CN104520768A - 永久掩模抗蚀剂用感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法和印刷配线板的制造方法 - Google Patents

永久掩模抗蚀剂用感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法和印刷配线板的制造方法 Download PDF

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Publication number
CN104520768A
CN104520768A CN201380041388.3A CN201380041388A CN104520768A CN 104520768 A CN104520768 A CN 104520768A CN 201380041388 A CN201380041388 A CN 201380041388A CN 104520768 A CN104520768 A CN 104520768A
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CN
China
Prior art keywords
epoxy resin
polymer combination
photosensitive polymer
hydrogen atom
glycidyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380041388.3A
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English (en)
Chinese (zh)
Inventor
赖华子
太田绘美子
村上泰治
名越俊昌
田中惠生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN104520768A publication Critical patent/CN104520768A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
CN201380041388.3A 2012-08-06 2013-08-02 永久掩模抗蚀剂用感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法和印刷配线板的制造方法 Pending CN104520768A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-174063 2012-08-06
JP2012174063 2012-08-06
PCT/JP2013/071060 WO2014024804A1 (ja) 2012-08-06 2013-08-02 永久マスクレジスト用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN104520768A true CN104520768A (zh) 2015-04-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380041388.3A Pending CN104520768A (zh) 2012-08-06 2013-08-02 永久掩模抗蚀剂用感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法和印刷配线板的制造方法

Country Status (5)

Country Link
JP (1) JPWO2014024804A1 (ja)
KR (1) KR20150042775A (ja)
CN (1) CN104520768A (ja)
TW (1) TWI589993B (ja)
WO (1) WO2014024804A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107850840A (zh) * 2015-07-14 2018-03-27 罗门哈斯电子材料有限责任公司 感光性树脂组合物
CN109541889A (zh) * 2018-12-19 2019-03-29 江苏艾森半导体材料股份有限公司 用于半导体封装工艺的负性光刻胶
CN110941140A (zh) * 2018-09-21 2020-03-31 旭化成株式会社 感光性树脂组合物
CN112543891A (zh) * 2018-08-01 2021-03-23 株式会社有泽制作所 保护剂用树脂组合物及其用途

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785551B2 (ja) * 2015-04-03 2020-11-18 三菱製紙株式会社 エッチング方法
JP2017003966A (ja) * 2015-06-12 2017-01-05 Jsr株式会社 感光性組成物、及びメッキ造形物の製造方法
JP7007792B2 (ja) * 2015-09-30 2022-01-25 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7018168B2 (ja) * 2015-12-22 2022-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法
JP2018174250A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP7228121B2 (ja) * 2018-04-25 2023-02-24 エア・ウォーター・パフォーマンスケミカル株式会社 光重合増感剤組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1176405A (zh) * 1996-09-10 1998-03-18 希巴特殊化学控股公司 改进光象质量的方法
US20010053437A1 (en) * 1997-11-28 2001-12-20 Kuniaki Sato Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film
CN1975577A (zh) * 2005-11-08 2007-06-06 罗门哈斯电子材料有限公司 光敏组合物
CN101833241A (zh) * 2009-03-09 2010-09-15 村上精密制版（昆山）有限公司 一种感光性树脂组合物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3247091B2 (ja) * 1997-11-28 2002-01-15 日立化成工業株式会社 光硬化性樹脂組成物及びこれを用いた感光性エレメント
JP3879316B2 (ja) * 1999-05-10 2007-02-14 ダイヤニトリックス株式会社 活性エネルギー線硬化性樹脂組成物
JP2002338639A (ja) * 2001-05-17 2002-11-27 Nippon Shokubai Co Ltd ラジカル硬化性樹脂組成物および硬化方法
JP2013057755A (ja) * 2011-09-07 2013-03-28 Fujifilm Corp 感光性樹脂組成物、感光性フイルム、感光性積層体、永久パターン形成方法およびプリント基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1176405A (zh) * 1996-09-10 1998-03-18 希巴特殊化学控股公司 改进光象质量的方法
US20010053437A1 (en) * 1997-11-28 2001-12-20 Kuniaki Sato Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film
CN1975577A (zh) * 2005-11-08 2007-06-06 罗门哈斯电子材料有限公司 光敏组合物
CN101833241A (zh) * 2009-03-09 2010-09-15 村上精密制版（昆山）有限公司 一种感光性树脂组合物

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107850840A (zh) * 2015-07-14 2018-03-27 罗门哈斯电子材料有限责任公司 感光性树脂组合物
CN107850840B (zh) * 2015-07-14 2022-05-17 罗门哈斯电子材料有限责任公司 感光性树脂组合物
CN112543891A (zh) * 2018-08-01 2021-03-23 株式会社有泽制作所 保护剂用树脂组合物及其用途
CN110941140A (zh) * 2018-09-21 2020-03-31 旭化成株式会社 感光性树脂组合物
CN110941140B (zh) * 2018-09-21 2023-09-15 旭化成株式会社 感光性树脂组合物
CN109541889A (zh) * 2018-12-19 2019-03-29 江苏艾森半导体材料股份有限公司 用于半导体封装工艺的负性光刻胶
CN109541889B (zh) * 2018-12-19 2020-06-26 江苏艾森半导体材料股份有限公司 用于半导体封装工艺的负性光刻胶
US11644750B2 (en) 2018-12-19 2023-05-09 Jiangsu Aisen Semiconductor Material Co., Ltd. Negative photoresist used for semiconductor encapsulation process

Also Published As

Publication number Publication date
KR20150042775A (ko) 2015-04-21
WO2014024804A1 (ja) 2014-02-13
JPWO2014024804A1 (ja) 2016-07-25
TWI589993B (zh) 2017-07-01
TW201418882A (zh) 2014-05-16

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Application publication date: 20150415