CN104465591B - 半导体装置 - Google Patents

半导体装置 Download PDF

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CN104465591B
CN104465591B CN201410477053.2A CN201410477053A CN104465591B CN 104465591 B CN104465591 B CN 104465591B CN 201410477053 A CN201410477053 A CN 201410477053A CN 104465591 B CN104465591 B CN 104465591B
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semiconductor chip
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CN104465591A (zh
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塚越功二
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Dynafine Semiconductor Co ltd
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Ablic Inc
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Abstract

本发明提供小型化且高可靠性的半导体装置。在承载半导体芯片的岛部（1）表面的半导体芯片承载区域（3）设有多个倒棱锥形状的凹部（2），并配置成为使倒棱锥形状的凹部（2）的至少一边，与矩形的半导体芯片承载区域（3）的最靠近外周的边平行地面对，使该一边的相反侧的顶点朝向半导体芯片承载区域（3）的内侧。

Description

半导体装置
技术领域
本发明涉及具有搭载半导体芯片的岛部的半导体装置。
背景技术
关于电子部件所要求的性能，所占比例较多的与封装尺寸的小型化、薄型化相关，在开发中追求小型化、薄型化的过程中，认为还同时进行了以材料的开发或结构的研究、工艺的开发或重新认识等为代表的技术进步。关于这种追求电子部件的小型化、薄型化的背景，可举出与所搭载的设备的小型化、薄型化成比例的情况，体现了商品趋于多样化。尤其是在半导体部件中多采用树脂模封装的方式，以达到通用化。
树脂模封装的构成大致分为采用树脂基板和环氧树脂模的和采用引线框和环氧树脂模的结构。在采用树脂基板或引线框的树脂模封装中要同时谋求小型化、薄型化时，追求如何才能将各构成部分的尺寸设计成越来越小且细、薄，其结果，还出现可靠性变得不充分、或者成为脆弱的封装等的弊端。因此，需要重新认识如何提高发展小型化、薄型化的电子部件的可靠性。以半导体部件为代表的树脂模封装中尺寸变化显著，随着产品尺寸变小、变薄，难以维持可靠性，故显得重要，需要新的尝试。
图7是半导体封装中，具有安装半导体芯片的安装区域的岛的平面图（A）及截面图（B）（例如，参照专利文献1）。岛的尺寸显著大于半导体芯片，在其表面设有多个槽。根据说明，槽的宽度大体上为0.2mm左右，深度为0.1mm～0.2mm左右，并配置成格子状。此外，被配置为格子状的槽，被刻在比半导体芯片尺寸大的尺寸范围。半导体芯片经由银膏安装固接到岛上，但是在这时所涂敷的银膏进入槽部内，并且在半导体芯片的侧面周围部分过度扩展的银膏被引导到槽中，能够减小沿着芯片侧面爬上的银膏，并能防止银膏爬上到半导体芯片表面。
