CN103477457A - 带透镜的光半导体装置及其制造方法 - Google Patents

带透镜的光半导体装置及其制造方法 Download PDF

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Publication number
CN103477457A
CN103477457A CN2012800159799A CN201280015979A CN103477457A CN 103477457 A CN103477457 A CN 103477457A CN 2012800159799 A CN2012800159799 A CN 2012800159799A CN 201280015979 A CN201280015979 A CN 201280015979A CN 103477457 A CN103477457 A CN 103477457A
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China
Prior art keywords
transparent resin
lens
optical semiconductor
semiconductor device
seal
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Pending
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CN2012800159799A
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English (en)
Chinese (zh)
Inventor
田崎益次
市川明
佐藤英昭
远藤谕
本柳翔之
冈部良广
折笠阳一
我妻优
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Asahi Rubber Inc
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Asahi Rubber Inc
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Publication of CN103477457A publication Critical patent/CN103477457A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
CN2012800159799A 2011-04-28 2012-04-25 带透镜的光半导体装置及其制造方法 Pending CN103477457A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011102417 2011-04-28
JP2011-102417 2011-04-28
PCT/JP2012/002828 WO2012147342A1 (ja) 2011-04-28 2012-04-25 レンズ付き光半導体装置、及びその製造方法

Publications (1)

Publication Number Publication Date
CN103477457A true CN103477457A (zh) 2013-12-25

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CN2012800159799A Pending CN103477457A (zh) 2011-04-28 2012-04-25 带透镜的光半导体装置及其制造方法

Country Status (7)

Country Link
US (1) US9018663B2 (de)
EP (1) EP2704221A4 (de)
JP (1) JP5897554B2 (de)
KR (1) KR101561754B1 (de)
CN (1) CN103477457A (de)
TW (1) TW201306320A (de)
WO (1) WO2012147342A1 (de)

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CN106618511A (zh) * 2016-11-29 2017-05-10 深圳还是威健康科技有限公司 一种可测量体温的穿戴智能设备
CN107461614A (zh) * 2016-06-03 2017-12-12 重庆市莜歌电子科技有限公司 具有软体照射面的led路灯
CN111987081A (zh) * 2020-08-26 2020-11-24 天水华天科技股份有限公司 一种led显示模组的防串光格栅的成型方法及塑封模
CN114901993A (zh) * 2019-12-18 2022-08-12 欧司朗光电半导体有限责任公司 卤素灯替换件

