CN103917040B - 电路基板、电路基板的制造方法和电子组件 - Google Patents

电路基板、电路基板的制造方法和电子组件 Download PDF

Info

Publication number
CN103917040B
CN103917040B CN201410001411.2A CN201410001411A CN103917040B CN 103917040 B CN103917040 B CN 103917040B CN 201410001411 A CN201410001411 A CN 201410001411A CN 103917040 B CN103917040 B CN 103917040B
Authority
CN
China
Prior art keywords
circuit substrate
chip
pattern
resist
assembly section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410001411.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN103917040A (zh
Inventor
浅见博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN103917040A publication Critical patent/CN103917040A/zh
Application granted granted Critical
Publication of CN103917040B publication Critical patent/CN103917040B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN201410001411.2A 2013-01-09 2014-01-02 电路基板、电路基板的制造方法和电子组件 Expired - Fee Related CN103917040B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013001853A JP6007796B2 (ja) 2013-01-09 2013-01-09 回路基板の製造方法
JP2013-001853 2013-01-09

Publications (2)

Publication Number Publication Date
CN103917040A CN103917040A (zh) 2014-07-09
CN103917040B true CN103917040B (zh) 2017-09-08

Family

ID=51042336

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410001411.2A Expired - Fee Related CN103917040B (zh) 2013-01-09 2014-01-02 电路基板、电路基板的制造方法和电子组件

Country Status (4)

Country Link
US (1) US9918388B2 (https=)
JP (1) JP6007796B2 (https=)
CN (1) CN103917040B (https=)
TW (1) TWI633812B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104733359A (zh) * 2015-03-24 2015-06-24 王春 一种高效、节能金属图形线路速成的ept
US10014268B2 (en) * 2016-03-01 2018-07-03 Advanced Semiconductor Engineering, Inc. Semiconductor chip, semiconductor device and manufacturing process for manufacturing the same
EP3433603B1 (en) 2016-07-19 2020-01-29 HP Indigo B.V. Assessment of primer content on a print substrate
US10643863B2 (en) * 2017-08-24 2020-05-05 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
CN112313032A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 各向异性导电膜及其制造方法以及连接结构体的制造方法
US12172240B2 (en) 2018-06-26 2024-12-24 Resonac Corporation Solder particles
CN114420003B (zh) * 2022-01-17 2024-01-02 深圳市思坦科技有限公司 集成式led结构及制备方法
TWI787063B (zh) * 2022-01-19 2022-12-11 友達光電股份有限公司 基板結構
US12595578B1 (en) * 2022-06-22 2026-04-07 Consolidated Nuclear Security, LLC Production of metals from metal oxides

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251704B1 (en) * 1997-12-25 2001-06-26 Oki Electric Industry Co., Ltd. Method of manufacturing semiconductor devices having solder bumps with reduced cracks
TW200417299A (en) * 1998-08-10 2004-09-01 Fujitsu Ltd Method of mounting electronic component

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6440174A (en) * 1987-08-04 1989-02-10 Taruchin Kk Soldering method
JP3362079B2 (ja) 1993-05-12 2003-01-07 昭和電工株式会社 はんだ粉末定着方法
US5686318A (en) * 1995-12-22 1997-11-11 Micron Technology, Inc. Method of forming a die-to-insert permanent connection
JP4087876B2 (ja) * 1998-08-10 2008-05-21 富士通株式会社 ハンダバンプの形成方法
JP3420076B2 (ja) 1998-08-31 2003-06-23 新光電気工業株式会社 フリップチップ実装基板の製造方法及びフリップチップ実装基板及びフリップチップ実装構造
KR100723454B1 (ko) * 2004-08-21 2007-05-30 페어차일드코리아반도체 주식회사 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법
CN100473259C (zh) * 2004-04-13 2009-03-25 纬创资通股份有限公司 电路板组装方法与结构及用以组装该结构的工装用具
US7928591B2 (en) * 2005-02-11 2011-04-19 Wintec Industries, Inc. Apparatus and method for predetermined component placement to a target platform
JP5104460B2 (ja) * 2008-03-28 2012-12-19 富士通株式会社 突起電極を有する基板の製造方法
JP5456545B2 (ja) * 2009-04-28 2014-04-02 昭和電工株式会社 回路基板の製造方法
JP5658442B2 (ja) * 2009-06-02 2015-01-28 株式会社東芝 電子部品とその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251704B1 (en) * 1997-12-25 2001-06-26 Oki Electric Industry Co., Ltd. Method of manufacturing semiconductor devices having solder bumps with reduced cracks
TW200417299A (en) * 1998-08-10 2004-09-01 Fujitsu Ltd Method of mounting electronic component

Also Published As

Publication number Publication date
CN103917040A (zh) 2014-07-09
TW201429329A (zh) 2014-07-16
US20140191382A1 (en) 2014-07-10
TWI633812B (zh) 2018-08-21
JP2014135354A (ja) 2014-07-24
JP6007796B2 (ja) 2016-10-12
US9918388B2 (en) 2018-03-13

Similar Documents

Publication Publication Date Title
CN103917040B (zh) 电路基板、电路基板的制造方法和电子组件
TWI508241B (zh) 封裝基板、封裝基板製程、半導體元件之封裝結構及其製程
TWI549204B (zh) Manufacturing method of semiconductor device
US8759971B2 (en) Semiconductor apparatus
TW200525666A (en) Bump-on-lead flip chip interconnection
JP2005109496A (ja) プリ半田構造を形成するための半導体パッケージ基板及びプリ半田構造が形成された半導体パッケージ基板、並びにこれらの製法
TW201725661A (zh) 半導體裝置與其製造方法
TW201524283A (zh) 印刷電路板及其製造方法與使用其之半導體封裝件
KR101025349B1 (ko) 반도체 패키지 및 그의 제조 방법
CN103299410B (zh) 电子元器件模块及电子元器件单元
TW201417196A (zh) 晶片封裝基板和結構及其製作方法
JP5320165B2 (ja) 半導体装置
US9171814B2 (en) Method of manufacturing semiconductor device and semiconductor device
JP4661122B2 (ja) 部品実装配線基板および配線基板への部品の実装方法
JP2018037520A (ja) 半導体装置、電子装置、半導体装置の製造方法及び電子装置の製造方法
CN104282637B (zh) 倒装芯片半导体封装结构
JP2009064989A (ja) 半導体装置およびその製造方法
JP2011171427A (ja) 積層型半導体装置
TW201123326A (en) Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same
KR102006637B1 (ko) 범프의 형성 방법 및 이를 포함하는 반도체 소자의 형성방법
TWI546931B (zh) 半導體器件的製作方法
JP5560713B2 (ja) 電子部品の実装方法等
JP2008078238A (ja) 電子部品の実装構造及び電子部品の実装方法
US8604356B1 (en) Electronic assembly having increased standoff height
JP2011061179A (ja) 印刷回路基板及び印刷回路基板の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170908

CF01 Termination of patent right due to non-payment of annual fee