CN103531488B - 半导体设备、制造半导体设备的方法和照相机 - Google Patents

半导体设备、制造半导体设备的方法和照相机 Download PDF

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Publication number
CN103531488B
CN103531488B CN201310280236.0A CN201310280236A CN103531488B CN 103531488 B CN103531488 B CN 103531488B CN 201310280236 A CN201310280236 A CN 201310280236A CN 103531488 B CN103531488 B CN 103531488B
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CN103531488A (zh
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都筑幸司
栗原康
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Canon Inc
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Canon Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/70—Surface textures, e.g. pyramid structures
    • H10F77/707—Surface textures, e.g. pyramid structures of the substrates or of layers on substrates, e.g. textured ITO layer on a glass substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201310280236.0A 2012-07-06 2013-07-05 半导体设备、制造半导体设备的方法和照相机 Active CN103531488B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012153020A JP6067262B2 (ja) 2012-07-06 2012-07-06 半導体装置およびその製造方法、ならびにカメラ
JP2012-153020 2012-07-06

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CN103531488A CN103531488A (zh) 2014-01-22
CN103531488B true CN103531488B (zh) 2016-05-18

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US (1) US9209330B2 (enExample)
JP (1) JP6067262B2 (enExample)
CN (1) CN103531488B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012165647A1 (en) * 2011-06-01 2012-12-06 Canon Kabushiki Kaisha Semiconductor device
TWI613766B (zh) 2015-08-18 2018-02-01 蘇州晶方半導體科技股份有限公司 半導體晶片封裝結構及其封裝方法
JP7025153B2 (ja) * 2017-09-08 2022-02-24 エムテックスマツムラ株式会社 中空パッケージ用容器、半導体素子パッケージおよびその製造方法
JP7292828B2 (ja) * 2018-04-27 2023-06-19 キヤノン株式会社 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法
JP6990317B2 (ja) * 2018-08-31 2022-01-12 富士フイルム株式会社 撮像ユニット及び撮像装置
JP7214870B2 (ja) * 2019-07-01 2023-01-30 富士フイルム株式会社 撮像素子ユニット及び撮像装置
FR3114676B1 (fr) * 2020-09-30 2023-02-10 St Microelectronics Grenoble 2 Boîtier électronique
JP7542032B2 (ja) * 2022-06-23 2024-08-29 キヤノン株式会社 撮像装置

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CN1497641A (zh) * 2002-10-21 2004-05-19 佳能株式会社 气密容器的制造方法、图像显示装置的制造方法及粘接方法
CN1685500A (zh) * 2002-09-30 2005-10-19 皇家飞利浦电子股份有限公司 包括密封间隙和防止蒸汽诱发故障的集成电路封装及其制造方法
CN102315365A (zh) * 2010-06-29 2012-01-11 松下电器产业株式会社 半导体装置用封装及其制造方法、以及半导体装置

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JPS6033447U (ja) * 1983-08-11 1985-03-07 沖電気工業株式会社 セラミツクパツケ−ジ
JPS6329555A (ja) * 1986-07-23 1988-02-08 Hitachi Ltd 封止電子装置
JP3787174B2 (ja) * 1995-06-28 2006-06-21 ペンタックス株式会社 内視鏡用固体撮像装置
JP4378868B2 (ja) * 2000-10-16 2009-12-09 ソニー株式会社 半導体装置
JP2004165152A (ja) 2002-10-21 2004-06-10 Canon Inc 気密容器の製造方法及び画像表示装置の製造方法及び接合方法
JP2004342992A (ja) 2003-05-19 2004-12-02 Seiko Epson Corp 光デバイス及びその製造方法、光モジュール並びに電子機器
JP2008047889A (ja) * 2006-07-20 2008-02-28 Fujikura Ltd 半導体パッケージとその製造方法
JP5511125B2 (ja) 2006-12-27 2014-06-04 キヤノン株式会社 半導体モジュール及びその製造方法
JP4378394B2 (ja) 2007-05-31 2009-12-02 シャープ株式会社 半導体装置およびそれを備えた光学装置用モジュール
JP2009021307A (ja) * 2007-07-10 2009-01-29 Sharp Corp 半導体装置、撮像装置、およびそれらの製造方法
JP2009135353A (ja) * 2007-12-03 2009-06-18 Panasonic Corp 半導体装置及びその製造に使用する樹脂接着材
JP4800291B2 (ja) * 2007-12-13 2011-10-26 シャープ株式会社 センサモジュールの製造方法および電子情報機器の製造方法
JP5136215B2 (ja) * 2008-05-29 2013-02-06 住友ベークライト株式会社 半導体装置
JP2010141123A (ja) 2008-12-11 2010-06-24 Shinko Electric Ind Co Ltd 電子部品装置
JP2009302556A (ja) 2009-08-31 2009-12-24 Renesas Technology Corp 半導体装置
EP2515330A1 (en) * 2009-12-18 2012-10-24 Mitsubishi Electric Corporation Electronic component package
JP2011159900A (ja) * 2010-02-03 2011-08-18 Panasonic Corp 固体撮像装置
JP5729100B2 (ja) * 2011-04-11 2015-06-03 ソニー株式会社 半導体装置の製造方法、半導体装置、電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1685500A (zh) * 2002-09-30 2005-10-19 皇家飞利浦电子股份有限公司 包括密封间隙和防止蒸汽诱发故障的集成电路封装及其制造方法
CN1497641A (zh) * 2002-10-21 2004-05-19 佳能株式会社 气密容器的制造方法、图像显示装置的制造方法及粘接方法
CN102315365A (zh) * 2010-06-29 2012-01-11 松下电器产业株式会社 半导体装置用封装及其制造方法、以及半导体装置

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US20140008753A1 (en) 2014-01-09
JP2014017334A (ja) 2014-01-30
JP6067262B2 (ja) 2017-01-25
US9209330B2 (en) 2015-12-08
CN103531488A (zh) 2014-01-22

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