FR3114676B1 - Boîtier électronique - Google Patents

Boîtier électronique Download PDF

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Publication number
FR3114676B1
FR3114676B1 FR2009984A FR2009984A FR3114676B1 FR 3114676 B1 FR3114676 B1 FR 3114676B1 FR 2009984 A FR2009984 A FR 2009984A FR 2009984 A FR2009984 A FR 2009984A FR 3114676 B1 FR3114676 B1 FR 3114676B1
Authority
FR
France
Prior art keywords
housing
electric case
casing
region
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2009984A
Other languages
English (en)
Other versions
FR3114676A1 (fr
Inventor
Olivier Zanellato
Remi Brechignac
Jerome Lopez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR2009984A priority Critical patent/FR3114676B1/fr
Priority to US17/485,010 priority patent/US11862757B2/en
Publication of FR3114676A1 publication Critical patent/FR3114676A1/fr
Application granted granted Critical
Publication of FR3114676B1 publication Critical patent/FR3114676B1/fr
Priority to US18/503,025 priority patent/US20240072214A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Boîtier électronique La présente description concerne un boîtier (10) pour dispositif électronique (12), le boîtier comprenant une plaque (22) et un mur latéral (20), séparés par une couche en un matériau de fixation et au moins une région (28) en un matériau configuré pour former dans la région (28) une ouverture entre l'intérieur et l'extérieur du boîtier lorsque le boîtier est chauffé. Figure pour l'abrégé : Fig. 1
FR2009984A 2020-09-30 2020-09-30 Boîtier électronique Active FR3114676B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR2009984A FR3114676B1 (fr) 2020-09-30 2020-09-30 Boîtier électronique
US17/485,010 US11862757B2 (en) 2020-09-30 2021-09-24 Electronic package
US18/503,025 US20240072214A1 (en) 2020-09-30 2023-11-06 Electronic package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2009984 2020-09-30
FR2009984A FR3114676B1 (fr) 2020-09-30 2020-09-30 Boîtier électronique

Publications (2)

Publication Number Publication Date
FR3114676A1 FR3114676A1 (fr) 2022-04-01
FR3114676B1 true FR3114676B1 (fr) 2023-02-10

Family

ID=73643095

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2009984A Active FR3114676B1 (fr) 2020-09-30 2020-09-30 Boîtier électronique

Country Status (2)

Country Link
US (2) US11862757B2 (fr)
FR (1) FR3114676B1 (fr)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5013871A (en) * 1988-02-10 1991-05-07 Olin Corporation Kit for the assembly of a metal electronic package
US5612576A (en) * 1992-10-13 1997-03-18 Motorola Self-opening vent hole in an overmolded semiconductor device
JP4519424B2 (ja) * 2003-06-26 2010-08-04 ルネサスエレクトロニクス株式会社 樹脂モールド型半導体装置
US7005720B2 (en) * 2004-01-23 2006-02-28 Siliconware Precision Industries Co., Ltd. Semiconductor package with photosensitive chip and fabrication method thereof
JP5095113B2 (ja) * 2005-03-25 2012-12-12 富士フイルム株式会社 固体撮像装置の製造方法、及び固体撮像装置
US20060237829A1 (en) * 2005-04-26 2006-10-26 Eiichi Hosomi Method and system for a semiconductor package with an air vent
US7675149B1 (en) * 2006-09-12 2010-03-09 Maxim Integrated Products, Inc. Check valve package for Pb-free, single piece electronic modules
US8258013B1 (en) * 2010-02-12 2012-09-04 Xilinx, Inc. Integrated circuit assembly having vented heat-spreader
WO2012165647A1 (fr) * 2011-06-01 2012-12-06 Canon Kabushiki Kaisha Dispositif à semi-conducteurs
JP6067262B2 (ja) * 2012-07-06 2017-01-25 キヤノン株式会社 半導体装置およびその製造方法、ならびにカメラ
US10461066B2 (en) * 2016-06-29 2019-10-29 Maxim Integrated Products, Inc. Structure and method for hybrid optical package with glass top cover
US20180130719A1 (en) * 2016-11-09 2018-05-10 Advanced Semiconductor Engineering, Inc. Semiconductor device packages and method of manufacturing the same
US11515220B2 (en) * 2019-12-04 2022-11-29 Advanced Semiconductor Engineering, Inc. Semiconductor package structures and methods of manufacturing the same

Also Published As

Publication number Publication date
US11862757B2 (en) 2024-01-02
US20240072214A1 (en) 2024-02-29
FR3114676A1 (fr) 2022-04-01
US20220102591A1 (en) 2022-03-31

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