KR20120130866A - Composition of film for dissipating heat, and manufacturing method of film for dissipating heat using thereof - Google Patents

Abstract

PURPOSE: A composition for a heat-radiating film is provided to have sufficient strength while having excellent thermal conductivity. CONSTITUTION: A composition for a heat-radiating film comprises PP, PE, HD/PE, EVA, ZnO, C(carbon, graphite, carbon), carbon nanotubes, MgO(magnesium oxide), PEROXLDELLD, LLD, PE(octene-based), SIC(silicon carbide), Si6O3H3(siloxane), a stabilizer, Al2O3(aluminum oxide) and carbon black. A preparing method of a heat-radiating film using the composition for a heat-radiating film comprises: a step of preparing the composition for a heat-radiating film and a step of forming a material for a heat-radiating film by mixing the composition in a mixer. [Reference numerals] (AA) Start; (BB) End; (S1) Step of putting fillers selected from ZnO, C, CNT, MgO, AL_2O_3, SiC, Si_6O_3H_3 into heat-drier to dry; (S2) Step of putting carbon into carbon to dry; (S3) Step of drying CNT in thermal dryer and mixing; (S4) Step of mixing ZnO and MgO; (S5) Step of mixing AL_2O_3; (S6) Step of mixing SiC; (S7) Step of mixing LD/PE, HD/PE, PP/PE, EVA; (S8) Step of putting peroxide(nucleating agent) into a mixer; (S9) Step of putting LLP/PE in and mixing

Description

COMPOSITION OF FILM FOR DISSIPATING HEAT, AND MANUFACTURING METHOD OF FILM FOR DISSIPATING HEAT USING THEREOF

The present invention relates to a heat dissipation film technology, and more particularly, to a composition for a heat dissipation film having excellent thermal conductivity and at the same time sufficient strength and a method for producing a heat dissipation film using the same.

As a thermally conductive electrical insulating material, conventionally, a compound in which beryllium oxide, aluminum oxide, aluminum hydroxide, magnesium oxide, zinc oxide or the like is blended with silicon rubber (see Japanese Patent Application Laid-Open No. 47-32400) or boron nitride in silicon rubber And reinforcement with a mesh insulating material (see Japanese Laid-Open Utility Model No. 54-184074).

These are used as heat dissipation insulation materials for heat transistors such as power transistors, thyristors, rectifiers, transformers, or power MOSs or FETs. However, when such a material is used under high temperature conditions of 200 ° C or higher, there is a drawback that silicone rubber deteriorates due to the influence of impurities or pH in the thermally conductive powder.

In addition, since these heat dissipating resin compositions are made of a heat dissipating sheet and attached to the back of a panel such as a plasma display panel (PDP), an adhesive tape is used to reduce the thermal conductivity of the heat dissipating sheet itself, thereby greatly reducing the heat dissipation effect. In addition to the deterioration, the heat dissipation sheet has little elastic force and thus has a weak disadvantage in impact.

Accordingly, in the technical field, there is a demand for technology development for manufacturing a heat radiation film having excellent thermal conductivity.

The present invention is to solve the above problems, to provide a composition for a heat radiation film having excellent thermal conductivity and at the same time sufficient strength and a method for producing a heat radiation film using the same.

In addition, the present invention is to provide a heat dissipating film composition for producing a heat dissipating film having excellent strength and sufficient electrical insulation and excellent electrical insulation by using a heat dissipating film composition and a method for producing a heat dissipating film using the same. .

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

Composition for a heat radiation film according to an embodiment of the present invention to achieve the above object, PP, PE, HD / PE, EVA, ZnO (zinc), C (carbon, graphite, carbon), CNT (carbon nanotube) Composition including, MgO (magnesium oxide), PEROXLDELLD, LLD, PE (octene series), SIC (silicon carbide), Si ₆ O ₃ H ₃ (siloxane), stabilizer, Al ₂ O ₃ (aluminum oxide) and BLACK carbon It is characterized by.

