CN1039756C - 从塑料封装组件中恢复半导体裸芯片的方法 - Google Patents

从塑料封装组件中恢复半导体裸芯片的方法 Download PDF

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Publication number
CN1039756C
CN1039756C CN94113437A CN94113437A CN1039756C CN 1039756 C CN1039756 C CN 1039756C CN 94113437 A CN94113437 A CN 94113437A CN 94113437 A CN94113437 A CN 94113437A CN 1039756 C CN1039756 C CN 1039756C
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China
Prior art keywords
chip
assembly
plastic
plastic package
nitric acid
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Expired - Fee Related
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CN94113437A
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English (en)
Chinese (zh)
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CN1108808A (zh
Inventor
P·达米奥特
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International Business Machines Corp
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International Business Machines Corp
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Publication of CN1108808A publication Critical patent/CN1108808A/zh
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Publication of CN1039756C publication Critical patent/CN1039756C/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN94113437A 1994-02-22 1994-12-31 从塑料封装组件中恢复半导体裸芯片的方法 Expired - Fee Related CN1039756C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP94480015.0 1994-02-22
EP94480015A EP0668611A1 (en) 1994-02-22 1994-02-22 Method for recovering bare semiconductor chips from plastic packaged modules

Publications (2)

Publication Number Publication Date
CN1108808A CN1108808A (zh) 1995-09-20
CN1039756C true CN1039756C (zh) 1998-09-09

Family

ID=8218113

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94113437A Expired - Fee Related CN1039756C (zh) 1994-02-22 1994-12-31 从塑料封装组件中恢复半导体裸芯片的方法

Country Status (7)

Country Link
US (1) US5424254A (enExample)
EP (1) EP0668611A1 (enExample)
JP (1) JP2688178B2 (enExample)
KR (1) KR0143951B1 (enExample)
CN (1) CN1039756C (enExample)
MY (1) MY113986A (enExample)
TW (1) TW282568B (enExample)

