CN107022196A - Heat Conduction Material, its preparation method and heat-conducting piece - Google Patents
Heat Conduction Material, its preparation method and heat-conducting piece Download PDFInfo
- Publication number
- CN107022196A CN107022196A CN201610073005.6A CN201610073005A CN107022196A CN 107022196 A CN107022196 A CN 107022196A CN 201610073005 A CN201610073005 A CN 201610073005A CN 107022196 A CN107022196 A CN 107022196A
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- conduction material
- graphite
- thermally
- conductive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Abstract
The present invention relates to a kind of Heat Conduction Material, its preparation method and heat-conducting piece.A kind of Heat Conduction Material, by weight percentage, including following components：Organosilicon polymer 30%~60%；Graphite scrap 30%~70%；And graphene 0%~10%；Wherein, the thickness of the graphite scrap is 5 μm~50 μm, and the length of the graphite scrap is 30 μm~300 μm；Graphite scrap described in the Heat Conduction Material is in multi-layer oriented arrangement.Above-mentioned Heat Conduction Material thermal conductivity is higher.
Description
Technical field
The present invention relates to a kind of Heat Conduction Material, its preparation method and heat-conducting piece.
Background technology
Radiating is always the work of one primary study of electronics industry, and the actual work temperature of electronic component is
Influence one of key factor of its reliability.As electronic equipment develops towards miniaturization, high power consumption, its work(
Consumption density is stepped up.The caloric value of electronic equipment is also multiplied, and this is also proposed to the heat dispersion of system
Higher requirement.Heat-conducting interface material is the critical component of cooling system, be connection chip and radiator it
Between heat transfer bridge.The glue system of material based on heat-conducting interface material is generally comprised, and filling
Filler and dispersant in glue system etc..Selection, the selection of glue system and the selection of dispersing aid of wire feeding
The thermal conductivity of heat-conducting interface material can be had a huge impact.
Existing heat-conducting interface material its thermal conductivity mostly in below 5W/mK, existing powder system with
And under manufacturing condition, its thermal conductivity is difficult to have a distinct increment.
The content of the invention
Based on this, it is necessary to provide a kind of higher Heat Conduction Material of thermal conductivity, its preparation method and heat-conducting piece.
A kind of Heat Conduction Material, by weight percentage, including following components：
Organosilicon polymer 30%~70%；And
Graphite scrap 30%~70%；
Graphene 0%~10%；
Wherein, the thickness of the graphite scrap is 5 μm~50 μm, and the length of the graphite scrap is 30 μ
M~300 μm；Graphite scrap described in the Heat Conduction Material is in multi-layer oriented arrangement.
In one of the embodiments, the organosilicon polymer is selected from vinyl polysiloxane, benzene alkenyl and gathered
At least one of siloxanes, methylbenzene olefin(e) acid siloxanes and methylvinyl-polysiloxane.
In one of the embodiments, the graphene is in graphene sheet layer powder or graphene particles
It is at least one；The thickness of the graphene is 2nm~10nm, and length is 3 μm~50 μm.
In one of the embodiments, the Heat Conduction Material includes 10 layers~100 layers thermally-conductive sheet stacked gradually.
In one of the embodiments, the thickness of every layer of thermally-conductive sheet is 0.3mm~0.5mm.
The preparation method of Heat Conduction Material described in any of the above-described, comprises the following steps：
Each component in the Heat Conduction Material is mixed into the thermally-conductive sheet that mill obtains sheet；And
Thermally-conductive sheet described in multilayer is stacked gradually and obtains the Heat Conduction Material.
In one of the embodiments, each component by the Heat Conduction Material mixes mill and obtains sheet
Thermally-conductive sheet the step of be specially：
Organosilicon polymer and graphene are mixed into mill and obtain premix within 15 minutes~45 minutes；
Mill in graphite scrap addition premix is evenly distributed in premix to graphite scrap and obtains sheet
Thermally-conductive sheet.
In one of the embodiments, it is described also to wrap after the step of thermally-conductive sheet is stacked gradually described in multilayer
Include step：Thermally-conductive sheet described in the multilayer stacked gradually is subjected to transverse cuts.
