CN104425940A - 插拔性优异的镀锡铜合金端子材 - Google Patents
插拔性优异的镀锡铜合金端子材 Download PDFInfo
- Publication number
- CN104425940A CN104425940A CN201410415663.XA CN201410415663A CN104425940A CN 104425940 A CN104425940 A CN 104425940A CN 201410415663 A CN201410415663 A CN 201410415663A CN 104425940 A CN104425940 A CN 104425940A
- Authority
- CN
- China
- Prior art keywords
- layer
- alloy
- less
- cusn
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 23
- 239000000956 alloy Substances 0.000 title abstract description 28
- 238000003780 insertion Methods 0.000 title description 7
- 230000037431 insertion Effects 0.000 title description 7
- 238000000605 extraction Methods 0.000 title 1
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims description 59
- 229910016347 CuSn Inorganic materials 0.000 claims description 53
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 150000001875 compounds Chemical class 0.000 claims description 9
- 229910005887 NiSn Inorganic materials 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 abstract description 26
- 239000000758 substrate Substances 0.000 abstract description 8
- 229910000990 Ni alloy Inorganic materials 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract 9
- 229910017755 Cu-Sn Inorganic materials 0.000 abstract 4
- 229910017927 Cu—Sn Inorganic materials 0.000 abstract 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract 4
- 239000002344 surface layer Substances 0.000 abstract 3
- 229910018471 Cu6Sn5 Inorganic materials 0.000 abstract 2
- 229910018100 Ni-Sn Inorganic materials 0.000 abstract 2
- 229910003306 Ni3Sn4 Inorganic materials 0.000 abstract 2
- 229910018532 Ni—Sn Inorganic materials 0.000 abstract 2
- 238000007747 plating Methods 0.000 description 37
- 238000012360 testing method Methods 0.000 description 19
- 229910000679 solder Inorganic materials 0.000 description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000007788 roughening Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 238000003917 TEM image Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000851 scanning transmission electron micrograph Methods 0.000 description 1
- 238000005480 shot peening Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-174844 | 2013-08-26 | ||
| JP2013174844 | 2013-08-26 | ||
| JP2014154151A JP2015063750A (ja) | 2013-08-26 | 2014-07-29 | 挿抜性に優れた錫めっき銅合金端子材 |
| JP2014-154151 | 2014-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104425940A true CN104425940A (zh) | 2015-03-18 |
Family
ID=51392117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410415663.XA Pending CN104425940A (zh) | 2013-08-26 | 2014-08-21 | 插拔性优异的镀锡铜合金端子材 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150056466A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2843086A3 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2015063750A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20150024252A (cg-RX-API-DMAC7.html) |
| CN (1) | CN104425940A (cg-RX-API-DMAC7.html) |
| IN (1) | IN2014DE02341A (cg-RX-API-DMAC7.html) |
| TW (1) | TW201512430A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109072471A (zh) * | 2016-05-10 | 2018-12-21 | 三菱综合材料株式会社 | 镀锡铜端子材及端子以及电线末端部结构 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201311944A (zh) * | 2011-08-12 | 2013-03-16 | Mitsubishi Materials Corp | 插拔性優異的鍍錫銅合金端子材及其製造方法 |
| JP6221695B2 (ja) * | 2013-03-25 | 2017-11-01 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
| JP6039540B2 (ja) * | 2013-12-13 | 2016-12-07 | 三井金属鉱業株式会社 | 電解銅箔及びその製造方法 |
| JP6160582B2 (ja) * | 2014-09-11 | 2017-07-12 | 三菱マテリアル株式会社 | 錫めっき銅合金端子材及びその製造方法 |
| JP6543138B2 (ja) * | 2015-08-28 | 2019-07-10 | Ｄｏｗａメタルテック株式会社 | Ｓｎめっき材およびその製造方法 |
| JP5939345B1 (ja) * | 2015-11-06 | 2016-06-22 | 株式会社オートネットワーク技術研究所 | 端子金具およびコネクタ |
| JP6543216B2 (ja) * | 2016-05-19 | 2019-07-10 | Ｄｏｗａメタルテック株式会社 | Ｓｎめっき材およびその製造方法 |
| CN109715864B (zh) * | 2016-10-17 | 2021-06-25 | 古河电气工业株式会社 | 导电性条材 |
| JP6423025B2 (ja) * | 2017-01-17 | 2018-11-14 | 三菱伸銅株式会社 | 挿抜性に優れた錫めっき付銅端子材及びその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050037229A1 (en) * | 2001-01-19 | 2005-02-17 | Hitoshi Tanaka | Plated material, method of producing same, and electrical / electronic part using same |
| JP4024244B2 (ja) | 2004-12-27 | 2007-12-19 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
| JP2007063624A (ja) | 2005-08-31 | 2007-03-15 | Nikko Kinzoku Kk | 挿抜性及び耐熱性に優れる銅合金すずめっき条 |
| JP4503620B2 (ja) * | 2007-01-25 | 2010-07-14 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
| TW201413068A (zh) * | 2012-07-02 | 2014-04-01 | Mitsubishi Materials Corp | 插拔性優良之鍍錫銅合金端子材料及其製造方法 |
-
2014
- 2014-07-29 JP JP2014154151A patent/JP2015063750A/ja active Pending
- 2014-08-05 KR KR20140100369A patent/KR20150024252A/ko not_active Withdrawn
- 2014-08-12 US US14/457,738 patent/US20150056466A1/en not_active Abandoned
- 2014-08-15 TW TW103128089A patent/TW201512430A/zh unknown
- 2014-08-18 IN IN2341DE2014 patent/IN2014DE02341A/en unknown
- 2014-08-21 CN CN201410415663.XA patent/CN104425940A/zh active Pending
- 2014-08-25 EP EP14182063.9A patent/EP2843086A3/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109072471A (zh) * | 2016-05-10 | 2018-12-21 | 三菱综合材料株式会社 | 镀锡铜端子材及端子以及电线末端部结构 |
| CN109072471B (zh) * | 2016-05-10 | 2021-05-28 | 三菱综合材料株式会社 | 镀锡铜端子材及端子以及电线末端部结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150024252A (ko) | 2015-03-06 |
| IN2014DE02341A (cg-RX-API-DMAC7.html) | 2015-06-26 |
| TW201512430A (zh) | 2015-04-01 |
| EP2843086A3 (en) | 2015-06-03 |
| JP2015063750A (ja) | 2015-04-09 |
| US20150056466A1 (en) | 2015-02-26 |
| EP2843086A2 (en) | 2015-03-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150318 |