现有技术文献
专利文献
专利文献1：日本特开2006－156437号公报。
发明内容
但是，专利文献1所记载的岛结构，在比半导体芯片尺寸大的范围设有格子状的槽，因此岛尺寸和设有格子状的槽的范围，需要具有始终显著大于半导体芯片尺寸的尺寸，因此需要较大的岛尺寸。在进行封装的小型化的情况下，难以将岛尺寸和在岛内形成有设为比半导体芯片大的格子状的槽的范围设计成接近半导体芯片尺寸，不适合用在要求小型化的封装。
此外，专利文献1所记载的岛结构，设为格子状的多个槽的宽度为0.2mm左右，深度为0.1mm～0.2mm左右。在要求小型化、薄型化的封装中，半导体芯片尺寸也同时小型化的情况下，若槽的宽度需要为0.2mm则在安装半导体芯片时有可能成为倾斜的原因。此外，薄型化的封装中往往采用岛部或引线框部的厚度为0.2mm～0.1mm或者该范围以下的材料作为板厚的母材，变得难以设置需要0.1mm～0.2mm左右的深度的格子状的槽。在向岛以格子状设置多处具有0.2mm左右的宽度和深度的槽的情况下，加工并不容易，需要加工成本和时间。因此专利文献1所记载的向岛部加工槽的结构难以适用于封装的要求小型化、薄型化的设计，会与成本增加关联。
此外，半导体封装中，也有安装多个半导体芯片的产品，在向岛搭载多个半导体芯片的情况下、或者进一步增加安装个数的多芯片化的半导体产品的情况下，进行与向岛部搭载的半导体芯片相同个数的槽加工，这不仅使加工复杂，而且进一步扩大岛尺寸，进而导致成本增加，因此这种应用容易出现困难。
此外，固接岛部与半导体芯片的粘接剂有采用绝缘膏的情况。在使用银膏的情况下，会产生银膏中的银爬上而造成的迁移（migration）、或产生银膏中的银与树脂相分离的渗出（bleed out），成为降低可靠性的原因之一，采用不包括银填充剂（filler）的绝缘膏的产品越来越多。由于与银膏相比不包括银填充剂，所以绝缘膏中树脂比率增多，从而低粘度的比较多。由此存在与银膏的处理相比难以控制的部分，例如，难以确保伴随表面张力下降的涂敷后的膏浸润扩展或厚度的部分、涂敷后的膏形状难以半球形状化的部分等。在向设有格子状的槽的岛涂敷绝缘膏而使用的情况下，大部分膏进入槽中扩展并传递，因此难以在岛表面和与半导体芯片的固接接触面之间残留绝缘膏。此外进入槽内部的绝缘膏被与槽两侧面的接触牵引的表面容易成为凹陷的形状，容易在半导体芯片与岛之间产生间隙，因此会难以获得充分的粘接强度。
而且，在固接岛部与半导体芯片的情况下，安装半导体芯片而得到的粘接剂的厚度，在银膏中大致与银填充剂尺寸成比例，因此在岛部表面与半导体芯片之间形成至少20μm左右厚度的银膏，能获得充分的厚度和粘接强度。在采用绝缘膏的情况下，往往不包括填充剂或采用硅石填充剂等，无法确保通过银填充剂而获得的厚度，即便包含填充剂的情况下也大多成为5μm以下的厚度。因此在岛部表面与半导体芯片之间形成的膏厚度会薄到数μm左右，因此容易导致粘接强度下降。
其中，尝试着以提高对岛部的半导体芯片与绝缘膏及银膏的粘接力为目标的加工方法、结构的改良。在设置槽加工的结构中，通过以线状或格子状设置槽或者以圆形状设置槽加工，谋求提高因低粘度化而容易流动的绝缘膏的粘接强度。此外，还进行了通过对岛部表面实施粗面化处理，向岛部设置微细的凹凸，从而谋求提高半导体芯片与绝缘膏的粘接强度的尝试，关系到固接的半导体芯片与岛表面的粘接强度提高。
因此，本发明的课题是提供一种可小型化及薄型化且可靠性高的半导体装置，以在用绝缘膏来固接并安装半导体芯片的半导体装置中，不需要显著加大半导体芯片尺寸的加工而提高半导体芯片与岛的粘接强度，同时使膏不会浸润扩展到岛外部而保持在涂敷部位，使膏的涂敷形状不凹下而不在与半导体芯片的固接面之间产生间隙，能够以半导体芯片尺寸程度的固接面积小尺寸地设计所安装的岛部分。