In one of the embodiments, it is by the superposition pressure that thermally-conductive sheet described in multilayer is stacked gradually
34.475kPa~68.95kPa.
In one of the embodiments, the graphite scrap is crushed by graphite and obtained, and the graphite is selected from natural
At least one of graphite, expanded graphite and electrographite piece.
A kind of heat-conducting piece, the material of the heat-conducting piece is the Heat Conduction Material described in any of the above-described.
Above-mentioned Heat Conduction Material with the addition of graphite scrap in organosilicon polymer, and graphite scrap is used as filler, stone
Black fragment by graphite flake by crushing i.e. available, and the thermal conductivity of graphite scrap is also very high, graphite scrap
Thickness is 5 μm~50 μm, and the length of graphite scrap is 30 μm~300 μm, the thickness and length of graphite scrap
There is larger size difference between degree, the oriented alignment being preferably orientated can be reached in Heat Conduction Material, is entered
One step improves thermal conductivity；Graphite scrap is in multi-layer oriented arrangement in Heat Conduction Material, this multi-layer oriented arrangement
Structure can greatly improve the heat conductivility of Heat Conduction Material, leading in its plane after the multi-layer oriented arrangement of graphite scrap
Heating rate advantage is embodied, heat-conducting interface material thermal conductivity also significant increase.
Brief description of the drawings
Fig. 1 schemes for the SEM of the graphite scrap of embodiment 1；
The SEM of pre-compositions of the Fig. 2 to be obtained after the graphite scrap and organosilicon polymer mill of embodiment 1 schemes；
Fig. 3 schemes for the SEM of the Heat Conduction Material of embodiment 2；
Fig. 4 is the photo of heat-conducting piece prepared by embodiment 5.
Embodiment
Further detailed is made to Heat Conduction Material, its preparation method and heat-conducting piece mainly in combination with specific embodiment below
Explanation.
The Heat Conduction Material of one embodiment, by weight percentage, including following components：
Organosilicon polymer 30%~70%；
Graphite scrap 30%~70%；
Graphene 0%~10%；
Organosilicon polymer is the basic material of Heat Conduction Material.It is preferred that, organosilicon polymer is selected from vinyl
In polysiloxanes, benzene alkenyl polysiloxanes, methylbenzene olefin(e) acid siloxanes and methylvinyl-polysiloxane extremely
Few one kind.Certainly, it is necessary to which explanation, organosilicon polymer is not limited to different materials indicated above,
Can also be other organosilicon polymers commonly used in the trade.It is further preferred that the ethene of organosilicon polymer
The viscosity average molecular weigh of based polysiloxane is 60 × 104~70 × 104。
Graphite scrap is used as the important filler in Heat Conduction Material.The thickness of graphite scrap be 5 μm~50 μm, stone
The length of black fragment is 30 μm~300 μm.The thickness of graphite scrap and length dimension otherness are bigger, orientation
Oriented alignment it is better.It is preferred that, length and the thickness ratio of graphite scrap are 2：1~60:1.
It is preferred that, graphite scrap is obtained by graphite by crushing, graphite be selected from native graphite, expanded graphite and
At least one of graphite flake.
It is preferred that, the face direction thermal conductivity factor of graphite scrap is not less than 1500W/mK (LF447 tests).
Graphene as Heat Conduction Material important filler.Graphene has larger specific surface area and light weight, few
The graphene powder of amount just can form certain effective network structure, be obviously improved leading for Heat Conduction Material
Hot property.It is preferred that, graphene is selected from single-layer graphene, bilayer graphene and lacks in layer graphene at least
It is a kind of.It should be noted that multi-layer graphene can also be not precluded from multi-layer graphene herein as filler.
It is preferred that, the thickness of graphene is 2nm~10nm, and length is 3 μm~50 μm.
It is preferred that, graphene is selected from least one of graphene sheet layer powder or graphene particles.