In the method for manufacturing a heat dissipation film using the composition for heat dissipation film according to an embodiment of the present invention, the water may contain a filler selected from ZnO, C, CNT, MgO, Al ₂ O ₃ , SIC, Si ₆ O ₃ H ₃ . Since the first step of drying in a heat dryer for 3 hours to 4 hours; A second step of mixing C (graphite) and C (carbon) in an amount of 2% of the amount desired to be dried in a heat dryer; A third step of mixing 0.5% to 1% of the amount to produce CNTs in a heat dryer with the material produced in the second step; A fourth step of drying in a heat dryer at 1% of ZnO and 2% of MgO, followed by drying; A fifth step of drying after mixing in a heat dryer at 8 to 10% of the amount to make Al ₂ O ₃ ; A sixth step of drying the mixture by adding it to a heat dryer at 0.8% of the amount to make SIC; A seventh step of mixing LD / PE, HD / PE, PP / PE, EVA; An eighth step of mixing 2% of the amount of PEROXLDE (nucleating agent) and 1% of the amount of antioxidant to be mixed into the blender together with the mixture of step 7 to form a heat radiation film member; And a control unit.

In the method for producing a heat dissipation film using a heat dissipation film composition according to another embodiment of the present invention, the first step is characterized in that the temperature of the heat dryer is set to 65 to 110 ℃.

In the method of manufacturing a heat dissipation film using a composition for heat dissipation film according to another embodiment of the present invention, the seventh step is to make 28% of the amount to be made when using LD / PE, when using LLD / PE (octene series) It is characterized by using at 34% of the amount.

In the method of manufacturing a heat dissipation film using a heat dissipation film composition according to another embodiment of the present invention, the seventh step is to make 32% of the amount to be made when using HD / PE, when using LLD / PE (octene series) It is characterized by using as 30% of the amount to be.

In the method of manufacturing a heat dissipation film using a heat dissipation film composition according to another embodiment of the present invention, the seventh step, 35% of the amount to be made when using PP / PE, to make when using LLD / PE (octene series) It is characterized by using 25% of the amount.

In the method for manufacturing a heat dissipation film using a heat dissipation film composition according to another embodiment of the present invention, the seventh step, 10% of the amount to be made when using EVA, 30% of the amount to be made when using LD / PE, LLD When / PE (octene series) is used, it is characterized by using 26% of the amount to be made.

According to another embodiment of the present invention, a method of manufacturing a heat dissipation film using a heat dissipation film composition may be performed after the eighth step. When the heat dissipation film member is generated, lubricating a metal surface in contact with plastic may help flow. Preparing a mechanical temperature by adding 1% of an amount to be added to the main material and a compound that maintains the physical and chemical properties of the resin during use of the finished product; And performing extrusion molding; To further include, in order to produce a heat dissipation film in the production process while increasing the amount corresponding to 1% of the amount to be made of CNT, 3% of the amount to be made Al ₂ O ₃ characterized in that the production of insulating high thermal conductivity heat radiation film .

In the method of manufacturing a heat dissipation film using a heat dissipation film composition according to another embodiment of the present invention, the step of performing the extrusion molding is made of any one of a cubed molded film, a Ti-die molded film, a calendar-type processed molded film It is characterized by.

The heat dissipation film composition and the method of manufacturing the heat dissipation film using the same according to an embodiment of the present invention is characterized by having excellent thermal conductivity and at the same time sufficient strength.

In addition, the heat dissipation film composition and the method of manufacturing the heat dissipation film using the same according to another embodiment of the present invention, excellent thermal conductivity using the heat dissipation film zero composition, yet has sufficient strength and further provides good electrical insulation effect. do.

1 is a flow chart showing a manufacturing method of a heat radiation film using a composition for heat radiation film according to an embodiment of the present invention.
Figure 2 is a flow chart for explaining the manufacturing process of the heat radiation sheet according to the embodiment of the present invention.
3 is a test report of the heat radiation film according to an embodiment of the present invention
4 to 5 is a test result of the heat radiation film sample according to an embodiment of the present invention

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

In the present invention, a composition for a heat radiation film and a method of manufacturing a heat radiation film using the same are disclosed. Heat dissipation film according to the present invention is a heat dissipation sheet used in various electronic products, in particular LED (TV, monitor, notebook, lighting) or LCD products, heat conduction film used in the PCB substrate, mobile, adapter, navigation, etc. Used for products.

The heat dissipation film according to the embodiment of the present invention is insulated by the plastic raw material PE, PP, HD / PE, EVA main raw material, and the thermal conductivity is mixed as a medium to perform injection, extrusion molding.

