CN108384248A - The manufacturing method of thermal conductivity piece and thermal conductivity piece - Google Patents
The manufacturing method of thermal conductivity piece and thermal conductivity piece Download PDFInfo
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- CN108384248A CN108384248A CN201810153894.6A CN201810153894A CN108384248A CN 108384248 A CN108384248 A CN 108384248A CN 201810153894 A CN201810153894 A CN 201810153894A CN 108384248 A CN108384248 A CN 108384248A
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- thermal conductivity
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- conductivity piece
- conducting filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The present invention provides the good thermal conductivity piece of thermal conductivity of thickness direction.Thermal conductivity piece contains heat conductivity composition, the heat conductivity composition contains organic siliconresin, conducting filler and the packing material for making conducting filler be arranged along prescribed direction, conducting filler is orientated along the thickness direction of thermal conductivity piece, at least contains aluminium nitride as packing material.In the L*a*b* color specification systems recorded in " JIS Z 8729 " and " JIS Z 8730 " when measuring the surface of thermal conductivity piece, the brightness L* indicated with " L* " value is 32.5 or more.
Description
The application is December 18 2012 applying date, application number 201280061296.7 (PCT/JP2012/082817),
The divisional application of the application for a patent for invention of entitled " manufacturing method of thermal conductivity piece and thermal conductivity piece ".
Technical field
The present invention relates to promote the thermal conductivity piece of heat dissipations and the manufacturing methods of thermal conductivity piece such as heat generation electronic unit.
The application to be in Japanese patent application No. Patent 2011-278788 filed in 20 days December in 2011 of Japan
Basic claims priority, by referring to these applications are cited in the application.
Background technology
Along with the further high performance of electronic instrument, the densification of semiconductor element, high attachmentization are developed.
Along with this, further expeditiously heat dissipation becomes critically important one to the heat that the electronic unit for constituting electronic instrument is generated heat
Ring.For high efficiency heat radiation, semiconductor is installed on the radiators such as heat emission fan, heat sink (heat sink) via thermal conductivity piece
In.The piece that the packing materials such as inorganic filler are disperseed to and are contained in gained in organosilicon is widely used in thermal conductivity piece.It is dissipated to such
Hot component requires further increasing for thermal conductivity, usually for the purpose of high-termal conductivity, is matched with by raising inorganic in matrix
The filling rate of filler is dealt with.But if improving the filling rate of inorganic filler, flexibility is impaired or inorganic filler
Filling rate height leads to that powder falling occurs, and therefore, the filling rate for improving inorganic filler is limited.
Inorganic filler is such as can enumerate aluminium oxide, aluminium nitride, aluminium hydroxide.It, can also be by nitrogen for the purpose of high thermal conductivity
Change flake shaped particles, the carbon fibers such as boron, graphite etc. to be filled in matrix.This is according to thermal conductivity possessed by flake shaped particle etc.
Anisotropy and set.Such as known carbon fiber has the thermal conductivity of about 600-1200W/mK in machine direction.Boron nitride exists
Face direction with about 110W/mK, in thermal conductivity of the direction vertical with face direction with about 2W/mK or so, there is anisotropy.
It is generally known that if increasing thermal conductivity piece the loading of conducting filler, thermal conductivity improves.But it is fibrous
Conducting filler compared with ball filler, loading can not be increased.Therefore individually fibrous conducting filler can not obtain
High thermal conductivity.Here, pass through the face direction for making fibrous conducting filler and the thermal conductivity piece for being used as direction of heat transfer
Thickness direction is identical, that is, by making the conducting filler of threadiness be orientated along the thickness direction of thermal conductivity piece, can make thermal conductivity
It improves tremendously.
Heat conductivity composition of the coating containing carbon fiber has been recorded in patent document 1 and is applied magnetic field and is made carbon fiber orientation
Method.But must have mobility when carbon fiber orientation, therefore in the method recorded in patent document 1, heat conduction can not be made
The loading of property filler increases.Thus it is desirable to obtain conducting filler to be orientated along thermal conductivity piece thickness direction, thickness side
To the good thermal conductivity piece of thermal conductivity.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2006-335957 bulletins.
Invention content
The subject that the invention solves
The present invention proposes for the above situation, its purpose is to provide the good thermal conductivity piece of the thermal conductivity of thickness direction and
The manufacturing method of thermal conductivity piece.
Solve the scheme of project
Present inventor has performed in-depth studies, as a result, it has been found that：Measure thermal conductivity piece surface when " JIS Z 8729 " and
In L*a*b* color specification systems recorded in " JIS Z 8730 ", there is height phase between the brightness L* indicated with " L* " value and thermal conductivity
Pass relationship, so as to complete the present invention.
The present invention relates to a kind of thermal conductivity piece containing heat conductivity composition, the heat conductivity composition contain curability tree
Oil/fat composition and make the packing material that conducting filler is arranged along prescribed direction, wherein conducting filler is along thermal conductivity piece
Thickness direction is orientated, and at least contain aluminium nitride as packing material, " JIS Z 8729 " at the surface of measurement thermal conductivity piece
In L*a*b* color specification systems recorded in " JIS Z 8730 ", the brightness L* indicated with " L* " value is 32.5 or more.
The manufacturing method of the thermal conductivity piece of the present invention has following processes：Heat conductivity composition production process, wherein make
Heat conductivity composition, the heat conductivity composition contain hardening resin composition, conducting filler and make conducting filler along rule
Determine the packing material of direction arrangement；Orientation procedure, wherein combine the thermal conductivity made in heat conductivity composition production process
Object is formed as column, while conducting filler being made to be orientated along columnar length direction；Cut off operation, wherein cut by ultrasonic wave
Columnar heat conductivity composition is cut into defined size along with the direction that length direction intersects vertically, is led by off line
Hot；In thermal conductivity piece, conducting filler is orientated along the thickness direction of thermal conductivity piece, at least contains aluminium nitride as filling
Material, the L*a*b* table color modes recorded in " JIS Z 8729 " and " JIS Z 8730 " when measuring the surface of thermal conductivity piece
In, the brightness L* indicated with " L* " value is 32.5 or more.
The present invention thermal conductivity evaluation method be：" JIS Z 8729 " and " JIS Z when measuring the surface of thermal conductivity piece
In L*a*b* color specification systems recorded in 8730 ", the brightness L* indicated with " L* " value is used, evaluates the thermal conductivity of thermal conductivity piece, institute
State thermal conductivity piece and contain heat conductivity composition, the heat conductivity composition contain hardening resin composition, conducting filler and
The packing material for making conducting filler be arranged along prescribed direction；In thermal conductivity piece, conducting filler along thermal conductivity piece thickness
Direction is orientated, and at least contains aluminium nitride as packing material.
