CN104051547B - 一种高压快速软恢复二极管及其制备方法 - Google Patents
一种高压快速软恢复二极管及其制备方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
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- H01L29/8613—Mesa PN junction diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
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- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Electrodes Of Semiconductors (AREA)
Abstract
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Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104795450B (zh) * | 2015-03-19 | 2018-07-06 | 北京时代民芯科技有限公司 | 一种新型高电流密度快恢复二极管结构及其制作方法 |
US10546961B2 (en) * | 2015-09-25 | 2020-01-28 | Mitsubishi Electric Corporation | Semiconductor device with non-overlapping impurity layers |
CN106601826B (zh) * | 2015-10-16 | 2024-03-15 | 国网智能电网研究院 | 一种快恢复二极管及其制作方法 |
CN106252390A (zh) * | 2016-09-19 | 2016-12-21 | 西安理工大学 | 一种沟槽‑场限环复合终端结构及其制备方法 |
CN106816463B (zh) * | 2017-01-16 | 2023-02-03 | 全球能源互联网研究院有限公司 | 一种终端结构、半导体器件及其制备方法 |
CN107275387A (zh) * | 2017-06-26 | 2017-10-20 | 电子科技大学 | 一种功率半导体器件终端结构及其制备方法 |
TWI635611B (zh) * | 2017-09-25 | 2018-09-11 | 新唐科技股份有限公司 | 高壓半導體元件 |
CN108110040A (zh) * | 2017-11-02 | 2018-06-01 | 全球能源互联网研究院有限公司 | 功率半导体器件及其制造方法 |
CN109390389A (zh) * | 2018-09-17 | 2019-02-26 | 西安理工大学 | 具有双侧调整区的高压快速软恢复二极管及其制备方法 |
CN109411530A (zh) * | 2018-11-30 | 2019-03-01 | 中国振华集团永光电子有限公司(国营第八七三厂) | 一种电力电子半导体芯片终端结构及其制造方法 |
CN109742160B (zh) * | 2019-03-13 | 2023-03-28 | 捷捷半导体有限公司 | 浅沟槽高压gpp芯片及其制备方法 |
CN110164980A (zh) * | 2019-05-24 | 2019-08-23 | 湖北台基半导体股份有限公司 | 一种高压快软恢复二极管 |
CN111211175A (zh) * | 2020-03-23 | 2020-05-29 | 上海道之科技有限公司 | 一种快恢复二极管器件结构及其制作方法 |
CN111628007B (zh) * | 2020-04-29 | 2023-09-05 | 株洲中车时代半导体有限公司 | 功率二极管及其制造方法 |
CN112635564A (zh) * | 2020-12-18 | 2021-04-09 | 西安电子科技大学 | 一种基于柔性衬底的soi基ldmos器件及其制作方法 |
Citations (3)
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CN1819260A (zh) * | 2005-01-28 | 2006-08-16 | 三菱电机株式会社 | 半导体装置 |
CN103208531A (zh) * | 2013-04-07 | 2013-07-17 | 株洲南车时代电气股份有限公司 | 一种快恢复二极管frd芯片及其制作方法 |
CN103746002A (zh) * | 2013-12-17 | 2014-04-23 | 西安理工大学 | 一种台阶形沟槽-场限环复合终端结构 |
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JP3409503B2 (ja) * | 1995-05-22 | 2003-05-26 | 株式会社日立製作所 | ダイオード及びダイオードの駆動方法並びに半導体回路 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1819260A (zh) * | 2005-01-28 | 2006-08-16 | 三菱电机株式会社 | 半导体装置 |
CN103208531A (zh) * | 2013-04-07 | 2013-07-17 | 株洲南车时代电气股份有限公司 | 一种快恢复二极管frd芯片及其制作方法 |
CN103746002A (zh) * | 2013-12-17 | 2014-04-23 | 西安理工大学 | 一种台阶形沟槽-场限环复合终端结构 |
Non-Patent Citations (1)
Title |
---|
4.5KV快软恢复二极管的特性优化与工艺设计;李佳斌;《万方学位论文》;20121031;第9页最后1段-第14页第1段、第25页第2段-第28页最后1段,附图2-7 * |
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