CN103748143B - 聚酰胺1010树脂粒子及其制造方法 - Google Patents

聚酰胺1010树脂粒子及其制造方法 Download PDF

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Publication number
CN103748143B
CN103748143B CN201280041329.1A CN201280041329A CN103748143B CN 103748143 B CN103748143 B CN 103748143B CN 201280041329 A CN201280041329 A CN 201280041329A CN 103748143 B CN103748143 B CN 103748143B
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China
Prior art keywords
polyamide
resin
acid
polymer
resin particles
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Expired - Fee Related
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CN201280041329.1A
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English (en)
Chinese (zh)
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CN103748143A (zh
Inventor
斋藤真希子
竹崎宏
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Toray Industries Inc
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Toray Industries Inc
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Priority claimed from PCT/JP2011/071954 external-priority patent/WO2012043509A1/ja
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of CN103748143A publication Critical patent/CN103748143A/zh
Application granted granted Critical
Publication of CN103748143B publication Critical patent/CN103748143B/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/14—Powdering or granulating by precipitation from solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/60—Polyamides or polyester-amides
    • C08G18/603—Polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
CN201280041329.1A 2011-09-27 2012-07-11 聚酰胺1010树脂粒子及其制造方法 Expired - Fee Related CN103748143B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPPCT/JP2011/071954 2011-09-27
PCT/JP2011/071954 WO2012043509A1 (ja) 2010-09-28 2011-09-27 ポリマー微粒子およびその製造方法
JP2012067571A JP5541586B2 (ja) 2011-09-27 2012-03-23 ポリアミド１０１０樹脂粒子およびその製造方法
JP2012-067571 2012-03-23
PCT/JP2012/067693 WO2013046860A1 (ja) 2011-09-27 2012-07-11 ポリアミド１０１０樹脂粒子およびその製造方法

Publications (2)

Publication Number Publication Date
CN103748143A CN103748143A (zh) 2014-04-23
CN103748143B true CN103748143B (zh) 2016-06-29

Family

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Family Applications (1)

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CN201280041329.1A Expired - Fee Related CN103748143B (zh) 2011-09-27 2012-07-11 聚酰胺1010树脂粒子及其制造方法

Country Status (9)

Country Link
US (1) US9617395B2 (https=)
EP (1) EP2743290A4 (https=)
JP (1) JP5541586B2 (https=)
KR (1) KR20140080478A (https=)
CN (1) CN103748143B (https=)
AU (1) AU2012313453A1 (https=)
BR (1) BR112014007130A2 (https=)
TW (1) TWI527846B (https=)
WO (1) WO2013046860A1 (https=)

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EP2896656B1 (en) * 2012-09-14 2019-05-08 Toray Industries, Inc. Polyamide resin composition and molded article
CN105263992B (zh) 2013-05-31 2018-11-06 东丽株式会社 乙烯-乙烯醇系共聚物微粒子、及含有其的分散液和树脂组合物、以及该微粒子的制造方法
JP6291222B2 (ja) * 2013-11-19 2018-03-14 Ｊｘｔｇエネルギー株式会社 プリプレグ、繊維強化複合材料及び粒子含有樹脂組成物
JP6291221B2 (ja) * 2013-11-19 2018-03-14 Ｊｘｔｇエネルギー株式会社 プリプレグ、繊維強化複合材料及び粒子含有樹脂組成物
EP3153541A4 (en) * 2014-06-09 2018-01-10 Toray Industries, Inc. Method for producing polymer microparticles
CN104149219B (zh) * 2014-07-31 2017-04-26 中国科学院重庆绿色智能技术研究院 一体化粉体球化及分级方法
JP6567038B2 (ja) * 2014-08-01 2019-08-28 カルティエ・インターナショナル・アクチエンゲゼルシャフト シルクフィブロインを備えた表面を有する時計構成要素
CN105440663B (zh) * 2014-08-07 2018-08-24 中国科学院理化技术研究所 一种选择性激光烧结用尼龙微粉的制备方法
CN104262646B (zh) * 2014-09-12 2017-07-21 中国科学院化学研究所 形貌可控的长碳链聚酰胺粉末基体及形貌可控的高导电复合粉末材料
JP6647209B2 (ja) 2014-10-29 2020-02-14 住友精化株式会社 ポリエステル系弾性体の水性分散体及びその製造方法
CN106674553B (zh) * 2015-11-11 2020-02-11 中国科学院理化技术研究所 一种聚酰胺多孔微球及其制备方法
CN106751767B (zh) * 2015-11-24 2019-09-24 中国科学院理化技术研究所 一种选择性激光烧结用尼龙合金复合微粉及其制备方法
CN108699255A (zh) 2016-05-10 2018-10-23 株式会社吴羽 聚酰胺微粒及其制造方法以及聚酰胺微粒组合物
KR102560234B1 (ko) 2016-07-22 2023-07-26 세키스이가세이힝코교가부시키가이샤 열가소성 수지로 이루어지는 대략 구형상 수지 입자, 그 제조 방법 및 그 용도
CN108720547B (zh) * 2017-04-25 2024-02-13 佛山市顺德区美的电热电器制造有限公司 不粘涂层及其制备方法以及锅具和煮食设备
KR20210002679A (ko) * 2018-06-14 2021-01-08 닛뽕소다 가부시키가이샤 폴리아미드 4 입자의 제조 방법
CN109171647B (zh) * 2018-08-14 2021-06-11 上海常仁信息科技有限公司 能够皮肤检测的健康机器人
JP7055784B2 (ja) * 2018-12-13 2022-04-18 キヤノン化成株式会社 霧化塗布用表面反射防止塗料および表面反射防止塗膜
US12109766B2 (en) * 2020-02-21 2024-10-08 Toray Industries, Inc. Fiber-reinforced composite molded article and method for molding same
CN113337105B (zh) * 2020-03-02 2022-09-23 中国科学院化学研究所 一种聚合物粉体及其制备方法
CN113354942B (zh) * 2020-03-02 2022-10-18 中国科学院化学研究所 一种聚合物粉体及其制备方法
US11643503B2 (en) * 2020-07-10 2023-05-09 Xerox Corporation Highly spherical polyamide microparticles and synthesis methods related thereto
CN112300415A (zh) * 2020-11-19 2021-02-02 广东聚石科技研究有限公司 一种球形尼龙粉末及其制备方法和应用
WO2022113993A1 (ja) 2020-11-30 2022-06-02 東レ株式会社 ポリアミド微粒子、およびその製造方法
WO2023117888A1 (en) * 2021-12-21 2023-06-29 Basf Se Chemical product passport for emission data

