TWI540195B - A circuit connecting material and a connecting method using the same, and a connecting structure - Google Patents

A circuit connecting material and a connecting method using the same, and a connecting structure Download PDF

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Publication number
TWI540195B
TWI540195B TW101134443A TW101134443A TWI540195B TW I540195 B TWI540195 B TW I540195B TW 101134443 A TW101134443 A TW 101134443A TW 101134443 A TW101134443 A TW 101134443A TW I540195 B TWI540195 B TW I540195B
Authority
TW
Taiwan
Prior art keywords
meth
circuit
acrylate
acrylate monomer
monofunctional
Prior art date
Application number
TW101134443A
Other languages
English (en)
Chinese (zh)
Other versions
TW201336956A (zh
Inventor
Shinichi Hayashi
Yuta Araki
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW201336956A publication Critical patent/TW201336956A/zh
Application granted granted Critical
Publication of TWI540195B publication Critical patent/TWI540195B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
TW101134443A 2011-09-21 2012-09-20 A circuit connecting material and a connecting method using the same, and a connecting structure TWI540195B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011206379A JP5844589B2 (ja) 2011-09-21 2011-09-21 異方性導電フィルム及びそれを用いた接続方法並びに接続構造体

Publications (2)

Publication Number Publication Date
TW201336956A TW201336956A (zh) 2013-09-16
TWI540195B true TWI540195B (zh) 2016-07-01

Family

ID=45898191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101134443A TWI540195B (zh) 2011-09-21 2012-09-20 A circuit connecting material and a connecting method using the same, and a connecting structure

Country Status (5)

Country Link
JP (1) JP5844589B2 (ja)
KR (1) KR101872562B1 (ja)
CN (1) CN103797078B (ja)
TW (1) TWI540195B (ja)
WO (1) WO2013042633A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6065407B2 (ja) * 2012-04-27 2017-01-25 日立化成株式会社 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法
JP2017103303A (ja) * 2015-11-30 2017-06-08 日立化成株式会社 半導体用接着剤、半導体装置、及び半導体装置の製造方法
JP7413024B2 (ja) 2020-01-07 2024-01-15 日本化学工業株式会社 導電性接着剤、それを用いた接着構造体及び電子部品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62244143A (ja) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd 半導体素子の電気的接続方法
JP3313053B2 (ja) * 1997-12-11 2002-08-12 住友ベークライト株式会社 ダイアタッチペーストの製造方法
JP3313054B2 (ja) * 1997-12-16 2002-08-12 住友ベークライト株式会社 ダイアタッチペースト
JP3209954B2 (ja) * 1997-12-19 2001-09-17 住友ベークライト株式会社 ダイアタッチペースト
JP2000008021A (ja) * 1998-06-18 2000-01-11 Nichiban Co Ltd 熱硬化性接着剤組成物及びそれから得られるシート
JP4720073B2 (ja) * 2003-08-07 2011-07-13 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP4900553B2 (ja) * 2005-03-30 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 熱硬化型異方性導電接着剤
JP2008291199A (ja) 2007-04-23 2008-12-04 Hitachi Chem Co Ltd 回路接続材料およびそれを用いた接続構造体
JP2009164500A (ja) * 2008-01-10 2009-07-23 Sumitomo Bakelite Co Ltd 接着剤および半導体パッケージ
JP2011037953A (ja) 2009-08-07 2011-02-24 Hitachi Chem Co Ltd 接着剤組成物、回路接続構造体及び半導体装置
WO2011083652A1 (ja) * 2010-01-07 2011-07-14 日本合成化学工業株式会社 活性エネルギー線硬化性組成物及びその用途
KR101766934B1 (ko) * 2010-01-21 2017-08-09 닛폰고세이가가쿠고교 가부시키가이샤 점착제, 광학 부재용 점착제, 점착제층 부착 광학 부재, 화상 표시장치, 활성 에너지선 및/또는 열경화성 점착제 조성물, 점착제 조성물
JP2010245546A (ja) * 2010-06-10 2010-10-28 Nitto Denko Corp 接着シート

Also Published As

Publication number Publication date
JP5844589B2 (ja) 2016-01-20
WO2013042633A1 (ja) 2013-03-28
CN103797078B (zh) 2016-08-31
KR101872562B1 (ko) 2018-06-28
CN103797078A (zh) 2014-05-14
KR20140064967A (ko) 2014-05-28
JP2012041541A (ja) 2012-03-01
TW201336956A (zh) 2013-09-16

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