CN103975429B - The manufacture method of thermal conductivity piece and thermal conductivity piece - Google Patents
The manufacture method of thermal conductivity piece and thermal conductivity piece Download PDFInfo
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- CN103975429B CN103975429B CN201280061296.7A CN201280061296A CN103975429B CN 103975429 B CN103975429 B CN 103975429B CN 201280061296 A CN201280061296 A CN 201280061296A CN 103975429 B CN103975429 B CN 103975429B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
The present invention provides the good thermal conductivity piece of thermal conductivity of thickness direction.Thermal conductivity piece contains heat conductivity composition, the heat conductivity composition contains organic siliconresin, conducting filler and the packing material for making conducting filler be arranged along prescribed direction, thickness direction orientation of the conducting filler along thermal conductivity piece, at least contains aluminium nitride as packing material." JIS Z 8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", the brightness L* represented using " L* " value is more than 32.5 when determining the surface of thermal conductivity piece.
Description
Technical field
The present invention relates to promote the thermal conductivity piece of radiating and the manufacture methods of thermal conductivity piece such as heat generation electronic unit.
The application using Japanese patent application No. Patent 2011-278788 filed in 20 days December in 2011 of Japan as
Basic claims priority, by referring to these applications are cited in the application.
Background technology
Along with the further high performance of electronic instrument, the densification of semiconductor element, high attachmentization are developed.
Accompany with this, further expeditiously radiating turns into critically important one to the heat that the electronic unit for forming electronic instrument is generated heat
Ring.For high efficiency heat radiation, semiconductor is installed on the heat abstractors such as heat emission fan, heat sink (heat sink) via thermal conductivity piece
In.Thermal conductivity piece, which widely uses, to be disperseed packing materials such as inorganic fillers and is contained in the piece of gained in organosilicon.Dissipated to such
Hot component requires the further raising of thermal conductivity, generally for the purpose of high-termal conductivity, is matched with by raising inorganic in matrix
The filling rate of filler is dealt with.But if improving the filling rate of inorganic filler, flexibility is damaged, or inorganic filler
Filling rate height causes powder falling occurs, and therefore, the filling rate for improving inorganic filler is limited.
Inorganic filler is such as can enumerate aluminum oxide, aluminium nitride, aluminium hydroxide., can also be by nitrogen for the purpose of high thermal conductivity
Change flake shaped particle, the carbon fibers such as boron, graphite etc. to be filled in matrix.This is the thermal conductivity according to possessed by flake shaped particle etc.
Anisotropy and set.Such as known carbon fiber has about 600-1200W/mK thermal conductivity in machine direction.Boron nitride exists
Face direction with about 110W/mK, in thermal conductivity of the direction vertical with face direction with about 2W/mK or so, there is anisotropy.
If it is generally known that increasing thermal conductivity piece the loading of conducting filler, thermal conductivity improves.It is but fibrous
Conducting filler compared with ball filler, loading can not be increased.Therefore individually fibrous conducting filler can not obtain
High thermal conductivity.Here, by the face direction of the conducting filler for making threadiness and it is used as the thermal conductivity piece of direction of heat transfer
Thickness direction is identical, i.e. by being orientated thickness direction of the conducting filler of threadiness along thermal conductivity piece, can make thermal conductivity
Improve tremendously.
Heat conductivity composition of the coating containing carbon fiber has been recorded in patent document 1 and has applied magnetic field and makes carbon fiber orientation
Method.But must have mobility during carbon fiber orientation, therefore in the method described in patent document 1, heat conduction can not be made
The loading of property filler increases.For this it is desirable to obtain conducting filler to be orientated along thermal conductivity piece thickness direction, thickness side
To the good thermal conductivity piece of thermal conductivity.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2006-335957 publications.
The content of the invention
The invention problem to be solved
The present invention proposes, the good thermal conductivity piece of the thermal conductivity its object is to provide thickness direction for the above situation
And the manufacture method of thermal conductivity piece.
Solves the scheme of problem
Present inventor has performed in-depth study, as a result finds：" JIS Z when determining the surface of thermal conductivity piece
8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", have between the brightness L* and thermal conductivity that are represented with " L* " value
There is height correlation relation, so as to complete the present invention.
The present invention relates to a kind of thermal conductivity piece containing heat conductivity composition, the heat conductivity composition contains curability tree
Oil/fat composition and make the packing material that conducting filler arranges along prescribed direction, wherein, conducting filler is along thermal conductivity piece
Thickness direction is orientated, and at least contains aluminium nitride as packing material, " the JIS Z 8729 " when determining the surface of thermal conductivity piece
" in the L*a*b* color specification systems described in JIS Z 8730 ", the brightness L* represented using " L* " value is more than 32.5.
The manufacture method of the thermal conductivity piece of the present invention has following processes：Heat conductivity composition production process, wherein, make
Heat conductivity composition, the heat conductivity composition contain hardening resin composition, conducting filler and make conducting filler along rule
Determine the packing material of direction arrangement；Orientation procedure, wherein, the thermal conductivity made in heat conductivity composition production process is combined
Thing is formed as column, while makes length direction orientation of the conducting filler along column；Cut off operation, wherein, cut by ultrasonic wave
Off line, the heat conductivity composition of column is cut into defined size along with the direction that length direction intersects vertically, led
Hot；In thermal conductivity piece, thickness direction orientation of the conducting filler along thermal conductivity piece, at least contain aluminium nitride as filling
Material, " JIS Z 8729 " and " the L*a*b* table color modes described in JIS Z 8730 " when determining the surface of thermal conductivity piece
In, the brightness L* represented using " L* " value is more than 32.5.
The present invention thermal conductivity evaluation method be：" JIS Z 8729 " and " JIS Z when determining the surface of thermal conductivity piece
In L*a*b* color specification systems described in 8730 ", the brightness L* represented with " L* " value is used, evaluates the thermal conductivity of thermal conductivity piece, institute
State thermal conductivity piece and contain heat conductivity composition, the heat conductivity composition contain hardening resin composition, conducting filler and
The packing material for making conducting filler be arranged along prescribed direction；In thermal conductivity piece, thickness of the conducting filler along thermal conductivity piece
Direction is orientated, and at least contains aluminium nitride as packing material.
Invention effect
According to the present invention, by least containing aluminium nitride in thermal conductivity piece, when determining the surface of thermal conductivity piece
" JIS Z 8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", the brightness L* for making to represent using " L* " value is 32.5
More than, conducting filler can be orientated along the thickness direction of thermal conductivity piece, can make the thermal conductivity of the thickness direction of thermal conductivity piece
Well.
Brief description of the drawings
[Fig. 1] Fig. 1 is the flow chart for illustrating an example of the manufacture method of the thermal conductivity piece of the present invention.
[Fig. 2] Fig. 2 is the ultrasonic wave for representing to use in the cut off operation in the manufacture method of the thermal conductivity piece of the present invention
The outside drawing of one example of cutting machine.