According to the extrusion molding can be produced in the desired thickness by controlling the thickness of the film during production. The heat-dissipating film thus prepared is used for the purpose of insulation and heat conduction in electrical and electronic products to be used in a film form or injection molding by being flexible with high thermal conductivity.

In the composition for a heat radiation film according to the present invention is used a blending material of the composition shown in Table 1.

PP, PE, HD / PE, EVA Excellent insulation ZnO (Zinc) Oxygen and zinc compound, light powder, called zinc and zinc bag, using pigment and pharmaceutical raw materials, and good thermal conductivity C (carbon, graphite, carbon) Graphite is an isomer of carbon with metallic luster. When graphite and carbon particles are more than 0.3u / mm, they are applied as additives because of their excellent electrical conductivity as well as thermal conductivity, and they have advantages such as ease of diffusion while reducing the influence of chemically safe polymers. CNT (carbon nanotube) Hexagonal carbons are nanometers of billions of molecules long. Tensile strength, 100 times stronger than steel, and excellent in flexibility, thermal conductivity, and is equivalent to diamond. MgO (Magnesium Oxide)  Although it is a white powder, crystals of equiaxed crystals are precipitated in the solution dissolved with lead acid and easily dissolved in ammonia. In addition, heat dissipation, or heat conduction, is good, and has electrical and insulating properties, and is used as a flame retardant pigment and a pigment. PEROXLDE It accelerates the crystallization rate of the polymer and refines the crystal size. By increasing the rate of crystallization, the cycle time is shortened. It can be widely used as an additive to control the secondary structure. It is also excellent at increasing macromolecules. LLD, PE (Octene series) Excellent elongation and tensile strength. SIC (silicon carbide) Excellent thermal conductivity Si ₆ O ₃ H ₃ (siloxane) Excellent thermal conductivity stabilizator It is a compound that is mixed with several resins to help maintain the physical and chemical properties of the resin during the processing and use of the finished product. Al ₂ O ₃ (aluminum oxide) Alkaline Metallic (Industrial Terms) Alumina Molecular weight 101.96 is pure and stable and has good thermal conductivity. BLACK carbon Substances added for the purpose of increasing anti-aging reinforcement for practical use of filler plastics

On the other hand, the manufacturing method of the heat radiation film using the composition for heat radiation film according to the embodiment of the present invention is the same as FIG. Referring to FIG. 1, the filler selected from ZnO, C, CNT, MgO, Al 2 O 3, SIC, and Si 6 O 3 H 3 may contain moisture, followed by drying in a heat dryer for 3 hours to 4 hours (S1). In this case, the temperature of the heat dryer is set to 65 to 110 ℃.

After step S1, C (graphite) and C (carbon) are mixed to 2% of the amount to be made and dried in a heat dryer (S2).

After step S2, 0.5% to 1% of the amount to make CNT is put into a heat dryer and mixed with the material produced in the drying step S2 (S3).

1% of the amount to make ZnO, 2% of the amount to make MgO, put in a heat dryer in the same manner as in step (S2) and mixed (S4).

After step S4, 8-10% of the amount to make Al2O3 is mixed in the same manner as step S2 (S5).

After step S5, 0.8% of the amount to make SIC is mixed in the same manner as step S2 (S6).

Then, LD / PE, HD / PE, PP / PE, EVA are mixed (S7).

More specifically, it is used in the combination of 1) to 4) as follows. First, use 1) 28% of the amount to be made when using LD / PE, and 34% of the amount to be made when using LLD / PE (octene series).

2) 32% of the amount to be made when using HD / PE, and 30% of the amount to be made when using LLD / PE (octene series).

3) Use 35% of the amount to be made when using PP / PE and 25% of the amount to be made when using LLD / PE (octene series).

4) Use 10% of the amount to be made when using EVA, 30% of the amount to be made when using LD / PE, and 26% of the amount to be made when using LLD / PE (octene series).

On the other hand, assuming 28% of the amount to make the selected LD / PE, 2% of the amount to make PEROXLDE (nucleating agent), 1% of the amount to make the antioxidant is put in the blender in step (S7) Mix (S8).

