CN1045150C - 制造多层电路板的方法及制成的多层电路板 - Google Patents

制造多层电路板的方法及制成的多层电路板 Download PDF

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Publication number
CN1045150C
CN1045150C CN94194469A CN94194469A CN1045150C CN 1045150 C CN1045150 C CN 1045150C CN 94194469 A CN94194469 A CN 94194469A CN 94194469 A CN94194469 A CN 94194469A CN 1045150 C CN1045150 C CN 1045150C
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CN
China
Prior art keywords
layer
resin
resin composition
groups
resin component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN94194469A
Other languages
English (en)
Chinese (zh)
Other versions
CN1137339A (zh
Inventor
P·T·麦克格拉斯
W·赫特里奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fernox Ltd
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB939321186A external-priority patent/GB9321186D0/en
Priority claimed from GB9412457A external-priority patent/GB9412457D0/en
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Publication of CN1137339A publication Critical patent/CN1137339A/zh
Application granted granted Critical
Publication of CN1045150C publication Critical patent/CN1045150C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Reinforcement Elements For Buildings (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN94194469A 1993-10-14 1994-10-14 制造多层电路板的方法及制成的多层电路板 Expired - Fee Related CN1045150C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9321186.0 1993-10-14
GB939321186A GB9321186D0 (en) 1993-10-14 1993-10-14 Bonding inner layers in printed circuit board manufacture
GB9412457A GB9412457D0 (en) 1994-06-21 1994-06-21 Bonding inner layers in printed circuit board manufacture
GB9412457.5 1994-06-21

Publications (2)

Publication Number Publication Date
CN1137339A CN1137339A (zh) 1996-12-04
CN1045150C true CN1045150C (zh) 1999-09-15

Family

ID=26303676

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94194469A Expired - Fee Related CN1045150C (zh) 1993-10-14 1994-10-14 制造多层电路板的方法及制成的多层电路板

Country Status (10)

Country Link
US (1) US6074803A (cg-RX-API-DMAC7.html)
EP (1) EP0723736B1 (cg-RX-API-DMAC7.html)
JP (1) JPH09507609A (cg-RX-API-DMAC7.html)
CN (1) CN1045150C (cg-RX-API-DMAC7.html)
AT (1) ATE199201T1 (cg-RX-API-DMAC7.html)
AU (1) AU7860094A (cg-RX-API-DMAC7.html)
DE (1) DE69426702T2 (cg-RX-API-DMAC7.html)
DK (1) DK0723736T3 (cg-RX-API-DMAC7.html)
TW (1) TW290583B (cg-RX-API-DMAC7.html)
WO (1) WO1995010931A1 (cg-RX-API-DMAC7.html)

Families Citing this family (18)

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Publication number Priority date Publication date Assignee Title
JP4060962B2 (ja) * 1998-02-25 2008-03-12 互応化学工業株式会社 アルカリ現像型フォトソルダーレジストインク
US6277544B1 (en) * 1999-06-09 2001-08-21 Advanced Micro Devices, Inc. Reverse lithographic process for semiconductor spaces
US6221777B1 (en) 1999-06-09 2001-04-24 Advanced Micro Devices, Inc. Reverse lithographic process for semiconductor vias
US7228533B2 (en) * 2001-08-24 2007-06-05 Sun Microsystems, Inc. Frameworks for generation of Java macro instructions for performing programming loops
DE10302596A1 (de) * 2002-01-24 2003-08-28 Shipley Company Marlborough Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
ES2219174B1 (es) * 2003-03-27 2006-02-01 Chemplate Materials, S.L. "procedimiento para la fabricacion de placas para circuitos impresos y maquina para el mismo".
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
EP1518899A3 (en) * 2003-09-18 2005-08-03 Fuji Photo Film Co., Ltd. Photocurable adhesive and bonding process employing same
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
JP4878597B2 (ja) * 2005-04-13 2012-02-15 株式会社タムラ製作所 感光性樹脂組成物、プリント配線板、および半導体パッケージ基板
US7795663B2 (en) * 2005-06-21 2010-09-14 E. I. Du Pont De Nemours And Company Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof
US20080084678A1 (en) * 2006-10-10 2008-04-10 Motorola, Inc. Printed circuit board and a method for imbedding a battery in a printed circuit board
CN101654607B (zh) * 2009-09-08 2013-01-16 烟台德邦科技有限公司 一种高纯度光热-双固化胶粘剂及其制备方法
JP5626574B2 (ja) * 2010-10-27 2014-11-19 日立化成株式会社 感光性樹脂組成物並びにこれを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
CN102938981A (zh) * 2012-11-10 2013-02-20 大连太平洋电子有限公司 一种厚铜阻焊板的真空脱泡加工方法
US9764532B2 (en) * 2014-07-01 2017-09-19 Isola Usa Corp. Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
CN108347820B (zh) * 2017-01-25 2020-09-15 奥特斯(中国)有限公司 容纳部件的基底结构上的高导热涂层