[Fig. 3] Fig. 3 is the outside drawing for an example for representing slicing device.
[Fig. 4] Fig. 4 is for illustrating an example in the alignment process of the manufacture method of other thermal conductivity pieces of the present invention
The flow chart of son.
[Fig. 5] Fig. 5 is interim molding procedure, the alignment process for illustrating the manufacture method of the thermal conductivity piece of the present invention
With the schematic diagram of an example of formal molding procedure.
[Fig. 6] Fig. 6 is the lamilate obtained in the alignment process in the manufacture method for represent the thermal conductivity piece of the present invention
The oblique view of one example.
[Fig. 7] Fig. 7 (A) is the oblique view for representing to be not carried out an example of the formal formed body of pressurization, and Fig. 7 (B) is table
Show the oblique view of an example of the formal formed body after implementing pressurization.
Embodiment
Referring to the drawings, embodiment of the present invention (hereinafter referred to as the present embodiment) is carried out in the following order detailed
Describe in detail bright.
1. thermal conductivity piece
2. the manufacture method of thermal conductivity piece
3. the manufacture method of other thermal conductivity pieces
4. thermal conductivity evaluation method.
<1. thermal conductivity piece>
The thermal conductivity piece 1 of the present embodiment contains heat conductivity composition, and the heat conductivity composition contains curable resin group
Compound, conducting filler and the packing material for making conducting filler be arranged along prescribed direction, conducting filler is along thermal conductivity piece
Thickness direction orientation.In the thermal conductivity piece of the present embodiment, aluminium nitride is at least contained in thermal conductivity piece, determines thermal conductivity piece
Surface when " JIS Z 8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", the brightness that is represented with " L* " value
L* is more than 32.5.Brightness L* during surface by making measure thermal conductivity piece is more than 32.5, makes conducting filler along heat conduction
Property piece thickness direction orientation, the thermal conductivity of the thickness direction of thermal conductivity piece can be made good.
(dependency relation between brightness L* and thermal conductivity in L*a*b* color specification systems)
The color of object is generally made up of 3 brightness (lightness), form and aspect (tone) and chroma (color saturation) key elements.
Accurate Determining and when showing these key elements, it is necessary to which they objectively can be quantized come the color specification system showed.It is such
Color specification system can for example enumerate L*a*b* color specification systems.L*a*b* color specification systems such as can by commercially available spectral photometric colour measuring meter analyzer hold
Change places and be measured.
L*a*b* color specification systems are such as " JIS Z 8729 " and " color specification system described in JIS Z 8730 ", wherein by each face
Color is configured at the spherical colour space to be indicated.In L*a*b* color specification systems, brightness is with the position table in the longitudinal axis (z-axis) direction
Show, form and aspect are represented with the positional representation of peripheral direction, chroma with the distance away from central shaft.
Represent that the position in the longitudinal axis (z-axis) direction of brightness is represented with L*.Brightness L* value is positive number, and the numeral is smaller then bright
Degree is lower, has the tendency of dimmed.Specifically, L* value is changing equivalent to the 0 of black between 100 equivalent to white.
By the spherical colour space the position of L*=50 along level cut-out sectional view along, the positive direction of x-axis is red side
To the positive direction of y-axis is yellow direction, and the negative direction of x-axis is green direction, and the negative direction of y-axis is blue direction.X-direction
Position by take -60 to+60 value a* represent.The position in y-axis direction is by taking the b* of -60 to+60 value to represent.This
Sample, a* and b* are the positive and negative numerals for representing colourity, more black closer to 0.Form and aspect and chroma are represented by their a* values and b* values.
In L*a*b* color specification systems, brightness L* then turns white for more than 32, less than 32 nigrescences of brightness L*.In L*a*b* table colors
In system, a* is less than -1 greening, and a* is more than -1 then rubescent.B* turns blue less than -1, and b* exceedes+1 jaundice.
Such as L*a*b* color specification systems are being used to make to containing carbon fiber as conducting filler, containing aluminium nitride and aluminum oxide
For the thermal conductivity piece of packing material cross-section determination degree of blackness when, brightness L* is more than 32.5 then to turn white.The reason is that brightness
L* is more than 32.5, then from the direction vertical with section during thermal conductivity piece, the area of the conducting filler in thermal conductivity piece
Reduce, white aluminum oxide and aluminium nitride expose the surface of thermal conductivity piece in addition.That is, brightness L* is more than 32.5, then means
Thickness direction orientation of the conducting filler along thermal conductivity piece.
On the other hand, use L*a*b* color specification systems to contain carbon fiber as conducting filler, containing aluminium nitride and oxygen
When changing cross-section determination degree of blackness of the aluminium as the thermal conductivity piece of packing material, less than 32.5 nigrescences of brightness L*.The reason is that
Brightness L* is less than 32.5, then from the direction vertical with section during thermal conductivity piece, the face of the conducting filler in thermal conductivity piece
Product increase, white aluminum oxide and aluminium nitride are difficult to expose from the surface of thermal conductivity piece in addition.That is, brightness L* is less than 32.5, then
Compared with meaning when brightness L* is more than 32.5, conducting filler is orientated not along the thickness direction of thermal conductivity piece.
Generally the high conducting filler of thermal conductivity is filled in thermal conductivity piece, then the thermal conductivity of thermal conductivity piece improves.It is former
Originally think, such as a large amount of filled bitumen base carbon fibres are as conducting filler, then thermal conductivity raising.Think, thermal conductivity piece table
The brightness L* in face reduces, then thermal conductivity improves.But high thermal conductivity is obtained, it is not merely to increase containing for conducting filler
Amount, but, the viscosity of heat conductivity composition when not only adding packing material to keep shape, and reduce extrusion, make heat conduction
Property filler along thermal conductivity piece thickness direction orientation and it is critically important.
Present inventor has performed in-depth study, as a result finds, " the JIS Z when determining the surface of thermal conductivity piece
8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", have between the brightness L* and thermal conductivity that are represented with " L* " value
There is the dependency relation of height.It has also been found that in order that thickness direction of the conducting filler along thermal conductivity piece is orientated, with conducting filler
Use level compare, the use level of the low aluminium nitride of thermal conductivity ratio conducting filler has a significant impact.That is, by making thermal conductivity piece
In at least contain aluminium nitride, and brightness L* when making the surface of measure thermal conductivity piece is more than 32.5, then makes conducting filler edge
The thickness direction orientation of thermal conductivity piece, can make the thermal conductivity of the thickness direction of thermal conductivity piece good.
(hardening resin composition)
Contained hardening resin composition is not particularly limited in thermal conductivity piece, such as organic silicon bonding can be used
Agent, acrylate class bonding agent etc..Organic silicon bonding agent can use the bonding of condensation cured type or addition curable
Agent.The content of hardening resin composition is not particularly limited, such as can be 25-45 volumes %.
