JP6034562B2 - 熱伝導性シート及び熱伝導性シートの製造方法 - Google Patents

熱伝導性シート及び熱伝導性シートの製造方法 Download PDF

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Publication number
JP6034562B2
JP6034562B2 JP2011278788A JP2011278788A JP6034562B2 JP 6034562 B2 JP6034562 B2 JP 6034562B2 JP 2011278788 A JP2011278788 A JP 2011278788A JP 2011278788 A JP2011278788 A JP 2011278788A JP 6034562 B2 JP6034562 B2 JP 6034562B2
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Japan
Prior art keywords
conductive sheet
thermally conductive
heat conductive
filler
heat
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JP2011278788A
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English (en)
Japanese (ja)
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JP2013131563A (ja
JP2013131563A5 (https=
Inventor
荒巻　慶輔
慶輔 荒巻
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Dexerials Corp
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Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2011278788A priority Critical patent/JP6034562B2/ja
Priority to PCT/JP2012/082817 priority patent/WO2013094613A1/ja
Priority to CN201810153894.6A priority patent/CN108384248B/zh
Priority to CN201280061296.7A priority patent/CN103975429B/zh
Priority to TW101148546A priority patent/TWI611013B/zh
Publication of JP2013131563A publication Critical patent/JP2013131563A/ja
Publication of JP2013131563A5 publication Critical patent/JP2013131563A5/ja
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Publication of JP6034562B2 publication Critical patent/JP6034562B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2011278788A 2011-12-20 2011-12-20 熱伝導性シート及び熱伝導性シートの製造方法 Active JP6034562B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011278788A JP6034562B2 (ja) 2011-12-20 2011-12-20 熱伝導性シート及び熱伝導性シートの製造方法
PCT/JP2012/082817 WO2013094613A1 (ja) 2011-12-20 2012-12-18 熱伝導性シート及び熱伝導性シートの製造方法
CN201810153894.6A CN108384248B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法
CN201280061296.7A CN103975429B (zh) 2011-12-20 2012-12-18 导热性片以及导热性片的制造方法
TW101148546A TWI611013B (zh) 2011-12-20 2012-12-20 熱傳導性片及熱傳導性片之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011278788A JP6034562B2 (ja) 2011-12-20 2011-12-20 熱伝導性シート及び熱伝導性シートの製造方法

Publications (3)

Publication Number Publication Date
JP2013131563A JP2013131563A (ja) 2013-07-04
JP2013131563A5 JP2013131563A5 (https=) 2015-02-19
JP6034562B2 true JP6034562B2 (ja) 2016-11-30

Family

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Family Applications (1)

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JP2011278788A Active JP6034562B2 (ja) 2011-12-20 2011-12-20 熱伝導性シート及び熱伝導性シートの製造方法

Country Status (4)

Country Link
JP (1) JP6034562B2 (https=)
CN (2) CN103975429B (https=)
TW (1) TWI611013B (https=)
WO (1) WO2013094613A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6069112B2 (ja) * 2013-06-19 2017-02-01 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP2015073067A (ja) * 2013-09-06 2015-04-16 バンドー化学株式会社 熱伝導性樹脂成形品
KR20170091508A (ko) * 2014-12-02 2017-08-09 세키스이가가쿠 고교가부시키가이샤 열전도 시트 및 그의 제조 방법
JP6178389B2 (ja) * 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
CN106810876B (zh) * 2015-12-02 2020-11-10 中国科学院金属研究所 一种填料定向排布的复合材料及其制备方法
KR102659683B1 (ko) * 2016-02-01 2024-04-19 반도 카가쿠 가부시키가이샤 열전도성 수지 성형품
CN107022196A (zh) * 2016-02-02 2017-08-08 中兴通讯股份有限公司 导热材料、其制备方法及导热件
EP3575366A4 (en) * 2017-01-19 2020-10-28 University of Fukui MATERIAL WITH HIGH THERMAL CONDUCTIVITY AND ITS PRODUCTION PROCESS
US20210070952A1 (en) * 2018-11-16 2021-03-11 Fuji Polymer Industries Co., Ltd. Heat-conductive sheet and method for manufacturing same
EP3753993B1 (en) 2018-12-25 2024-10-16 Fuji Polymer Industries Co., Ltd. Heat-conductive composition and heat-conductive sheet employing same
CN112041411B (zh) * 2018-12-25 2022-04-01 富士高分子工业株式会社 导热性组合物及使用了其的导热性片材
CN110625877B (zh) * 2019-09-05 2021-06-08 上海阿莱德实业股份有限公司 一种导热界面材料的制备方法
JP7458775B2 (ja) * 2019-12-24 2024-04-01 デクセリアルズ株式会社 熱伝導性成形体の製造方法
JP6884456B1 (ja) 2020-02-21 2021-06-09 積水ポリマテック株式会社 熱伝導性シート及びその製造方法
CN112712944B (zh) * 2020-12-24 2022-04-08 武汉肯达科讯科技有限公司 一种高导热绝缘垫片及其制备方法
CN115141460B (zh) * 2021-03-30 2023-09-01 太阳油墨（苏州）有限公司 热固性树脂组合物、固化物以及电子部件
CN114106564B (zh) * 2021-11-17 2023-08-29 深圳市鸿富诚新材料股份有限公司 一种取向型导热凝胶、制备方法及其应用
JP7752544B2 (ja) * 2022-02-18 2025-10-10 信越化学工業株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP2023179996A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法
JP2023179989A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法
JP2023179992A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4545246B2 (ja) * 1999-06-02 2010-09-15 電気化学工業株式会社 熱伝導性シリコーン成形体の製造方法
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
JP2006124206A (ja) * 2004-10-27 2006-05-18 Sumitomo Electric Ind Ltd 窒化アルミニウム脱脂中間体及び焼結体
JP4897360B2 (ja) * 2006-06-08 2012-03-14 ポリマテック株式会社 熱伝導性成形体及びその製造方法
WO2008085999A1 (en) * 2007-01-10 2008-07-17 Momentive Performance Materials Inc. Thermal interface materials and methods for making thereof
JP2008266586A (ja) * 2007-03-27 2008-11-06 Toyoda Gosei Co Ltd 低電気伝導性高放熱性高分子材料及び成形体

Also Published As

Publication number Publication date
CN108384248B (zh) 2021-10-19
CN103975429A (zh) 2014-08-06
TWI611013B (zh) 2018-01-11
CN103975429B (zh) 2018-03-30
JP2013131563A (ja) 2013-07-04
CN108384248A (zh) 2018-08-10
TW201341519A (zh) 2013-10-16
WO2013094613A1 (ja) 2013-06-27

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