CN103975429B - 导热性片以及导热性片的制造方法 - Google Patents

导热性片以及导热性片的制造方法 Download PDF

Info

Publication number
CN103975429B
CN103975429B CN201280061296.7A CN201280061296A CN103975429B CN 103975429 B CN103975429 B CN 103975429B CN 201280061296 A CN201280061296 A CN 201280061296A CN 103975429 B CN103975429 B CN 103975429B
Authority
CN
China
Prior art keywords
thermally conductive
conductive sheet
filler
composition
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280061296.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103975429A (zh
Inventor
荒卷庆辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to CN201810153894.6A priority Critical patent/CN108384248B/zh
Publication of CN103975429A publication Critical patent/CN103975429A/zh
Application granted granted Critical
Publication of CN103975429B publication Critical patent/CN103975429B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN201280061296.7A 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法 Active CN103975429B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810153894.6A CN108384248B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-278788 2011-12-20
JP2011278788A JP6034562B2 (ja) 2011-12-20 2011-12-20 熱伝導性シート及び熱伝導性シートの製造方法
PCT/JP2012/082817 WO2013094613A1 (ja) 2011-12-20 2012-12-18 熱伝導性シート及び熱伝導性シートの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201810153894.6A Division CN108384248B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法

Publications (2)

Publication Number Publication Date
CN103975429A CN103975429A (zh) 2014-08-06
CN103975429B true CN103975429B (zh) 2018-03-30

Family

ID=48668500

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201280061296.7A Active CN103975429B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法
CN201810153894.6A Active CN108384248B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810153894.6A Active CN108384248B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法

Country Status (4)

Country Link
JP (1) JP6034562B2 (https=)
CN (2) CN103975429B (https=)
TW (1) TWI611013B (https=)
WO (1) WO2013094613A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6069112B2 (ja) * 2013-06-19 2017-02-01 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP2015073067A (ja) * 2013-09-06 2015-04-16 バンドー化学株式会社 熱伝導性樹脂成形品
KR20170091508A (ko) * 2014-12-02 2017-08-09 세키스이가가쿠 고교가부시키가이샤 열전도 시트 및 그의 제조 방법
JP6178389B2 (ja) * 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
CN106810876B (zh) * 2015-12-02 2020-11-10 中国科学院金属研究所 一种填料定向排布的复合材料及其制备方法
KR102659683B1 (ko) * 2016-02-01 2024-04-19 반도 카가쿠 가부시키가이샤 열전도성 수지 성형품
CN107022196A (zh) * 2016-02-02 2017-08-08 中兴通讯股份有限公司 导热材料、其制备方法及导热件
EP3575366A4 (en) * 2017-01-19 2020-10-28 University of Fukui MATERIAL WITH HIGH THERMAL CONDUCTIVITY AND ITS PRODUCTION PROCESS
US20210070952A1 (en) * 2018-11-16 2021-03-11 Fuji Polymer Industries Co., Ltd. Heat-conductive sheet and method for manufacturing same
EP3753993B1 (en) 2018-12-25 2024-10-16 Fuji Polymer Industries Co., Ltd. Heat-conductive composition and heat-conductive sheet employing same
CN112041411B (zh) * 2018-12-25 2022-04-01 富士高分子工业株式会社 导热性组合物及使用了其的导热性片材
CN110625877B (zh) * 2019-09-05 2021-06-08 上海阿莱德实业股份有限公司 一种导热界面材料的制备方法
JP7458775B2 (ja) * 2019-12-24 2024-04-01 デクセリアルズ株式会社 熱伝導性成形体の製造方法
JP6884456B1 (ja) 2020-02-21 2021-06-09 積水ポリマテック株式会社 熱伝導性シート及びその製造方法
CN112712944B (zh) * 2020-12-24 2022-04-08 武汉肯达科讯科技有限公司 一种高导热绝缘垫片及其制备方法
CN115141460B (zh) * 2021-03-30 2023-09-01 太阳油墨（苏州）有限公司 热固性树脂组合物、固化物以及电子部件
CN114106564B (zh) * 2021-11-17 2023-08-29 深圳市鸿富诚新材料股份有限公司 一种取向型导热凝胶、制备方法及其应用
JP7752544B2 (ja) * 2022-02-18 2025-10-10 信越化学工業株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP2023179996A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法
JP2023179989A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法
JP2023179992A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345040A (ja) * 1999-06-02 2000-12-12 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体の製造方法
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
CN101087511A (zh) * 2006-06-08 2007-12-12 保力马科技株式会社 导热性成形体及其制造方法
WO2008085999A1 (en) * 2007-01-10 2008-07-17 Momentive Performance Materials Inc. Thermal interface materials and methods for making thereof
CN101275035A (zh) * 2007-03-27 2008-10-01 丰田合成株式会社 低导电性高散热性高分子材料及成型体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006124206A (ja) * 2004-10-27 2006-05-18 Sumitomo Electric Ind Ltd 窒化アルミニウム脱脂中間体及び焼結体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345040A (ja) * 1999-06-02 2000-12-12 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体の製造方法
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
CN101087511A (zh) * 2006-06-08 2007-12-12 保力马科技株式会社 导热性成形体及其制造方法
WO2008085999A1 (en) * 2007-01-10 2008-07-17 Momentive Performance Materials Inc. Thermal interface materials and methods for making thereof
CN101275035A (zh) * 2007-03-27 2008-10-01 丰田合成株式会社 低导电性高散热性高分子材料及成型体

Also Published As

Publication number Publication date
JP6034562B2 (ja) 2016-11-30
CN108384248B (zh) 2021-10-19
CN103975429A (zh) 2014-08-06
TWI611013B (zh) 2018-01-11
JP2013131563A (ja) 2013-07-04
CN108384248A (zh) 2018-08-10
TW201341519A (zh) 2013-10-16
WO2013094613A1 (ja) 2013-06-27

Similar Documents

Publication Publication Date Title
CN103975429B (zh) 导热性片以及导热性片的制造方法
TWI617449B (zh) 導熱片及導熱片之製造方法
KR101681861B1 (ko) 열전도 시트의 제조 방법, 열전도 시트, 및 방열 부재
JP6178389B2 (ja) 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
CN103764733B (zh) 导热性片材的制备方法
US9437521B2 (en) Thermally conductive sheet
CN110739223B (zh) 导热性片的制造方法
TWI658550B (zh) 熱傳導片之製造方法、熱傳導片、及散熱構件
CN114600567B (zh) 散热片及其制备方法
US20220289932A1 (en) Thermally conductive sheet and method for producing same
CN107043538A (zh) 导热性片材
WO2016104169A1 (ja) 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
JP2013131564A (ja) 熱伝導性シート、この熱伝導性シートを用いた半導体装置及び半導体装置の製造方法
JP2013131562A (ja) 熱伝導性シートの製造方法
KR101619631B1 (ko) 고성능 열전달 패드의 제조방법
KR101611513B1 (ko) 탄소계 충진재가 첨가된 열전도 테이프의 제조 방법 및 그에 의해 제조된 열전도 테이프

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Maple County, Japan

Patentee after: DEXERIALS Corp.

Country or region after: Japan

Address before: Tokyo, Japan

Patentee before: DEXERIALS Corp.

Country or region before: Japan

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20251010

Address after: Osaka

Patentee after: SEKISUI CHEMICAL Co.,Ltd.

Country or region after: Japan

Address before: Maple County, Japan

Patentee before: DEXERIALS Corp.

Country or region before: Japan