CN103988342A - 蚀刻的硅结构、形成蚀刻的硅结构的方法及其应用 - Google Patents

蚀刻的硅结构、形成蚀刻的硅结构的方法及其应用 Download PDF

Info

Publication number
CN103988342A
CN103988342A CN201280060454.7A CN201280060454A CN103988342A CN 103988342 A CN103988342 A CN 103988342A CN 201280060454 A CN201280060454 A CN 201280060454A CN 103988342 A CN103988342 A CN 103988342A
Authority
CN
China
Prior art keywords
silicon
etched
copper
etching
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280060454.7A
Other languages
English (en)
Chinese (zh)
Inventor
刘峰明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nexeon Ltd
Original Assignee
Nexeon Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexeon Ltd filed Critical Nexeon Ltd
Publication of CN103988342A publication Critical patent/CN103988342A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604Chemical etching
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/02Silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/04Processes of manufacture in general
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/04Processes of manufacture in general
    • H01M4/0402Methods of deposition of the material
    • H01M4/0404Methods of deposition of the material by coating on electrode collectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/13Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • H01M4/134Electrodes based on metals, Si or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/13Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • H01M4/139Processes of manufacture
    • H01M4/1395Processes of manufacture of electrodes based on metals, Si or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/36Selection of substances as active materials, active masses, active liquids
    • H01M4/38Selection of substances as active materials, active masses, active liquids of elements or alloys
    • H01M4/386Silicon or alloys based on silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00Batteries for particular applications
    • H01M2220/30Batteries in portable systems, e.g. mobile phone, laptop
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Secondary Cells (AREA)
  • Battery Electrode And Active Subsutance (AREA)
CN201280060454.7A 2011-10-06 2012-10-05 蚀刻的硅结构、形成蚀刻的硅结构的方法及其应用 Pending CN103988342A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1117279.8A GB201117279D0 (en) 2011-10-06 2011-10-06 Etched silicon structures, method of forming etched silicon structures and uses thereof
GB1117279.8 2011-10-06
PCT/GB2012/052483 WO2013050785A1 (en) 2011-10-06 2012-10-05 Etched silicon structures, method of forming etched silicon structures and uses thereof

Publications (1)

Publication Number Publication Date
CN103988342A true CN103988342A (zh) 2014-08-13

Family

ID=45035271

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280060454.7A Pending CN103988342A (zh) 2011-10-06 2012-10-05 蚀刻的硅结构、形成蚀刻的硅结构的方法及其应用

Country Status (7)

Country Link
US (1) US20140248539A1 (enExample)
EP (1) EP2764563B1 (enExample)
JP (1) JP2015504568A (enExample)
KR (1) KR20140083006A (enExample)
CN (1) CN103988342A (enExample)
GB (2) GB201117279D0 (enExample)
WO (1) WO2013050785A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107820644A (zh) * 2015-06-30 2018-03-20 罗伯特·博世有限公司 用于锂电池的硅单片石墨阳极
CN108075164A (zh) * 2016-11-09 2018-05-25 林逸樵 二次电池及其制作方法
CN108232204A (zh) * 2016-12-10 2018-06-29 中国科学院大连化学物理研究所 一种硅基有序化电极及其制备方法和应用
CN109597250A (zh) * 2018-12-26 2019-04-09 深圳市华星光电技术有限公司 蓝相液晶面板的制作方法及其立体电极的制作方法
CN110803706A (zh) * 2019-12-04 2020-02-18 宝鸡文理学院 一种快速高效脱除介孔氧化硅材料模板剂的方法
CN119419233A (zh) * 2024-10-09 2025-02-11 浙江锂威能源科技有限公司 一种金属镀层包覆硅基材料及二次电池