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US10422503B2 (en) 2009-10-30 2019-09-24 Ideal Industries Lighting Llc One-piece multi-lens optical member and method of manufacture
TWI545328B (zh) * 2012-07-10 2016-08-11 鴻海精密工業股份有限公司 鏡頭模組測試裝置
JP5891133B2 (ja) * 2012-07-12 2016-03-22 スタンレー電気株式会社 半導体発光装置
JP6079248B2 (ja) * 2013-01-15 2017-02-15 オムロン株式会社 Ｒｆタグ、その製造方法、およびｒｆタグ用一次成形体
JP2014175362A (ja) * 2013-03-06 2014-09-22 Toshiba Corp 半導体発光素子及びその製造方法
US10400984B2 (en) 2013-03-15 2019-09-03 Cree, Inc. LED light fixture and unitary optic member therefor
DE102013104195A1 (de) * 2013-04-25 2014-10-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
CN105940262B (zh) 2014-01-23 2020-01-07 亮锐控股有限公司 具有自对准预制透镜的发光设备
RU2672643C2 (ru) 2014-03-28 2018-11-16 Асахи Раббер Инк. Светораспределительная линза
US9620436B2 (en) 2014-04-09 2017-04-11 Invensas Corporation Light emitting diode device with reconstituted LED components on substrate
US9680073B2 (en) * 2014-05-30 2017-06-13 Seoul Semiconductor Co., Ltd. Light emitting module
TWI593141B (zh) * 2014-07-15 2017-07-21 邱羅利士公司 封裝結構之製法
KR20160010206A (ko) * 2014-07-18 2016-01-27 서울바이오시스 주식회사 웨이퍼 레벨 패키지 공정을 이용한 발광 소자 제조 방법 및 그것에 의해 제조된 발광 소자
US10207440B2 (en) 2014-10-07 2019-02-19 Cree, Inc. Apparatus and method for formation of multi-region articles
TWI559463B (zh) * 2014-10-31 2016-11-21 矽品精密工業股份有限公司 封裝結構及其製法
WO2016108207A1 (en) 2015-01-01 2016-07-07 Visteon Global Technologies, Inc. Infotainment system for recommending a task during a traffic transit time
US11162806B2 (en) * 2015-01-05 2021-11-02 Harman International Industries, Incorporated Learning and predictive navigation system
US9752925B2 (en) * 2015-02-13 2017-09-05 Taiwan Biophotonic Corporation Optical sensor
JP6325471B2 (ja) * 2015-03-02 2018-05-16 株式会社東芝 光結合装置および絶縁装置
JP6626294B2 (ja) * 2015-09-04 2019-12-25 株式会社東芝 半導体装置および光結合装置
JP6524904B2 (ja) * 2015-12-22 2019-06-05 日亜化学工業株式会社 発光装置
DE102016009961A1 (de) * 2016-08-16 2018-02-22 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Verfahren zum Bestimmen der Position eines Fahrzeugs und Computersystem dafür
DE102016225242A1 (de) * 2016-12-16 2018-06-21 Robert Bosch Gmbh Verfahren zur Herstellung eines Lasermoduls einer Laser-Nivelliervorrichtung sowie Laser-Nivelliervorrichtung
KR102631105B1 (ko) * 2017-08-31 2024-01-30 니치아 카가쿠 고교 가부시키가이샤 발광 장치
JP7128433B2 (ja) * 2017-10-11 2022-08-31 ウシオ電機株式会社 光照射装置
JP6777105B2 (ja) * 2018-01-31 2020-10-28 日亜化学工業株式会社 発光装置の製造方法
JP7177331B2 (ja) 2018-06-29 2022-11-24 日亜化学工業株式会社 発光装置
JP7047646B2 (ja) * 2018-07-19 2022-04-05 東芝ライテック株式会社 車両用照明装置、および車両用灯具
JP7488088B2 (ja) * 2020-04-02 2024-05-21 日機装株式会社 半導体発光装置

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CN101900302A (zh) * 2009-02-03 2010-12-01 奥斯兰姆施尔凡尼亚公司 用于发光二极管的光束扩展光学装置

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JP2003008065A (ja) * 2001-06-21 2003-01-10 Citizen Electronics Co Ltd Ｓｍｄ型光素子モジュールの製造方法
US20040223315A1 (en) * 2003-03-03 2004-11-11 Toyoda Gosei Co., Ltd. Light emitting apparatus and method of making same
US20080048200A1 (en) * 2004-11-15 2008-02-28 Philips Lumileds Lighting Company, Llc LED with Phosphor Tile and Overmolded Phosphor in Lens
US20080026498A1 (en) * 2006-07-31 2008-01-31 Eric Tarsa Light emitting diode package element with internal meniscus for bubble free lens placement
CN101900302A (zh) * 2009-02-03 2010-12-01 奥斯兰姆施尔凡尼亚公司 用于发光二极管的光束扩展光学装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107461614A (zh) * 2016-06-03 2017-12-12 重庆市莜歌电子科技有限公司 具有软体照射面的led路灯
CN106618511A (zh) * 2016-11-29 2017-05-10 深圳还是威健康科技有限公司 一种可测量体温的穿戴智能设备
CN114901993A (zh) * 2019-12-18 2022-08-12 欧司朗光电半导体有限责任公司 卤素灯替换件
CN111987081A (zh) * 2020-08-26 2020-11-24 天水华天科技股份有限公司 一种led显示模组的防串光格栅的成型方法及塑封模

Also Published As

Publication number Publication date
KR20130114745A (ko) 2013-10-17
JPWO2012147342A1 (ja) 2014-07-28
US20140027807A1 (en) 2014-01-30
US9018663B2 (en) 2015-04-28
EP2704221A1 (de) 2014-03-05
TW201306320A (zh) 2013-02-01
WO2012147342A1 (ja) 2012-11-01
EP2704221A4 (de) 2014-10-15
JP5897554B2 (ja) 2016-03-30
KR101561754B1 (ko) 2015-10-19

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Application publication date: 20131225