CN104465473B - 具有散热件的集成电路封装系统及其制造方法 - Google Patents

具有散热件的集成电路封装系统及其制造方法 Download PDF

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CN104465473B
CN104465473B CN201410475480.7A CN201410475480A CN104465473B CN 104465473 B CN104465473 B CN 104465473B CN 201410475480 A CN201410475480 A CN 201410475480A CN 104465473 B CN104465473 B CN 104465473B
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die cap
substrate
integrated circuit
radiating piece
reference mark
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CN104465473A (zh
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金五汉
郑世逸
李喜秀
郑载翰
金永澈
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Stats Chippac Pte Ltd
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Stats Chippac Pte Ltd
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Abstract

一种集成电路封装系统及其制造方法，所述系统包括：衬底；形成在所述衬底上的模盖；在所述模盖中刻划的基准标记；被施加在所述衬底上并且参照所述基准标记的热界面材料；以及安装在所述热界面材料上的散热件，所述散热件通过相对于所述基准标记对齐的定位缺口被准确地定位。

Description

具有散热件的集成电路封装系统及其制造方法
技术领域
本发明总地涉及集成电路封装系统，并且更具体地，涉及封装高性能集成电路的系统。
背景技术
许多当今的消费性电子装置正以更少的空间包含(pack)更多的功能。手机摄像机、具有集成摄像头的腕式手表手机、手机大小的平板电脑以及略大于硬币的个人音乐播放器的涌现证实了这一点。
集成电路制造商的挑战之一在于，调节晶体管的大小至一尺寸，所述尺寸将允许实现这些功能和提供充分接口接触来允许所述功能恰当发挥作用所需的成千上万的晶体管的集成。通常，被集成的功能的量将受到可以在给定空间中被提供的接口互连件的数量的限制。接口密度的开发方面的进步已经推动互连件的数量从40引脚集成电路到400-1000引脚的倒装芯片集成电路。
随着输入/输出(I/O)引脚数的剧增，出现了新的限制。去除由成千上万的晶体管的开关生成的热可能是一项艰巨的任务。具有有限功能和数十个I/O引脚的集成电路会依赖于通过I/O互连件自身传送的热。热将从集成电路芯片通过封装互连件流到具有足够大的质量来消散热能的系统板。
在当今的集成电路封装体中，可以通过I/O互连件驱散热的晶体管的数量由于路径的热阻和生成热的晶体管的绝对数量而受到限制。因为过量的热对集成电路的可靠性具有很大影响，对于这一问题的解决方案是至关重要的。
因此，仍旧存在对具有散热件以提高日渐缩小的封装件的可靠性的集成电路封装系统的需求。鉴于可以被集成在单个封装件中的晶体管的数量上的改进以及封装件必须能够消散的热的量，要找到这些问题的答案是越来越重要的。鉴于持续增加的商业竞争压力连同增长的消费者预期以及市场中获得有意义的产品差异机会的逐渐减少，找到这些问题的答案是关键的。另外，对于降低成本、提高效率和改善性能以及满足竞争压力的需要为找到这些问题的答案的关键必要性增添了更大的紧迫性。
长久以来一直在寻求对于这些问题的解决方案，但是之前的发展尚未教导或建议任何解决方案，因此，对于这些问题的解决方案长久以来一直困惑本领域的技术人员。
发明内容
