CN101556940B - 具有散热片的半导体封装结构 - Google Patents

具有散热片的半导体封装结构 Download PDF

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CN101556940B
CN101556940B CN2008100906970A CN200810090697A CN101556940B CN 101556940 B CN101556940 B CN 101556940B CN 2008100906970 A CN2008100906970 A CN 2008100906970A CN 200810090697 A CN200810090697 A CN 200810090697A CN 101556940 B CN101556940 B CN 101556940B
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余秉勋
洪菁蔚
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Powertech Technology Inc
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Abstract

本发明是一种具有散热片的半导体封装结构，其特征在于，包括：一基板，具有一芯片承载区与多个穿孔环绕设置于芯片承载区周缘；一芯片设置于芯片承载区并与基板电性连接；一散热片罩设于芯片上方，其中散热片具有多个支撑部且支撑部由基板上朝穿孔延伸出基板的一下表面；以及一封装胶体包覆芯片、部分基板及散热片。利用散热片支撑部来增加热散功能并减低封装体翘曲程度。

Description

具有散热片的半导体封装结构
技术领域
本发明有关一种具有散热片的半导体封装结构，特别是一种可防止封装体翘曲的具有散热片的半导体封装结构。
背景技术
IC构装是属半导体产业的后段加工工序，可分为晶片切割、粘晶、焊线、封胶、印字、包装，主要是将前工序加工完成晶片上IC予以分割成芯片，粘晶、并加上外接引脚及包覆。近年来，由于半导体芯片的高度密集化，伴随而来的热量亦随着增加，然而，因为封装结构越趋轻薄短小，导致热量集中于小尺寸的封装结构中，亦造成其热流密度的提高。
为有效增加封装结构的散热速率，已发展出多种具有散热片的封装结构，例如HSBGA(Heat Slug Grid Array)等，其是通过热导系数高的散热片将热量传导至封装结构的外部。
图1为现有的一种HSBGA的封装构造，其是在设置有芯片20的一基板10上，以胶剂粘贴有一散热片30，并以封装树脂40包覆芯片20与散热片30。如图所示，散热片30具有一外露部32与一内接部34，且散热片30利用内接部34贴附于基板10上而外露部32暴露出封装树脂40。然而，在散热片30与基板10的粘着过程中往往会由于工艺设备产生震动或操作不慎，使散热片30在胶剂固化前偏移预设位置，导致封装完成的制品不良率提升。
发明内容
为了解决上述问题，本发明目的是提供一种具有散热片的半导体封装结构，可防止散热片于粘着过程偏移而提高封装制品良率。此外，此封装结构利用散热片上多个支撑部来增加热散功能并减低封装体封装后的翘曲程度。
为了达到上述目的，本发明的具有散热片的半导体封装结构，其特征在于，包括：一基板，其具有一芯片承载区与多个穿孔环绕设置于芯片承载区周缘；一芯片设置于芯片承载区并与基板电性连接；一散热片罩设于芯片上方，其中散热片具有多个支撑部且支撑部由基板上朝穿孔延伸出基板的一下表面；以及一封装胶体包覆芯片、部分基板及散热片，其中部份该封装胶体穿过这些穿孔并包覆突出于该基板的该下表面的这些支撑部。
附图说明
以下将配合附图对本发明的具体实施例进行详细说明，以使更清楚了解本发明的目的、技术内容、特点及其所达成的功效，其中：
图1是现有的的HSBGA的封装构造的剖视示意图。
图2是本发明具有散热片的半导体装结构一实施例的剖视示意图。
图3A是本发明具有散热片的半导体装结构又一实施例的剖视示意图。
图3B是图3A一实施例的上视示意图。
图4A是本发明具有散热片的半导体装结构又一实施例的剖视示意图。
图4B是本发明具有不同实施例的凸出部的封装结构剖视示意图。
具体实施方式
现参阅附图对本发明的较佳实施例进行详细说明，所述较佳实施例仅是列举以进行清楚说明本发明而非用以限定本发明。
首先，请参考图2，图2是本发明一实施例的具有散热片的半导体装结构的剖视示意图。如图所示，本发明的具有散热片的半导体封装结构包括一基板110，其具有一芯片承载区(图上未标)与多个穿孔112环绕设置于芯片承载区周缘，如图所示，芯片承载区如基板110的一上表面114的特定区域。一芯片120设置于芯片承载区，并与基板110电性连接，如图所示，此处芯片120是利用多条引线150作为与基板110电性连接的媒介，但可以理解的，芯片120与基板110的电接方式并不限制于打线形式，其它例如覆晶方式亦可实作于本发明的结构中。一散热片130罩设于芯片120上方。其中散热片130具有多个支撑部132且支撑部132由基板110上朝穿孔112延伸出基板110的一下表面116。一封装胶体140包覆芯片120、部分基板110及散热片130。
接续上述说明，于一实施例中，此封装结构还包括多个导电球160设置于暴露出的基板110下表面116以方便此封装结构电接至其它外界装置。另外，如图所示，散热片130上的支撑部132可为条状支撑部以方便插设入基板110上的穿孔112。于一实施例中，基板110上的穿孔112数量是大于等于散热片130上支撑部132的数量。也就是说，当穿孔112数量等于支撑部132数量时，当条状支撑部132穿过穿孔112后，以灌模方式利用封装胶体140予以包覆，封装胶体140可流过穿孔112并包覆突出于基板110的支撑部132；反之，若当穿孔112数量多于支撑部132数量时，部份封装胶体140则可直接流过穿孔形成支撑凸块，其亦可防止当封装结构构装至其它外界装置时因施力不均而产生的崩裂问题或是封装胶体固化时所产生的翘曲。
再来，请参阅图3A，于又一较佳实施例中，基板110上还包括一开窗(在次图上未标示)设置于芯片承载区内以适用于开窗型半导体封装的需求。如图3A和图3B所示，多条引线152穿过开窗118并电性连接芯片120与基板110的下表面116。再者，为有效缩减封装体厚度并提高散热速率，散热片130可利用如绝缘导热胶体直接贴附于芯片120上，另外，利用贴附方式亦有助于散热片130的定位。于又一实施例中，散热片130亦可局部暴露于封装胶体140外。此外，请参阅图3B，图3B为图3A其中一种可能的上视示意图，但可以理解的是，其穿孔112位置与形状并不限制于图中所示。
接续上述说明，请参考图4A，于又一实施例中，为增加封装胶体140与散热片130的键结与摩擦力以防止散热片可能的松脱问题，此封装结构还包括至少一凸出部134突出于支撑部132。其中凸出部134与支撑部132可形成一角度，例如锐角、钝角或直角，图中所示是以直角为例，且凸出部134的形状没有限制，图4B中即绘示封装结构中另一实施例的凸出部134结构，但其形状并不限于此。另外，于又一实施例中，亦可使用表面处理方式形成一粗糙面于散热片130与封装胶体140接触的部份(图中未示)来增加其后封装胶体140与散热片130的摩擦力。
根据上述，此发明特征之一是在利用散热片上穿过基板的支撑部来增加散热面积并且改善封装过程中或封装后所可能发生的翘曲问题，其中支撑部的形状与数量没有限制。另外，支撑部是突出基板下表面，封装后被封装胶体包覆的散热片支撑部亦可提供封装结构支撑，此结构亦可减少当封装体构装至外界装置时所可能产生的封装体边缘崩裂问题。此外，散热片的支撑部上亦可形成至少一凸出部或形成一粗糙面于封装胶体与散热片的接触面以加强封装胶体与散热片的结合强度，且凸出部的形状与大小没有限制，工艺上相当具有弹性。
综合上述，本发明提供一种具有散热片的半导体封装结构，可防止散热片于粘着过程偏移而提高封装制品良率。此外，此封装结构利用散热片上多个支撑部来增加热散功能并减低封装体封装后的翘曲程度。
以上所述的实施例仅是说明本发明的技术思想及特点，其目的在使熟悉此项技术的人士能够了解本发明的内容并据以实施，当不能以其限定本发明的专利范围，即凡是根据本发明所揭示的精神所作的等同的改变或替换，仍应涵盖在本发明的专利范围内。