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201122315D0 (en) * 2011-12-23 2012-02-01 Nexeon Ltd Etched silicon structures, method of forming etched silicon structures and uses thereof
AU2013243954A1 (en) * 2012-04-02 2014-10-30 Moderna Therapeutics, Inc. Modified polynucleotides for the production of cosmetic proteins and peptides
AU2013243949A1 (en) * 2012-04-02 2014-10-30 Moderna Therapeutics, Inc. Modified polynucleotides for the production of biologics and proteins associated with human disease
IN2015DN00810A (enExample) 2013-05-30 2015-06-12 Lg Chemical Ltd
EP3033788A1 (en) * 2013-08-14 2016-06-22 Board of Regents, The University of Texas System Methods of fabricating silicon nanowires and devices containing silicon nanowires
JP6171097B2 (ja) * 2013-10-30 2017-07-26 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. 非平行アイランドエッチング
WO2015065394A1 (en) 2013-10-30 2015-05-07 Hewlett-Packard Development Company, L.P. Island etched filter passages
US10205164B2 (en) 2013-12-03 2019-02-12 Lg Chem Ltd. Porous silicon-based anode active material, method for preparing the same, and lithium secondary battery comprising the same
CN104803342B (zh) * 2014-01-23 2016-08-17 清华大学 碗状金属纳米结构的制备方法
JP6121959B2 (ja) * 2014-09-11 2017-04-26 株式会社東芝 エッチング方法、物品及び半導体装置の製造方法、並びにエッチング液
KR101677023B1 (ko) * 2014-10-17 2016-11-17 한양대학교 에리카산학협력단 실리콘 표면 에칭방법 및 시드층 형성방법
KR101801789B1 (ko) 2015-11-05 2017-11-28 한국과학기술연구원 다공성 탄소 재료 및 이의 제조 방법
KR101859811B1 (ko) * 2016-03-07 2018-06-28 한국과학기술원 금속 나노입자와 금속 초박막이 코팅된 전도성 단결정 실리콘 입자, 이를 포함하는 고용량 이차전지용 음극활물질 및 그 제조방법
US11289700B2 (en) 2016-06-28 2022-03-29 The Research Foundation For The State University Of New York KVOPO4 cathode for sodium ion batteries
CN108604617B (zh) * 2016-12-27 2022-06-28 中国建材国际工程集团有限公司 用次氯酸钙活化CdTe薄膜太阳能电池的CdTe层的方法
JP7134778B2 (ja) * 2018-08-09 2022-09-12 株式会社東芝 処理システム
CN115428235A (zh) * 2020-02-20 2022-12-02 汉阳大学校Erica产学协力团 金属负极电极、包含其的二次电池及其制备方法
JP7448998B2 (ja) 2020-02-20 2024-03-13 漢陽大学校エリカ産学協力団 複合繊維、これを含む固体電解質、及びこれを含む金属空気電池
US20230343941A1 (en) * 2020-09-25 2023-10-26 Tohoku University Lithium-ion secondary battery negative electrode mixture and lithium-ion secondary battery
US12315736B2 (en) * 2022-09-14 2025-05-27 Applied Materials, Inc. Methods of highly selective silicon oxide removal
WO2024249394A1 (en) * 2023-05-27 2024-12-05 University Of Louisville Research Foundation, Inc. Materials and methods for high energy density silicon lithium ion batteries
KR102861629B1 (ko) * 2024-06-03 2025-09-17 한화모멘텀 주식회사 음극재 및 이의 제조방법, 이를 포함하는 리튬이온 이차전지