本发明提供制造集成电路封装系统的方法，所述方法包括：提供衬底；在所述衬底上形成模盖(mold cap)；在所述模盖中刻划基准标记；参照所述基准标记定位热界面材料，所述热界面材料被施加在所述衬底上；以及在所述热界面材料上安装散热件，所述散热件通过相对于所述基准标记对齐定位缺口被准确地定位。
本发明提供集成电路封装系统，所述系统包括：衬底；形成在所述衬底上的模盖；在所述模盖中刻划的基准标记；被施加在所述衬底上并且参照所述基准标记的热界面材料；以及安装在所述热界面材料上的散热件，所述散热件通过相对于基准标记对齐的定位缺口被准确地定位。
除了以上提及的内容之外或者替代以上提及的内容，本发明的特定实施方案具有其他步骤或元件。当参照附图进行以下详细描述时，通过阅读该详细描述，这些步骤或元件对于本领域的技术人员将变得清楚。
附图说明
图1是本发明的实施方案中的具有散热件的集成电路封装系统的顶视图。
图2是沿图1的剖线2-2所视的具有散热件的集成电路封装系统的剖视图。
图3是在制造的部件组装阶段中衬底板组件的剖视图。
图4是在制造的模制阶段中衬底板组件的剖视图。
图5是在制造的激光打标阶段(laser marking phase)中图4的衬底板组件的剖视图。
图6是在制造的蚀刻阶段中图4的衬底板组件的剖视图。
图7是在制造的分割阶段(singulation phase)中图4的衬底板组件的顶视图。
图8是制造的热界面材料施加阶段中图7的基础封装件的顶视图。
图9是制造的散热件安装阶段中图7的基础封装件的剖视图。
图10是制造的热界面材料图形施加阶段中基础封装件的顶视图。
图11是具有散热件的集成电路封装系统的顶部平面视图。
图12是本发明的实施方案中的集成电路封装系统的制造方法的流程图。
具体实施方式
充分详细地描述以下实施方案，以使得本领域的技术人员能够实现并使用本发明。要理解的是，其他实施方案基于本公开将是显而易见的，并且可以在不脱离本发明的范围的情况下改变系统、处理或机械。
在以下描述中，给出了许多特定细节，以提供本发明的透彻理解。然而，将显而易见的是，可以在没有这些特定细节的情况下实施本发明。为了避免模糊本发明，不详细公开一些公知的电路、系统构造和处理步骤。
示出所述系统的实施方案的附图是半图解式的，并且不按比例绘制，特别是，一些尺寸在附图中为了呈现的清晰度被放大示出。类似地，尽管附图中的视图为了易于描述通常示出类似的方位，但是附图中的这一描绘对于大部分是任意的。一般来讲，可以以任意方位操作本发明。
其中，多个实施方案被公开和描述为具有某些共同的特征，为了清楚和便于所述多个实施方案的图示说明、描述以及理解，彼此类似和相同的特征将会通常以类似的参考标号来描述。为了描述方便而非意图具有任何其他意义或提供对本发明的限制，实施方案已经被编号为第一实施方案、第二实施方案等。
为了说明的目的，本文中所使用的术语“水平面”被定义为与集成电路管芯的有源侧平面或表面平行的平面，而不管其方位如何。术语“垂直”是指垂直于刚才定义的水平面的方向。如图所示，诸如“在…上面”、“在…下面”、“底部”、“顶部”、“侧”(如“侧壁”中)、“高于”、“低于”、“上部”、“在…之上/上方(over)”以及“在…下方”的术语是相对于水平面定义的。术语“在…上(on)”意味着在元件之间存在直接接触，而没有介于中间的材料。
本文所使用的术语“处理”包括在形成所描述的结构中所需要进行的材料或光致抗蚀材料的沉积、图形化、曝光、显影、蚀刻、清洁和/或材料或光致抗蚀材料的移除。
现在参照图1，其中示出本发明的实施方案中的具有散热件的集成电路封装系统100的顶视图。集成电路封装系统100的剖视图描绘散热件102，所述散热件102具有准确地定位在模盖104上的定位缺口103，所述模盖104具有基准标记106。模盖104可以由环氧树脂模制料或陶瓷模制料形成，以向集成电路管芯(未示出)提供保护。
散热件102可以通过光学定位系统(未示出)被准确地定位在模盖104上。所述光学定位系统可以将基准标记106用作模盖104上的对比点，从而在模盖104上在±25微米的范围内定位散热件102的定位缺口103。散热件102完全在模盖104的顶部表面之上。
已经通过在模盖104上形成基准标记106发现，光学定位系统可以在散热件102上提供定位缺口103的准确放置。在没有基准标记106和定位缺口103的情况下，散热件102的位置无法被保持到准确的定位位置，因为模盖104的边缘不给予足够的对比来为光学定位系统提供参考。
剖线2-2可以提供下面被进一步描述的图2的剖视图。
