CN103988342A - 蚀刻的硅结构、形成蚀刻的硅结构的方法及其应用 - Google Patents
蚀刻的硅结构、形成蚀刻的硅结构的方法及其应用 Download PDFInfo
- Publication number
- CN103988342A CN103988342A CN201280060454.7A CN201280060454A CN103988342A CN 103988342 A CN103988342 A CN 103988342A CN 201280060454 A CN201280060454 A CN 201280060454A CN 103988342 A CN103988342 A CN 103988342A
- Authority
- CN
- China
- Prior art keywords
- silicon
- etched
- copper
- etching
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/0402—Methods of deposition of the material
- H01M4/0404—Methods of deposition of the material by coating on electrode collectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/134—Electrodes based on metals, Si or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
- H01M4/1395—Processes of manufacture of electrodes based on metals, Si or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/36—Selection of substances as active materials, active masses, active liquids
- H01M4/38—Selection of substances as active materials, active masses, active liquids of elements or alloys
- H01M4/386—Silicon or alloys based on silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2220/00—Batteries for particular applications
- H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
- Secondary Cells (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1117279.8A GB201117279D0 (en) | 2011-10-06 | 2011-10-06 | Etched silicon structures, method of forming etched silicon structures and uses thereof |
| GB1117279.8 | 2011-10-06 | ||
| PCT/GB2012/052483 WO2013050785A1 (en) | 2011-10-06 | 2012-10-05 | Etched silicon structures, method of forming etched silicon structures and uses thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103988342A true CN103988342A (zh) | 2014-08-13 |
Family
ID=45035271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280060454.7A Pending CN103988342A (zh) | 2011-10-06 | 2012-10-05 | 蚀刻的硅结构、形成蚀刻的硅结构的方法及其应用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140248539A1 (enExample) |
| EP (1) | EP2764563B1 (enExample) |
| JP (1) | JP2015504568A (enExample) |
| KR (1) | KR20140083006A (enExample) |
| CN (1) | CN103988342A (enExample) |
| GB (2) | GB201117279D0 (enExample) |
| WO (1) | WO2013050785A1 (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107820644A (zh) * | 2015-06-30 | 2018-03-20 | 罗伯特·博世有限公司 | 用于锂电池的硅单片石墨阳极 |
| CN108075164A (zh) * | 2016-11-09 | 2018-05-25 | 林逸樵 | 二次电池及其制作方法 |
| CN108232204A (zh) * | 2016-12-10 | 2018-06-29 | 中国科学院大连化学物理研究所 | 一种硅基有序化电极及其制备方法和应用 |
| CN109597250A (zh) * | 2018-12-26 | 2019-04-09 | 深圳市华星光电技术有限公司 | 蓝相液晶面板的制作方法及其立体电极的制作方法 |
| CN110803706A (zh) * | 2019-12-04 | 2020-02-18 | 宝鸡文理学院 | 一种快速高效脱除介孔氧化硅材料模板剂的方法 |
| CN119419233A (zh) * | 2024-10-09 | 2025-02-11 | 浙江锂威能源科技有限公司 | 一种金属镀层包覆硅基材料及二次电池 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201122315D0 (en) * | 2011-12-23 | 2012-02-01 | Nexeon Ltd | Etched silicon structures, method of forming etched silicon structures and uses thereof |
| AU2013243954A1 (en) * | 2012-04-02 | 2014-10-30 | Moderna Therapeutics, Inc. | Modified polynucleotides for the production of cosmetic proteins and peptides |
| AU2013243949A1 (en) * | 2012-04-02 | 2014-10-30 | Moderna Therapeutics, Inc. | Modified polynucleotides for the production of biologics and proteins associated with human disease |