It is preferred that, the specific surface area of graphene is 260m2/ g~300m2/g。
It is preferred that, the loose shape density of graphene is 0.13-0.20g/cm3。
It is preferred that, the metal ion content ＜ 1000ppm of graphene.
Heat Conduction Material is the sandwich construction of multi-layer oriented arrangement.Contain graphite scrap in Heat Conduction Material, multilayer is fixed
The heat conductivility of Heat Conduction Material can be significantly improved to the sandwich construction of arrangement.In the present embodiment, heat conduction
Material includes at least 10 layers thermally-conductive sheet stacked gradually, and the number of plies of thermally-conductive sheet can be set as needed,
In one of the embodiments, Heat Conduction Material includes 10 layers~100 layers thermally-conductive sheet stacked gradually.Every layer is led
Graphite scrap in backing material is differed greatly due to thickness and length dimension and is easily reached the oriented alignment of orientation,
Multilayered thermally-conductive sheet material is stacked gradually, so that graphite scrap is in multi-layer oriented arrangement.It is further preferred that every layer
The thickness of thermally-conductive sheet is 0.3mm~0.5mm.It is appreciated that graphite scrap is in the structure of multi-layer oriented arrangement
It is not limited to by the way of multilayered thermally-conductive sheet material is stacked gradually, it would however also be possible to employ other modes.
Above-mentioned Heat Conduction Material with the addition of graphite scrap and graphene powder as filler in organosilicon polymer,
Graphene has larger specific surface area and light weight, and a small amount of graphene powder is certain with regard to that can be formed effectively to lead
Ther mal network structure, the filling of graphene has more contact effects and realizes more passages of heat, significantly
Lift the heat conductivility of Heat Conduction Material；The price of graphene is higher, and graphite scrap is as important filler,
Graphite scrap by graphite flake by crushing i.e. available, and the thermal conductivity of graphite scrap is also very high, graphite scrap
Thickness be 5 μm~50 μm, the length of graphite scrap is 30 μm~300 μm, the thickness of graphite scrap with
There is larger size difference between length, the oriented alignment being preferably orientated can be reached in Heat Conduction Material,
Further improve thermal conductivity；Graphite scrap is in multi-layer oriented arrangement, this multi-layer oriented arrangement in Heat Conduction Material
Structure can greatly improve the heat conductivility of Heat Conduction Material；The graphene of addition is very soft, to Heat Conduction Material
Hardness and compression performance influence are smaller.
Referring to Fig. 1, the preparation method of above-mentioned Heat Conduction Material, comprises the following steps：
Step S110, graphite carried out to crush and obtain graphite scrap.
It is preferred that, graphite scrap is obtained by graphite by crushing, graphite be selected from native graphite, expanded graphite and
At least one of electrographite piece.
If it should be noted that can reach requirement using commercially available graphite scrap, step S110 can be saved
Slightly.
Step S120, each component in Heat Conduction Material is mixed into mill obtain the thermally-conductive sheet of sheet.
In the present embodiment, each component in Heat Conduction Material is mixed into the step that mill obtains the thermally-conductive sheet of sheet
It is rapid to be specially：Organosilicon polymer and graphene are mixed into mill and obtain premix within 15 minutes~45 minutes；And
Mill to graphite scrap in graphite scrap addition premix is evenly distributed on to the heat conduction that sheet is obtained in premix
Sheet material.It is preferred that, mill is carried out using two roller mills, and mill is carried out at room temperature.It is further preferred that
The roller spacing of two roller mills is 0.3mm~0.5mm.It is of course also possible to by three kinds of components one in Heat Conduction Material
Play mixing mill.If not containing graphene in Heat Conduction Material, organosilicon polymer and graphite scrap are mixed
Run refining 15 minutes~45 minutes jointly.
It is preferred that, the thickness of every layer of thermally-conductive sheet is 0.3mm~0.5mm.
Step S130, multilayered thermally-conductive sheet material is stacked gradually obtain Heat Conduction Material.
It is preferred that, the superposition pressure that multilayered thermally-conductive sheet material is stacked gradually is 34.475kPa~68.95kPa.