现在参照图2，其中示出沿图1的剖线2-2所观察的具有散热件102的集成电路封装系统100的剖视图。集成电路封装系统100的剖视图描绘通过芯片互连件208(例如焊料凸块、柱状凸块、焊料柱、金凸块等)耦合到封装件衬底206的部件侧204的倒装芯片集成电路202。倒装芯片集成电路202可以为超薄倒装芯片来使集成电路封装系统100的厚度最小化。
封装件衬底206的系统侧210可以提供信号耦合路径212。信号耦合路径212可以具有系统互连件214，例如焊料凸块、焊料柱、金凸块等，来附接到下一级系统(未示出)。信号耦合路径212可以提供信号连接到倒装芯片集成电路202或到分立部件216。分立部件216可以包括电阻、电容、电感、二极管、晶体管等。本文所使用的术语“分立(discrete)”意指单个封装的部件。
模盖104可以被形成在部件侧204，来封包(enclose)芯片互连件208、分立部件216并且与倒装芯片集成电路202的倒装芯片后侧218是共平面的。倒装芯片后侧218可以从模盖104露出，用于在倒装芯片后侧218和散热件102之间施加热界面材料220，例如热粘合剂。由于集成电路封装系统100的紧凑性质，封装件高度222可以在1.2mm至1.3mm的范围内。散热件102完全在倒装芯片集成电路202的顶部表面之上，例如倒装芯片后侧218。
已经发现的是，散热件102在模盖104顶部上的施加以及通过热界面材料220耦合的倒装芯片后侧218可以减少由于温度的原因造成的翘曲并且改善系统互连件214的共面性。封装件高度222的减少的尺寸可以小于具有热消除机构(例如散热件102)的现有封装件的厚度的一半。进一步已经发现的是，散热件102通过热界面材料220附接到倒装芯片后侧218可以向散热件102提供比通过芯片互连件208、信号耦合路径212以及系统互连件214的组合更少的热阻。倒装芯片后侧218和散热件102之间减少的热阻可以通过允许倒装芯片集成电路202的更低的操作温度来提高集成电路封装系统100的可靠性。
要理解的是，分立部分216可以围绕倒装芯片集成电路202，只要可以提供到信号耦合路径212的充分的连接。分立部件216的数量和位置仅仅是示例性的，且任何数量的分立部件216可以被包括。进一步要理解的是，系统互连件214的数量和位置仅仅是示例性的，且系统互连件214的数量仅仅受下一级系统(未示出)的最小互连空间限制。
现在参照图3，其中示出制造的部件组装阶段中衬底板组件301的剖视图。衬底板组件301的剖视图描绘具有部件侧204和系统侧210的衬底302。信号耦合路径212可以将系统侧210连接到部件侧204。
倒装芯片集成电路202可以通过芯片互连件208被耦合到部件侧204的信号耦合路径212。分立部件216可以通过导电粘合剂(例如，焊膏，所述焊膏回流来形成连接焊料304)被耦合到部件侧204的信号耦合路径212。
以实施例的方式，存在围绕芯片互连件208并且在倒装芯片集成电路202和部件侧204之间的底部填充粘合剂306的可选的施加。底部填充粘合剂306的施加可以增加衬底302的刚度，并且可以辅助防止在附加制造过程期间对芯片互连件208的损坏。仅有倒装芯片集成电路202中的一个被示出具有底部填充粘合剂306，但要理解的是，如果底部填充粘合剂306被使用，则其将会被呈现在倒装芯片集成电路202的每个上。
现在参照图4，其中示出在制造的模制阶段中的衬底基板组件401的剖视图。衬底板组件401的剖视图描绘部件侧204被模盖104完全覆盖的衬底302。
模盖104可以增加衬底板组件401的刚性，来帮助防止翘曲，所述翘曲可能增加对芯片互连件208和连接焊料304的应力。模盖104可以完全围绕并且支撑芯片互连件208和分立部件216。模盖104的顶层被形成为与倒装芯片后侧218是共面的。
现在参照图5，其中示出在制造的激光打标阶段501中图4的衬底板组件401的剖视图。衬底板组件401的剖视图可以由激光打标设备502处理。激光打标设备502可以被准确地定位在倒装芯片后侧218的平面之上。
倒装芯片后侧218的平面上的水平位置可以被激光能504准确地刻划，从而在倒装芯片集成电路202周围并且在模盖104的表面上提供图1的基准标记106。基准标记106可以在图1的模盖104上的三个地方被复制，并且每个被定位在意图的部位的±25μm的容差内。
现在参照图6，其中示出制造的蚀刻阶段601中的图4的衬底板组件401的剖视图。衬底板组件401的剖视图描绘置放在模盖104的表面上的掩模602和倒装芯片集成电路202。掩模602可以具有图形化的开口604，所述图形化的开口604准确地定位在倒装芯片集成电路202的外围。