| IN2015DN00810A (enExample) | 2013-05-30 | 2015-06-12 | Lg Chemical Ltd | |
| EP3033788A1 (en) * | 2013-08-14 | 2016-06-22 | Board of Regents, The University of Texas System | Methods of fabricating silicon nanowires and devices containing silicon nanowires |
| JP6171097B2 (ja) * | 2013-10-30 | 2017-07-26 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 非平行アイランドエッチング |
| WO2015065394A1 (en) | 2013-10-30 | 2015-05-07 | Hewlett-Packard Development Company, L.P. | Island etched filter passages |
| US10205164B2 (en) | 2013-12-03 | 2019-02-12 | Lg Chem Ltd. | Porous silicon-based anode active material, method for preparing the same, and lithium secondary battery comprising the same |
| CN104803342B (zh) * | 2014-01-23 | 2016-08-17 | 清华大学 | 碗状金属纳米结构的制备方法 |
| JP6121959B2 (ja) * | 2014-09-11 | 2017-04-26 | 株式会社東芝 | エッチング方法、物品及び半導体装置の製造方法、並びにエッチング液 |
| KR101677023B1 (ko) * | 2014-10-17 | 2016-11-17 | 한양대학교 에리카산학협력단 | 실리콘 표면 에칭방법 및 시드층 형성방법 |
| KR101801789B1 (ko) | 2015-11-05 | 2017-11-28 | 한국과학기술연구원 | 다공성 탄소 재료 및 이의 제조 방법 |
| KR101859811B1 (ko) * | 2016-03-07 | 2018-06-28 | 한국과학기술원 | 금속 나노입자와 금속 초박막이 코팅된 전도성 단결정 실리콘 입자, 이를 포함하는 고용량 이차전지용 음극활물질 및 그 제조방법 |
| US11289700B2 (en) | 2016-06-28 | 2022-03-29 | The Research Foundation For The State University Of New York | KVOPO4 cathode for sodium ion batteries |
| CN108604617B (zh) * | 2016-12-27 | 2022-06-28 | 中国建材国际工程集团有限公司 | 用次氯酸钙活化CdTe薄膜太阳能电池的CdTe层的方法 |
| JP7134778B2 (ja) * | 2018-08-09 | 2022-09-12 | 株式会社東芝 | 処理システム |
| CN115428235A (zh) * | 2020-02-20 | 2022-12-02 | 汉阳大学校Erica产学协力团 | 金属负极电极、包含其的二次电池及其制备方法 |
| JP7448998B2 (ja) | 2020-02-20 | 2024-03-13 | 漢陽大学校エリカ産学協力団 | 複合繊維、これを含む固体電解質、及びこれを含む金属空気電池 |
| US20230343941A1 (en) * | 2020-09-25 | 2023-10-26 | Tohoku University | Lithium-ion secondary battery negative electrode mixture and lithium-ion secondary battery |
| US12315736B2 (en) * | 2022-09-14 | 2025-05-27 | Applied Materials, Inc. | Methods of highly selective silicon oxide removal |
| WO2024249394A1 (en) * | 2023-05-27 | 2024-12-05 | University Of Louisville Research Foundation, Inc. | Materials and methods for high energy density silicon lithium ion batteries |
| KR102861629B1 (ko) * | 2024-06-03 | 2025-09-17 | 한화모멘텀 주식회사 | 음극재 및 이의 제조방법, 이를 포함하는 리튬이온 이차전지 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007083152A1 (en) * | 2006-01-23 | 2007-07-26 | Nexeon Ltd | Method of etching a silicon-based material |
| CN101356666A (zh) * | 2006-12-13 | 2009-01-28 | 松下电器产业株式会社 | 非水电解质二次电池用负极及其制造方法、以及采用该负极的非水电解质二次电池 |
| CN101496199A (zh) * | 2006-10-10 | 2009-07-29 | 松下电器产业株式会社 | 非水电解质二次电池用负极 |
| EP2226374A1 (en) * | 2009-03-06 | 2010-09-08 | S.O.I. TEC Silicon | Etching composition, in particular for silicon materials, method for characterizing defects of such materials and process of treating such surfaces with etching composition |
| US20100301276A1 (en) * | 2009-05-27 | 2010-12-02 | Joong Kee Lee | Method of preparing bundle type silicon nanorod composite through electroless etching process using metal ions and anode active material for lithium secondary cells comprising the same |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3436259A (en) * | 1966-05-12 | 1969-04-01 | Ibm | Method for plating and polishing a silicon planar surface |