It is preferred that, step is also included after the step of multilayered thermally-conductive sheet material is stacked gradually：By what is stacked gradually
Multilayered thermally-conductive sheet material carries out transverse cuts.
It is preferred that, 10 layers~100 layers of thermally-conductive sheet is stacked gradually and obtains Heat Conduction Material
The preparation method of above-mentioned Heat Conduction Material, it is simple to operate.
The heat-conducting piece of one embodiment, its material is above-mentioned Heat Conduction Material.
It is preferred that, heat-conducting piece is by the way that the shaping of above-mentioned Heat Conduction Material transverse cuts is prepared.
It is preferred that, heat-conducting piece includes the thermally-conductive sheet that multilayer is stacked gradually.
Above-mentioned heat-conducting piece, by prepared by Heat Conduction Material transverse cuts, the thermal conductivity of obtained heat conducting element compared with
It is high.
It is specific embodiment part below：
Embodiment 1
The Heat Conduction Material of embodiment 1 includes following components：
Methylvinyl-polysiloxane 21.84g and graphite scrap 32.76g.
Electrographite piece crush to obtain graphite scrap, the average thickness of graphite scrap is 25 μm, stone
The average length of black fragment is 100 μm；By organosilicon polymer and graphite scrap using two roller mills in room
The lower mixing mill of temperature obtains premix for 25 minutes, and roller spacing is 0.5mm, and premix forms the thermally conductive sheet of sheet
Material, the thickness of thermally-conductive sheet is 0.5mm；50 layers of thermally-conductive sheet are stacked gradually, superposition pressure is 30KPa,
Heat-conducting piece is obtained after transverse cuts.
Use stable state heat flow method test thermal conductivity of the individual layer thermally-conductive sheet under 68.95kPa pressure for
2.0W/m·K；Thermal conductivity of the heat-conducting piece under 68.95kPa pressure after transverse cuts is 8.5W/mK,
Shore (00) hardness is 57.
Embodiment 2
The Heat Conduction Material of embodiment 2 includes following components：
Methylvinyl-polysiloxane 21.84g and graphite scrap 32.76g.
Electrographite piece crush to obtain graphite scrap, the average thickness of graphite scrap is 17 μm, stone
The average length of black fragment is 100 μm；By organosilicon polymer and graphite scrap using two roller mills in room
The lower mixing mill of temperature obtains premix for 25 minutes, and roller spacing is 0.5mm, and premix forms the thermally conductive sheet of sheet
Material, the thickness of thermally-conductive sheet is 0.5mm；60 layers of thermally-conductive sheet are stacked gradually, superposition pressure is 30KPa,
Heat-conducting piece is obtained after transverse cuts.
Individual layer thermally-conductive sheet is tested under 68.95kPa pressure using stable state heat flow method (method or instrument)
Thermal conductivity is 2.2W/mK；Thermal conductivity of the heat-conducting piece under 68.95kPa pressure after transverse cuts be
11.4W/mK, Shore (00) hardness is 57.
Embodiment 3
The Heat Conduction Material of embodiment 3 includes following components：
Methylvinyl-polysiloxane 21.84g and graphite scrap 40.56g.
Electrographite piece crush to obtain graphite scrap, the average thickness of graphite scrap is 25 μm, stone
The average length of black fragment is 100 μm；By organosilicon polymer and graphite scrap using two roller mills in room
The lower mixing mill of temperature obtains premix for 25 minutes, and roller spacing is 0.5mm, and premix forms the thermally conductive sheet of sheet
Material, the thickness of thermally-conductive sheet is 0.5mm；60 layers of thermally-conductive sheet are stacked gradually, superposition pressure is 30KPa,
Heat-conducting piece is obtained after transverse cuts.
Use stable state heat flow method test thermal conductivity of the individual layer thermally-conductive sheet under 68.95kPa pressure for
3.0W/m·K；Thermal conductivity of the heat-conducting piece under 68.95kPa pressure after transverse cuts is 13.22W/mK,
Shore (00) hardness is 60.