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US5700697A (en) * 1993-02-01 1997-12-23 Silicon Packaging Technology Method for packaging an integrated circuit using a reconstructed package
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5591649A (en) * 1995-01-19 1997-01-07 Texas Instruments Incorporated Process of removing a tape automated bonded semiconductor from bonded leads
US6551845B1 (en) * 1996-01-02 2003-04-22 Micron Technology, Inc. Method of temporarily securing a die to a burn-in carrier
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5698474A (en) * 1996-02-26 1997-12-16 Hypervision, Inc. High speed diamond-based machining of silicon semiconductor die in wafer and packaged form for backside emission microscope detection
US6043100A (en) * 1996-04-19 2000-03-28 Weaver; Kevin Chip on tape die reframe process
JP3417247B2 (ja) * 1996-05-28 2003-06-16 株式会社デンソー 樹脂封止型電子装置の製造方法
US5923946A (en) * 1997-04-17 1999-07-13 Cree Research, Inc. Recovery of surface-ready silicon carbide substrates
US5976897A (en) * 1997-10-10 1999-11-02 Advanced Micro Devices, Inc. Method of protecting device leads of a packaged integrated circuit
US6342398B1 (en) 1998-12-17 2002-01-29 Taiwan Semiconductor Manufacturing Company Method of backside emission analysis for BGA packaged IC's
US6329212B1 (en) * 1999-01-08 2001-12-11 Advanced Micro Devices, Inc. Process for exposing for analysis the back side of a semiconductor die mounted in a package
US6294028B1 (en) 1999-04-23 2001-09-25 International Business Machines Corporation Mercury process gold ballbond removal apparatus
US6335208B1 (en) 1999-05-10 2002-01-01 Intersil Americas Inc. Laser decapsulation method
US6452176B1 (en) 1999-07-22 2002-09-17 Advanced Micro Devices, Inc. Arrangement and method for using electron channeling patterns to detect substrate damage
US6387206B1 (en) 1999-08-17 2002-05-14 Advanced Micro Devices, Inc. Method and system for plastic package decapsulation of electronic devices
JP4403631B2 (ja) * 2000-04-24 2010-01-27 ソニー株式会社 チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP2001313350A (ja) * 2000-04-28 2001-11-09 Sony Corp チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
US6429028B1 (en) 2000-08-29 2002-08-06 Dpa Labs, Incorporated Process to remove semiconductor chips from a plastic package
JP2002184934A (ja) * 2000-12-13 2002-06-28 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US20020100600A1 (en) 2001-01-26 2002-08-01 Albert Douglas M. Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same
JP4611569B2 (ja) * 2001-05-30 2011-01-12 ルネサスエレクトロニクス株式会社 リードフレーム及び半導体装置の製造方法
US6630369B2 (en) * 2001-07-17 2003-10-07 Ultra Tec Manufacturing, Inc. Sample preparation apparatus and method
DE10154017A1 (de) * 2001-11-02 2003-05-15 Atmel Germany Gmbh Verfahren zum Schutz einer kunststoffgehäusten elektronischen Baugruppe
EP1440608B1 (de) * 2001-11-02 2006-02-15 ATMEL Germany GmbH Verfahren zum offnen eines kunststoffgehauses einer elektronischen baugruppe
US6521479B1 (en) * 2001-12-28 2003-02-18 Texas Instruments Incorporated Repackaging semiconductor IC devices for failure analysis
US7067332B1 (en) * 2004-03-16 2006-06-27 Altera Corporation Method for die removal from plastic packages
US7772038B2 (en) * 2005-09-30 2010-08-10 Retro Reflective Optics, Llc CMOS process for fabrication of ultra small or non standard size or shape semiconductor die
KR100744029B1 (ko) * 2006-04-07 2007-07-30 주식회사 하이닉스반도체 페키지된 반도체 칩의 디캡 방법
KR100806324B1 (ko) * 2007-01-05 2008-02-27 (주)엠아이반도체 반도체 불량분석을 위한 웨이퍼 에칭 시스템 및 방법
US7981698B2 (en) * 2007-03-09 2011-07-19 The Charles Stark Draper Laboratory, Inc. Removal of integrated circuits from packages
CN102023274B (zh) * 2009-09-11 2014-03-19 中芯国际集成电路制造(北京)有限公司 一种去除芯片陶瓷封装体的方法
KR101149865B1 (ko) * 2010-02-04 2012-05-24 한국생산기술연구원 반도체 칩 패키지에서 반도체 칩 분리 방법
CN102163537B (zh) * 2010-02-24 2012-10-17 中芯国际集成电路制造(上海)有限公司 一种废弃芯片单元回收利用方法
CN102468122A (zh) * 2010-11-01 2012-05-23 中芯国际集成电路制造(上海)有限公司 半导体器件失效分析样品制作方法及分析方法
CN102565680B (zh) * 2010-12-27 2016-09-14 无锡华润上华半导体有限公司 半导体器件的失效分析方法
US20120288966A1 (en) * 2011-05-12 2012-11-15 Ming-Teng Hsieh Method for decapsulating integrated circuit package
CN103824756B (zh) * 2012-11-16 2017-12-05 中芯国际集成电路制造(上海)有限公司 去除封装结构的方法
JP5846153B2 (ja) * 2013-04-26 2016-01-20 トヨタ自動車株式会社 半導体装置および半導体装置の研磨方法
CN105070649B (zh) * 2015-08-12 2018-08-14 上海华力微电子有限公司 一种引线键合去除的方法
CN105206546B (zh) * 2015-09-10 2017-11-21 宜特(上海)检测技术有限公司 覆晶芯片失效分析方法及电性定位中检测样品的制备方法
CN105301475A (zh) * 2015-09-22 2016-02-03 上海华虹宏力半导体制造有限公司 封装芯片背面失效定点的方法
CN106920759B (zh) * 2015-12-28 2020-04-24 上海新微技术研发中心有限公司 一种芯片保护壳去除方法及装置
CN109188212B (zh) * 2018-08-09 2020-09-11 安徽干城电子科技有限公司 一种塑封微电子器件绝缘性测试设备
DE102018218673A1 (de) * 2018-10-31 2020-04-30 Zf Friedrichshafen Ag Sensoranordnung
RU199130U1 (ru) * 2020-03-16 2020-08-17 Акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" Маска для декорпусирования устройств микроэлектроники в полимерном корпусе
RU2738466C1 (ru) * 2020-09-25 2020-12-14 Закрытое акционерное общество "СуперОкс" (ЗАО "СуперОкс") Способ изготовления высокотемпературных сверхпроводниковых лент второго поколения
CN117080066B (zh) * 2023-10-13 2024-01-26 深圳基本半导体有限公司 一种碳化硅芯片表层的去层的方法

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JPS55163855A (en) * 1979-06-08 1980-12-20 Fujitsu Ltd Method of opening sealed electronic part sealed by epoxy resin
JPH02301144A (ja) * 1989-05-15 1990-12-13 Nec Corp 外郭体樹脂剥離方法

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JPS63184347A (ja) * 1987-01-27 1988-07-29 Matsushita Electric Works Ltd 半導体パツケ−ジの開封方法
JPH04184957A (ja) * 1990-11-20 1992-07-01 Nec Corp Ｉｃパッケージの開封方法

Patent Citations (2)

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JPS55163855A (en) * 1979-06-08 1980-12-20 Fujitsu Ltd Method of opening sealed electronic part sealed by epoxy resin
JPH02301144A (ja) * 1989-05-15 1990-12-13 Nec Corp 外郭体樹脂剥離方法

Also Published As

Publication number Publication date
MY113986A (en) 2002-07-31
JP2688178B2 (ja) 1997-12-08
KR0143951B1 (ko) 1998-08-17
CN1108808A (zh) 1995-09-20
TW282568B (enExample) 1996-08-01
US5424254A (en) 1995-06-13
EP0668611A1 (en) 1995-08-23
JPH07240429A (ja) 1995-09-12

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