图形化的开口604可以通过光致抗蚀过程(photo-resist process)被准确地定位到±0.1μm的容差。一旦图形化的开口604被准确地定位，则模盖104的表面可以通过蚀刻过程被刻划，来提供基准标记106。在蚀刻已经刻划出基准标记106之后，掩模602可以被移除。
现在参照图7，其中示出在制造的分割阶段701中图4的衬底板组件401的顶视图。衬底板组件401的顶视图描绘分割设备702，例如分割锯、剪切机或激光切割机。分割设备702可以循着分割线704来使基础封装件706分开。
基础封装件706可以使倒装芯片后侧218从模盖104露出并且与模盖104共面。模盖104可以具有准确地定位在基础封装件706的角落中的基准标记106。识读标记708可以被准确地定位在模盖104的角落中的一个中。识读标记708可以被用来指明封装件定向或特定特征。
要理解的是，基准标记106的形状可以为任何形状，例如凹陷到模盖104的表面中的圆形、椭圆形、菱形、正方形、矩形、十字形、三角形等。识读标记708可以为与基准标记106不同的任何形状。
剖线4-4示出衬底板组件401的视图位置和方向。仅作为实施例，衬底板组件401以2×3的布局被示出。衬底板组件401可以以任何矩阵配置来实现，而不限制本发明。基准标记106和识读标记708的位置和类型可以基于图1的散热件102的尺寸以及如由分割线704限定的模盖104的尺寸来建立。
要理解的是，散热件102的准确定位可以通过从图2的倒装芯片集成电路202去除热能量来扩展图1的集成电路封装系统100的可靠性。已经发现的是，图2的封装件高度222可以被最小化，同时提高集成电路封装系统100的可靠性。
现在参照图8，其中示出在制造的热界面材料施加阶段801中图7的基础封装件706的顶视图。基础封装件706的顶视图描绘基准标记106和识读标记708，所述基准标记106和识读标记708每个被形成为模盖104中的凹陷形状，所述凹陷形状可以被用作施加热界面材料220的定位参考。热界面材料220可以以具有足够量并且位于适当位置的测定的图形802被施加，来填充图1的倒装芯片后侧218和散热件102之间的所有空间，不留空隙。
要理解的是，基准标记106和识读标记708的形状和位置可以改变并且对可以用于这些目的的凹陷的形状没有限制。基准标记106中的三个和识读标记708提供的位置参考可以允许热界面材料220在倒装芯片后侧218上的准确定位。热界面材料220可以以测定的图形802被施加，例如平行线、圆形块、螺旋线、复合X图形等。
以测定的图形802形式的热界面材料220的量可以被计算来提供倒装芯片后侧218的完全覆盖，而在倒装芯片后侧218和散热件102之间不留任何空隙。热界面材料220的量(volume)中的一些可以填充模盖104和散热件102之间的空间，而不延伸超过散热件102的边缘。
现在参照图9，其中示出在制造的散热件安装阶段901中图7的基础封装件706的剖视图。基础封装件706的剖视图描绘准确地定位在倒装芯片后侧218上的热界面材料220。散热件102可以被部件定位设备902(例如，提起和放置设备)拾起。部件定位设备902可以包括光学传感器904来检测散热件102相对于图1的基准标记106和图7的识读标记708的对齐。
要理解的是，以测定的图形802形式的热界面材料220可以基于基准标记106和识读标记708提供的定位参考，被准确地定位在倒装芯片后侧218和模盖104上。部件定位设备902可以将散热件102准确地对齐到热界面材料220上的位置并且按压到热界面材料220上的位置上。
在分割过程之前，系统互连件214可以被耦合到封装件衬底206的系统侧的信号耦合路径212。要理解的是，在分割过程之前，基础封装件706可以被电气测试，从而仅在基础封装件706的良好测试单元上继续制造。热界面材料220和散热件102的施加将仅被应用于基础封装件706的已知的良好单元。
已经发现的是，散热件102在基础封装件706上的施加可以分布热界面材料220，所述热界面材料220已经被图形化来消除倒装芯片后侧218和散热件102之间的空隙的可能性。集成电路封装系统100可以保持系统互连件214的平面性并且防止基础封装件706的高温翘曲，同时提供小于或等于1.3mm的图2的封装件高度222。因此，已经发现的是，本发明的集成电路封装系统100和设备或产品提供重要的并且迄今为未知的和不可获得的方案、能力以及功能方面，来制造与现有技术过程相比具有小于图2的封装件高度的高热性能的集成电路封装件。