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007083152A1 (en) * 2006-01-23 2007-07-26 Nexeon Ltd Method of etching a silicon-based material
CN101356666A (zh) * 2006-12-13 2009-01-28 松下电器产业株式会社 非水电解质二次电池用负极及其制造方法、以及采用该负极的非水电解质二次电池
CN101496199A (zh) * 2006-10-10 2009-07-29 松下电器产业株式会社 非水电解质二次电池用负极
EP2226374A1 (en) * 2009-03-06 2010-09-08 S.O.I. TEC Silicon Etching composition, in particular for silicon materials, method for characterizing defects of such materials and process of treating such surfaces with etching composition
US20100301276A1 (en) * 2009-05-27 2010-12-02 Joong Kee Lee Method of preparing bundle type silicon nanorod composite through electroless etching process using metal ions and anode active material for lithium secondary cells comprising the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436259A (en) * 1966-05-12 1969-04-01 Ibm Method for plating and polishing a silicon planar surface
JP3186621B2 (ja) * 1996-12-24 2001-07-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN1160186C (zh) 1999-06-03 2004-08-04 宾夕法尼亚州研究基金会 纳米尺度的组合物、复合结构、其制造和应用
US6790785B1 (en) * 2000-09-15 2004-09-14 The Board Of Trustees Of The University Of Illinois Metal-assisted chemical etch porous silicon formation method
GB2395059B (en) 2002-11-05 2005-03-16 Imp College Innovations Ltd Structured silicon anode
US7244513B2 (en) * 2003-02-21 2007-07-17 Nano-Proprietary, Inc. Stain-etched silicon powder
FR2853562B1 (fr) * 2003-04-14 2006-08-11 Centre Nat Rech Scient Procede de fabrication de granules semiconducteurs
TW200620451A (en) * 2004-11-09 2006-06-16 Univ Osaka Method for forming hole in crystal substrate, and crystal substrate having hole formed by the method
DE102005041877A1 (de) * 2005-09-02 2007-03-08 Koynov, Svetoslav, Dr. Verfahren zur Herstellung siliziumhaltiger Oberflächen und optoelektronische Bauelemente
FR2914925B1 (fr) 2007-04-13 2009-06-05 Altis Semiconductor Snc Solution utilisee dans la fabrication d'un materiau semi-conducteur poreux et procede de fabrication dudit materiau
GB0709165D0 (en) * 2007-05-11 2007-06-20 Nexeon Ltd A silicon anode for a rechargeable battery
GB0713898D0 (en) 2007-07-17 2007-08-29 Nexeon Ltd A method of fabricating structured particles composed of silcon or a silicon-based material and their use in lithium rechargeable batteries
US8815104B2 (en) * 2008-03-21 2014-08-26 Alliance For Sustainable Energy, Llc Copper-assisted, anti-reflection etching of silicon surfaces
WO2010027962A2 (en) * 2008-09-04 2010-03-11 The Board Of Trustees Of The University Of Illinois Method of forming a nanoscale three-demensional pattern in a porous semiconductor
GB2464158B (en) * 2008-10-10 2011-04-20 Nexeon Ltd A method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries
US8278191B2 (en) * 2009-03-31 2012-10-02 Georgia Tech Research Corporation Methods and systems for metal-assisted chemical etching of substrates
GB0922063D0 (en) 2009-12-17 2010-02-03 Intrinsiq Materials Global Ltd Porous silicon
TWI472477B (zh) 2010-03-02 2015-02-11 國立臺灣大學 矽奈米結構與其製造方法及應用
GB201005979D0 (en) * 2010-04-09 2010-05-26 Nexeon Ltd A method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007083152A1 (en) * 2006-01-23 2007-07-26 Nexeon Ltd Method of etching a silicon-based material
US20100233539A1 (en) * 2006-01-23 2010-09-16 Mino Green Method of etching a silicon-based material
CN101496199A (zh) * 2006-10-10 2009-07-29 松下电器产业株式会社 非水电解质二次电池用负极
CN101356666A (zh) * 2006-12-13 2009-01-28 松下电器产业株式会社 非水电解质二次电池用负极及其制造方法、以及采用该负极的非水电解质二次电池
EP2226374A1 (en) * 2009-03-06 2010-09-08 S.O.I. TEC Silicon Etching composition, in particular for silicon materials, method for characterizing defects of such materials and process of treating such surfaces with etching composition
US20100301276A1 (en) * 2009-05-27 2010-12-02 Joong Kee Lee Method of preparing bundle type silicon nanorod composite through electroless etching process using metal ions and anode active material for lithium secondary cells comprising the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107820644A (zh) * 2015-06-30 2018-03-20 罗伯特·博世有限公司 用于锂电池的硅单片石墨阳极
CN107820644B (zh) * 2015-06-30 2022-07-12 罗伯特·博世有限公司 用于锂电池的硅单片石墨阳极
CN108075164A (zh) * 2016-11-09 2018-05-25 林逸樵 二次电池及其制作方法
CN108232204A (zh) * 2016-12-10 2018-06-29 中国科学院大连化学物理研究所 一种硅基有序化电极及其制备方法和应用
CN109597250A (zh) * 2018-12-26 2019-04-09 深圳市华星光电技术有限公司 蓝相液晶面板的制作方法及其立体电极的制作方法
CN110803706A (zh) * 2019-12-04 2020-02-18 宝鸡文理学院 一种快速高效脱除介孔氧化硅材料模板剂的方法
CN110803706B (zh) * 2019-12-04 2023-03-28 宝鸡文理学院 一种快速高效脱除介孔氧化硅材料模板剂的方法
CN119419233A (zh) * 2024-10-09 2025-02-11 浙江锂威能源科技有限公司 一种金属镀层包覆硅基材料及二次电池

Also Published As

Publication number Publication date
GB201117279D0 (en) 2011-11-16
KR20140083006A (ko) 2014-07-03
GB201217909D0 (en) 2012-11-21
GB2495405A (en) 2013-04-10
GB2495405B (en) 2014-11-12
US20140248539A1 (en) 2014-09-04
EP2764563A1 (en) 2014-08-13
EP2764563B1 (en) 2016-09-21
JP2015504568A (ja) 2015-02-12
WO2013050785A1 (en) 2013-04-11

Similar Documents

Publication Publication Date Title
EP2764563B1 (en) Etched silicon structures, method of forming etched silicon structures and uses thereof
US20140335411A1 (en) Etched silicon structures, method of forming etched silicon structures and uses thereof
US9184438B2 (en) Method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries
CN103098265B (zh) 制造由硅或硅基材料构成的结构化粒子的方法及其在锂可充电电池中的用途
US20150050556A1 (en) Etched silicon structures, method of forming etched silicon structures and uses thereof
US20140170303A1 (en) Electrodeposition process for the manufacture of an electrode for a metial-ion battery
EP2897200B1 (en) Porous complex, and method for preparing same
US20160172457A1 (en) Methods of fabricating silicon nanowires and devices containing silicon nanowires
US20130224599A1 (en) Negative active material for rechargeable lithium battery, method of preparing the same, and rechargeable lithium battery including the same
CN104011261B (zh) 刻蚀硅结构、形成刻蚀硅结构的方法及其用途
WO2015008093A1 (en) Method of forming etched silicon structures
KR101589458B1 (ko) 실리콘 나노 와이어의 제조 방법 및 이를 이용한 실리콘계 음극 활물질과 리튬 2차전지의 제조방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140813