(conducting filler)
Carbon fiber for example can be used in conducting filler, particularly preferably uses the carbon fiber of asphaltic base.The carbon fiber of asphaltic base
It is using pitch as main material, after each processing steps such as melt spinning, non-fusible and carbonization, with 2000-3000 DEG C or exceedes
3000 DEG C of high temperature is heat-treated and graphited carbon fiber.Material asphalt is divided into that optics is out of order, does not show each of deviation
To same sex pitch, and molecules align is formed into liquid crystal shape, the optically anisotropic anisotropic pitch (mesophase pitch) of display.
Mechanical property by carbon fiber of the carbon fiber than being manufactured by isotropic pitch of anisotropic pitch manufacture is excellent, electricity and leads
Hot raising.Therefore the graphitized carbon fibre of intermediate phase pitch-based is preferably used.
The average fiber length of conducting filler is preferably more than 100 μm.By growing the average fiber of conducting filler
Spend for more than 100 μm, then conducting filler easily arranges in the same direction, therefore can make thermal conductivity piece leading in thickness direction
It is hot more good.
Conducting filler content in thermal conductivity piece is preferably 15-25 volumes %.By making the content of conducting filler be 15
More than volume %, thermal resistance value can be more effectively reduced, therefore thermal conductivity piece can be made more good in the thermal conductivity of thickness direction
It is good., can by making the content of conducting filler be below 25 volume %, such as when extruding heat conductivity composition by extruder
To prevent that extrusion is difficult.
(packing material)
Packing material is according to the flow velocity difference with the conducting filler in heat conductivity composition, for making conducting filler
Easily arranged along prescribed direction, i.e. for making conducting filler easily along extrusion direction orientation.Packing material is additionally operable to as leading
Thermal conductive material works.
Aluminum oxide, aluminium nitride, boron nitride, zinc oxide, Si powder, metal dust for example can be used in packing material, at least makes
Use aluminium nitride.Aluminium nitride has nitrogen in its intramolecular, and the nitrogen hinders the reaction of hardening resin composition, suppresses thermal conductivity combination
The rise of thing viscosity.Therefore, by least using aluminium nitride to be used as packing material, with only using alumina particle as filling material
Compared during material, conducting filler is orientated along prescribed direction along the thickness direction of thermal conductivity piece.Therefore,
By at least using aluminium nitride to be used as packing material, thickness direction of the conducting filler more effectively along thermal conductivity piece can be made
Orientation, therefore, can make the thermal conductivity of thermal conductivity piece thickness direction good.
In addition, it can more effectively make to lead as packing material by using the different spherical particle of more than two kinds of particle diameter
Hot filler is orientated readily along the thickness direction of thermal conductivity piece.As a result, " the JIS Z when determining the surface of thermal conductivity piece
8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", can be more reliably with the brightness L* that " L* " value represents
More than 32.5.So, conducting filler edge is made as packing material by using the different spherical particle of more than two kinds of particle diameter
The thickness direction orientation of thermal conductivity piece, therefore thermal conductivity piece can be made more good in the thermal conductivity of thickness direction.
The content of packing material in thermal conductivity piece is preferably 40-50 volumes %.Additionally, it is preferred that aluminium nitride is in thermal conductivity piece
In contain more than 5.1 volume %.It is more than 5.1 volume % by making the content of the aluminium nitride in thermal conductivity piece, can effectively presses down
The viscosity rise of heat conductivity composition processed, more effectively make thickness direction orientation of the conducting filler along thermal conductivity piece.As a result,
Determine thermal conductivity piece surface when " JIS Z 8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", with
The brightness L* that " L* " value represents can be more effectively more than 32.5.So, by making the content of aluminium nitride in thermal conductivity piece be
More than 5.1 volume %, thermal conductivity piece can be made more good in the thermal conductivity of thickness direction.
The average grain diameter of packing material is preferably 0.5-5 μm.By making the average grain diameter of packing material be more than 0.5 μm 5 μ
Below m, can fully it be worked as thermally conductive materials, also, in heat conductivity composition, the orientation of conducting filler is difficult to beat
Disorderly, therefore thermal conductivity piece 1 can be made more good in the thermal conductivity of thickness direction.
In addition, as described above, during using the different spherical particle of more than two kinds of particle diameter as packing material, preferably make big
Spherical particle be 2-5 μm, small spherical particle be 0.3-2 μm, it is possible thereby to more effectively make conducting filler readily along
The thickness direction orientation of thermal conductivity piece.As a result, " JIS Z 8729 " and " the JIS Z when determining the surface of thermal conductivity piece
In L*a*b* color specification systems described in 8730 ", the brightness L* represented with " L* " value can be more reliably for more than 32.5.
It should be noted that in described above, with L*a*b* color specification system examples, but the selection mode of color specification system is not special
Limit, as long as the color specification system of L*a*b* color specification systems can be scaled.Such as can be XYZ color specification systems, L*C*h color specification systems.
<2. the manufacture method of thermal conductivity piece>
Above-mentioned thermal conductivity piece 1 can for example manufacture according to following manufacture method.The manufacture of the thermal conductivity piece of the present embodiment
Method is as shown in figure 1, have heat conductivity composition production process S1, orientation procedure S2 and cut off operation S3.
(heat conductivity composition production process S1)
In heat conductivity composition production process S1, above-mentioned heat conductivity composition is made.Cooperation in heat conductivity composition
For example preferred conducting filler of amount is 15-25 volume %, and packing material is 40-50 volumes %.In addition, in heat conductivity composition,
5.1 volume % above aluminium nitride are preferably comprised as packing material.
(orientation procedure S2)
In orientation procedure S2, the heat conductivity composition made in heat conductivity composition production process S1 is formed as into post
Shape, while make length direction orientation of the conducting filler along column.In orientation procedure S2, for example, by be expressed into be coated with it is de-
In the mould of mold materials, as shown in Fig. 2 the column thermal conductivity of length direction L orientation of the conducting filler along column can be formed
Composition 2.Or in orientation procedure S2, such as the heat conduction that will can also be made in heat conductivity composition production process S1
Property composition be coated on the polyester film for being coated with release materials, formed Fig. 2 shown in column heat conductivity composition 2.
(cut off operation S3)
In cut off operation S3, by ultrasonic cut-off machine, by the thermal conductivity group of the column formed in orientation procedure S2
Compound 2 cuts into defined size along with the direction that length direction intersects vertically, and obtains thermal conductivity piece 1.
In cut off operation S3, such as shown in Figures 2 and 3, by using ultrasonic cut-off machine 3, with ultrasonic cutting
Device 4 cuts the heat conductivity composition 2 of column along the length direction L of the heat conductivity composition 2 with the column direction V to intersect vertically
Piece, thermal conductivity piece 1 can be formed in the state of the orientation of conducting filler is kept.Therefore, the orientation of conducting filler is maintained at
Thickness direction, the good thermal conductivity piece 1 of thermal conduction characteristic can be obtained.