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956043A (en) * 1972-08-25 1976-05-11 Ciba-Geigy Corporation Process for the manufacture of printed multi-layer circuits
US4943516A (en) * 1987-11-30 1990-07-24 Taiyo Ink Manufacturing Co., Ltd. Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof

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JPS51116893A (en) * 1975-04-08 1976-10-14 Ube Ind Ltd Photo-setting compositions
GB1512814A (en) * 1975-08-13 1978-06-01 Ciba Geigy Ag Epoxide resins
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPS6318692A (ja) * 1986-07-11 1988-01-26 日立化成工業株式会社 印刷配線板の製造方法
US4774279A (en) * 1987-01-14 1988-09-27 Kollmorgen Corporation Adherent coating for copper
JPS6462375A (en) * 1987-09-02 1989-03-08 Arakawa Chem Ind Liquid photosolder resist ink composition of alkali development type
JPH0268A (ja) * 1987-11-13 1990-01-05 Toshiba Corp ソルダ−レジスト組成物
JPH0823694B2 (ja) * 1988-08-04 1996-03-06 富士写真フイルム株式会社 液状感光性樹脂組成物
US5178988A (en) * 1988-09-13 1993-01-12 Amp-Akzo Corporation Photoimageable permanent resist
US5229252A (en) * 1989-06-09 1993-07-20 Morton International, Inc. Photoimageable compositions
IL94474A (en) * 1989-06-09 1993-07-08 Morton Int Inc Photoimageable compositions
JPH05140251A (ja) * 1991-03-29 1993-06-08 Showa Highpolymer Co Ltd 感光性・水性樹脂組成物
JPH04331270A (ja) * 1991-05-02 1992-11-19 Chisso Corp 印刷用インキ組成物
DE4116957A1 (de) * 1991-05-24 1992-11-26 Ruetgerswerke Ag Durch strahlung vernetzbare beschichtungsmittel und ihre verwendung
CA2090099C (en) * 1992-05-15 1997-01-14 James Rath Method of forming a multilayer printed circuit board and product thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956043A (en) * 1972-08-25 1976-05-11 Ciba-Geigy Corporation Process for the manufacture of printed multi-layer circuits
US4943516A (en) * 1987-11-30 1990-07-24 Taiyo Ink Manufacturing Co., Ltd. Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof
US4943516B1 (cg-RX-API-DMAC7.html) * 1987-11-30 1994-01-11 Taiyo Ink Manufacturing Co.,Ltd.

Also Published As

Publication number Publication date
TW290583B (cg-RX-API-DMAC7.html) 1996-11-11
CN1137339A (zh) 1996-12-04
EP0723736B1 (en) 2001-02-14
DE69426702D1 (de) 2001-03-22
AU7860094A (en) 1995-05-04
JPH09507609A (ja) 1997-07-29
EP0723736A1 (en) 1996-07-31
WO1995010931A1 (en) 1995-04-20
ATE199201T1 (de) 2001-02-15
DE69426702T2 (de) 2001-05-31
DK0723736T3 (da) 2001-06-18
HK1002905A1 (en) 1998-09-25
US6074803A (en) 2000-06-13

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