Embodiment 4
The Heat Conduction Material of embodiment 4 includes following components：
Methylvinyl-polysiloxane 21.84g and graphite scrap 40.56g.
Electrographite piece crush to obtain graphite scrap, the average thickness of graphite scrap is 17 μm, stone
The average length of black fragment is 100 μm；By organosilicon polymer and graphite scrap using two roller mills in room
The lower mixing mill of temperature obtains premix for 25 minutes, and roller spacing is 0.5mm, and premix forms the thermally conductive sheet of sheet
Material, the thickness of thermally-conductive sheet is 0.5mm；60 layers of thermally-conductive sheet are stacked gradually, superposition pressure is 30KPa,
Heat-conducting piece is obtained after transverse cuts.
Use stable state heat flow method test thermal conductivity of the individual layer thermally-conductive sheet under 68.95kPa pressure for
3.3W/m·K；Thermal conductivity of the heat-conducting piece under 68.95kPa pressure after transverse cuts is 16.91W/mK,
Shore (00) hardness is 60.
Embodiment 5
The Heat Conduction Material of embodiment 5 includes following components：
Methylvinyl-polysiloxane 21.84g, graphite scrap 40.56g and graphene 4.6g.Graphene it is flat
Equal thickness is 2nm, and average length is 10 μm, and the specific surface area of graphene is 400m2/g。
Electrographite piece crush to obtain graphite scrap, the average thickness of graphite scrap is 25 μm, stone
The average length of black fragment is 100 μm；Graphene is added into silicone rubber matrix mill 30 minutes to graphite
Alkene is uniformly distributed obtains premix in the base, by premix and graphite scrap using two roller mills in room temperature
Lower continuation mill obtains thermally-conductive sheet for 30 minutes, and roller spacing is 0.5mm；The thickness of thermally-conductive sheet is 0.5mm；
60 layers of thermally-conductive sheet are stacked gradually, superposition pressure is 30KPa, obtain heat-conducting piece after transverse cuts.
Use stable state heat flow method test thermal conductivity of the individual layer thermally-conductive sheet under 68.95kPa pressure for
3.3W/m·K；Thermal conductivity of the heat-conducting piece under 68.95kPa pressure after transverse cuts is 18.12W/mK,
Shore (00) hardness is 63.
Embodiment 6
The Heat Conduction Material of embodiment 6 includes following components：
Methylvinyl-polysiloxane 21.84g, graphite scrap 40.56g and graphene 4.6g.Graphene it is flat
Equal thickness is 2nm, and average length is 10 μm, and the specific surface area of graphene is 400m2/g。
Electrographite piece crush to obtain graphite scrap, the average thickness of graphite scrap is 17 μm, stone
The average length of black fragment is 100 μm；Graphene is added into silicone rubber matrix mill 30 minutes to graphite
Alkene is uniformly distributed obtains premix in the base, by premix and graphite scrap using two roller mills in room temperature
Lower continuation mill obtains thermally-conductive sheet for 30 minutes, and roller spacing is 0.5mm；The thickness of thermally-conductive sheet is 0.5mm；
60 layers of thermally-conductive sheet are stacked gradually, superposition pressure is 30KPa, obtain heat-conducting piece after transverse cuts.
Use stable state heat flow method test thermal conductivity of the individual layer thermally-conductive sheet under 68.95kPa pressure for
3.5W/m·K；Laser scattering method is used to measure material conducts heat rate for 26.12W/mK after transverse cuts,
Shore (00) hardness is 63.
It is higher using the thermal conductivity of the heat-conducting piece of the present invention program from embodiment 1~6, it is possible to achieve 25W/m
More than K ultra-high conducting heating rate.
Each technical characteristic of embodiment described above can be combined arbitrarily, not right to make description succinct
The all possible combination of each technical characteristic in above-described embodiment is all described, as long as however, these skills
Contradiction is not present in the combination of art feature, is all considered to be the scope of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed,
But can not therefore it be construed as limiting the scope of the patent.It should be pointed out that for this area
For those of ordinary skill, without departing from the inventive concept of the premise, some deformations can also be made and changed
Enter, these belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be defined.