| JP3186621B2 (ja) * | 1996-12-24 | 2001-07-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN1160186C (zh) | 1999-06-03 | 2004-08-04 | 宾夕法尼亚州研究基金会 | 纳米尺度的组合物、复合结构、其制造和应用 |
| US6790785B1 (en) * | 2000-09-15 | 2004-09-14 | The Board Of Trustees Of The University Of Illinois | Metal-assisted chemical etch porous silicon formation method |
| GB2395059B (en) | 2002-11-05 | 2005-03-16 | Imp College Innovations Ltd | Structured silicon anode |
| US7244513B2 (en) * | 2003-02-21 | 2007-07-17 | Nano-Proprietary, Inc. | Stain-etched silicon powder |
| FR2853562B1 (fr) * | 2003-04-14 | 2006-08-11 | Centre Nat Rech Scient | Procede de fabrication de granules semiconducteurs |
| TW200620451A (en) * | 2004-11-09 | 2006-06-16 | Univ Osaka | Method for forming hole in crystal substrate, and crystal substrate having hole formed by the method |
| DE102005041877A1 (de) * | 2005-09-02 | 2007-03-08 | Koynov, Svetoslav, Dr. | Verfahren zur Herstellung siliziumhaltiger Oberflächen und optoelektronische Bauelemente |
| FR2914925B1 (fr) | 2007-04-13 | 2009-06-05 | Altis Semiconductor Snc | Solution utilisee dans la fabrication d'un materiau semi-conducteur poreux et procede de fabrication dudit materiau |
| GB0709165D0 (en) * | 2007-05-11 | 2007-06-20 | Nexeon Ltd | A silicon anode for a rechargeable battery |
| GB0713898D0 (en) | 2007-07-17 | 2007-08-29 | Nexeon Ltd | A method of fabricating structured particles composed of silcon or a silicon-based material and their use in lithium rechargeable batteries |
| US8815104B2 (en) * | 2008-03-21 | 2014-08-26 | Alliance For Sustainable Energy, Llc | Copper-assisted, anti-reflection etching of silicon surfaces |
| WO2010027962A2 (en) * | 2008-09-04 | 2010-03-11 | The Board Of Trustees Of The University Of Illinois | Method of forming a nanoscale three-demensional pattern in a porous semiconductor |
| GB2464158B (en) * | 2008-10-10 | 2011-04-20 | Nexeon Ltd | A method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries |
| US8278191B2 (en) * | 2009-03-31 | 2012-10-02 | Georgia Tech Research Corporation | Methods and systems for metal-assisted chemical etching of substrates |
| GB0922063D0 (en) | 2009-12-17 | 2010-02-03 | Intrinsiq Materials Global Ltd | Porous silicon |
| TWI472477B (zh) | 2010-03-02 | 2015-02-11 | 國立臺灣大學 | 矽奈米結構與其製造方法及應用 |
| GB201005979D0 (en) * | 2010-04-09 | 2010-05-26 | Nexeon Ltd | A method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries |
-
2011
- 2011-10-06 GB GBGB1117279.8A patent/GB201117279D0/en not_active Ceased
-
2012
- 2012-10-05 CN CN201280060454.7A patent/CN103988342A/zh active Pending
- 2012-10-05 WO PCT/GB2012/052483 patent/WO2013050785A1/en not_active Ceased
- 2012-10-05 US US14/349,498 patent/US20140248539A1/en not_active Abandoned
- 2012-10-05 JP JP2014533992A patent/JP2015504568A/ja active Pending
- 2012-10-05 KR KR1020147012116A patent/KR20140083006A/ko not_active Withdrawn
- 2012-10-05 EP EP12772390.6A patent/EP2764563B1/en not_active Not-in-force
- 2012-10-05 GB GB1217909.9A patent/GB2495405B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007083152A1 (en) * | 2006-01-23 | 2007-07-26 | Nexeon Ltd | Method of etching a silicon-based material |