At this time, the rotation of the blender is 100 minutes to 150 rotations for 5 minutes, then LLD / PE 20% after the input, and then mixed at 150 rotations for 10 minutes (S9).

After the step S9 is completed, the machine is operated by an extrusion molding (reader) method to produce a heat radiation film. At this time, the M / B (masterbatch) temperature of the extruder is cylinder C130 C145 C150 D160 (temperature varies slightly due to machine aging) when selecting 1) of the machine temperature step (S7). Produce a film member.

Note that when using as C1, C2, C3 (cylinder), when natural heat is generated, change in physical properties will be produced with caution. The heat radiation film thus formed is obtained with a thermal conductivity of 2.5 W / mK (experimental results of the Korea Institute of Industrial Testing)

ZnO 2%, MgO 3%, SIC6 0.8% SIC selected on steps S1 to S9 are not mixed to 0.8%. When C (graphite) is produced at 15% each and Al2O3 is produced at 13% content compared to LD / PE, the thermal conductivity is 1.1 W / mK when the first test is conducted.

Meanwhile, in the first test, 20% graphite, 10% Al2O3, 3% CNT, and 2% nucleating agent and 1% stabilizing agent were produced in a content of LD / PE (including LLD / PE) and then produced. If tested, thermal conductivity of 2.4W / mK is obtained.

On the other hand, when 2% less CNT is used in the second test, a thermal conductivity of 1.35 W / mK is obtained. (Test result of Korea Institute of Technology)

In another embodiment, a heat radiation film member having an insulating high thermal conductivity or low thermal conductivity may be produced when compounding by increasing or decreasing the selected filler.

2 is a flowchart illustrating a manufacturing process of a heat radiation sheet according to an embodiment of the present invention. Referring to FIG. 2, when the heat-dissipating film member of FIG. 1 is generated, the physical and chemical properties of the resin during use of the finished product and the material to help flow by lubricating the metal surface in contact with the plastic when extruded to 100% Add 1% of the amount to make the compound to maintain the addition is prepared by checking the mechanical temperature (S11).

On the other hand, performing extrusion molding (S12), 1) under-tube molding film (R / L operation), 2) Ti-die molding film (R / L operation), 3) calendar type processed molding film (R / L operation) It is prepared by either. All three are film controllable with adjustable thickness.

After the step (S12), to produce a heat radiation film to increase the amount corresponding to 1% of the amount to be made of CNT, 3% of the amount to be made Al2O3 during the production process can be prepared insulated high thermal conductivity heat radiation film (S13).

At this time, the mechanical temperature of the heat radiation film member can be manufactured while adjusting according to the C1 C2 C3 mechanical aging, it should be noted that the operation is not made if there is moisture in the heat radiation film member.

3 is also a test report of the heat radiation film according to the embodiment of the present invention, Figures 4 to 5 show the test results of the heat radiation film sample according to the embodiment of the present invention.

The specific heat capacity was measured with a differential scanning calorimeter (KS M ISO 11357-4 plastic) in a (23 ± 2) ℃ 60% environment using a DSC apparatus and a thermal diffusivity meter as shown in the accompanying Figures 4 to 5, Density and specific gravity of KS M 3016 plastics were measured and thermal diffusivity, specific heat capacity and thermal conductivity by laser flash method (KS L 1604 fine ceramics) of monolithic ceramics were tested.

As a result of the above test, the heat dissipation film of the present invention had a specific heat of 1.65 (J / g ° C) at 25 ° C. This shows that the specific heat of ordinary vinyl is 0.2 to 0.3. The heat conductive heat-dissipating film of the present invention is composed of a vinyl component, but it can be seen that the specific heat of ordinary vinyl is significantly higher.

And, when the density and specific gravity of the plastic is measured 1.333 of the thermal conductive film, the specific gravity of the vinyl is about 0.92 it can be seen that the heat dissipation film of the present invention is rather high specific gravity.

In addition, the heat dissipation film has a thermal diffusion rate of 0.61 (m ㎡ / s) at 25 ℃ and exhibits a thermal diffusivity of 0.1 to 0.2 than a normal vinyl film, the thermal conductive heat dissipation film of the present invention is a vinyl component as a main raw material It was confirmed by a test that the thermal diffusivity is somewhat higher than this ordinary vinyl film.