现在参照图10，其中示出制造的热界面材料图形施加阶段1001中的基础封装件706的顶视图。基础封装件706的顶视图描绘基准标记106和识读标记708，所述基准标记106和识读标记708每个被形成为模盖104中的凹陷形状，所述凹陷形状可以被用作定位参考来施加热界面材料220。热界面材料220可以以具有足够数量并且在适当位置的星爆状(starburst)图形1002或者X-十字图形1004被施加，来填充图1的倒装芯片后侧218和散热件102之间的所有空间，而不留下空隙。
要理解的是，基准标记106和识读标记708的形状和位置可以改变并且对可以用于这些目的的凹陷的形状没有限制。由基准标记106中的三个和识读标记708提供的位置参考可以允许热界面材料220在倒装芯片后侧218上的准确定位。热界面材料220可以以星爆状图形1002或X-十字图形1004被施加。
以测定的图形802形式的热界面材料220的量可以被计算来提供倒装芯片后侧218的完全覆盖，而在倒装芯片后侧218和散热件102之间不留任何空隙。热界面材料220的量中的一些可以填充模盖104和散热件102之间的空间，而不延伸超过散热件102的边缘。
图11是具有散热件102的集成电路封装系统100的顶部平面视图。集成电路封装系统100的顶部平视图描绘具有基准标记106和识读标记708的基础封装件706。倒装芯片后侧218可以被热界面材料220完全覆盖而不留任何空隙。通过控制热界面材料220的量并且通过施加图8的测定的图形802、图10的星爆状图形1002或图10的X-十字图形1004，模盖104的一准确百分比可以被热界面材料220覆盖。
以实施例的方式，对于测定的图形802、星爆状图形1002或者X-十字图形1004中的任一项并且以重量控制热界面材料220的量，可以以15mg的热界面材料220覆盖模盖104的60％或者使用20mg的热界面材料220覆盖模盖104的80％。要理解的是，使用测定的图形802、星爆状图形1002或者X-十字图形1004可以防止散热件102和倒装芯片后侧218之间出现空隙。热界面材料220到模盖104的一部分上的延伸可以防止散热件102的脱离(delamination)。
现在参照图12，其中示出本发明的实施方案中的制造集成电路封装系统的方法1200的流程图。方法1200包括：在框1202中，提供衬底；在框1204中，在衬底上形成模盖；在框1206中，在模盖中刻划基准标记；在框1208中，参照基准标记定位热界面材料，所述热界面材料被施加在所述衬底上；以及在框1210中，在热界面材料上安装散热件，所述散热件通过相对于基准标记对齐定位缺口被准确地定位。
所得的方法、处理、设备、装置、产品和/或系统是简单的、成本有效的、不复杂的、高度通用的且有效的，并且可以通过改动已知技术来令人惊讶地、不明显地实现，因此容易适合于高效率地、经济地制造这样的集成电路封装系统，所述集成电路封装系统与常规制造方法或处理和技术完全兼容、具有低封装件高度和良好的热性能。
本发明的另一重要方面是，它有价值地支持并服务于降低成本、简化系统和提高性能的历史趋势。
本发明的这些和其他有价值的方面因此将本技术的状态至少推进到下一个水平。
尽管已经结合特定最佳模式对本发明进行了描述，但是要理解，鉴于前述描述，许多替代方式、修改方式和变化方式对于本领域的技术人员将是显而易见的。因此，意图是涵盖落在所包括的权利要求书的范围内的所有这样的替代方式、修改方式和变化方式。在本文中到目前为止所阐述的或者在附图中所示出的所有内容都要从说明性而非限制性的意义上进行解释。

Claims (20)

1.一种制造集成电路封装系统的方法，所述方法包括：
在衬底上安装倒装芯片集成电路；
在所述衬底上形成模盖；
在所述模盖中刻划基准标记；
在所述模盖上形成识读标记，所述识读标记与所述基准标记相比具有不同的形状；
在所述衬底上以测定的图形施加热界面材料，所述热界面材料被定位在所述基准标记与所述识读标记之间，并且所述测定的图形被定位来在倒装芯片后侧和散热件之间不形成空隙；以及
在所述热界面材料上安装散热件，所述散热件通过相对于所述基准标记对齐定位缺口被准确地定位，所述散热件完全在所述模盖和所述倒装芯片集成电路的顶部表面之上，并且热界面材料的一部分位于所述散热件和所述模盖之间，并且不延伸超过所述散热件的边缘。