| US20100233539A1 (en) * | 2006-01-23 | 2010-09-16 | Mino Green | Method of etching a silicon-based material |
| CN101496199A (zh) * | 2006-10-10 | 2009-07-29 | 松下电器产业株式会社 | 非水电解质二次电池用负极 |
| CN101356666A (zh) * | 2006-12-13 | 2009-01-28 | 松下电器产业株式会社 | 非水电解质二次电池用负极及其制造方法、以及采用该负极的非水电解质二次电池 |
| EP2226374A1 (en) * | 2009-03-06 | 2010-09-08 | S.O.I. TEC Silicon | Etching composition, in particular for silicon materials, method for characterizing defects of such materials and process of treating such surfaces with etching composition |
| US20100301276A1 (en) * | 2009-05-27 | 2010-12-02 | Joong Kee Lee | Method of preparing bundle type silicon nanorod composite through electroless etching process using metal ions and anode active material for lithium secondary cells comprising the same |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107820644A (zh) * | 2015-06-30 | 2018-03-20 | 罗伯特·博世有限公司 | 用于锂电池的硅单片石墨阳极 |
| CN107820644B (zh) * | 2015-06-30 | 2022-07-12 | 罗伯特·博世有限公司 | 用于锂电池的硅单片石墨阳极 |
| CN108075164A (zh) * | 2016-11-09 | 2018-05-25 | 林逸樵 | 二次电池及其制作方法 |
| CN108232204A (zh) * | 2016-12-10 | 2018-06-29 | 中国科学院大连化学物理研究所 | 一种硅基有序化电极及其制备方法和应用 |
| CN109597250A (zh) * | 2018-12-26 | 2019-04-09 | 深圳市华星光电技术有限公司 | 蓝相液晶面板的制作方法及其立体电极的制作方法 |
| CN110803706A (zh) * | 2019-12-04 | 2020-02-18 | 宝鸡文理学院 | 一种快速高效脱除介孔氧化硅材料模板剂的方法 |
| CN110803706B (zh) * | 2019-12-04 | 2023-03-28 | 宝鸡文理学院 | 一种快速高效脱除介孔氧化硅材料模板剂的方法 |
| CN119419233A (zh) * | 2024-10-09 | 2025-02-11 | 浙江锂威能源科技有限公司 | 一种金属镀层包覆硅基材料及二次电池 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201117279D0 (en) | 2011-11-16 |
| KR20140083006A (ko) | 2014-07-03 |
| GB201217909D0 (en) | 2012-11-21 |
| GB2495405A (en) | 2013-04-10 |
| GB2495405B (en) | 2014-11-12 |
| US20140248539A1 (en) | 2014-09-04 |
| EP2764563A1 (en) | 2014-08-13 |
| EP2764563B1 (en) | 2016-09-21 |
| JP2015504568A (ja) | 2015-02-12 |
| WO2013050785A1 (en) | 2013-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2764563B1 (en) | Etched silicon structures, method of forming etched silicon structures and uses thereof | |
| US20140335411A1 (en) | Etched silicon structures, method of forming etched silicon structures and uses thereof | |
| US9184438B2 (en) | Method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries | |
| CN103098265B (zh) | 制造由硅或硅基材料构成的结构化粒子的方法及其在锂可充电电池中的用途 | |
| US20150050556A1 (en) | Etched silicon structures, method of forming etched silicon structures and uses thereof | |
| US20140170303A1 (en) | Electrodeposition process for the manufacture of an electrode for a metial-ion battery | |
| EP2897200B1 (en) | Porous complex, and method for preparing same | |
| US20160172457A1 (en) | Methods of fabricating silicon nanowires and devices containing silicon nanowires | |
| US20130224599A1 (en) | Negative active material for rechargeable lithium battery, method of preparing the same, and rechargeable lithium battery including the same | |
| CN104011261B (zh) | 刻蚀硅结构、形成刻蚀硅结构的方法及其用途 | |
| WO2015008093A1 (en) | Method of forming etched silicon structures | |
| KR101589458B1 (ko) | 실리콘 나노 와이어의 제조 방법 및 이를 이용한 실리콘계 음극 활물질과 리튬 2차전지의 제조방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140813 |