CN103797078B - 电路连接材料以及使用该电路连接材料的连接方法和连接结构体 - Google Patents

电路连接材料以及使用该电路连接材料的连接方法和连接结构体 Download PDF

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Publication number
CN103797078B
CN103797078B CN201280046252.7A CN201280046252A CN103797078B CN 103797078 B CN103797078 B CN 103797078B CN 201280046252 A CN201280046252 A CN 201280046252A CN 103797078 B CN103797078 B CN 103797078B
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China
Prior art keywords
methyl
anisotropic conductive
conductive film
acrylate monomer
film
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CN201280046252.7A
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Chinese (zh)
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CN103797078A (zh
Inventor
林慎
林慎一
荒木雄太
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Dexerials Corp
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Dexerials Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
CN201280046252.7A 2011-09-21 2012-09-14 电路连接材料以及使用该电路连接材料的连接方法和连接结构体 Active CN103797078B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011206379A JP5844589B2 (ja) 2011-09-21 2011-09-21 異方性導電フィルム及びそれを用いた接続方法並びに接続構造体
JP2011-206379 2011-09-21
PCT/JP2012/073696 WO2013042633A1 (ja) 2011-09-21 2012-09-14 回路接続材料及びそれを用いた接続方法並びに接続構造体

Publications (2)

Publication Number Publication Date
CN103797078A CN103797078A (zh) 2014-05-14
CN103797078B true CN103797078B (zh) 2016-08-31

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ID=45898191

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CN201280046252.7A Active CN103797078B (zh) 2011-09-21 2012-09-14 电路连接材料以及使用该电路连接材料的连接方法和连接结构体

Country Status (5)

Country Link
JP (1) JP5844589B2 (ja)
KR (1) KR101872562B1 (ja)
CN (1) CN103797078B (ja)
TW (1) TWI540195B (ja)
WO (1) WO2013042633A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6065407B2 (ja) * 2012-04-27 2017-01-25 日立化成株式会社 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法
JP2017103303A (ja) * 2015-11-30 2017-06-08 日立化成株式会社 半導体用接着剤、半導体装置、及び半導体装置の製造方法
JP7413024B2 (ja) * 2020-01-07 2024-01-15 日本化学工業株式会社 導電性接着剤、それを用いた接着構造体及び電子部品
JP7510292B2 (ja) * 2020-07-17 2024-07-03 京都エレックス株式会社 導電性接着剤組成物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11172205A (ja) * 1997-12-11 1999-06-29 Sumitomo Bakelite Co Ltd ダイアタッチペーストの製造方法
JPH11171943A (ja) * 1997-12-16 1999-06-29 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JPH11186297A (ja) * 1997-12-19 1999-07-09 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JP2009164500A (ja) * 2008-01-10 2009-07-23 Sumitomo Bakelite Co Ltd 接着剤および半導体パッケージ
JP2010245546A (ja) * 2010-06-10 2010-10-28 Nitto Denko Corp 接着シート
WO2011083652A1 (ja) * 2010-01-07 2011-07-14 日本合成化学工業株式会社 活性エネルギー線硬化性組成物及びその用途
WO2011090090A1 (ja) * 2010-01-21 2011-07-28 日本合成化学工業株式会社 粘着剤、光学部材用粘着剤、粘着剤層付き光学部材、画像表示装置、活性エネルギー線および／または熱硬化性粘着剤組成物、粘着剤組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62244143A (ja) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd 半導体素子の電気的接続方法
JP2000008021A (ja) * 1998-06-18 2000-01-11 Nichiban Co Ltd 熱硬化性接着剤組成物及びそれから得られるシート
JP4720073B2 (ja) * 2003-08-07 2011-07-13 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP4900553B2 (ja) * 2005-03-30 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 熱硬化型異方性導電接着剤
JP2008291199A (ja) 2007-04-23 2008-12-04 Hitachi Chem Co Ltd 回路接続材料およびそれを用いた接続構造体
JP2011037953A (ja) 2009-08-07 2011-02-24 Hitachi Chem Co Ltd 接着剤組成物、回路接続構造体及び半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11172205A (ja) * 1997-12-11 1999-06-29 Sumitomo Bakelite Co Ltd ダイアタッチペーストの製造方法
JPH11171943A (ja) * 1997-12-16 1999-06-29 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JPH11186297A (ja) * 1997-12-19 1999-07-09 Sumitomo Bakelite Co Ltd ダイアタッチペースト
JP2009164500A (ja) * 2008-01-10 2009-07-23 Sumitomo Bakelite Co Ltd 接着剤および半導体パッケージ
WO2011083652A1 (ja) * 2010-01-07 2011-07-14 日本合成化学工業株式会社 活性エネルギー線硬化性組成物及びその用途
WO2011090090A1 (ja) * 2010-01-21 2011-07-28 日本合成化学工業株式会社 粘着剤、光学部材用粘着剤、粘着剤層付き光学部材、画像表示装置、活性エネルギー線および／または熱硬化性粘着剤組成物、粘着剤組成物
JP2010245546A (ja) * 2010-06-10 2010-10-28 Nitto Denko Corp 接着シート

Also Published As

Publication number Publication date
KR20140064967A (ko) 2014-05-28
WO2013042633A1 (ja) 2013-03-28
KR101872562B1 (ko) 2018-06-28
TW201336956A (zh) 2013-09-16
JP5844589B2 (ja) 2016-01-20
JP2012041541A (ja) 2012-03-01
CN103797078A (zh) 2014-05-14
TWI540195B (zh) 2016-07-01

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