Ultrasonic cut-off machine 3 is as shown in figure 3, possess the workbench 5 for the heat conductivity composition 2 for placing column, and side applies
The ultrasonic cutter 4 that the heat conductivity composition 2 of the column on workbench 5 is cut into slices on ultrasonic activation side.
In workbench 5, silicon rubber 7 is equipped in metal mobile station 6.Mobile station 6 can be by travel mechanism 8 along rule
Determine direction movement, the bottom that the heat conductivity composition 2 of column is sent to ultrasonic cutter 4 successively is operated.Silicon rubber 7 has
There is the thickness for the point of a knife for being enough to bear ultrasonic cutter 4.In workbench 5, the thermal conductivity combination of column is placed on silicon rubber 7
Thing 2, coordinate the sectioning of ultrasonic cutter 4, mobile station 6 is moved to prescribed direction, by the heat conductivity composition 2 of column
The bottom of ultrasonic cutter 4 is delivered to successively.
Ultrasonic cutter 4 has：Knife 9 that the heat conductivity composition 2 of column is cut into slices, give ultrasonic wave to knife 9
The ultrasonic wave Fa Zhen mechanisms 10 of vibration, the elevating mechanism 11 for making the progress descending operation of knife 9.
Knife 9 is point of a knife towards workbench 5, carries out descending operation by elevating mechanism 11, thus will be positioned on workbench 5
The heat conductivity composition 2 of column cut into slices.The size of knife 9, material are according to size, the group of the heat conductivity composition 2 of column
Determined into waiting.Such as knife 9 is formed by the steel of wide 40mm, thickness 1.5mm, 10 ° of point of a knife angle.
Slice direction of the ultrasonic wave Fa Zhen mechanisms 10 along the heat conductivity composition 2 of column gives ultrasonic activation to knife 9,
Such as transmission frequency is 20.5kHz, adjustable amplitude section is 50 μm, 60 μm, 70 μm of this 3 stages.
Such ultrasonic cut-off machine 3 passes through the heat conduction when giving ultrasonic activation to ultrasonic cutter 4 to column
Property composition 2 is cut into slices, and the orientation of the conducting filler of thermally conductive sheet 1 can be made to be maintained at the thickness direction of thermal conductivity piece 1.
While ultrasonic activation is given by ultrasonic cut-off machine 3 while the thermal conductivity piece 1 cut into slices, super with not giving
Acoustic vibration and the thermal conductivity piece cut into slices are compared, and thermal resistance are suppressed to relatively low.The reason is that the edge of ultrasonic cut-off machine 3
Slice direction and give ultrasonic activation to ultrasonic cutter 4, therefore interface resistance is low, along the thickness side of thermal conductivity piece 1
It is difficult to overturn because of knife 9 to the conducting filler of orientation.And in the thermal conductivity piece do not given ultrasonic activation and cut into slices,
Because the frictional resistance of knife makes the orientation of conducting filler chaotic, reduce and be exposed to section, thus thermal resistance raises.Therefore, pass through
Using ultrasonic cut-off machine 3, the excellent thermal conductivity piece 1 of thermal conduction characteristic can be obtained.
According to the preparation method of thermal conductivity piece as described above, thermal conductivity piece 1 can be obtained, wherein, conducting filler edge
The thickness direction orientation of thermal conductivity piece 1, " JIS Z 8729 " and " JIS Z 8730 " when determining the surface of thermal conductivity piece 1
In described L*a*b* table color modes, the brightness L* represented using " L* " value is more than 32.5.
<3. the manufacture method of other thermal conductivity pieces>
Thermal conductivity piece 1 can manufacture according to manufacture method as described below.That is, as shown in figure 4, in above-mentioned thermal conductivity piece
Manufacture method orientation procedure S2 in, can have interim molding procedure S21, alignment process S22 and formal molding procedure
S23.According to the manufacture method of such thermal conductivity piece, thermal conductivity piece 1 can be more reliably obtained, wherein, in measure thermal conductivity
" JIS Z 8729 " and " represent bright in the L*a*b* color specification systems described in JIS Z 8730 " with " L* " value during the surface of piece 1
It is more than 32.5 to spend L*.I.e., it is possible to more reliably make the conducting filler in thermal conductivity piece 1 arrange in the same direction, can make
Thermal conductivity piece 1 is more good in the thermal conductivity of thickness direction.It should be noted that in the following description, for above-mentioned thermal conductivity
Description is omitted by composition production process S1.
(interim molding procedure S21)
In interim molding procedure S21, as shown in Fig. 5 (A), led what is made in heat conductivity composition production process S1
Hot composition 12 is extruded with extruder 13, is shaped to facing for the elongate column that wherein conducting filler is orientated along extrusion direction
When formed body 14 (hereinafter referred to as interim formed body 14).
Extruder 13 is configured to the cartridge type of elongate for example as shown in Fig. 5 (A), preferably discharges heat conductivity composition 12 1
The opening portion 12B of side bore W2 reduces diameter compared with body 12A internal diameter W1.In extruder 13, body 12A's is interior
Footpath W1 is to reduce a diameter of coniform, opening portion 12B bore W2 and body from the assigned position of length direction to extrusion direction
Portion 12A internal diameter W1, which is compared, can reduce diameter.Extruded, extruded by extruder 13 as heat conductivity composition 12 is used
In machine 13, make heat conductivity composition 12 towards the part of the diminution diameter compared with body 12A internal diameter W1 by thus, leading
Hot filler is readily along extrusion direction.It is possible thereby to more reliably make length side of the conducting filler along interim formed body 14
To orientation.
Such as the conducting filler content in heat conductivity composition 12 is when being 15-25 volume %, the preferred opening of extruder 13
Portion 12B bore W2 is 1.5-9.5mm or so.In this case, by making opening portion 12B bore W2 be more than 1.5mm,
When heat conductivity composition 12 is extruded with extruder 13, it can prevent that extrusion is difficult.By making opening portion 12B bore W2 be
Below 9.5mm, the orientation of conducting filler are difficult to confusion, thus can make thermal conductivity piece 1 thickness direction thermal conductivity more
Well.
In extruder 13, opening portion 12B cross sectional shape can for example be set as round shape, triangular shape, rectangular-shaped, square
Shape, preferably it is set as rectangular-shaped or square shape.By making opening portion 12B cross sectional shape be rectangular-shaped or square shape, temporarily
Formed body 14 can be prism-shaped.Therefore, in alignment process S22, multiple interim formed bodys 14 are made vertical with length direction
Direction on arranged with contiguous fashion, and multiple interim formed bodys 14 of arrangement are disposed in and orientation is approximately perpendicular intersects
Direction, be difficult to produce gap when obtaining lamilate 14A (hereinafter referred to as lamilate 14A), between lamilate 14A.Thus, it is laminated
It is difficult in body 14A containing bubble, therefore in formal molding procedure S23, the more excellent formal shaping of anti-flammability can be obtained
Body 16.