Claims (11)
1. a kind of Heat Conduction Material, it is characterised in that by weight percentage, including following components：
Organosilicon polymer 30%~70%；And
Graphite scrap 30%~70%；
Graphene 0%~10%；
Wherein, the thickness of the graphite scrap is 5 μm~50 μm, and the length of the graphite scrap is 30 μ
M~300 μm；Graphite scrap described in the Heat Conduction Material is in multi-layer oriented arrangement.
2. Heat Conduction Material according to claim 1, it is characterised in that the organosilicon polymer is selected from
Vinyl polysiloxane, benzene alkenyl polysiloxanes, methylbenzene olefin(e) acid siloxanes and methylvinyl-polysiloxane
At least one of.
3. Heat Conduction Material according to claim 1, it is characterised in that the graphene is selected from graphene
At least one of lamella powder or graphene particles；The thickness of the graphene is 2nm~10nm, and length is
3 μm~50 μm.
4. Heat Conduction Material according to claim 1, it is characterised in that the Heat Conduction Material includes 10
Layer~100 layers of thermally-conductive sheet for stacking gradually.
5. Heat Conduction Material according to claim 4, it is characterised in that the thickness of every layer of thermally-conductive sheet
Spend for 0.3mm~0.5mm.
6. the preparation method of the Heat Conduction Material as described in claim any one of 1-5, it is characterised in that including
Following steps：
Each component in the Heat Conduction Material is mixed into the thermally-conductive sheet that mill obtains sheet；And
Thermally-conductive sheet described in multilayer is stacked gradually and obtains the Heat Conduction Material.
7. the preparation method of Heat Conduction Material according to claim 6, it is characterised in that described by described in
Each component in Heat Conduction Material mixes the step of mill obtains the thermally-conductive sheet of sheet：
Organosilicon polymer and graphene are mixed into mill and obtain premix within 15 minutes~45 minutes；
Mill to fragment in graphite addition premix is evenly distributed on to the thermally conductive sheet that sheet is obtained in premix
Material.
8. the preparation method of Heat Conduction Material according to claim 6, it is characterised in that described by multilayer
Also include step after the step of thermally-conductive sheet is stacked gradually：By thermally conductive sheet described in the multilayer stacked gradually
Material carries out transverse cuts.
9. the preparation method of Heat Conduction Material according to claim 6, it is characterised in that by described in multilayer
The superposition pressure that thermally-conductive sheet is stacked gradually is 10kPa~50kPa.
10. the preparation method of Heat Conduction Material according to claim 6, it is characterised in that the graphite
Fragment by graphite crush obtain, the graphite in native graphite, expanded graphite and electrographite piece extremely
Few one kind.
11. a kind of heat-conducting piece, it is characterised in that the material of the heat-conducting piece is any one of claim 1-5 institutes
The Heat Conduction Material stated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610073005.6A CN107022196A (en) | 2016-02-02 | 2016-02-02 | Heat Conduction Material, its preparation method and heat-conducting piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610073005.6A CN107022196A (en) | 2016-02-02 | 2016-02-02 | Heat Conduction Material, its preparation method and heat-conducting piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107022196A true CN107022196A (en) | 2017-08-08 |
Family
ID=59524976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610073005.6A Pending CN107022196A (en) | 2016-02-02 | 2016-02-02 | Heat Conduction Material, its preparation method and heat-conducting piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107022196A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110920126A (en) * | 2019-11-18 | 2020-03-27 | 苏州鸿凌达电子科技有限公司 | Device for preparing heat conducting fins for graphene fiber orientation arrangement |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102197069A (en) * | 2008-10-21 | 2011-09-21 | 日立化成工业株式会社 | Heat conducting sheet, manufacturing method thereof, and heat radiator that utilizes same |