Invention effect
According to the present invention, by least containing aluminium nitride in thermal conductivity piece, " the JIS Z when measuring the surface of thermal conductivity piece
8729 " in the L*a*b* color specification systems recorded in " JIS Z 8730 ", are made the brightness L* indicated with " L* " value for 32.5 or more, led
Hot filler can be orientated along the thickness direction of thermal conductivity piece, and the thermal conductivity of the thickness direction of thermal conductivity piece can be made good.
Description of the drawings
[Fig. 1] Fig. 1 is the flow chart of an example of the manufacturing method of the thermal conductivity piece for illustrating the present invention.
[Fig. 2] Fig. 2 is the ultrasonic wave used in the cut off operation indicated in the manufacturing method of the thermal conductivity piece of the present invention
The outside drawing of one example of cutting machine.
[Fig. 3] Fig. 3 is the outside drawing for an example for indicating slicing device.
[Fig. 4] Fig. 4 is for illustrating an example in the alignment process of the manufacturing method of other thermal conductivity pieces of the present invention
The flow chart of son.
[Fig. 5] Fig. 5 is interim molding procedure, the alignment process of the manufacturing method of the thermal conductivity piece for illustrating the present invention
With the schematic diagram of an example of formal molding procedure.
[Fig. 6] Fig. 6 is the lamilate obtained in the alignment process in the manufacturing method for indicate the thermal conductivity piece of the present invention
The oblique view of one example.
[Fig. 7] Fig. 7 (A) is the oblique view of an example of the formal formed body for indicating that pressurization is not carried out, and Fig. 7 (B) is table
Show the oblique view of an example of the formal formed body after implementing pressurization.
Specific implementation mode
Referring to the drawings, embodiment of the present invention (hereinafter referred to as the present embodiment) is carried out in the following order detailed
It describes in detail bright.
1. thermal conductivity piece
2. the manufacturing method of thermal conductivity piece
3. the manufacturing method of other thermal conductivity pieces
4. thermal conductivity evaluation method.
<1. thermal conductivity piece>
The thermal conductivity piece 1 of the present embodiment contains heat conductivity composition, the heat conductivity composition contain hardening resin composition,
Conducting filler and the packing material for making conducting filler be arranged along prescribed direction, thickness of the conducting filler along thermal conductivity piece
Direction is orientated.In the thermal conductivity piece of the present embodiment, aluminium nitride is at least contained in thermal conductivity piece, measures the surface of thermal conductivity piece
When " JIS Z 8729 " and " JIS Z 8730 " recorded in L*a*b* color specification systems in, be with the brightness L* that " L* " value indicates
32.5 or more.Brightness L* when surface by making measurement thermal conductivity piece is 32.5 or more, makes conducting filler along thermal conductivity piece
Thickness direction be orientated, the thermal conductivity of the thickness direction of thermal conductivity piece can be made good.
(the brightness L* in L*a*b* color specification systems and the correlativity between thermal conductivity)
The color of object is usually made of 3 brightness (brightness), form and aspect (tone) and chroma (color saturation) elements.In standard
When really measuring and show these elements, need they can objectively to be quantized come the color specification system showed.Such table color
System can for example enumerate L*a*b* color specification systems.L*a*b* color specification systems are such as can be by analyzer commercially available spectral photometric colour measuring meter easily
It is measured.
L*a*b* color specification systems are the color specification systems recorded in such as " JIS Z 8729 " and " JIS Z 8730 ", wherein by each face
Color is configured at the spherical colour space to be indicated.In L*a*b* color specification systems, brightness is with the position table in the longitudinal axis (z-axis) direction
Show, form and aspect are indicated with the position of peripheral direction, and chroma is indicated with the distance away from central shaft.
Indicate that the position in the longitudinal axis (z-axis) direction of brightness is indicated with L*.The value of brightness L* is positive number, and the number is smaller then bright
Degree is lower, has the tendency that dimmed.Specifically, the value of L* changes between being equivalent to the 0 to be equivalent to white 100 of black.
By the spherical colour space L*=50 position along the sectional view of level cut-out, the positive direction of x-axis is red side
To the positive direction of y-axis is yellow direction, and the negative direction of x-axis is green direction, and the negative direction of y-axis is blue direction.X-direction
Position by take -60 to+60 value a* indicate.The position in y-axis direction is by taking the b* of -60 to+60 value to indicate.This
Sample, a* and b* are the positive and negative numbers for indicating coloration, more black closer to 0.Form and aspect and chroma are indicated by their a* values and b* values.
In L*a*b* color specification systems, brightness L* then whitens for 32 or more, and brightness L* blacks less than 32.In L*a*b* table colors
In system, a* is less than -1 greening, and a* is -1 or more then rubescent.B* turns blue less than -1, and b* is more than+1 and turns to be yellow.
Such as made using L*a*b* color specification systems as conducting filler, containing aluminium nitride and aluminium oxide to containing carbon fiber
For the thermal conductivity piece of packing material cross-section determination degree of blackness when, brightness L* is 32.5 or more then to whiten.The reason is that brightness
L* is 32.5 or more, then from the direction vertical with section when thermal conductivity piece, the area of the conducting filler in thermal conductivity piece
It reduces, in addition white aluminium oxide and aluminium nitride expose the surface of thermal conductivity piece.That is, brightness L* is 32.5 or more, then mean
Conducting filler is orientated along the thickness direction of thermal conductivity piece.
On the other hand, using L*a*b* color specification systems to contain carbon fiber as conducting filler, contain aluminium nitride and oxygen
When changing cross-section determination degree of blackness of the aluminium as the thermal conductivity piece of packing material, brightness L* blacks less than 32.5.The reason is that
Brightness L* is less than 32.5, then from the direction vertical with section when thermal conductivity piece, the face of the conducting filler in thermal conductivity piece
Product increases, and in addition white aluminium oxide and aluminium nitride are difficult to expose from the surface of thermal conductivity piece.That is, brightness L* is less than 32.5, then
Mean compared with when brightness L* is 32.5 or more, conducting filler is orientated not along the thickness direction of thermal conductivity piece.
Usually the high conducting filler of thermal conductivity is filled in thermal conductivity piece, then the thermal conductivity of thermal conductivity piece improves.It is former
Originally think, such as a large amount of filled bitumen base carbon fibres are as conducting filler, then thermal conductivity raising.Think, thermal conductivity piece table
The brightness L* in face reduces, then thermal conductivity improves.But high thermal conductivity is obtained, it is not merely to increase containing for conducting filler
Amount, but, not only to add packing material come the viscosity of heat conductivity composition when keeping shape, and reducing extrusion, make heat conduction
Property filler along the thickness direction of thermal conductivity piece be orientated be also it is critically important.
Present inventor has performed in-depth studies, as a result, it has been found that, " the JIS Z when measuring the surface of thermal conductivity piece
8729 " in the L*a*b* color specification systems recorded in " JIS Z 8730 ", have with " L* " value brightness L* indicated and between thermal conductivity
There is the correlativity of height.It has also been found that in order to make conducting filler be orientated along the thickness direction of thermal conductivity piece, with conducting filler
Use level compare, the use level of the low aluminium nitride of thermal conductivity ratio conducting filler has a significant impact.That is, by making thermal conductivity piece
In at least contain aluminium nitride, and brightness L* when making the surface of measurement thermal conductivity piece is 32.5 or more, then makes conducting filler edge
The thickness direction of thermal conductivity piece is orientated, and the thermal conductivity of the thickness direction of thermal conductivity piece can be made good.