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WO2009142231A1 (ja) * 2008-05-21 2009-11-26 東レ株式会社 ポリマー微粒子の製造方法
JP2010189472A (ja) * 2009-02-16 2010-09-02 Unitika Ltd 環境配慮型熱可塑性樹脂組成物
WO2011132680A1 (ja) * 2010-04-20 2011-10-27 宇部興産株式会社 ポリアミド微粒子及びその製造方法並びにそれを用いた光学フィルム及び液晶表示装置

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DE102004020453A1 (de) 2004-04-27 2005-11-24 Degussa Ag Polymerpulver mit Polyamid, Verwendung in einem formgebenden Verfahren und Formkörper, hergestellt aus diesem Polymerpulver
JP2006328208A (ja) * 2005-05-26 2006-12-07 Daicel Degussa Ltd 真球状熱可塑性樹脂微粒子の製造法
DE102005053071A1 (de) * 2005-11-04 2007-05-16 Degussa Verfahren zur Herstellung von ultrafeinen Pulvern auf Basis Polymaiden, ultrafeinen Polyamidpulver sowie deren Verwendung
DE102006015791A1 (de) 2006-04-01 2007-10-04 Degussa Gmbh Polymerpulver, Verfahren zur Herstellung und Verwendung eines solchen Pulvers und Formkörper daraus
WO2010101134A1 (ja) * 2009-03-05 2010-09-10 宇部興産株式会社 ポリアミド粒子及びその製造方法
JP2011094128A (ja) * 2009-09-30 2011-05-12 Toray Ind Inc ポリアミド微粒子の製造方法
EP2374835B1 (en) 2010-04-07 2013-12-25 Evonik Degussa GmbH Polyamide 1010 powder and its use in personal care products
JP5365573B2 (ja) 2010-04-14 2013-12-11 宇部興産株式会社 吸着材
CN104059236B (zh) * 2010-09-28 2016-11-16 东丽株式会社 聚合物微粒及其制造方法

Patent Citations (3)

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WO2009142231A1 (ja) * 2008-05-21 2009-11-26 東レ株式会社 ポリマー微粒子の製造方法
JP2010189472A (ja) * 2009-02-16 2010-09-02 Unitika Ltd 環境配慮型熱可塑性樹脂組成物
WO2011132680A1 (ja) * 2010-04-20 2011-10-27 宇部興産株式会社 ポリアミド微粒子及びその製造方法並びにそれを用いた光学フィルム及び液晶表示装置

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JP2013072086A (ja) 2013-04-22
US20140349113A1 (en) 2014-11-27
BR112014007130A2 (pt) 2020-10-27
WO2013046860A1 (ja) 2013-04-04
EP2743290A4 (en) 2015-03-25
AU2012313453A1 (en) 2014-05-15
TWI527846B (zh) 2016-04-01
EP2743290A1 (en) 2014-06-18
CN103748143A (zh) 2014-04-23
JP5541586B2 (ja) 2014-07-09
TW201323489A (zh) 2013-06-16
US9617395B2 (en) 2017-04-11
KR20140080478A (ko) 2014-06-30

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Granted publication date: 20160629