Interim formed body 14 is conducting filler is orientated along extrusion direction by extruder 13, is the shape of elongate column
Shape, for example, it is elongated quadrangular shape, elongated triangular prism shape, elongated cylindric.
(alignment process S22)
In alignment process S22, such as shown in Fig. 5 (B), Fig. 5 (C), Fig. 6, it will be molded in interim molding procedure S21
Multiple interim formed bodys 14 arranged on the direction to be intersected vertically with length direction with contiguous fashion, obtain lamilate 14A.Example
Such as in alignment process S22, interim formed body 14 is arranged in defined frame 15, interim formed body 14 is arranged to cuboid
Shape or cubic, obtain lamilate 14A.In formal molding procedure S23, when being molded formal formed body 16, frame 15 is made
Fixing device for fixed lamilate 14A uses, and prevents lamilate 14A from moderate finite deformation occurs.Frame 15 is for example formed by metal.
(formal molding procedure S23)
In formal molding procedure S23, such as shown in Fig. 5 (D), pass through the lamilate for making to obtain in alignment process S22
14A solidifies, and as shown in Fig. 5 (E) and Fig. 7 (A), (B), is shaped to wherein composition lamilate 14A interim formed body 14 each other one
The formal formed body 16 of body.The method for solidifying lamilate 14A can for example be enumerated：Lamilate 14A is entered by heater
The method of row heating, or the method for carrying out heating pressurization to lamilate 14A by heating pressue device.Using acrylate tree
When fat is as the hardening resin composition for forming heat conductivity composition 12, for example, it is different by containing in heat conductivity composition 12
Cyanate esters, lamilate 14A can be made to solidify at normal temperatures.
The method for solidifying these lamilates 14A preferably carries out heating pressurization by heating pressue device to lamilate 14A
Method, i.e. when solidifying lamilate 14A, hung down in the length direction of multiple interim formed bodys 14 with forming lamilate 14A
Directly (press) is pressurizeed on intersecting direction (vertical direction).So, can be positively by bubble by being pressurizeed to lamilate 14A
Excluded from lamilate 14A, therefore in formal molding procedure S23, the more excellent formal formed body of anti-flammability can be obtained
16。
In cut off operation S4, by ultrasonic cut-off machine 3, the formal shaping that will be molded in formal molding procedure S23
The direction that body 16 intersects vertically along the length direction with interim formed body 14 cuts into defined size.In order to obtain thermal conductivity
Formal formed body 16 is sliced into each thermal conductivity piece 1 by piece 1, ultrasonic cut-off machine 3.Using ultrasonic cut-off machine 3, ultrasonic wave is used
Cutter 4, the direction of arrow that formal formed body 16 intersects vertically along the length direction with interim formed body 14 is cut into slices, thus
Thermal conductivity piece 1 can be formed in the state of the orientation of conducting filler is kept.Therefore the orientation that conducting filler can be obtained is protected
Hold in thickness direction, the good thermal conductivity piece 1 of thermal conduction characteristic.
<4. the evaluation method of color>
The evaluation method of the color of the present embodiment is：" JIS Z when determining the surface of above-mentioned thermal conductivity piece 1
8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", the brightness L* represented with " L* " value is used to evaluate heat conduction
The thermal conductivity of property piece 1.For example, when the brightness L* during surface of measure thermal conductivity piece 1 is more than 32.5, conducting filler is along leading
The thickness direction orientation of hot 1, therefore thermal conductivity piece 1 can be evaluated to be good in the thermal conductivity of thickness direction.Determine thermal conductivity
When brightness L* during the surface of piece 1 is less than 32.5, conducting filler is orientated not along the thickness direction of thermal conductivity piece 1, therefore is led
Hot 1 thermal conductivity in thickness direction can be evaluated as bad.
Embodiment
Embodiments of the invention are illustrated below.It should be noted that the present invention is not limited to these embodiments.This reality
Apply in example, for the thermal conductivity piece obtained by embodiment 1-6 and comparative example 1-3, orientation, thermal conductivity to its asphalt base carbon fiber
Evaluated with outward appearance.
(embodiment 1)
In embodiment 1,24 3 μm of volume % average grain diameters are disperseed in the addition reaction-type liquid organic siliconresin of two component
Alumina particle (packing material) (Deuki Kagaku Kogyo Co., Ltd manufacture, ProductName：DAW-03), 18.3 volume % are averaged
The aluminum nitride particle (manufacture of Co., Ltd. Tokuyama (ト Network ヤ マ) company) that 1 μm of particle diameter, 24.1 volume % average major axis lengths
150 μm, asphalt base carbon fiber (conducting filler) (Teijin Ltd's manufacture, the trade name of 8 μm of average minor axis length：ラヒ
ー マ R-A301), prepare organosilicon resin composition (heat conductivity composition).Two component addition reaction-type liquid organic siliconresin
It is (with H-Si by 16.8 volume % organosilicon A liquid (organopolysiloxane with vinyl) and 18.8 volume % organosilicon B liquid
The organopolysiloxane of base) mix.Gained organosilicon resin composition extrusion is being coated with the mould of release materials
In (20mm × 20mm), organosilicon formed body is shaped to.Gained organosilicon formed body is solidified 1 hour with 100 DEG C in an oven,
Organosilicon solidfied material is made.Gained organosilicon solidfied material is cut into thickness 2.0mm with ultrasonic cutter, obtains thickness
2.0mm thermal conductivity piece.The chip rate of ultrasonic cutter is 50mm per second.Give the ultrasonic activation of ultrasonic cutter
It is：Send out vibration frequency 20.5kHz, 60 μm of amplitude.
(embodiment 2)
In example 2, the two component formed in 16.8 volume % organosilicon A liquid of mixing and 18.8 volume % organosilicon B liquid
Disperse alumina particle (the electrochemically industrial strain of 11.7 3 μm of volume % average grain diameters in addition reaction-type liquid organic siliconresin
Formula commercial firm manufactures, ProductName：DAW-03), (Co., Ltd. Tokuyama is public for the aluminum nitride particle of 31.2 1 μm of volume % average grain diameters
Department manufacture), 23.5 150 μm of volume % average major axis lengths, the asphalt base carbon fiber (Teijin Ltd of 8 μm of average minor axis length
Manufacture, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, in addition similarly to Example 1, is led
Hot.
(embodiment 3)
In embodiment 3, add in the two component for mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid form
Disperse alumina particle (the electrochemically industrial strain formula of 20.2 3 μm of volume % average grain diameters into response type liquid organic siliconresin
Commercial firm manufactures, ProductName：DAW-03), aluminum nitride particle (the Tokuyama companies of Co., Ltd. of 20.1 1 μm of volume % average grain diameters
Manufacture), 24.1 150 μm of volume % average major axis lengths, asphalt base carbon fiber (Teijin Ltd's system of 8 μm of average minor axis length
Make, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, in addition similarly to Example 1, obtains heat conduction
Property piece.