为了解决上述课题，本发明中采用了以下方案。
首先，一种半导体装置，具有经由绝缘膏粘接半导体芯片的岛部，其特征在于，在所述岛表面的半导体芯片承载区域设有多个倒棱锥形状的凹部，从所述倒棱锥形状的凹部的头顶点向上方延伸的垂直线和向所述半导体芯片承载区域的外侧的开口线所成的第一开口角度，小于所述垂直线和向所述半导体芯片承载区域的内侧的开口线所成的第二开口角度。
此外，半导体装置的特征在于：所述倒棱锥形状的凹部为倒正三棱锥。
此外，半导体装置的特征在于：所述半导体芯片承载区域为矩形，是在所述半导体芯片承载区域的四角具有风筝式四边形的底面的方锤。
此外，半导体装置的特征在于：与半导体芯片承载区域的中心附近相比，所述倒棱锥形状的凹部在所述半导体芯片承载区域的外周附近配置更密。
此外，半导体装置的特征在于：所述倒棱锥形状的凹部配置在所述半导体芯片承载区域的外缘部。
此外，半导体装置的特征在于：所述岛部具有多个所述半导体芯片承载区域。
此外，半导体装置的特征在于：构成所述岛的材料为金属、树脂、陶瓷、敷金属的树脂的任一种。
发明效果
通过采用上述构成，本发明的半导体装置可以小尺寸地设计搭载半导体芯片的岛部，并能做成小型化且可靠性高的半导体装置。
附图说明
图1是示意性地示出本发明的半导体装置的第一实施例的平面图；
图2是沿着图1的X－X’的半导体芯片承载截面图；
图3是沿着图1的X－X’的截面图；
图4是示意性地示出本发明的半导体装置的第二实施例的平面图；
图5是示意性地示出本发明的半导体装置的第三实施例的平面图；
图6是示意性地示出本发明的半导体装置的第四实施例的平面图；
图7是示意性地示出现有的半导体装置的岛部的图。
具体实施方式
实施例1
以下，根据附图，对本实施例的半导体装置进行说明。
图1是示意性地示出本发明的半导体装置的第一实施例的平面图。岛部1是固接并承载（芯片焊接）半导体芯片的基台部。虽然未做图示，但是引线配置在岛部周围，经由金属丝连接引线和半导体芯片，树脂密封岛部和半导体芯片和金属丝以及引线的一部分而成为半导体装置。
在岛部1表面的半导体芯片承载区域3设有多个倒棱锥形状的凹部2，半导体芯片利用绝缘膏固接在岛部表面。岛部1的大小程度为相对于利用绝缘膏固接到岛表面的半导体芯片承载区域3相等或稍大的尺寸。此外，设于岛部1的倒棱锥形状的凹部2，在岛部1中设在比固接的半导体芯片承载区域3小的范围。图1所示的倒棱锥形状的凹部2，为在岛1的表面设置了将正三棱锥的头顶点倒过来的凹部的形状。即，是设置了倒正三棱锥的凹部的形状。如图1所示，倒正三棱锥的底面为正三角形，但配置成为使其中的至少一边与矩形的半导体芯片承载区域3的最靠近外周的边平行地面对，使该一边的相反侧的顶点朝向半导体芯片承载区域3的内侧。
图2是沿着图1的X－X’的截面图，并且是在岛部搭载了半导体芯片时的截面。
半导体芯片8搭载于岛部1的表面，经由绝缘膏等的粘接剂9来固接。绝缘膏9涂敷在岛部1的表面，还进入到倒棱锥形状的凹部2，使与半导体芯片8的粘接牢固。
图3是沿着X－X’的截面图，倒正三棱锥的凹部2在截面图中为楔形形状，从楔形形状的头顶点向上方延伸的垂直线和向半导体芯片承载区域3的外侧的开口线所成的开口角度θ1，具有与从楔形形状的头顶点向上方延伸的垂直线和向半导体芯片承载区域3的内侧的开口线所成的开口角度θ2不同的角度。相对于半导体芯片承载区域外侧的开口角度θ1是小于相对于半导体芯片承载区域内侧的θ2的角度，假设，倒正三棱锥为正四面体，则成为θ1≒19.5°、θ2＝35.3°。
