CN1420557A - 具嵌梢的散热板及其封装件 - Google Patents
具嵌梢的散热板及其封装件 Download PDFInfo
- Publication number
- CN1420557A CN1420557A CN01134948A CN01134948A CN1420557A CN 1420557 A CN1420557 A CN 1420557A CN 01134948 A CN01134948 A CN 01134948A CN 01134948 A CN01134948 A CN 01134948A CN 1420557 A CN1420557 A CN 1420557A
- Authority
- CN
- China
- Prior art keywords
- heating panel
- support plate
- tip
- packaging part
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
一种具嵌脚的散热板及其封装件,主要是由一覆盖半导体的散热板,利用其倒勾的嵌梢插入载板的通孔而固定。该散热板穿过并勾住载板具有压迫力,可对覆盖的半导体作压力控制,进而具有优良的差距控制能力,有助于散热效能的增进。该散热板的结构具有穿过载板的通孔,在载板内可制作接地的导电层与通孔连接,以使散热板兼具接地功能及增强散热功能;由于散热板与半导体连接,可有效滤除电流经过时所产生的杂讯及降低电感。带有本发明的散热板嵌附的载板所形成的封装件底层亦可植有与载板上电路接通的锡球,该锡球与另一印刷基板连接时,散热板的嵌销尖端可与印刷基板接合,以增加整个封装件的强固性、散热性及电气特性。
Description
技术领域
本发明涉及一种半导体的散热板及其封装件。
背景技术
在半导体集成度快速增加与运行频率高速提升之后,该半导体运行时所产生的高热便需借助散热板来发散。一般的半导体散热板的结构如图1所示:在半导芯片1’与载板15’结合后在半导体芯片1’顶面涂布适量的导热胶12’,并将散热板13’覆盖住半导体芯片1’,使散热板13’内面与半导体芯片1’顶面通过导热胶12’接触而传导热量至空气中发散;另一种现有的半导体散热板如图2所示:半导体芯片2’与载板25’以金线21’作电气结合后以环氧树脂24’封装起来,再于环氧树脂24’顶面涂布适量的导热胶22’,并将散热板23’黏上环氧树脂24’。但是上述现有的半导体散热板(片)设计,多数仅为对半导体芯片行散热之用,其使用的结构亦仅为使半导芯片的热量通过导热胶传递到散热板(片)上,再由空气带走散热板(片)上的热量,达到散热的效果,除此之外再无任何其他功效。
发明内容
本发明的目的在于提供一种可有效控制散热板与半导体芯片或封装件间距的具嵌梢的散热板及其封装件。
本发明的另一目的在于提供一种具有接地功能且可滤除杂讯及降低电感的具嵌梢的散热板及其封装件。
本发明的另一目的在于提供一种可简化散热板与负载有半导体芯片载板的制造工艺且安装牢固的散热板及其封装件。
为了达到上述目的,本发明提供了一种具嵌梢的散热板,其主要为一可覆盖住一个以上的半导体芯片的盖板式壳状物,该散热板的外围具有一凸伸的卡梢,该卡梢头端设有一开口,并在外径设有颈部。
本发明还提供一种具嵌梢的散热板的封装件,其主要为一散热板、载板及一个以上的与载板接合妥的半导体芯片,该散热板的外围具有一凸伸的卡梢,该卡梢头端设有一开口,并在外径设有颈部;该载板上设有适当的通孔;该半导体芯片顶面涂有导热胶,散热板的卡梢对正载板上的通孔位置插入,使该卡梢的头端穿过载板,而卡梢的颈部卡在载板的通孔内。
该载板内层制作有与通孔相接通的接地层线路。
本发明的优点是:
1、本发明的散热板具有控制该散热板与半导体芯片或封装件间距的能力:因该散热板嵌于载板上,可对半导体芯片提供一固定的压力控制力,以确保散热片,导热胶及半导体芯片或封装件紧密的接触。
2、本发明的散热板具有接地功能:该散热板的卡梢插入承载半导体芯片的载板通孔内,而该通孔可与载板内的接地层线路导通,如此可使该散热板具备接地功能。
3、本发明的封装件具有滤除杂讯及降低电感的作用:由于本发明的封装件具有接地线路,故可在本封装件导电后有效滤除杂讯及降低电感,获得一更可靠的电路信号。
4、本发明的封装件具有增强结合度的设计:本发明的散热板穿过载板后的凸出头端可与另一印刷基板上的脚垫相结合,以增加本封装件载板下方的锡球与印刷基板上的电路层脚垫焊接的强固度及散热性,形成一更可靠的封装体。
5、本发明可简化散热板与负载有半导体芯片载板的制造工艺:本发明的散热板与载板间的结合结构为嵌入卡接式,不再需要涂布接著剂即可与载板相接合,使得制造更为方便。
附图说明
下面结合附图及实施例对本发明进行详细说明:
图1是现有的半导体散热板的结构示意图;
图2是另一现有的半导体散热板的结构示意图;
图3A-图3B是本发明的散热板与半导体载板结合示意图;
图4是本发明的封装件与印刷电路板PCB示意图。图中符号说明:
现有技术部分1’ 半导体芯片11’ 金属凸块12’ 导热胶13’ 散热板14’ 接触胶15’ 载板2’ 半导体芯片21’ 金线22’ 导热胶23’ 散热板24’ 环氧树脂25’ 载板本发明部分1 封装件11 半导体芯片12 金属凸块13 导热胶14 载板141 接地层线路142 通孔143 锡球15 散热板151 卡梢152 开口153 头端154 颈部2 印刷机板21 电路22 脚垫
具体实施方式
