CN103763861B - 一种半孔板的生产工艺 - Google Patents
一种半孔板的生产工艺 Download PDFInfo
- Publication number
- CN103763861B CN103763861B CN201410050068.0A CN201410050068A CN103763861B CN 103763861 B CN103763861 B CN 103763861B CN 201410050068 A CN201410050068 A CN 201410050068A CN 103763861 B CN103763861 B CN 103763861B
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- Prior art keywords
- substrate
- half bore
- copper
- bore
- pore plate
- Prior art date
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- 239000011148 porous material Substances 0.000 title claims abstract description 22
- 238000005516 engineering process Methods 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 35
- 239000010949 copper Substances 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000005530 etching Methods 0.000 claims abstract description 19
- 238000013461 design Methods 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 17
- 238000012545 processing Methods 0.000 claims abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 238000004080 punching Methods 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 5
- 229910001431 copper ion Inorganic materials 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000001117 sulphuric acid Substances 0.000 claims description 5
- 235000011149 sulphuric acid Nutrition 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 238000010923 batch production Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410050068.0A CN103763861B (zh) | 2014-02-13 | 2014-02-13 | 一种半孔板的生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410050068.0A CN103763861B (zh) | 2014-02-13 | 2014-02-13 | 一种半孔板的生产工艺 |
Publications (2)
Publication Number | Publication Date |
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CN103763861A CN103763861A (zh) | 2014-04-30 |
CN103763861B true CN103763861B (zh) | 2016-08-17 |
Family
ID=50530994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410050068.0A Active CN103763861B (zh) | 2014-02-13 | 2014-02-13 | 一种半孔板的生产工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN103763861B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105430934B (zh) * | 2015-12-24 | 2018-01-19 | 广州杰赛科技股份有限公司 | 制作阻焊线路板的方法 |
CN110636707A (zh) * | 2019-09-25 | 2019-12-31 | 萍乡市丰达兴线路板制造有限公司 | 一种改善pcb半孔板中的半孔残铜的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005026322A (ja) * | 2003-06-30 | 2005-01-27 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
CN102143660A (zh) * | 2010-01-28 | 2011-08-03 | 竞陆电子(昆山)有限公司 | 印刷电路板半孔加工工艺 |
TWI391062B (zh) * | 2010-07-02 | 2013-03-21 | Boardtek Comp Suzhou Co Ltd | 具有半孔的電路板的成型方法 |
CN201947544U (zh) * | 2010-12-28 | 2011-08-24 | 深圳市翔宇电路有限公司 | Pth半孔成型掉铜焊盘 |
CN102500682B (zh) * | 2011-10-26 | 2014-01-15 | 高德(无锡)电子有限公司 | 板边镀铜孔半孔板的冲型加工工艺 |
CN103179805A (zh) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | 金属半孔成型方法和印刷电路板制造方法 |
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2014
- 2014-02-13 CN CN201410050068.0A patent/CN103763861B/zh active Active
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Publication number | Publication date |
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CN103763861A (zh) | 2014-04-30 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing technology of half-pore board Effective date of registration: 20190313 Granted publication date: 20160817 Pledgee: Suining rural commercial bank Limited by Share Ltd Pledgor: Wesky (Suining) Electronics Co., Ltd. Registration number: 2019510000026 |
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Date of cancellation: 20201215 Granted publication date: 20160817 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: 2019510000026 |
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Denomination of invention: Production technology of a kind of half hole plate Effective date of registration: 20201217 Granted publication date: 20160817 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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Date of cancellation: 20211124 Granted publication date: 20160817 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A production process of half orifice plate Effective date of registration: 20211129 Granted publication date: 20160817 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2021980013515 |
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Date of cancellation: 20220329 Granted publication date: 20160817 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2021980013515 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
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Denomination of invention: A production process of half orifice plate Effective date of registration: 20220331 Granted publication date: 20160817 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2022980003697 |
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