| CN103374226A (en) * | 2012-04-17 | 2013-10-30 | 信越化学工业株式会社 | Insulation heat releasing sheet and pelleting method of boron nitride |
| CN103764733A (en) * | 2012-07-07 | 2014-04-30 | 迪睿合电子材料有限公司 | Method for producing thermally conductive sheet |
| CN103958611A (en) * | 2011-12-27 | 2014-07-30 | 松下电器产业株式会社 | Anisotropic thermally conductive composition and molded article thereof |
| CN103975429A (en) * | 2011-12-20 | 2014-08-06 | 迪睿合电子材料有限公司 | Thermally conductive sheet and method for manufacturing thermally conductive sheet |
-
2016
- 2016-02-02 CN CN201610073005.6A patent/CN107022196A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102197069A (en) * | 2008-10-21 | 2011-09-21 | 日立化成工业株式会社 | Heat conducting sheet, manufacturing method thereof, and heat radiator that utilizes same |
| CN103975429A (en) * | 2011-12-20 | 2014-08-06 | 迪睿合电子材料有限公司 | Thermally conductive sheet and method for manufacturing thermally conductive sheet |
| CN103958611A (en) * | 2011-12-27 | 2014-07-30 | 松下电器产业株式会社 | Anisotropic thermally conductive composition and molded article thereof |
| CN103374226A (en) * | 2012-04-17 | 2013-10-30 | 信越化学工业株式会社 | Insulation heat releasing sheet and pelleting method of boron nitride |
| CN103764733A (en) * | 2012-07-07 | 2014-04-30 | 迪睿合电子材料有限公司 | Method for producing thermally conductive sheet |
Non-Patent Citations (1)
| Title |
|---|
| 周文英等: "《导热高分子材料》", 30 April 2014 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110920126A (en) * | 2019-11-18 | 2020-03-27 | 苏州鸿凌达电子科技有限公司 | Device for preparing heat conducting fins for graphene fiber orientation arrangement |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3885135B1 (en) | Thermal conductive sheet and method for manufacturing same | |
| CN101160033B (en) | Heat transfer composite, associated device and method | |
| JP7168617B2 (en) | Heat-conducting sheet and manufacturing method thereof | |
| JP5322894B2 (en) | Insulating heat conductive sheet manufacturing method, insulating heat conductive sheet and heat radiation member | |
| JP5407120B2 (en) | HEAT CONDUCTIVE SHEET, ITS MANUFACTURING METHOD, AND HEAT DISSIPATION DEVICE USING THE SAME | |
| KR20110085991A (en) | Heat conducting sheet, manufacturing method thereof, and heat radiator that utilizes same | |
| CN109997423B (en) | Heat sink with high load resistance and high thermal conductivity | |
| CN111492474B (en) | Insulating radiating fin | |
| JP5185582B2 (en) | Thermally conductive sheet | |
| CN106810877A (en) | A kind of heat-conducting interface material and its application | |
| US11618247B2 (en) | Thermally conductive sheet and production method for same | |
| JP5405890B2 (en) | Thermally conductive moldings and their applications | |
| KR102614679B1 (en) | thermal conductive sheet | |
| KR102455995B1 (en) | heat conduction sheet | |
| JP2010034422A (en) | Method of manufacturing radiator sheet | |
| CN108701662A (en) | Thermally conductive sheet and its manufacturing method and radiator | |
| US20220289932A1 (en) | Thermally conductive sheet and method for producing same | |
| CN107686699A (en) | Heat-conducting interface material and heat-conducting interface material preparation method | |
| JP2007153969A (en) | Highly heat-conductive resin composition and substrate for wiring | |
| CN108702857A (en) | Laminated body and its manufacturing method and secondary and secondary manufacturing method | |
| JP2020196864A (en) | Composite resin block object and its manufacturing method and heat conductive resin compact therewith and its manufacturing method | |
| JP7240429B2 (en) | Heat dissipation materials and semiconductor modules | |
| CN107022196A (en) | Heat Conduction Material, its preparation method and heat-conducting piece | |
| JP3721272B2 (en) | Method for producing thermally conductive resin molding | |
| Hu et al. | Spherical boron nitride/silicone rubber composite with high isotropic thermal conductivity via pre‐constructing thermally conductive networks |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170808 |
|
| RJ01 | Rejection of invention patent application after publication |