通过采用这种结构，在向岛部表面涂敷了绝缘膏的情况下，比银膏粘度低且容易浸润扩展的绝缘膏，在设置倒棱锥形状的凹部2的范围内能容易抑制浸润扩展，此外能够保持在倒棱锥形状的凹部2，不会浸润扩展到岛部之外而容易滞留。其结果，在岛部内滞留有绝缘膏，从而在固接并安装了半导体芯片的情况下，消除了半导体芯片尺寸以上的绝缘膏扩展，不会从岛部溢出。同时膏不会爬到元件侧面而形成圆角（fillet），不会使岛部尺寸显著越过半导体芯片尺寸，而能够形成紧凑的固接安装面积。
倒棱锥形状的凹部2具有根据其形状控制所涂敷的绝缘膏的表面能量的一部分的效果，因此所保持的绝缘膏容易形成凸出的半球形状，在固接并安装半导体芯片的情况下难以在与岛表面之间产生间隙。由此在将岛部1小型化的部分中采用如绝缘膏这样的低粘度且易于浸润扩展的膏来固接并安装半导体芯片的情况下，绝缘膏也不会在半导体芯片侧面设置圆角，也不会从岛部内溢出，此外即便在与半导体芯片尺寸相等程度的固接面积中也能得到充分的粘接强度，因此能够期待获得可靠性高的封装的效果。
设于半导体芯片承载区域3的倒棱锥形状的凹部2，刻至数十μm的深度，因此即便岛部1的厚度薄也容易引入。此外，在利用绝缘膏来固接并安装半导体芯片后的膏厚度，在设有倒棱锥形状的凹部2的部位和除此以外的部位能够进行不同厚度的固接。
绝缘膏在倒棱锥形状的凹部2中容易制作凸出的半球形状，此外通过岛部1的深度方向的头顶点所成的角度，具有难以向岛外侧的浸润扩展的指向性，而且在比半导体芯片固接面积小的范围有规律地配置，因此在固接半导体芯片的情况下能够对固接面无间隙地浸润扩展并安装绝缘膏。由此岛部1和半导体芯片尺寸为相等的尺寸，即便岛部1的厚度被设计成较薄，也能期待能稳定地获得较强的粘接强度的效果。
岛部1的材料包括金属、树脂、陶瓷、敷金属的树脂等，倒棱锥形状的凹部2的深度也可以浅到数十μm左右，因此即便材料或厚度、尺寸改变的情况下也很少难以设置刻度的情况，此外由于不需要复杂的加工，即便封装的材料或结构变更，也能期待获得不变的粘接强度的效果。
实施例2
图4是示意性地示出本发明的半导体装置的第二实施例的平面图。
半导体装置很多是在一个岛上搭载多个半导体芯片，图4中示出了搭载两个半导体芯片时的岛部4。在对一个岛部4搭载至少2个芯片以上的半导体芯片的情况下，岛部4中倒棱锥形状的凹部5设在搭载半导体芯片的部位6、7这两处的范围，半导体芯片利用绝缘膏固接并安装到岛部4的表面。岛部4的尺寸与利用绝缘膏来固接并安装的半导体芯片尺寸和半导体芯片搭载数成比例而变大，设为相对于半导体芯片尺寸相等或稍大的程度的固接范围与半导体芯片2的固接安装结构。
在利用绝缘膏向岛部4固接并安装两个半导体芯片的情况下，绝缘膏以与半导体芯片尺寸相等程度的固接面积安装到半导体芯片固接并安装的部位，倒棱锥形状的凹部5在半导体芯片固接并安装的部位被刻到落在半导体芯片尺寸内的范围。倒棱锥形状的凹部5不需要将槽作成格子状等的复杂的加工，因此能够容易适用到岛部4，此外也易于邻接设置。
在此绝缘膏以不浸润扩展到在向岛部4的表面固接并安装半导体芯片的2个部位的范围设置倒棱锥形状的凹部5的范围的方式进行涂敷，相对于半导体芯片尺寸不会从岛溢出而能够固接并安装，能够获得充分的粘接强度。由此半导体芯片可以邻接地固接并安装，能够期待这样的效果，即，即便在固接并安装多个半导体芯片的情况下也能将岛部4的尺寸设计为小型并将封装小型化及薄型化。
实施例3
图5是示意性地示出本发明的半导体装置的第三实施例的平面图。