(embodiment 4)
In example 4, add in the two component for mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid form
Disperse alumina particle (the electrochemically industrial strain formula meeting of 28 3 μm of volume % average grain diameters into response type liquid organic siliconresin
Society manufactures, ProductName：DAW-03), aluminum nitride particle (Co., Ltd.'s Tokuyama company systems of 14.3 1 μm of volume % average grain diameters
Make), 20.1 150 μm of volume % average major axis lengths, asphalt base carbon fiber (Teijin Ltd's system of 8 μm of average minor axis length
Make, trade name：ラ ヒ ー マ R-A301), prepare organosilicon resin composition.Gained organosilicon resin composition is coated on
On the cloth polyester film of release materials (stacking coating), organosilicon formed body is manufactured.By gained organosilicon formed body in baking oven
In with 100 DEG C heat 1 hour, organosilicon solidfied material is made.Gained organosilicon solidfied material is cut into thickness with ultrasonic cutter
2.0mm is spent, obtains thickness 2.0mm thermal conductivity piece.The chip rate of ultrasonic cutter is 50mm per second.Ultrasonic wave is given to cut
The ultrasonic activation of cutter is：Send out vibration frequency 20.5kHz, 60 μm of amplitude.
(embodiment 5)
In embodiment 5, add in the two component for mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid form
Disperse alumina particle (the electrochemically industrial strain formula of 37.2 3 μm of volume % average grain diameters into response type liquid organic siliconresin
Commercial firm manufactures, ProductName：DAW-03), aluminum nitride particle (the Tokuyama companies of Co., Ltd. of 5.1 1 μm of volume % average grain diameters
Manufacture), 20.1 150 μm of volume % average major axis lengths, asphalt base carbon fiber (Teijin Ltd's system of 8 μm of average minor axis length
Make, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, in addition similarly to Example 1, obtains heat conduction
Property piece.
(embodiment 6)
In embodiment 6, add in the two component for mixing 17.1 volume % organosilicon A liquid, 17.1 volume % organosilicon B liquid form
Disperse aluminum nitride particle (Co., Ltd. Tokuyama of 42.6 1 μm of volume % average grain diameters into response type liquid organic siliconresin
Company manufacture), asphalt base carbon fiber (Supreme Being people's strain formula meeting of 23.2 150 μm of volume % average major axis lengths, 8 μm of average minor axis length
Society manufactures, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, in addition similarly to Example 1, is obtained
Thermal conductivity piece.
(comparative example 1)
In comparative example 1, in the two component addition for mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid form
Disperse alumina particle (the electrochemically industrial strain formula meeting of 42.3 3 μm of volume % average grain diameters in response type liquid organic siliconresin
Society manufactures, ProductName：DAW-03), 24.1 150 μm of volume % average major axis lengths, the pitch base carbon of 8 μm of average minor axis length are fine
(Teijin Ltd manufactures dimension, trade name：ラ ヒ ー マ R-A301), prepare organosilicon resin composition, in addition with reality
It is same to apply example 1, obtains thermal conductivity piece.
(comparative example 2)
In comparative example 2, in the two component addition for mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid form
Disperse alumina particle (the electrochemically industrial strain formula meeting of 41.3 3 μm of volume % average grain diameters in response type liquid organic siliconresin
Society manufactures, ProductName：DAW-03), 20.1 150 μm of volume % average major axis lengths, the pitch base carbon of 8 μm of average minor axis length are fine
(Teijin Ltd manufactures dimension, trade name：ラ ヒ ー マ R-A301), prepare organosilicon resin composition, in addition with reality
It is same to apply example 4, obtains thermal conductivity piece.
(comparative example 3)
In comparative example 3, in the two component addition reaction for mixing 18 volume % organosilicon A liquid, 18 volume % organosilicon B liquid form
Disperse alumina particle (Deuki Kagaku Kogyo Co., Ltd's system of 44.8 3 μm of volume % average grain diameters in type liquid organic siliconresin
Make, ProductName：DAW-03), 19.2 150 μm of volume % average major axis lengths, the asphalt base carbon fiber (Supreme Being of 8 μm of average minor axis length
People Co., Ltd. manufactures, trade name：ラ ヒ ー マ R-A301), prepare organosilicon resin composition, in addition with embodiment 1
Equally, thermal conductivity piece is obtained.
The summary sheets such as embodiment 1- embodiments 6, the condition of comparative example 1- comparative examples 3 are shown in Table 1.
[table 1]
(orientation on asphalt base carbon fiber)
The orientation of asphalt base carbon fiber observes the section of thermal conductivity piece and the black using L*a*b* color specification systems by SEM
Degree is determined to evaluate.
The section of thermal conductivity piece as obtained by observing in embodiment 1- embodiments 6 SEM, as a result finds asphalt base carbon fiber
The thickness direction of thermal conductivity piece is orientated.The particularly thermal conductivity of embodiment 1- embodiments 3, embodiment 5 and the gained of embodiment 6
Piece, compared with the thermal conductivity piece of the gained of embodiment 4, asphalt base carbon fiber is preferably orientated along the thickness direction of thermal conductivity piece.
It is due in embodiment 1- embodiments 3, embodiment 5 and embodiment 6 to think its reason, is expressed into the mould for being coated with release materials
In tool and it is shaped to organosilicon formed body.
On the other hand, the section of the thermal conductivity piece as obtained by SEC observes comparative example 1- comparative examples 3, as a result finds, with reality
The thermal conductivity piece for applying the gained of a 1- embodiment 6 compares, and asphalt base carbon fiber is not orientated to the thickness direction of thermal conductivity piece.
For the section of thermal conductivity piece, also degree of blackness is determined using L*a*b* color specification systems.Use with " the institutes of JIS Z 8729 "
The color showing method that defined L*a*b* color specification systems represent is as degree of blackness index.Using the degree of blackness of L*a*b* color specification systems
Measure uses spectrophotometer (ProductName：CM-700d, Konica Minolta Sensing Co., Ltds manufacture).
The thermal conductivity piece of gained in embodiment 1- embodiments 6, " the JIS Z 8729 " when determining the surface of thermal conductivity piece
In described L*a*b* color specification systems, the brightness L* represented using " L* " value is more than 32.5.And in the gained of comparative example 1- comparative examples 3
Thermal conductivity piece in, determine thermal conductivity piece surface when " in the L*a*b* color specification systems described in JIS Z 8729 ", with
The brightness L* that " L* " value represents is less than 32.5.By the result, it is believed that the thermal conductivity piece of the gained of embodiment 1- embodiments 6, compared with
The thermal conductivity piece of the gained of example 1- comparative examples 3 compares, and asphalt base carbon fiber is more effectively orientated along the thickness direction of thermal conductivity piece.