为使本发明所达成的上述目的及优点所应用的技术手段,兹配合附图,并列举较佳实施例说明如后。
本发明为一具嵌梢的散热板及其封装件,请参照图3A所示,其散热板15的结构主要为一盖板式壳状物,可覆盖住一个以上的半导体芯片11,在散热板15的外围具有一凸伸的卡梢151,该卡梢151头端153设有一开口152,并在外径设一颈部153。
本发明的具嵌梢的散热板封装件,其主要组成构件为一上述的散热板15及一个以上的与载板14接合妥的半导体芯片11,而在该载板14上设有适当的通孔142;载板14内层制作有适当的接地层线路与通孔142相接通,其接合工艺主要是将半导体芯片11顶面涂上导热胶13后,将散热板15的卡梢151对正载板14上的通孔142位置插入,使该卡梢151的头端穿过载板14,而颈部154卡在载板14的通孔142内,请参照图3A-图3B。
因本散热板15主要为铝、铜等高导热材料制品,半导体芯片11运作时所产生的高热可经由导热胶13传递至散热板15上,再发散至空气之中;而另一散热途迳为经由通孔142到接地层线路141:又因本封装件1具有接地线路,亦可提供过滤电流杂讯及降低电感的功能。
另,由于本散热板15是以卡嵌式与载板14结合,故可提供一优良的压力控制能力,使散热板15与半导体芯片11保持一适当间距,可增加本封装件1的散热能力的可靠性。
如图4所示,本发明的封装件1亦可与另一表层具有电路21、脚垫22的印刷基板2相接合:由本封装件1底层的锡球143与印刷基板2上的脚垫22焊接,另本封装件1底层的散热板15卡梢151头端153亦可与印刷基板2上的脚垫22焊接,以增加整个封装结构的稳固性及散热性。
由上可知,本发明已具备发明专利的申请新颖性、创造性及实用性的要求,特依法提请专利申请。
虽然本发明以一较佳实施例披露如上,然其并非用以限定本发明,任何本领域技术人员,在不脱离本发明的精神和范围内,当可作各种更动与润饰,因此本发明的保护范围以权利要求书并结合说明书及附图所界定者为准。
Claims (4)
1、一种具嵌梢的散热板,其主要为一可覆盖住一个以上的半导体芯片的盖板式壳状物,其特征是:该散热板的外围具有一凸伸的卡梢,该卡梢头端设有一开口,并在外径设有颈部。
2、一种具嵌梢的散热板的封装件,其主要为一散热板、载板及一个以上的与载板接合妥的半导体芯片,其特征在于:
该散热板的外围具有一凸伸的卡梢,该卡梢头端设有一开口,并在外径设有颈部;
该载板上设有适当的通孔;
该半导体芯片顶面涂有导热胶,散热板的卡梢对正载板上的通孔位置插入,使该卡梢的头端穿过载板,而卡梢的颈部卡在载板的通孔内。
3、根据权利要求2所述的封装件,其特征是:该载板内层制作有与通孔相接通的接地层线路。
4、根据权利要求2所述的封装件,其特征是:该封装件与另一表层具有电路、脚垫的印刷基板相接合,其中封装件底层的散热板卡梢头端与印刷基板上的脚垫焊接。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN01134948A CN1420557A (zh) | 2001-11-16 | 2001-11-16 | 具嵌梢的散热板及其封装件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN01134948A CN1420557A (zh) | 2001-11-16 | 2001-11-16 | 具嵌梢的散热板及其封装件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1420557A true CN1420557A (zh) | 2003-05-28 |
Family
ID=4672862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN01134948A Pending CN1420557A (zh) | 2001-11-16 | 2001-11-16 | 具嵌梢的散热板及其封装件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1420557A (zh) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7251140B2 (en) | 2003-10-17 | 2007-07-31 | Samsung Sdi Co., Ltd | Display apparatus having heat dissipating structure for driver integrated circuit |
CN100392692C (zh) * | 2004-03-04 | 2008-06-04 | 三星Sdi株式会社 | 等离子显示设备 |
US7508673B2 (en) | 2004-03-04 | 2009-03-24 | Samsung Sdi Co., Ltd. | Heat dissipating apparatus for plasma display device |
US7646092B2 (en) | 2005-12-06 | 2010-01-12 | Yamaha Corporation | Semiconductor device and manufacturing method thereof |
CN101207169B (zh) * | 2006-12-19 | 2010-05-19 | 南茂科技股份有限公司 | 发光芯片封装体与光源组件 |