Claims (7)

1.一种具有散热片的半导体封装结构，其特征在于，包含：
一基板，其具有一芯片承载区与多个穿孔环绕设置于该芯片承载区周缘；
一芯片，其设置于该芯片承载区并与该基板电性连接；
一散热片，其罩设于该芯片上方，其中该散热片具有多个支撑部且这些支撑部由该基板上朝这些穿孔延伸出该基板的一下表面；以及
一封装胶体，其包覆该芯片、部分该基板及该散热片，其中部份该封装胶体穿过这些穿孔并包覆突出于该基板的该下表面的这些支撑部。
2.根据权利要求1所述的具有散热片的半导体封装结构，其特征在于该基板上的该穿孔数量大于等于该散热片的这些支撑部的数量。
3.根据权利要求1所述的具有散热片的半导体封装结构，其特征在于该基板上还包含一开窗设置于该芯片承载区内。
4.根据权利要求3所述的具有散热片的半导体封装结构，其特征在于还包括多条引线，这些引线穿过该开窗并电性连接该芯片与该基板的该下表面。
5.根据权利要求1所述的具有散热片的半导体封装结构，其特征在于还包含至少一凸出部突出于这些支撑部表面，其中该凸出部与该支撑部形成一角度。
6.根据权利要求1所述的具有散热片的半导体封装结构，其特征在于还包含形成一粗糙面于该散热片表面上。
7.根据权利要求1所述的具有散热片的半导体封装结构，其特征在于还包含多个导电球设置于暴露出的该基板的该下表面。
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CN1420557A (zh) * 2001-11-16 2003-05-28 华泰电子股份有限公司 具嵌梢的散热板及其封装件
CN101060101A (zh) * 2007-05-25 2007-10-24 日月光半导体制造股份有限公司 半导体封装构造

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