From these results, aluminium nitride, and the L*a* when determining the surface of thermal conductivity piece are contained in thermal conductivity piece
In b* color specification systems, the brightness L* represented using " L* " value is more than 32.5, thus, makes thickness of the asphalt base carbon fiber along thermal conductivity piece
Direction orientation is spent, thermal conductivity piece can be made good in the thermal conductivity of thickness direction.
(evaluation on thermal conductivity)
The thermal conductivity measurement result such as institute of table 1 of thermal conductivity piece obtained by embodiment 1- embodiments 6, comparative example 1- comparative examples 3
Show.The evaluation of thermal conductivity is carried out according to ASTM-D5470 assay method.
In the thermal conductivity piece of the gained of embodiment 1- embodiments 6, by thermal conductivity piece section integrally in terms of, thermal conductivity piece is in thickness side
To thermal conductivity be 22.3-33.1W/mK, it is known that the thermal conductivity of thickness direction is good.Think the reason is that embodiment 1- is real
In the thermal conductivity piece for applying the gained of example 6, in the L*a*b* color specification systems when determining the surface of thermal conductivity piece, represent bright with " L* " value
It is more than 32.5 to spend L*, therefore, thickness direction orientation of the asphalt base carbon fiber along thermal conductivity piece, can make thermal conductivity piece in thickness
The thermal conductivity in direction is good.
On the other hand, the thermal conductivity of the thermal conductivity piece of the gained of comparative example 1- comparative examples 3 is below 20.2W/mK, with embodiment
The thermal conductivity piece of the gained of 1- embodiments 6 compares, it is known that the thermal conductivity of thickness direction is bad, it is believed that the reason is that comparative example 1-
In the thermal conductivity piece of the gained of comparative example 3, aluminium nitride is not contained in thermal conductivity piece, in addition, being used when determining thermal conductivity piece surface
L*a*b* color specification systems in, the brightness L* represented with " L* " value is not up to more than 32.5.
(on ocular estimate)
The evaluation of fraction defective is, when being sliced into thermal conductivity piece by organosilicon solidfied material, is rolled up according to the surface of thermal conductivity piece
The number for entering the piece with through hole in bubble or thermal conductivity piece is carried out.Have in bubble-free and piece and whether there is through hole, lead by visual observation
The section of hot judges.
In the thermal conductivity piece of the gained of embodiment 1- embodiments 6, the surface of thermal conductivity piece is not involved in bubble, in thermal conductivity piece
In the absence of through hole, therefore fraction defective is less than 5%, relatively low.
And in the thermal conductivity piece of the gained of comparative example 1, surface is involved in bubble, through hole in piece in addition be present, therefore fraction defective is
28%, it is higher.This is regarded as due to not containing aluminium nitride, therefore the bad dispersibility of organosilicon resin composition in thermal conductivity piece.
The thermal conductivity piece of the gained of comparative example 2 is manufactured by being laminated coating, therefore compared with comparative example 1, the amount of bubble subtracts
It is few, in addition compared with comparative example 1, fraction defective can be reduced, but the orientation of asphalt base carbon fiber is chaotic, the deviation of thermal conductivity
Greatly.This is regarded as due to not containing aluminium nitride in thermal conductivity piece, and led by being laminated coating making organosilicon formed body
Cause.
In the thermal conductivity piece of the gained of comparative example 3, the surface of thermal conductivity piece is not involved in bubble, and is not present in thermal conductivity piece
Through hole, therefore fraction defective is less than 5%, it is relatively low.But compared with embodiment 1- embodiments 6, thermal conductivity is bad.This be considered due to
Aluminium nitride is not contained in the thermal conductivity piece of the gained of comparative example 3, and the use level of aluminum oxide is excessively caused.
Symbol description
1 thermal conductivity piece, 2 column heat conductivity compositions, 3 ultrasonic cut-off machines, 4 ultrasonic cutters, 5 workbench,
6 mobile stations, 7 silicon rubber, 8 travel mechanisms, 9 knives, 10 ultrasonic wave Fa Zhen mechanisms, 11 elevating mechanisms, the combination of 12 thermal conductivity
Thing, 13 extruders, 14 interim formed bodys, 14A lamilates, 15 frames, 16 formal formed bodys.
Claims (6)
1. a kind of thermal conductivity piece, the thermal conductivity piece contains heat conductivity composition, and the heat conductivity composition contains curable resin group
Compound, the conducting filler for carbon fiber and the packing material for making the conducting filler be arranged along prescribed direction, wherein,
Thickness direction orientation of the conducting filler along the thermal conductivity piece,
The packing material contains the different spherical aluminum nitride particles and alumina particle of particle diameter,
" JIS Z 8729 " and " JIS Z 8730 " are remembered when determining the surface vertical with thickness direction of the thermal conductivity piece
In the L*a*b* color specification systems of load, the brightness L* represented using " L* " value is more than 32.5.
2. the thermal conductivity piece of claim 1, wherein, the thermal conductivity piece contains the aluminium nitride more than 5.1 volume %.
3. the thermal conductivity piece of claim 1 or 2, wherein, the average fiber length of the conducting filler is more than 100 μm.
4. a kind of manufacture method of thermal conductivity piece, it has following processes：
Heat conductivity composition production process, wherein, heat conductivity composition is made, the heat conductivity composition contains curable resin group
Compound, the conducting filler for carbon fiber and the packing material for making the conducting filler be arranged along prescribed direction；
Orientation procedure, wherein, by extruding or being coated with the thermal conductivity group that will be made in the heat conductivity composition production process
Compound is formed as column, while makes length direction orientation of the conducting filler along the column；With
Cut off operation, wherein, by ultrasonic cut-off machine, by the heat conductivity composition of the column along vertical with length direction
Intersecting direction cuts into defined size, obtains thermal conductivity piece；
In the thermal conductivity piece, thickness direction orientation of the conducting filler along the thermal conductivity piece, the packing material
Containing the different spherical aluminum nitride particles and alumina particle of particle diameter, the vertical with thickness direction of the thermal conductivity piece is being determined
Surface when " JIS Z 8729 " and " in the L*a*b* table color modes described in JIS Z 8730 ", represent bright with " L* " value
It is more than 32.5 to spend L*.
5. the manufacture method of the thermal conductivity piece of claim 4, wherein,
The orientation procedure includes following processes：
Interim molding procedure, wherein, the heat conductivity composition made in the heat conductivity composition production process is extruded
Machine is extruded, and is shaped to the interim formed body of elongate column of the wherein described conducting filler along extrusion direction orientation；
Alignment process, wherein, multiple interim formed bodys are arranged with the direction that length direction intersects vertically with contiguous fashion, and
Multiple interim formed bodys of arrangement are disposed in and the substantially vertical direction intersected of the orientation, acquisition lamilate；With
Formal molding procedure, wherein, by solidifying the lamilate, it is shaped to wherein form multiple interim shapings of lamilate
The formal formed body that body is integrated with each other；
In the cut off operation, by ultrasonic cut-off machine, intersected vertically along the length direction with the formal formed body
Direction cuts into given size, obtains the thermal conductivity piece.