CN101556940B (zh) * | 2008-04-08 | 2011-04-13 | 力成科技股份有限公司 | 具有散热片的半导体封装结构 |
US7928591B2 (en) | 2005-02-11 | 2011-04-19 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
CN102480835A (zh) * | 2010-11-24 | 2012-05-30 | 三星电机株式会社 | 焊接连接销、半导体封装基板以及使用它们安装半导体芯片的方法 |
CN102573397A (zh) * | 2010-12-23 | 2012-07-11 | 山特电子(深圳)有限公司 | 热传输装置、其制造和组装方法及设备组件 |
CN101356644B (zh) * | 2006-02-10 | 2013-03-13 | 温德克工业股份有限公司 | 具有可拆卸元件的电子装置 |
CN104517912A (zh) * | 2013-09-30 | 2015-04-15 | 南茂科技股份有限公司 | 薄膜覆晶封装结构 |
CN111654972A (zh) * | 2020-06-29 | 2020-09-11 | 杭州富特科技股份有限公司 | 电路板封装结构及封装方法 |
CN113890557A (zh) * | 2021-09-30 | 2022-01-04 | 深圳盛必达通信有限公司 | 一种小型化通讯模块 |
-
2001
- 2001-11-16 CN CN01134948A patent/CN1420557A/zh active Pending
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7251140B2 (en) | 2003-10-17 | 2007-07-31 | Samsung Sdi Co., Ltd | Display apparatus having heat dissipating structure for driver integrated circuit |
CN100392692C (zh) * | 2004-03-04 | 2008-06-04 | 三星Sdi株式会社 | 等离子显示设备 |
US7508673B2 (en) | 2004-03-04 | 2009-03-24 | Samsung Sdi Co., Ltd. | Heat dissipating apparatus for plasma display device |
US8530248B2 (en) | 2005-02-11 | 2013-09-10 | Wintec Industries, Inc. | Method for placing a component onto a target platform by an apparatus using a probe |
US9253894B2 (en) | 2005-02-11 | 2016-02-02 | Wintec Industries, Inc. | Electronic assembly with detachable components |
US8822238B2 (en) | 2005-02-11 | 2014-09-02 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
US8674523B2 (en) | 2005-02-11 | 2014-03-18 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
US7928591B2 (en) | 2005-02-11 | 2011-04-19 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
US8536572B2 (en) | 2005-02-11 | 2013-09-17 | Wintec Industries, Inc. | Assembled multi-component electronic apparatus using alignment and reference marks |
US8535955B2 (en) | 2005-02-11 | 2013-09-17 | Wintec Industries, Inc. | Method for assembling a multi-component electronic apparatus |
US8344376B2 (en) | 2005-02-11 | 2013-01-01 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
US8350393B2 (en) | 2005-02-11 | 2013-01-08 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
US8344489B2 (en) | 2005-12-06 | 2013-01-01 | Yamaha Corporation | Semiconductor device and manufacturing method thereof |
