CN104010752A - 银微粒及其制造方法、以及含有该银微粒的导电性糊、导电性膜和电子器件 - Google Patents

银微粒及其制造方法、以及含有该银微粒的导电性糊、导电性膜和电子器件 Download PDF

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Publication number
CN104010752A
CN104010752A CN201280062600.XA CN201280062600A CN104010752A CN 104010752 A CN104010752 A CN 104010752A CN 201280062600 A CN201280062600 A CN 201280062600A CN 104010752 A CN104010752 A CN 104010752A
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CN
China
Prior art keywords
silver
colored particulate
particulate
liquid
fine particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280062600.XA
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English (en)
Chinese (zh)
Inventor
岩崎敬介
柿原康男
饭田哲二
大杉峰子
山本洋介
石谷诚治
森井弘子
林一之
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Toda Kogyo Corp
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Toda Kogyo Corp
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Filing date
Publication date
Application filed by Toda Kogyo Corp filed Critical Toda Kogyo Corp
Publication of CN104010752A publication Critical patent/CN104010752A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/05—Submicron size particles
    • B22F2304/054—Particle size between 1 and 100 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Composite Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
CN201280062600.XA 2011-12-28 2012-12-21 银微粒及其制造方法、以及含有该银微粒的导电性糊、导电性膜和电子器件 Pending CN104010752A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011289478A JP2013139589A (ja) 2011-12-28 2011-12-28 銀微粒子及びその製造法並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
JP2011-289478 2011-12-28
PCT/JP2012/083336 WO2013099818A1 (ja) 2011-12-28 2012-12-21 銀微粒子及びその製造法並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス

Publications (1)

Publication Number Publication Date
CN104010752A true CN104010752A (zh) 2014-08-27

Family

ID=48697303

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280062600.XA Pending CN104010752A (zh) 2011-12-28 2012-12-21 银微粒及其制造方法、以及含有该银微粒的导电性糊、导电性膜和电子器件

Country Status (5)

Country Link
JP (1) JP2013139589A (ko)
KR (1) KR20140113910A (ko)
CN (1) CN104010752A (ko)
TW (1) TW201341087A (ko)
WO (1) WO2013099818A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105761778A (zh) * 2016-04-22 2016-07-13 无锡南理工科技发展有限公司 一种低温固化型导电银浆料的制备方法
CN114054769A (zh) * 2021-11-17 2022-02-18 广东羚光新材料股份有限公司 一种银微粉及其制备方法和应用

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014098186A (ja) * 2012-11-14 2014-05-29 Mitsui Mining & Smelting Co Ltd 銀粉
JP6143627B2 (ja) * 2013-10-03 2017-06-07 住友金属鉱山株式会社 アンモニア回収方法
WO2015190076A1 (ja) * 2014-06-11 2015-12-17 バンドー化学株式会社 銀微粒子分散体、銀微粒子及びその製造方法
TWI548472B (zh) * 2014-07-18 2016-09-11 中國鋼鐵股份有限公司 微米級球形銀粒及其製造方法、導電膠及太陽能電池之電極
JP6263146B2 (ja) * 2015-04-06 2018-01-17 株式会社ノリタケカンパニーリミテド 導電膜付基板、その製造方法、およびポリイミド基板用導電性ペースト
JP6220966B2 (ja) * 2015-04-17 2017-10-25 バンドー化学株式会社 銀微粒子組成物
JP6856350B2 (ja) * 2015-10-30 2021-04-07 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP7183504B2 (ja) * 2017-09-06 2022-12-06 住友金属鉱山株式会社 湿式ニッケル粉末の粗大粒子低減方法
CN109465467B (zh) * 2018-12-24 2022-04-12 北京光禾生物科技有限公司 液态纳米银制备方法
WO2023189993A1 (ja) * 2022-03-31 2023-10-05 日清エンジニアリング株式会社 銀微粒子

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101347841A (zh) * 2008-09-03 2009-01-21 西北大学 粒度可控高振实密度银粉的制备方法
JP2009030084A (ja) * 2007-07-25 2009-02-12 Furukawa Electric Co Ltd:The 微粒子分散液の製造方法、及び微粒子分散液
CN101591488A (zh) * 2008-05-26 2009-12-02 富葵精密组件(深圳)有限公司 油墨及利用该油墨制作导电线路的方法
CN101626856A (zh) * 2007-03-30 2010-01-13 三菱麻铁里亚尔株式会社 银微粒子、银微粒子的制造方法、和银微粒子的制造装置
CN101804458A (zh) * 2009-02-12 2010-08-18 施乐公司 经有机胺稳定的银纳米颗粒及其制备方法
CN101875130A (zh) * 2009-12-08 2010-11-03 华中科技大学 一种纳米银颗粒的制备方法
TW201124215A (en) * 2009-10-02 2011-07-16 Toda Kogyo Corp Fine silver particles, method for producing same, conductive paste containing the fine silver particles, conductive film, and electronic device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1780707B (zh) * 2003-04-28 2010-07-14 住友金属矿山株式会社 制备银微粒子胶体分散系的方法、银微粒子胶体分散系和导电银膜
JP2009215573A (ja) * 2008-03-07 2009-09-24 Fujifilm Corp 棒状金属粒子及びその製造方法、並びに棒状金属粒子含有組成物、及び帯電防止材料

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101626856A (zh) * 2007-03-30 2010-01-13 三菱麻铁里亚尔株式会社 银微粒子、银微粒子的制造方法、和银微粒子的制造装置
JP2009030084A (ja) * 2007-07-25 2009-02-12 Furukawa Electric Co Ltd:The 微粒子分散液の製造方法、及び微粒子分散液
CN101591488A (zh) * 2008-05-26 2009-12-02 富葵精密组件(深圳)有限公司 油墨及利用该油墨制作导电线路的方法
CN101347841A (zh) * 2008-09-03 2009-01-21 西北大学 粒度可控高振实密度银粉的制备方法
CN101804458A (zh) * 2009-02-12 2010-08-18 施乐公司 经有机胺稳定的银纳米颗粒及其制备方法
TW201124215A (en) * 2009-10-02 2011-07-16 Toda Kogyo Corp Fine silver particles, method for producing same, conductive paste containing the fine silver particles, conductive film, and electronic device
CN101875130A (zh) * 2009-12-08 2010-11-03 华中科技大学 一种纳米银颗粒的制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105761778A (zh) * 2016-04-22 2016-07-13 无锡南理工科技发展有限公司 一种低温固化型导电银浆料的制备方法
CN105761778B (zh) * 2016-04-22 2018-09-21 无锡南理工科技发展有限公司 一种低温固化型导电银浆料的制备方法
CN114054769A (zh) * 2021-11-17 2022-02-18 广东羚光新材料股份有限公司 一种银微粉及其制备方法和应用
CN114054769B (zh) * 2021-11-17 2024-05-03 广东羚光新材料股份有限公司 一种银微粉及其制备方法和应用

Also Published As

Publication number Publication date
JP2013139589A (ja) 2013-07-18
TW201341087A (zh) 2013-10-16
WO2013099818A1 (ja) 2013-07-04
KR20140113910A (ko) 2014-09-25

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Application publication date: 20140827