6. a kind of thermal conductivity evaluation method, wherein, " the JIS Z when determining the surface vertical with thickness direction of thermal conductivity piece
8729 " and " in the L*a*b* color specification systems described in JIS Z 8730 ", the brightness L represented with " L* " value is used, is led described in evaluation
The thermal conductivity of hot, wherein the thermal conductivity piece contains heat conductivity composition, the heat conductivity composition contains curable resin
Composition, conducting filler and the packing material for making the conducting filler be arranged along prescribed direction；
In the thermal conductivity piece, thickness direction orientation of the conducting filler along the thermal conductivity piece, at least contain aluminium nitride
As the packing material.
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| CN201810153894.6A CN108384248B (en) | 2011-12-20 | 2012-12-18 | Thermally conductive sheet and method for producing thermally conductive sheet |
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| JP2011278788A JP6034562B2 (en) | 2011-12-20 | 2011-12-20 | Thermally conductive sheet and method for producing the thermally conductive sheet |
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| PCT/JP2012/082817 WO2013094613A1 (en) | 2011-12-20 | 2012-12-18 | Thermally conductive sheet and method for manufacturing thermally conductive sheet |
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| JP6069112B2 (en) * | 2013-06-19 | 2017-02-01 | デクセリアルズ株式会社 | Thermally conductive sheet and method for producing the thermally conductive sheet |
| JP2015073067A (en) * | 2013-09-06 | 2015-04-16 | バンドー化学株式会社 | Thermally conductive resin molded product |
| JP6650412B2 (en) * | 2014-12-02 | 2020-02-19 | 積水化学工業株式会社 | Thermal conductive sheet and manufacturing method thereof |
| JP6178389B2 (en) * | 2014-12-25 | 2017-08-09 | デクセリアルズ株式会社 | Method for manufacturing thermal conductive sheet, thermal conductive sheet, and semiconductor device |
| CN106810876B (en) * | 2015-12-02 | 2020-11-10 | 中国科学院金属研究所 | Composite material with directionally arranged fillers and preparation method thereof |
| WO2017135237A1 (en) | 2016-02-01 | 2017-08-10 | バンドー化学株式会社 | Thermally conductive molded resin article |
| CN107022196A (en) * | 2016-02-02 | 2017-08-08 | 中兴通讯股份有限公司 | Heat Conduction Material, its preparation method and heat-conducting piece |
| US20190367719A1 (en) * | 2017-01-19 | 2019-12-05 | University Of Fukui | Material having high thermal conductivity and method for producing same |
| WO2020100482A1 (en) * | 2018-11-16 | 2020-05-22 | 富士高分子工業株式会社 | Heat-conductive sheet and method for manufacturing same |
| CN112041411B (en) * | 2018-12-25 | 2022-04-01 | 富士高分子工业株式会社 | Thermally conductive composition and thermally conductive sheet using same |
| KR102509813B1 (en) * | 2018-12-25 | 2023-03-14 | 후지고분시고오교오가부시끼가이샤 | Thermally conductive composition and thermally conductive sheet using the same |
| CN110625877B (en) * | 2019-09-05 | 2021-06-08 | 上海阿莱德实业股份有限公司 | Preparation method of heat-conducting interface material |
| CN114746486B (en) * | 2020-02-21 | 2023-11-07 | 积水保力马科技株式会社 | Thermally conductive sheet and method for producing same |
| CN112712944B (en) * | 2020-12-24 | 2022-04-08 | 武汉肯达科讯科技有限公司 | High-thermal-conductivity insulating gasket and preparation method thereof |
| CN115141460B (en) * | 2021-03-30 | 2023-09-01 | 太阳油墨（苏州）有限公司 | Thermosetting resin composition, cured product, and electronic component |
| CN114106564B (en) * | 2021-11-17 | 2023-08-29 | 深圳市鸿富诚新材料股份有限公司 | Oriented heat conduction gel, preparation method and application thereof |
| JP2023120623A (en) * | 2022-02-18 | 2023-08-30 | 信越化学工業株式会社 | Heat-conductive sheet and manufacturing method of heat-conductive sheet |
| JP2023179989A (en) * | 2022-06-08 | 2023-12-20 | デクセリアルズ株式会社 | Laminate and method for manufacturing the same |
| JP2023179996A (en) * | 2022-06-08 | 2023-12-20 | デクセリアルズ株式会社 | Laminate and method for manufacturing the same |
| JP2023179992A (en) * | 2022-06-08 | 2023-12-20 | デクセリアルズ株式会社 | Laminate and method for manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000345040A (en) * | 1999-06-02 | 2000-12-12 | Denki Kagaku Kogyo Kk | Manufacture of heat-conductive silicone molding |
| CN101087511A (en) * | 2006-06-08 | 2007-12-12 | 保力马科技株式会社 | Thermally conductive forming body and method of manufacturing the same |
| CN101275035A (en) * | 2007-03-27 | 2008-10-01 | 丰田合成株式会社 | Low electric conductivity high heat radiation polymeric composition and molded body |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294676A (en) * | 2000-04-13 | 2001-10-23 | Jsr Corp | Heat-conductive sheet, method for producing heat- conductive sheet and radiating structure using heat- conductive sheet |
| JP2006124206A (en) * | 2004-10-27 | 2006-05-18 | Sumitomo Electric Ind Ltd | Degreased intermediate for aluminum nitride and sintered compact |
| WO2008085999A1 (en) * | 2007-01-10 | 2008-07-17 | Momentive Performance Materials Inc. | Thermal interface materials and methods for making thereof |
-
2011
- 2011-12-20 JP JP2011278788A patent/JP6034562B2/en active Active
-
2012
- 2012-12-18 CN CN201280061296.7A patent/CN103975429B/en active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000345040A (en) * | 1999-06-02 | 2000-12-12 | Denki Kagaku Kogyo Kk | Manufacture of heat-conductive silicone molding |
| CN101087511A (en) * | 2006-06-08 | 2007-12-12 | 保力马科技株式会社 | Thermally conductive forming body and method of manufacturing the same |
| CN101275035A (en) * | 2007-03-27 | 2008-10-01 | 丰田合成株式会社 | Low electric conductivity high heat radiation polymeric composition and molded body |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013094613A1 (en) | 2013-06-27 |
| JP6034562B2 (en) | 2016-11-30 |
| TWI611013B (en) | 2018-01-11 |
| CN108384248A (en) | 2018-08-10 |
| JP2013131563A (en) | 2013-07-04 |
| TW201341519A (en) | 2013-10-16 |
| CN108384248B (en) | 2021-10-19 |
| CN103975429A (en) | 2014-08-06 |
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