2.如权利要求1所述的方法，其中：
形成所述模盖的步骤包括在所述倒装芯片集成电路上形成所述模盖以与倒装芯片后侧共平面。
3.如权利要求1所述的方法，其中参照所述基准标记定位所述热界面材料的步骤包括形成被准确地定位在所述基准标记中的三个之间的所述测定的图形。
4.如权利要求1所述的方法，其中在所述模盖中刻划所述基准标记的步骤包括通过激光打标设备形成凹陷形状。
5.如权利要求1所述的方法，进一步包括将分立部件耦合到所述衬底并且在所述模盖之下。
6.一种制造集成电路封装系统的方法，所述方法包括：
在衬底上安装倒装芯片集成电路，所述衬底具有部件侧；
在所述衬底的所述部件侧上形成模盖；
在所述模盖中刻划基准标记；
在所述模盖上形成识读标记，所述识读标记与所述基准标记相比具有不同的形状；
在所述衬底上以测定的图形施加热界面材料，所述热界面材料被定位在所述基准标记与所述识读标记之间，并且所述测定的图形被定位来在倒装芯片后侧和散热件之间不形成空隙；以及
在所述热界面材料上安装散热件，所述散热件通过相对于所述基准标记对齐定位缺口，包括在所述散热件和所述模盖之间压紧所述测定的形状，而被准确地定位，所述散热件完全在所述模盖和所述倒装芯片集成电路的顶部表面之上，并且热界面材料的一部分位于所述散热件和所述模盖之间，并且不延伸超过所述散热件的边缘。
7.如权利要求6所述的方法，其中在所述衬底上安装倒装芯片集成电路，包括在所述倒装芯片集成电路和所述衬底之间回流芯片互连件，所述倒装芯片集成电路具有倒装芯片后侧；并且其中：
形成所述模盖的步骤包括在所述倒装芯片集成电路上以及在所述芯片互连件周围形成所述模盖以与倒装芯片后侧共平面。
8.如权利要求6所述的方法，其中参照所述基准标记定位所述热界面材料的步骤包括在由所述模盖围绕的倒装芯片后侧上形成所述测定的图形。
9.如权利要求6所述的方法，其中在所述模盖中刻划所述基准标记的步骤包括通过激光打标设备或者具有图形化的开口的掩模形成凹陷形状。
10.如权利要求6所述的方法，进一步包括在所述衬底上并且在所述模盖之下耦合分立部件，包括在所述分立部件和所述衬底内的信号耦合路径之间回流连接焊料。
11.一种集成电路封装系统，所述系统包括：
衬底；
安装在所述衬底上的倒装芯片集成电路；
形成在所述衬底上的模盖；
在所述模盖中刻划的基准标记；
在所述模盖上的识读标记，所述识读标记与所述基准标记相比具有不同的形状；
在所述衬底上处于测定的图形的热界面材料，所述热界面材料被定位在所述基准标记与所述识读标记之间，并且所述测定的图形被定位来在倒装芯片后侧和散热件之间不形成空隙；以及
安装在所述热界面材料上的散热件，所述散热件通过相对于所述基准标记对齐的定位缺口被准确地定位，完全在所述模盖和所述倒装芯片集成电路的顶部表面之上，并且热界面材料的一部分位于所述散热件和所述模盖之间，并且不延伸超过所述散热件的边缘。
12.如权利要求11所述的系统，所述模盖是在所述倒装芯片集成电路上并且与倒装芯片后侧共平面。
13.如权利要求11所述的系统，其中所述热界面材料是在所述衬底上并且所述测定的图形被准确地定位在所述基准标记中的三个之间。
14.如权利要求11所述的系统，其中所述基准标记包括通过激光打标设备形成的凹陷形状。
15.如权利要求11所述的系统，进一步包括耦合到所述衬底并且在所述模盖之下的分立部件。
16.如权利要求11所述的系统，其中：
所述衬底的部件侧包括形成于其上的所述模盖；以及
所述热界面材料的所述测定的形状包括在所述散热件和所述模盖之间压紧的所述测定的形状。
17.如权利要求16所述的系统，其中所述倒装芯片集成电路包括在所述倒装芯片集成电路和所述衬底之间的芯片互连件；并且
所述模盖是在所述倒装芯片集成电路上以及在所述芯片互连件周围，并且与倒装芯片后侧共平面。
18.如权利要求16所述的系统，其中所述热界面材料是在由所述模盖围绕的倒装芯片后侧上、被准确地定位在所述基准标记中的三个之间的测定的图形。
19.如权利要求16所述的系统，其中在所述模盖中被刻划的所述基准标记包括通过激光打标设备或者具有图形化的开口的掩模形成的、或者用具有图形化的开口的掩模刻蚀的凹陷形状。
20.如权利要求16所述的系统，进一步包括耦合到所述衬底并且在所述模盖之下的分立部件包括在所述分立部件和所述衬底内的信号耦合路径之间的连接焊料。
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