TWI611013B - 熱傳導性片及熱傳導性片之製造方法 - Google Patents

熱傳導性片及熱傳導性片之製造方法 Download PDF

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Publication number
TWI611013B
TWI611013B TW101148546A TW101148546A TWI611013B TW I611013 B TWI611013 B TW I611013B TW 101148546 A TW101148546 A TW 101148546A TW 101148546 A TW101148546 A TW 101148546A TW I611013 B TWI611013 B TW I611013B
Authority
TW
Taiwan
Prior art keywords
thermally conductive
conductive sheet
filler
composition
jis
Prior art date
Application number
TW101148546A
Other languages
English (en)
Chinese (zh)
Other versions
TW201341519A (zh
Inventor
荒卷慶輔
Original Assignee
迪睿合股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 迪睿合股份有限公司 filed Critical 迪睿合股份有限公司
Publication of TW201341519A publication Critical patent/TW201341519A/zh
Application granted granted Critical
Publication of TWI611013B publication Critical patent/TWI611013B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW101148546A 2011-12-20 2012-12-20 熱傳導性片及熱傳導性片之製造方法 TWI611013B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2011-278788 2011-12-20
JP2011278788A JP6034562B2 (ja) 2011-12-20 2011-12-20 熱伝導性シート及び熱伝導性シートの製造方法

Publications (2)

Publication Number Publication Date
TW201341519A TW201341519A (zh) 2013-10-16
TWI611013B true TWI611013B (zh) 2018-01-11

Family

ID=48668500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101148546A TWI611013B (zh) 2011-12-20 2012-12-20 熱傳導性片及熱傳導性片之製造方法

Country Status (4)

Country Link
JP (1) JP6034562B2 (https=)
CN (2) CN103975429B (https=)
TW (1) TWI611013B (https=)
WO (1) WO2013094613A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6069112B2 (ja) * 2013-06-19 2017-02-01 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP2015073067A (ja) * 2013-09-06 2015-04-16 バンドー化学株式会社 熱伝導性樹脂成形品
KR20170091508A (ko) * 2014-12-02 2017-08-09 세키스이가가쿠 고교가부시키가이샤 열전도 시트 및 그의 제조 방법
JP6178389B2 (ja) * 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
CN106810876B (zh) * 2015-12-02 2020-11-10 中国科学院金属研究所 一种填料定向排布的复合材料及其制备方法
KR102659683B1 (ko) * 2016-02-01 2024-04-19 반도 카가쿠 가부시키가이샤 열전도성 수지 성형품
CN107022196A (zh) * 2016-02-02 2017-08-08 中兴通讯股份有限公司 导热材料、其制备方法及导热件
EP3575366A4 (en) * 2017-01-19 2020-10-28 University of Fukui MATERIAL WITH HIGH THERMAL CONDUCTIVITY AND ITS PRODUCTION PROCESS
US20210070952A1 (en) * 2018-11-16 2021-03-11 Fuji Polymer Industries Co., Ltd. Heat-conductive sheet and method for manufacturing same
EP3753993B1 (en) 2018-12-25 2024-10-16 Fuji Polymer Industries Co., Ltd. Heat-conductive composition and heat-conductive sheet employing same
CN112041411B (zh) * 2018-12-25 2022-04-01 富士高分子工业株式会社 导热性组合物及使用了其的导热性片材
CN110625877B (zh) * 2019-09-05 2021-06-08 上海阿莱德实业股份有限公司 一种导热界面材料的制备方法
JP7458775B2 (ja) * 2019-12-24 2024-04-01 デクセリアルズ株式会社 熱伝導性成形体の製造方法
JP6884456B1 (ja) 2020-02-21 2021-06-09 積水ポリマテック株式会社 熱伝導性シート及びその製造方法
CN112712944B (zh) * 2020-12-24 2022-04-08 武汉肯达科讯科技有限公司 一种高导热绝缘垫片及其制备方法
CN115141460B (zh) * 2021-03-30 2023-09-01 太阳油墨（苏州）有限公司 热固性树脂组合物、固化物以及电子部件
CN114106564B (zh) * 2021-11-17 2023-08-29 深圳市鸿富诚新材料股份有限公司 一种取向型导热凝胶、制备方法及其应用
JP7752544B2 (ja) * 2022-02-18 2025-10-10 信越化学工業株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP2023179996A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法
JP2023179989A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法
JP2023179992A (ja) * 2022-06-08 2023-12-20 デクセリアルズ株式会社 積層体及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101087511A (zh) * 2006-06-08 2007-12-12 保力马科技株式会社 导热性成形体及其制造方法

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JP4545246B2 (ja) * 1999-06-02 2010-09-15 電気化学工業株式会社 熱伝導性シリコーン成形体の製造方法
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
JP2006124206A (ja) * 2004-10-27 2006-05-18 Sumitomo Electric Ind Ltd 窒化アルミニウム脱脂中間体及び焼結体
WO2008085999A1 (en) * 2007-01-10 2008-07-17 Momentive Performance Materials Inc. Thermal interface materials and methods for making thereof
JP2008266586A (ja) * 2007-03-27 2008-11-06 Toyoda Gosei Co Ltd 低電気伝導性高放熱性高分子材料及び成形体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101087511A (zh) * 2006-06-08 2007-12-12 保力马科技株式会社 导热性成形体及其制造方法

Also Published As

Publication number Publication date
JP6034562B2 (ja) 2016-11-30
CN108384248B (zh) 2021-10-19
CN103975429A (zh) 2014-08-06
CN103975429B (zh) 2018-03-30
JP2013131563A (ja) 2013-07-04
CN108384248A (zh) 2018-08-10
TW201341519A (zh) 2013-10-16
WO2013094613A1 (ja) 2013-06-27

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