与图1的不同点是将配置在半导体芯片承载区域3的四角的倒棱锥形状的凹部做成由具有风筝式四边形的底面的方锤构成的凹部10。如图所示，该风筝式四边形10是将不同高度而底面长度相同的2个等腰三角形的底边互相重合后的形状，配置成使高度的低的等腰三角形的顶点朝向半导体芯片承载区域3的四角方向，使高度高的等腰三角形的顶点朝向半导体芯片承载区域3的中心方向。其结果，从方锤的头顶点开始的开口角度，成为向半导体芯片承载区域四角方向的开口角度小于向半导体芯片承载区域中心方向的开口角度，使得岛部与半导体芯片的粘接更加牢固。
在此，作为倒棱锥形状的凹部的一例，说明了倒三棱锥、倒方锤，但是倒棱锥形状可为任何的倒多棱锤。
实施例4
图6是示意性地示出本发明的半导体装置的第四实施例的平面图。
在以上说明的实施例中，在半导体芯片承载区域3隔着均等的距离配置了倒棱锥形状的凹部，但是通过在半导体芯片承载区域3的中心附近配置疏，在半导体芯片承载区域3的外周附近配置密，进一步提高在半导体芯片承载区域3外周附近中比中心附近更能抑制多余的绝缘膏的浸润扩展的效果。
在图6所示的实施例中，采用如上所述地疏密配置倒棱锥形状的凹部2、10，并沿着半导体芯片承载区域3的外周边缘配置倒棱锥形状的凹部2、10的结构。
产业上的可利用性
在利用绝缘膏来固接并安装岛部表面和半导体芯片的半导体装置中，通过采用向比固接并安装到岛部表面的半导体芯片尺寸小的范围设置多个倒棱锥形状的凹部的结构，能够在岛部表面以固接在使绝缘膏与半导体芯片尺寸相等或稍宽的程度的范围的方式安装。
此外绝缘膏和岛部表面的固接面积成为半导体芯片尺寸左右，因此能够使岛部的面积小至相对于半导体芯片尺寸稍大的尺寸。进而倒棱锥形状的凹部由较浅地刻到小于数十μm左右的部分构成，从而不需要复杂的加工，因此即便厚度薄的岛也能容易设置，此外也能进行邻接设置，因此也能容易向岛部引入邻接地固接安装并搭载多个半导体芯片的设计，不仅在搭载一个半导体芯片时，而且在搭载多个半导体芯片的半导体装置中也可以进行小型化设计，能够提供可靠性高的小型化及薄型化的半导体装置，因此有助于向以电视或家电产品、便携终端为首的半导体装置搭载设备供应。
标号说明
1 岛部；2 倒棱锥形状的凹部（倒正三棱锥）；3 半导体芯片承载区域；4 搭载多个半导体芯片的岛部；5 倒棱锥形状的凹部（倒正三棱锥）；6 半导体芯片承载区域；7 半导体芯片承载区域；8 半导体芯片；9 绝缘膏（粘接剂）；10 倒棱锥形状的凹部（具有风筝式四边形底面的倒四棱锥）。

Claims (6)

1.一种半导体装置，具有经由绝缘膏粘接半导体芯片的岛部，其特征在于：在所述岛部的表面的半导体芯片承载区域设有多个倒棱锥形状的凹部，从所述倒棱锥形状的凹部的头顶点向上方延伸的垂直线和向所述半导体芯片承载区域的外侧的开口线所成的第一开口角度，小于所述垂直线和向所述半导体芯片承载区域的内侧的开口线所成的第二开口角度，
所述倒棱锥形状的凹部为倒正三棱锥。
2.根据权利要求1所述的半导体装置，其特征在于：所述半导体芯片承载区域为矩形，在所述半导体芯片承载区域的四角设有具有方锤的四角锥即所述凹部，所述方锤具有风筝式四边形的底面。
3.根据权利要求1或2所述的半导体装置，其特征在于：与半导体芯片承载区域的中心附近相比，所述倒棱锥形状的凹部在所述半导体芯片承载区域的外周附近配置得更密。
4.根据权利要求1或2所述的半导体装置，其特征在于：所述倒棱锥形状的凹部配置在所述半导体芯片承载区域的外缘部。
5.根据权利要求1或2所述的半导体装置，其特征在于：所述岛部具有多个所述半导体芯片承载区域。
6.根据权利要求1或2所述的半导体装置，其特征在于：构成所述岛部的材料为金属、树脂、陶瓷、或者敷金属的树脂的任一种。
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