ja) 2016-04-06
EP2608284A1 (en) 2013-06-26
JP5299577B2 (ja) 2013-09-25
US20140349419A1 (en) 2014-11-27

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Application publication date: 20150429