(hardening resin composition)
Hardening resin composition is not particularly limited contained in thermal conductivity piece, such as organic silicon bonding agent, third can be used
Olefin(e) acid ester resinae bonding agent etc..Organic silicon bonding agent can use the bonding agent of condensation cured type or addition curable.Gu
The content of the property changed resin combination is not particularly limited, such as can be 25-45 volumes %.
(conducting filler)
Carbon fiber for example can be used in conducting filler, particularly preferably uses the carbon fiber of asphaltic base.The carbon fiber of asphaltic base be with
Pitch is main material, after each processing steps such as melt spinning, non-fusible and carbonization, with 2000-3000 DEG C or more than 3000 DEG C
High temperature be heat-treated and graphited carbon fiber.Material asphalt is divided into that optics is out of order, does not show the isotropism of deviation
Pitch, and molecules align is constituted into liquid crystal shape, the optically anisotropic anisotropic pitch (mesophase pitch) of display.From it is each to
The mechanical property of carbon fiber of the carbon fiber than being manufactured by isotropic pitch of anisotropic pitch manufacture is excellent, and electricity and thermal conductivity carry
It is high.Therefore it is preferable to use the graphitized carbon fibres of intermediate phase pitch-based.
The average fiber length of conducting filler is preferably 100 μm or more.By keeping the average fiber of conducting filler long
Degree is 100 μm or more, then conducting filler is easy to arrange in the same direction, therefore can make thermal conductivity piece leading in thickness direction
It is hot more good.
Conducting filler content in thermal conductivity piece is preferably 15-25 volumes %.By making the content of conducting filler be 15
Volume % or more can more effectively reduce thermal resistance value, therefore thermal conductivity piece can be made more good in the thermal conductivity of thickness direction
It is good.It, can by making the content of conducting filler be 25 volume % hereinafter, for example when squeezing out heat conductivity composition by extruder
It is difficult to prevent from squeezing out.
(packing material)
Packing material is according to the flow velocity difference with the conducting filler in heat conductivity composition, for making conducting filler be easy
It is arranged along prescribed direction, that is, for making conducting filler be easy to be orientated along extrusion direction.Packing material is additionally operable to as thermal conductivity
Material works.
Aluminium oxide, aluminium nitride, boron nitride, zinc oxide, Si powder, metal powder for example can be used in packing material, at least makes
Use aluminium nitride.Aluminium nitride in its intramolecular there is nitrogen, the nitrogen to hinder the reaction of hardening resin composition, inhibit thermal conductivity combination
The raising of object viscosity.Therefore, by least aluminium nitride being used to be used as packing material, filling material is used as with alumina particle is only used
It is compared when material, conducting filler can more effectively be made to be orientated along the thickness direction of thermal conductivity piece along prescribed direction.Therefore,
By at least aluminium nitride being used to be used as packing material, thickness direction of the conducting filler more effectively along thermal conductivity piece can be made
It is orientated, therefore, the thermal conductivity of thermal conductivity piece thickness direction can be made good.
In addition, by using the different spherical particle of more than two kinds of grain size as packing material, can more effectively make to lead
Hot filler is orientated readily along the thickness direction of thermal conductivity piece.As a result, " the JIS Z when measuring the surface of thermal conductivity piece
8729 " in the L*a*b* color specification systems recorded in " JIS Z 8730 ", can be more reliably with the brightness L* that " L* " value indicates
32.5 or more.In this way, making conducting filler edge as packing material by using the different spherical particle of more than two kinds of grain size
The thickness direction for thermal conductivity piece is orientated, therefore thermal conductivity piece can be made more good in the thermal conductivity of thickness direction.
The content of packing material in thermal conductivity piece is preferably 40-50 volumes %.Additionally, it is preferred that aluminium nitride is in thermal conductivity piece
In contain 5.1 volume % or more.Content by making the aluminium nitride in thermal conductivity piece is 5.1 volume % or more, can effectively be pressed down
The viscosity of heat conductivity composition processed increases, and conducting filler is more effectively made to be orientated along the thickness direction of thermal conductivity piece.As a result,
In the L*a*b* color specification systems recorded in " JIS Z 8729 " and " JIS Z 8730 " when measuring the surface of thermal conductivity piece, with
The brightness L* that " L* " value indicates can be more effectively 32.5 or more.In this way, by making the content of aluminium nitride in thermal conductivity piece be
5.1 volume % or more can make thermal conductivity piece more good in the thermal conductivity of thickness direction.
The average grain diameter of packing material is preferably 0.5-5 μm.By making the average grain diameter of packing material be 0.5 μm or more 5 μ
M fully works hereinafter, can be used as thermally conductive materials, also, in heat conductivity composition, and the orientation of conducting filler is difficult to beat
Disorderly, therefore thermal conductivity piece 1 can be made more good in the thermal conductivity of thickness direction.
In addition, as described above, when using the different spherical particle of more than two kinds of grain size as packing material, preferably make big
Spherical particle be 2-5 μm, small spherical particle be 0.3-2 μm, it is possible thereby to more effectively make conducting filler readily along
The thickness direction of thermal conductivity piece is orientated.As a result, " JIS Z 8729 " and " JIS Z when measuring the surface of thermal conductivity piece
In L*a*b* color specification systems recorded in 8730 ", the brightness L* indicated with " L* " value can be more reliably for 32.5 or more.
It should be noted that in above description, with L*a*b* color specification system examples, but the selection mode of color specification system is not special
It limits, as long as the color specification system of L*a*b* color specification systems can be scaled.Such as can be XYZ color specification systems, L*C*h color specification systems.
<2. the manufacturing method of thermal conductivity piece>
Above-mentioned thermal conductivity piece 1 can for example be manufactured according to manufacturing method below.The manufacturing method of the thermal conductivity piece of the present embodiment
As shown in Figure 1, having heat conductivity composition production process S1, orientation procedure S2 and cut off operation S3.
(heat conductivity composition production process S1)
In heat conductivity composition production process S1, above-mentioned heat conductivity composition is made.Use level example in heat conductivity composition
If preferred conducting filler is 15-25 volume %, packing material is 40-50 volumes %.In addition, in heat conductivity composition, preferably
Contain the 5.1 above aluminium nitride of volume % as packing material.
(orientation procedure S2)
In orientation procedure S2, the heat conductivity composition made in heat conductivity composition production process S1 is formed as into column,
Conducting filler is set to be orientated along columnar length direction simultaneously.It is coated with demoulding in orientation procedure S2, such as by being expressed into
In the mold of material, as shown in Fig. 2, the column thermal conductivity group that conducting filler is orientated along columnar length direction L can be formed
Close object 2.Alternatively, in orientation procedure S2, such as the thermal conductivity that can also will be made in heat conductivity composition production process S1
Composition is coated on the polyester film for being coated with release materials, forms column heat conductivity composition 2 shown in Fig. 2.
(cut off operation S3)
In cut off operation S3, by ultrasonic cut-off machine, the columnar heat conductivity composition 2 that will be formed in orientation procedure S2
Defined size is cut into along with the direction that length direction intersects vertically, obtains thermal conductivity piece 1.
In cut off operation S3, such as shown in Figures 2 and 3, by using ultrasonic cut-off machine 3, with ultrasonic cutting
Device 4 cuts columnar heat conductivity composition 2 along the direction V to intersect vertically of the length direction L with columnar heat conductivity composition 2
Piece can form thermal conductivity piece 1 in the state of keeping the orientation of conducting filler.Therefore, the orientation of conducting filler is maintained at
Thickness direction can get the good thermal conductivity piece of thermal conduction characteristic 1.
Ultrasonic cut-off machine 3 is as shown in figure 3, have the workbench 5 for placing columnar heat conductivity composition 2 and side application
The ultrasonic cutter 4 that columnar heat conductivity composition 2 on workbench 5 is sliced by ultrasonic activation side.
In workbench 5, silicon rubber 7 is equipped in metal mobile station 6.Mobile station 6 can be by mobile mechanism 8 along rule
Determine direction movement, the lower part that columnar heat conductivity composition 2 is sent to ultrasonic cutter 4 successively operates.Silicon rubber 7 has
There is the thickness for the point of a knife for being enough to bear ultrasonic cutter 4.In workbench 5, columnar thermal conductivity combination is placed on silicon rubber 7
Object 2 coordinates the sectioning of ultrasonic cutter 4, so that mobile station 6 is moved to prescribed direction, by columnar heat conductivity composition 2
It is sent successively to the lower part of ultrasonic cutter 4.
Ultrasonic cutter 4 has：By knife 9 that columnar heat conductivity composition 2 is sliced, give ultrasonic wave to knife 9
The ultrasonic wave Fa Zhen mechanisms 10 of vibration, the elevating mechanism 11 for making the progress descending operation of knife 9.
Thus knife 9, which is point of a knife, will be positioned on workbench 5 towards workbench 5 by the progress descending operation of elevating mechanism 11
Columnar heat conductivity composition 2 be sliced.Size, group of the size, material of knife 9 according to columnar heat conductivity composition 2
It is determined at equal.Such as knife 9 is formed by the steel of wide 40mm, thickness 1.5mm, 10 ° of point of a knife angle.
Ultrasonic activation is given along the slice direction of columnar heat conductivity composition 2 to knife 9 by ultrasonic wave Fa Zhen mechanisms 10,
Such as transmission frequency is 20.5kHz, adjustable amplitude section is 50 μm, 60 μm, 70 μm of this 3 stages.
Such ultrasonic cut-off machine 3 by when giving ultrasonic activation to ultrasonic cutter 4 to columnar heat conduction
Property composition 2 is sliced, and the orientation of the conducting filler of thermally conductive sheet 1 can be made to be maintained at the thickness direction of thermal conductivity piece 1.
The thermal conductivity piece 1 being sliced while giving ultrasonic activation by ultrasonic cut-off machine 3 is super with not giving
Acoustic vibration and the thermal conductivity piece that is sliced are compared, and thermal resistance are suppressed to relatively low.The reason is that 3 edge of ultrasonic cut-off machine
It slice direction and gives ultrasonic activation to ultrasonic cutter 4, therefore interface resistance is low, along the thickness side of thermal conductivity piece 1
It is difficult to overturn because of knife 9 to the conducting filler of orientation.And in not giving ultrasonic activation and the thermal conductivity piece that is sliced,
Since the frictional resistance of knife keeps the orientation of conducting filler chaotic, reduction is exposed to section, and thus thermal resistance increases.Therefore, pass through
Using ultrasonic cut-off machine 3, the excellent thermal conductivity piece 1 of thermal conduction characteristic can be obtained.
According to the production method of thermal conductivity piece as described above, thermal conductivity piece 1 can be obtained, wherein conducting filler edge
The thickness direction for thermal conductivity piece 1 is orientated, " JIS Z 8729 " and " JIS Z 8730 " when measuring the surface of thermal conductivity piece 1
In recorded L*a*b* table color modes, the brightness L* indicated with " L* " value is 32.5 or more.
<3. the manufacturing method of other thermal conductivity pieces>
Thermal conductivity piece 1 can be manufactured according to manufacturing method as described below.That is, as shown in figure 4, above-mentioned thermal conductivity piece system
It makes in the orientation procedure S2 of method, can have interim molding procedure S21, alignment process S22 and formal molding procedure S23.Root
According to the manufacturing method of such thermal conductivity piece, thermal conductivity piece 1 can be more reliably obtained, wherein in the table for measuring thermal conductivity piece 1
The brightness L* indicated with " L* " value in the L*a*b* color specification systems recorded in " JIS Z 8729 " and " JIS Z 8730 " when face is
32.5 or more.I.e., it is possible to which the conducting filler in thermal conductivity piece 1 is more reliably made to arrange in the same direction, thermal conductivity can be made
Piece 1 is more good in the thermal conductivity of thickness direction.It should be noted that in the following description, for above-mentioned heat conductivity composition
Description is omitted by production process S1.
(interim molding procedure S21)
In interim molding procedure S21, as shown in Fig. 5 (A), the thermal conductivity that will be made in heat conductivity composition production process S1
Composition 12 is squeezed out with extruder 13, be shaped to wherein conducting filler along squeeze out elongate column that direction is orientated it is interim at
Type body 14 (hereinafter referred to as interim formed body 14).
Extruder 13 for example as shown in Fig. 5 (A), is configured to the cartridge type of elongate, and heat conductivity composition 12 1 is preferably discharged
The bore W2 of the opening portion 12B of side reduces diameter compared with the internal diameter W1 of body part 12A.In extruder 13, body part 12A's is interior
Diameter W1 is to reduce a diameter of coniform, the bore W2 and ontology of opening portion 12B from the specified position of length direction to direction is squeezed out
The internal diameter W1 of portion 12A, which is compared, can reduce diameter.By squeezing out the such extruder 13 of heat conductivity composition 12, squeezing out
In machine 13, so that heat conductivity composition 12 is passed through towards the part for reducing diameter compared with the internal diameter W1 of body part 12A, lead as a result,
Hot filler is readily along extrusion direction.It is possible thereby to more reliably make conducting filler along the length side of interim formed body 14
To orientation.
