CN104511974B - 脆性材料基板的裂断方法及裂断装置 - Google Patents

脆性材料基板的裂断方法及裂断装置 Download PDF

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Publication number
CN104511974B
CN104511974B CN201410378500.9A CN201410378500A CN104511974B CN 104511974 B CN104511974 B CN 104511974B CN 201410378500 A CN201410378500 A CN 201410378500A CN 104511974 B CN104511974 B CN 104511974B
Authority
CN
China
Prior art keywords
brisement
substrate
convex portion
brittle substrate
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410378500.9A
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English (en)
Chinese (zh)
Other versions
CN104511974A (zh
Inventor
岩坪佑磨
村上健二
武田真和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN104511974A publication Critical patent/CN104511974A/zh
Application granted granted Critical
Publication of CN104511974B publication Critical patent/CN104511974B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
CN201410378500.9A 2013-09-30 2014-08-01 脆性材料基板的裂断方法及裂断装置 Expired - Fee Related CN104511974B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013203710A JP6185812B2 (ja) 2013-09-30 2013-09-30 脆性材料基板のブレイク方法並びにブレイク装置
JP2013-203710 2013-09-30

Publications (2)

Publication Number Publication Date
CN104511974A CN104511974A (zh) 2015-04-15
CN104511974B true CN104511974B (zh) 2017-09-05

Family

ID=52788134

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410378500.9A Expired - Fee Related CN104511974B (zh) 2013-09-30 2014-08-01 脆性材料基板的裂断方法及裂断装置

Country Status (4)

Country Link
JP (1) JP6185812B2 (ja)
KR (1) KR102172681B1 (ja)
CN (1) CN104511974B (ja)
TW (1) TWI619589B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102073767B1 (ko) * 2018-10-30 2020-02-05 한국미쯔보시다이아몬드공업(주) 리브 마크 두께 검사 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1464866A (zh) * 2001-06-28 2003-12-31 三星钻石工业股份有限公司 脆性材料基板的破断装置及其破断方法
DE10311693B3 (de) * 2003-03-17 2004-12-02 Baumann Gmbh Brechvorrichtung für das Vereinzelnen von Keramikleiterplatten
CN1579013A (zh) * 2001-10-31 2005-02-09 三星钻石工业股份有限公司 在半导体晶片上形成划线的方法以及用以形成这种划线的设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562803A (en) * 1969-08-01 1971-02-09 Centrifugal Products Inc Plate breaking apparatus
JPS62121906U (ja) * 1986-01-24 1987-08-03
JPH01178408A (ja) * 1988-01-07 1989-07-14 Fujitsu Ltd 印刷配線板の分割方法
JP2008229715A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ装置
KR100959104B1 (ko) * 2008-07-16 2010-05-25 삼성모바일디스플레이주식회사 평판 디스플레이 패널 절단 장치
JP2010204236A (ja) * 2009-03-02 2010-09-16 Seiko Epson Corp 電気光学装置の製造方法、および電気光学装置
JP2010229005A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP5310278B2 (ja) * 2009-06-05 2013-10-09 三星ダイヤモンド工業株式会社 ブレイクバー
JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP2011218607A (ja) * 2010-04-06 2011-11-04 Sharp Corp 基板分割装置および基板分割方法
JP5187421B2 (ja) * 2010-11-30 2013-04-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
JP5790392B2 (ja) * 2011-10-12 2015-10-07 旭硝子株式会社 電子デバイスの製造方法
TWI488824B (zh) * 2011-12-05 2015-06-21 Mitsuboshi Diamond Ind Co Ltd The method and scribing device of glass substrate
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1464866A (zh) * 2001-06-28 2003-12-31 三星钻石工业股份有限公司 脆性材料基板的破断装置及其破断方法
CN1579013A (zh) * 2001-10-31 2005-02-09 三星钻石工业股份有限公司 在半导体晶片上形成划线的方法以及用以形成这种划线的设备
DE10311693B3 (de) * 2003-03-17 2004-12-02 Baumann Gmbh Brechvorrichtung für das Vereinzelnen von Keramikleiterplatten

Also Published As

Publication number Publication date
JP6185812B2 (ja) 2017-08-23
JP2015066832A (ja) 2015-04-13
KR102172681B1 (ko) 2020-11-02
CN104511974A (zh) 2015-04-15
TW201511908A (zh) 2015-04-01
KR20150037482A (ko) 2015-04-08
TWI619589B (zh) 2018-04-01

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Granted publication date: 20170905

Termination date: 20210801