The thermal conductivity of the heat dissipation film according to the present invention was confirmed 1.35 (W / mK) at 25 ℃, which is a common heat dissipation film of 0.2 to 0.25 thermal conductivity of the heat dissipation film of the present invention according to the test results was excellent can confirm.

The test results as described above are officially requested to the Korea Industrial Technology Testing Institute as shown in Figure 3 attached to the results confirmed on the official test report that the heat dissipation film of the present invention is excellent in specific heat, thermal diffusion rate and thermal conductivity Can be.

As described above, the specification and the drawings have been described with respect to the preferred embodiments of the present invention, although specific terms are used, it is only used in a general sense to easily explain the technical contents of the present invention and to help the understanding of the invention. It is not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

Claims (9)

PP, PE, HD / PE, EVA, ZnO (Zinc), C (Carbon, Graphite, Carbon), CNT (Carbon Nanotube), MgO (Magnesium Oxide), PEROXLDELLD, LLD, PE (Octene), SIC (Carbon) Silicon), Si ₆ O ₃ H ₃ (siloxane), stabilizer, Al ₂ O ₃ (aluminum oxide) and a composition for a heat radiation film comprising a black carbon.
A first step of drying the filler selected from ZnO, C, CNT, MgO, Al ₂ O ₃ , SIC, and Si ₆ O ₃ H ₃ because it may contain water, and then drying in a heat dryer for 3 to 4 hours;
A second step of mixing C (graphite) and C (carbon) in an amount of 2% of the amount desired to be dried in a heat dryer;
A third step of mixing 0.5% to 1% of the amount to produce CNTs in a heat dryer with the material produced in the second step;
A fourth step of drying in a heat dryer at 1% of ZnO and 2% of MgO, followed by drying;
A fifth step of drying after mixing in a heat dryer at 8 to 10% of the amount to make Al ₂ O ₃ ;
A sixth step of drying the mixture by adding it to a heat dryer at 0.8% of the amount to make SIC;
A seventh step of mixing LD / PE, HD / PE, PP / PE, EVA;
An eighth step of mixing 2% of the amount of PEROXLDE (nucleating agent) and 1% of the amount of antioxidant to be mixed into the blender together with the mixture of step 7 to form a heat radiation film member; Method for producing a heat dissipation film using a heat dissipation film composition comprising a.
The method of claim 2, wherein the first step,
Method for producing a heat-dissipating film using a heat-dissipating film composition, characterized in that the temperature of the heat dryer is set to 65 to 110 ℃.
The method of claim 2, wherein the seventh step,
Method for producing a heat-dissipating film using a composition for a heat-dissipating film, characterized in that the use of LD / PE 28% of the amount to be made, LLD / PE (octene-based) using 34% of the amount to be made.
The method of claim 2, wherein the seventh step,
32% of the amount to be made when using HD / PE, 30% of the amount to be made when using LLD / PE (octene-based) method for producing a heat-dissipating film using a heat-dissipating composition, characterized in that used.
The method of claim 2, wherein the seventh step,
35% of the amount to be made when using PP / PE, 25% of the amount to be made when using LLD / PE (octene-based) method for producing a heat-dissipating film using a heat-dissipating composition, characterized in that the use.
The method of claim 2, wherein the seventh step,
10% of the amount to be made when using EVA, 30% of the amount to be made when using LD / PE, and 26% of the amount to be made when using LLD / PE (octene series) Method for producing a film.
The method of claim 2, wherein the step is performed after the eighth step,
When the heat-dissipating film member is produced, mechanically by adding 1% of the amount to make the lubrication of the metal surface in contact with the plastic to aid the flow and the compound to maintain the physical and chemical properties of the resin during use of the finished product Confirming and preparing the temperature; And
Further comprising performing extrusion molding,
To produce a heat dissipating film, the composition for heat dissipating film, characterized in that to produce an insulating high thermal conductivity heat dissipating film while increasing to an amount corresponding to 1% of the amount to make CNT, 3% of the amount to make Al ₂ O ₃ during the production process Method for producing a thermal radiation film used.
The method of claim 8, wherein performing the extrusion molding,
A method for producing a heat dissipation film using a composition for heat dissipation film, characterized in that it is made of any one of a cubed molded film, a Ti-die molded film, and a calendar-type processed molded film.

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