Such as the conducting filler content in heat conductivity composition 12 is when being 15-25 volume %, the preferred opening of extruder 13
The bore W2 of portion 12B is 1.5-9.5mm or so.In this case, by making the bore W2 of opening portion 12B be 1.5mm or more,
When heat conductivity composition 12 is squeezed out with extruder 13, it can prevent from squeezing out difficult.By making the bore W2 of opening portion 12B be
9.5mm hereinafter, the orientation of conducting filler is difficult to confusion, therefore can make thermal conductivity piece 1 thickness direction thermal conductivity more
Well.
In extruder 13, the cross sectional shape of opening portion 12B can for example be set as round shape, triangular shape, rectangular-shaped, square
Shape is preferably set as rectangular-shaped or square shape.By making the cross sectional shape of opening portion 12B be rectangular-shaped or square shape, temporarily
Formed body 14 can be prism-shaped.Therefore, in alignment process S22, make multiple interim formed bodys 14 vertical with length direction
Direction on arranged with contiguous fashion, and multiple interim formed bodys 14 of arrangement are disposed in and the approximately perpendicular intersection of orientation
Direction, be difficult to generate gap when obtaining lamilate 14A (hereinafter referred to as lamilate 14A), between lamilate 14A.It is laminated as a result,
It is difficult in body 14A containing bubble, therefore in formal molding procedure S23, the more excellent formal molding of anti-flammability can be obtained
Body 16.
Interim formed body 14 is so that conducting filler is orientated along direction is squeezed out by extruder 13, is the shape of elongate column
Shape, for example, it is elongated quadrangular shape, elongated triangular prism shape, elongated cylindric.
(alignment process S22)
It, will be molding more in interim molding procedure S21 in alignment process S22, such as shown in Fig. 5 (B), Fig. 5 (C), Fig. 6
A interim formed body 14 is arranged on the direction to intersect vertically with length direction with contiguous fashion, obtains lamilate 14A.Such as
In alignment process S22, make interim formed body 14 be arranged in as defined in frame 15, by interim formed body 14 be arranged to rectangular-shape or
Cubic obtains lamilate 14A.In formal molding procedure S23, when making formal formed body 16 be molded, frame 15 is as solid
The fixing device of given layer zoarium 14A uses, and prevents lamilate 14A from moderate finite deformation occurs.Frame 15 is for example formed by metal.
(formal molding procedure S23)
It is solid by the lamilate 14A for making to obtain in alignment process S22 in formal molding procedure S23, such as shown in Fig. 5 (D)
Change, as shown in Fig. 5 (E) and Fig. 7 (A), (B), is shaped to what the interim formed body 14 of wherein composition lamilate 14A was integrated with each other
Formal formed body 16.Make the cured methods of lamilate 14A that can for example enumerate：Lamilate 14A is heated by heating device
Method, or by heat pressue device to lamilate 14A carry out heating pressurization method.Using acrylate conduct
When constituting the hardening resin composition of heat conductivity composition 12, such as by containing isocyanates in heat conductivity composition 12
Compound can be such that lamilate 14A cures at normal temperatures.
The cured methods of these lamilates 14A are made preferably to carry out heating pressurization to lamilate 14A by heating pressue device
Method, that is, make lamilate 14A cure when, with constitute lamilate 14A multiple interim formed bodys 14 length direction hang down
(press) is pressurizeed on the direction (vertical direction) directly intersected.In this way, by pressurizeing to lamilate 14A, it can be certainly by bubble
It is excluded from lamilate 14A, therefore in formal molding procedure S23, the more excellent formal formed body of anti-flammability can be obtained
16。
It, will the molding formal molding in formal molding procedure S23 by ultrasonic cut-off machine 3 in cut off operation S4
Body 16 cuts into defined size along the direction that the length direction with interim formed body 14 intersects vertically.In order to obtain thermal conductivity
Formal formed body 16 is sliced into each thermal conductivity piece 1 by piece 1, ultrasonic cut-off machine 3.Using ultrasonic cut-off machine 3, ultrasonic wave is used
Formal formed body 16 is sliced, thus by cutter 4 along the arrow direction that the length direction with interim formed body 14 intersects vertically
Thermal conductivity piece 1 can be formed in the state of keeping the orientation of conducting filler.Therefore the orientation that conducting filler can be obtained is protected
It holds in thickness direction, the good thermal conductivity piece of thermal conduction characteristic 1.
<4. the evaluation method of color>
The evaluation method of the color of the present embodiment is：" JIS Z 8729 " when measuring the surface of above-mentioned thermal conductivity piece 1 and
In L*a*b* color specification systems recorded in " JIS Z 8730 ", thermal conductivity piece 1 is evaluated using the brightness L* indicated with " L* " value
Thermal conductivity.For example, when brightness L* when measuring the surface of thermal conductivity piece 1 is 32.5 or more, conducting filler is along thermal conductivity piece 1
Thickness direction be orientated, therefore it is good that thermal conductivity piece 1 can be evaluated in the thermal conductivity of thickness direction.Measure the table of thermal conductivity piece 1
When brightness L* when face is less than 32.5, conducting filler is orientated not along the thickness direction of thermal conductivity piece 1, therefore thermal conductivity piece 1
It can be evaluated as in the thermal conductivity of thickness direction bad.
Embodiment
The embodiment of the present invention is illustrated below.It should be noted that invention is not limited to these embodiments.This reality
It applies in example, for the thermal conductivity piece obtained by embodiment 1-6 and comparative example 1-3, orientation, thermal conductivity to its asphalt base carbon fiber
It is evaluated with appearance.
(embodiment 1)
In embodiment 1, the oxygen of 24 3 μm of volume % average grain diameters is disperseed in the addition reaction-type liquid organic siliconresin of two component
Changing alumina particles (packing material), (Deuki Kagaku Kogyo Co., Ltd manufactures, ProductName：DAW-03), 18.3 volume % average grain diameters 1
μm aluminum nitride particle (manufacture of Co., Ltd. Tokuyama (ト Network ヤ マ) company), 24.1 150 μm of volume % average major axis lengths,
(Teijin Ltd manufactures the asphalt base carbon fiber (conducting filler) that 8 μm of average minor axis length, trade name：ラヒーマR-
A301), organosilicon resin composition (heat conductivity composition) is prepared.Two component addition reaction-type liquid organic siliconresin be by
16.8 volume % organosilicon A liquid (organopolysiloxane with vinyl) and 18.8 volume % organosilicon B liquid are (with H-Si bases
Organopolysiloxane) it mixes.By gained organosilicon resin composition squeeze out be coated with release materials mold (20mm ×
In 20mm), it is shaped to organosilicon formed body.Gained organosilicon formed body is cured 1 hour with 100 DEG C in an oven, is formed with
Machine silicon solidfied material.Gained organosilicon solidfied material is cut into thickness 2.0mm with ultrasonic cutter, obtains leading for thickness 2.0mm
Hot.The chip rate of ultrasonic cutter is 50mm per second.Giving the ultrasonic activation of ultrasonic cutter is：Hair shakes frequently
Rate 20.5kHz, 60 μm of amplitude.
(embodiment 2)
In example 2, the two component addition made of mixing 16.8 volume % organosilicon A liquid and 18.8 volume % organosilicon B liquid
Disperse alumina particle (the electrochemically industrial strain formula meeting of 11.7 3 μm of volume % average grain diameters in response type liquid organic siliconresin
Society manufactures, ProductName：DAW-03), aluminum nitride particle (Co., Ltd.'s Tokuyama corporations of 31.2 1 μm of volume % average grain diameters
Make), asphalt base carbon fiber (Teijin Ltd's systems of 23.5 150 μm of volume % average major axis lengths, 8 μm of average minor axis length
It makes, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, in addition to this similarly to Example 1, obtains heat conduction
Property piece.
(embodiment 3)
In embodiment 3, the two component addition made of mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid is anti-
Answer the alumina particle (Deuki Kagaku Kogyo Co., Ltd for disperseing 20.2 3 μm of volume % average grain diameters in type liquid organic siliconresin
Manufacture, ProductName：DAW-03), aluminum nitride particle (Co., Ltd.'s Tokuyama corporations of 20.1 1 μm of volume % average grain diameters
Make), asphalt base carbon fiber (Teijin Ltd's systems of 24.1 150 μm of volume % average major axis lengths, 8 μm of average minor axis length
It makes, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, in addition to this similarly to Example 1, obtains heat conduction
Property piece.
(embodiment 4)
In example 4, the two component addition made of mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid is anti-
Answer alumina particle (Deuki Kagaku Kogyo Co., Ltd's system for disperseing 28 3 μm of volume % average grain diameters in type liquid organic siliconresin
It makes, ProductName：DAW-03), the aluminum nitride particle (manufacture of Tokuyama companies of Co., Ltd.) of 14.3 1 μm of volume % average grain diameters,
Asphalt base carbon fiber (Teijin Ltd's manufacture, the quotient of 20.1 150 μm of volume % average major axis lengths, 8 μm of average minor axis length
The name of an article：ラ ヒ ー マ R-A301), prepare organosilicon resin composition.Gained organosilicon resin composition is coated on and is coated with
On the polyester film (stacking coating) of release materials, organosilicon formed body is manufactured.By gained organosilicon formed body in an oven with
100 DEG C are heated 1 hour, and organosilicon solidfied material is made.Gained organosilicon solidfied material is cut into thickness with ultrasonic cutter
2.0mm obtains the thermal conductivity piece of thickness 2.0mm.The chip rate of ultrasonic cutter is 50mm per second.Give ultrasonic cutting
The ultrasonic activation of device is：Send out vibration frequency 20.5kHz, 60 μm of amplitude.
(embodiment 5)
In embodiment 5, the two component addition made of mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid is anti-
Answer the alumina particle (Deuki Kagaku Kogyo Co., Ltd for disperseing 37.2 3 μm of volume % average grain diameters in type liquid organic siliconresin
Manufacture, ProductName：DAW-03), aluminum nitride particle (Co., Ltd.'s Tokuyama corporations of 5.1 1 μm of volume % average grain diameters
Make), asphalt base carbon fiber (Teijin Ltd's systems of 20.1 150 μm of volume % average major axis lengths, 8 μm of average minor axis length
It makes, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, in addition to this similarly to Example 1, obtains heat conduction
Property piece.
(embodiment 6)
In embodiment 6, the two component addition made of mixing 17.1 volume % organosilicon A liquid, 17.1 volume % organosilicon B liquid is anti-
Answer aluminum nitride particle (the Tokuyama companies of Co., Ltd. for disperseing 42.6 1 μm of volume % average grain diameters in type liquid organic siliconresin
Manufacture), asphalt base carbon fiber (Teijin Ltd's systems of 23.2 150 μm of volume % average major axis lengths, 8 μm of average minor axis length
It makes, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, in addition to this similarly to Example 1, obtains heat conduction
Property piece.
(comparative example 1)
In comparative example 1, the two component addition reaction made of mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid
Disperse alumina particle (Deuki Kagaku Kogyo Co., Ltd's system of 42.3 3 μm of volume % average grain diameters in type liquid organic siliconresin
It makes, ProductName：DAW-03), 24.1 150 μm of volume % average major axis lengths, 8 μm of average minor axis length asphalt base carbon fiber (Supreme Being
People Co., Ltd. manufactures, trade name：ラ ヒ ー マ R-A301), prepare organosilicon resin composition, in addition to this with embodiment 1
Equally, thermal conductivity piece is obtained.
(comparative example 2)
In comparative example 2, the two component addition reaction made of mixing 18.8 volume % organosilicon A liquid, 18.8 volume % organosilicon B liquid
Disperse alumina particle (Deuki Kagaku Kogyo Co., Ltd's system of 41.3 3 μm of volume % average grain diameters in type liquid organic siliconresin
It makes, ProductName：DAW-03), 20.1 150 μm of volume % average major axis lengths, 8 μm of average minor axis length asphalt base carbon fiber (Supreme Being
People Co., Ltd. manufactures, trade name：ラ ヒ ー マ R-A301), prepare organosilicon resin composition, in addition to this with embodiment 4
Equally, thermal conductivity piece is obtained.
(comparative example 3)
In comparative example 3, the two component addition reaction-type liquid made of mixing 18 volume % organosilicon A liquid, 18 volume % organosilicon B liquid
Disperse in shape organic siliconresin 44.8 3 μm of volume % average grain diameters alumina particle (Deuki Kagaku Kogyo Co., Ltd manufacture,
ProductName：DAW-03), 19.2 150 μm of volume % average major axis lengths, 8 μm of average minor axis length asphalt base carbon fiber (Supreme Being people
Co., Ltd. manufactures, trade name：ラ ヒ ー マ R-A301), organosilicon resin composition is prepared, it is in addition to this same with embodiment 1
Sample obtains thermal conductivity piece.
The summary sheets such as embodiment 1- embodiments 6, the condition of comparative example 1- comparative examples 3 are shown in Table 1.
[table 1]
(orientation about asphalt base carbon fiber)
The orientation of asphalt base carbon fiber is observed the section of thermal conductivity piece by SEM and is surveyed using the degree of blackness of L*a*b* color specification systems
It is fixed to evaluate.
The section of thermal conductivity piece as obtained by SEM observation embodiment 1- embodiments 6, as a result, it has been found that asphalt base carbon fiber
The thickness direction of thermal conductivity piece is orientated.The especially thermal conductivity of 6 gained of embodiment 1- embodiments 3, embodiment 5 and embodiment
Piece, compared with the thermal conductivity piece of 4 gained of embodiment, asphalt base carbon fiber is preferably orientated along the thickness direction of thermal conductivity piece.
Think, the reason is that due in embodiment 1- embodiments 3, embodiment 5 and embodiment 6, to be expressed into the mould for being coated with release materials
In tool and it is shaped to organosilicon formed body.
On the other hand, the section of the thermal conductivity piece as obtained by SEC observation comparative example 1- comparative examples 3, as a result, it has been found that, with reality
The thermal conductivity piece for applying 6 gained of a 1- embodiments compares, and asphalt base carbon fiber is not orientated the thickness direction of thermal conductivity piece.
For the section of thermal conductivity piece, also L*a*b* color specification systems is used to measure degree of blackness.It uses with " JIS Z 8729 " institute
The color showing method that defined L*a*b* color specification systems indicate is as degree of blackness index.Using the degree of blackness of L*a*b* color specification systems
It measures and uses spectrophotometer (ProductName：CM-700d, Konica Minolta Sensing Co., Ltds manufacture).
The thermal conductivity piece of gained in embodiment 1- embodiments 6, " JIS Z 8729 " when measuring the surface of thermal conductivity piece
In recorded L*a*b* color specification systems, the brightness L* indicated with " L* " value is 32.5 or more.And in 3 gained of comparative example 1- comparative examples
Thermal conductivity piece in, measure thermal conductivity piece surface when " JIS Z 8729 " recorded in L*a*b* color specification systems in, with
The brightness L* that " L* " value indicates is less than 32.5.By the result, it is believed that the thermal conductivity piece of 6 gained of embodiment 1- embodiments, compared with
The thermal conductivity piece of 3 gained of example 1- comparative examples compares, and asphalt base carbon fiber is more effectively orientated along the thickness direction of thermal conductivity piece.
As knowen from these results, aluminium nitride, and the L*a* when measuring the surface of thermal conductivity piece are contained in thermal conductivity piece
In b* color specification systems, the brightness L* indicated with " L* " value makes asphalt base carbon fiber along the thickness of thermal conductivity piece as a result, for 32.5 or more
It spends direction to be orientated, thermal conductivity piece can be made good in the thermal conductivity of thickness direction.
(evaluation about thermal conductivity)
The thermal conductivity measurement result of thermal conductivity piece obtained by embodiment 1- embodiments 6, comparative example 1- comparative examples 3 is as shown in table 1.It leads
The evaluation of heating rate is carried out according to the assay method of ASTM-D5470.
In the thermal conductivity piece of the gained of embodiment 1- embodiments 6, by thermal conductivity piece section integrally in terms of, thermal conductivity piece is in thickness side
To thermal conductivity be 22.3-33.1W/mK, it is known that the thermal conductivity of thickness direction is good.Think the reason is that embodiment 1- is real
In the thermal conductivity piece for applying 6 gained of example, in the L*a*b* color specification systems when measuring the surface of thermal conductivity piece, indicate bright with " L* " value
It is 32.5 or more to spend L*, and therefore, asphalt base carbon fiber is orientated along the thickness direction of thermal conductivity piece, and thermal conductivity piece can be made in thickness
The thermal conductivity in direction is good.
On the other hand, the thermal conductivity of the thermal conductivity piece of 3 gained of comparative example 1- comparative examples is 20.2W/mK hereinafter, and embodiment
The thermal conductivity piece of 6 gained of 1- embodiments compares, it is known that the thermal conductivity of thickness direction is bad, it is believed that the reason is that comparative example 1-
In the thermal conductivity piece of 3 gained of comparative example, aluminium nitride is not contained in thermal conductivity piece, in addition, being used when measuring thermal conductivity piece surface
L*a*b* color specification systems in, the brightness L* indicated with " L* " value is not up to 32.5 or more.
(about ocular estimate)
The evaluation of fraction defective is, when being sliced into thermal conductivity piece by organosilicon solidfied material, is involved in gas according to the surface of thermal conductivity piece
The number of the piece with through-hole carries out in bubble or thermal conductivity piece.Have in bubble-free and piece whether there is or not through-hole, by visual observation thermal conductivity
The section of piece judges.
In the thermal conductivity piece of the gained of embodiment 1- embodiments 6, the surface of thermal conductivity piece is not involved in bubble, in thermal conductivity piece
There is no through-holes, therefore fraction defective is less than 5%, relatively low.
And in the thermal conductivity piece of 1 gained of comparative example, surface is involved in bubble, and in addition there are through-holes in piece, therefore fraction defective is
28%, it is higher.This is regarded as due to not containing aluminium nitride, the bad dispersibility of organosilicon resin composition in thermal conductivity piece.
The thermal conductivity piece of 2 gained of comparative example is to be manufactured by the way that coating is laminated, therefore compared with comparative example 1, the amount of bubble subtracts
It is few, in addition compared with comparative example 1, fraction defective can be reduced, but the orientation of asphalt base carbon fiber is chaotic, the deviation of thermal conductivity
Greatly.This is regarded as due to not containing aluminium nitride in thermal conductivity piece, and is led by the way that coating making organosilicon formed body is laminated
It causes.
In the thermal conductivity piece of 3 gained of comparative example, the surface of thermal conductivity piece is not involved in bubble, and is not present in thermal conductivity piece
Through-hole, therefore fraction defective is less than 5%, it is relatively low.But compared with embodiment 1- embodiments 6, thermal conductivity is bad.This be considered due to
Aluminium nitride is not contained in the thermal conductivity piece of 3 gained of comparative example, and the use level of aluminium oxide is excessively caused.
Symbol description
1 thermal conductivity piece, 2 column heat conductivity compositions, 3 ultrasonic cut-off machines, 4 ultrasonic cutters, 5 workbench, 6 are moved
Dynamic platform, 7 silicon rubber, 8 mobile mechanisms, 9 knives, 10 ultrasonic wave Fa Zhen mechanisms, 11 elevating mechanisms, 12 heat conductivity compositions,
13 extruders, 14 interim formed bodys, 14A lamilates, 15 frames, 16 formal formed bodys.
Claims (8)
1. a kind of thermal conductivity piece, which contains heat conductivity composition, which contains curable resin group
Close object, conducting filler and the packing material for making the conducting filler be arranged along prescribed direction, wherein
The conducting filler is orientated along the thickness direction of the thermal conductivity piece,
At least contain aluminium nitride as the packing material,
The L*a*b* color specification systems recorded in " JIS Z 8729 " and " JIS Z 8730 " when measuring the surface of the thermal conductivity piece
In, the brightness L* indicated with " L* " value is 32.5 or more.
2. the thermal conductivity piece of claim 1, wherein the thermal conductivity piece contains the aluminium nitride of 5.1 volume % or more.
3. the thermal conductivity piece of claim 2, wherein the thermal conductivity piece contains the spherical particle different from the grain size of the aluminium nitride
As the packing material.
4. the thermal conductivity piece of claim 3, wherein the spherical particle is alumina particle.
5. the thermal conductivity piece of any one of claim 1-4, wherein the conducting filler is carbon fiber, average fiber length
It is 100 μm or more.
6. a kind of manufacturing method of thermal conductivity piece, with following processes：
Heat conductivity composition production process, wherein make heat conductivity composition, which contains curable resin group
Close object, conducting filler and the packing material for making the conducting filler be arranged along prescribed direction；
Orientation procedure, wherein the heat conductivity composition made in the heat conductivity composition production process is formed as into column,
The conducting filler is set to be orientated along the columnar length direction simultaneously；With
Cut off operation, wherein by ultrasonic cut-off machine, by the columnar heat conductivity composition along vertical with length direction
The direction of intersection cuts into defined size, obtains thermal conductivity piece；
In the thermal conductivity piece, the conducting filler is orientated along the thickness direction of the thermal conductivity piece, at least contains nitridation
As the packing material, " JIS Z 8729 " and " JIS Z 8730 " when measuring the surface of the thermal conductivity piece is remembered aluminium
In the L*a*b* table color modes of load, the brightness L* indicated with " L* " value is 32.5 or more.
7. the manufacturing method of the thermal conductivity piece of claim 6, wherein
The orientation procedure includes following processes：
Interim molding procedure, wherein squeeze out the heat conductivity composition made in the heat conductivity composition production process
Machine squeezes out, and is shaped to the wherein described conducting filler along the interim formed body for squeezing out the elongate column that direction is orientated；
Alignment process, wherein multiple interim formed bodys are arranged with the direction that length direction intersects vertically with contiguous fashion, and
Multiple interim formed bodys of arrangement are disposed in the direction of intersection substantially vertical with the orientation, obtain lamilate；With
Formal molding procedure, wherein by making the lamilate cure, be shaped to wherein constitute multiple interim moldings of lamilate
The formal formed body that body is integrated with each other；
In the cut off operation, by ultrasonic cut-off machine, intersect vertically along the length direction with the formal formed body
Direction cuts into predetermined size, obtains the thermal conductivity piece.
8. a kind of thermal conductivity evaluation method, wherein " JIS Z 8729 " and " JIS when measuring the surface color of thermal conductivity piece
In L*a*b* color specification systems recorded in Z 8730 ", the brightness L indicated with " L* " value is used, the heat conduction of the thermal conductivity piece is evaluated
Rate, wherein the thermal conductivity piece contains heat conductivity composition, which contains hardening resin composition, thermal conductivity
Filler and make the packing material that the conducting filler is arranged along prescribed direction；
In the thermal conductivity piece, the conducting filler is orientated along the thickness direction of the thermal conductivity piece, at least contains aluminium nitride
As the packing material.
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| JP2011-278788 | 2011-12-20 | ||
| JP2011278788A JP6034562B2 (en) | 2011-12-20 | 2011-12-20 | Thermally conductive sheet and method for producing the thermally conductive sheet |
| CN201280061296.7A CN103975429B (en) | 2011-12-20 | 2012-12-18 | The manufacture method of thermal conductivity piece and thermal conductivity piece |
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| CN114746486A (en) * | 2020-02-21 | 2022-07-12 | 积水保力马科技株式会社 | Thermally conductive sheet and method for producing same |
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| JP6069112B2 (en) | 2013-06-19 | 2017-02-01 | デクセリアルズ株式会社 | Thermally conductive sheet and method for producing the thermally conductive sheet |
| JP2015073067A (en) * | 2013-09-06 | 2015-04-16 | バンドー化学株式会社 | Thermally conductive resin molded product |
| CN106573779B (en) * | 2014-12-02 | 2021-06-18 | 积水化学工业株式会社 | Heat conductive sheet and method for manufacturing same |
| JP6178389B2 (en) * | 2014-12-25 | 2017-08-09 | デクセリアルズ株式会社 | Method for manufacturing thermal conductive sheet, thermal conductive sheet, and semiconductor device |
| CN106810876B (en) * | 2015-12-02 | 2020-11-10 | 中国科学院金属研究所 | Composite material with directionally arranged fillers and preparation method thereof |
| KR102659683B1 (en) * | 2016-02-01 | 2024-04-19 | 반도 카가쿠 가부시키가이샤 | Thermal conductive resin molded products |
| CN107022196A (en) * | 2016-02-02 | 2017-08-08 | 中兴通讯股份有限公司 | Heat Conduction Material, its preparation method and heat-conducting piece |
| JP7164874B2 (en) * | 2017-01-19 | 2022-11-02 | 国立大学法人福井大学 | High thermal conductivity material and its manufacturing method |
| DE112019004695T5 (en) * | 2018-11-16 | 2021-06-10 | Fuji Polymer Industries Co., Ltd. | Thermally conductive film and process for its manufacture |
| JP6692512B1 (en) * | 2018-12-25 | 2020-05-13 | 富士高分子工業株式会社 | Thermally conductive composition and thermally conductive sheet using the same |
| WO2020137086A1 (en) * | 2018-12-25 | 2020-07-02 | 富士高分子工業株式会社 | Heat-conductive composition and heat-conductive sheet employing same |
| CN110625877B (en) * | 2019-09-05 | 2021-06-08 | 上海阿莱德实业股份有限公司 | Preparation method of heat-conducting interface material |
| CN112712944B (en) * | 2020-12-24 | 2022-04-08 | 武汉肯达科讯科技有限公司 | High-thermal-conductivity insulating gasket and preparation method thereof |
| CN115141460B (en) * | 2021-03-30 | 2023-09-01 | 太阳油墨（苏州）有限公司 | Thermosetting resin composition, cured product, and electronic component |
| CN114106564B (en) * | 2021-11-17 | 2023-08-29 | 深圳市鸿富诚新材料股份有限公司 | Oriented heat conduction gel, preparation method and application thereof |
| JP2023120623A (en) * | 2022-02-18 | 2023-08-30 | 信越化学工業株式会社 | Heat-conductive sheet and manufacturing method of heat-conductive sheet |
| JP2023179996A (en) * | 2022-06-08 | 2023-12-20 | デクセリアルズ株式会社 | Laminate and method for manufacturing the same |
| JP2023179992A (en) * | 2022-06-08 | 2023-12-20 | デクセリアルズ株式会社 | Laminate and method for manufacturing the same |
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| CN101087511A (en) * | 2006-06-08 | 2007-12-12 | 保力马科技株式会社 | Thermally conductive forming body and method of manufacturing the same |
| CN101275035A (en) * | 2007-03-27 | 2008-10-01 | 丰田合成株式会社 | Low electric conductivity high heat radiation polymeric composition and molded body |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114746486A (en) * | 2020-02-21 | 2022-07-12 | 积水保力马科技株式会社 | Thermally conductive sheet and method for producing same |
| CN114746486B (en) * | 2020-02-21 | 2023-11-07 | 积水保力马科技株式会社 | Thermally conductive sheet and method for producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013131563A (en) | 2013-07-04 |
| TW201341519A (en) | 2013-10-16 |
| TWI611013B (en) | 2018-01-11 |
| CN108384248B (en) | 2021-10-19 |
| CN103975429A (en) | 2014-08-06 |
| JP6034562B2 (en) | 2016-11-30 |
| CN103975429B (en) | 2018-03-30 |
| WO2013094613A1 (en) | 2013-06-27 |
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