US7646092B2 (en) | 2005-12-06 | 2010-01-12 | Yamaha Corporation | Semiconductor device and manufacturing method thereof |
CN101356644B (zh) * | 2006-02-10 | 2013-03-13 | 温德克工业股份有限公司 | 具有可拆卸元件的电子装置 |
CN101207169B (zh) * | 2006-12-19 | 2010-05-19 | 南茂科技股份有限公司 | 发光芯片封装体与光源组件 |
CN101556940B (zh) * | 2008-04-08 | 2011-04-13 | 力成科技股份有限公司 | 具有散热片的半导体封装结构 |
CN102480835A (zh) * | 2010-11-24 | 2012-05-30 | 三星电机株式会社 | 焊接连接销、半导体封装基板以及使用它们安装半导体芯片的方法 |
CN102480835B (zh) * | 2010-11-24 | 2015-11-25 | 三星电机株式会社 | 焊接连接销、半导体封装基板以及使用它们安装半导体芯片的方法 |
CN102573397A (zh) * | 2010-12-23 | 2012-07-11 | 山特电子(深圳)有限公司 | 热传输装置、其制造和组装方法及设备组件 |
CN104517912A (zh) * | 2013-09-30 | 2015-04-15 | 南茂科技股份有限公司 | 薄膜覆晶封装结构 |
CN111654972A (zh) * | 2020-06-29 | 2020-09-11 | 杭州富特科技股份有限公司 | 电路板封装结构及封装方法 |
CN113890557A (zh) * | 2021-09-30 | 2022-01-04 | 深圳盛必达通信有限公司 | 一种小型化通讯模块 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3150351B2 (ja) | 電子装置及びその製造方法 | |
US6317326B1 (en) | Integrated circuit device package and heat dissipation device | |
US7928590B2 (en) | Integrated circuit package with a heat dissipation device | |
JP3160216B2 (ja) | 電子パッケージ及びその作製方法 | |
TWI333270B (en) | Flip chip contact (fcc) power package | |
US6853069B2 (en) | Packaged die on PCB with heat sink encapsulant and methods | |
US7078803B2 (en) | Integrated circuit heat dissipation system | |
TW511450B (en) | Heat dissipation plate with inlay pin and its assembly components | |
CN1420557A (zh) | 具嵌梢的散热板及其封装件 | |
JPH09153565A (ja) | ヒートシンク付きボールグリッドアレーパッケージ | |
US7551455B2 (en) | Package structure | |
JPH07211816A (ja) | パッケージした集積回路及びその製造方法 | |
JP2002076589A5 (zh) | ||
EP1432021A3 (en) | Manufacturing method for electronic component module and electromagnetically readable data carrier | |
US20140110833A1 (en) | Power module package | |
US6819566B1 (en) | Grounding and thermal dissipation for integrated circuit packages | |
EP1571706B1 (en) | Electronic device | |
US6396699B1 (en) | Heat sink with chip die EMC ground interconnect | |
CN1319138C (zh) | 封装的半导体器件的形成方法 | |
EP1988571A2 (en) | High power semiconductor package with dual-sided heat sinking | |
JP2009010213A (ja) | 混成集積回路装置 | |
JP3312611B2 (ja) | フィルムキャリア型半導体装置 | |
KR100230189B1 (ko) | 볼 그리드 어레이 반도체 패키지 | |
JP3344362B2 (ja) | フィルムキャリア型半導体装置 | |
CN100552946C (zh) | 电子封装结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |