CN103390573B - 保持工作台 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
- B23Q1/38—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members using fluid bearings or fluid cushion supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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Abstract
本发明提供一种保持工作台,该保持工作台能够降低污染物在吸引保持的板状物上的附着和损伤的可能性。一种保持板状物的保持工作台,所述保持工作台的特征在于,具有:环状保持部,其具有保持板状物的外周部的环状保持面;以及中央凹部,其被该环状保持部围绕,在该环状保持部形成有:抽吸口,其开口于该环状保持面;抽吸通路,其一端与该抽吸口连通并且另一端连接于抽吸源;液体喷出口,其开口于该抽吸口的外周侧的所述环状保持面;以及液体流路,其一端与该液体喷出口连通并且另一端连接于液体供给源。
Description
技术领域
本发明涉及保持晶片等板状物的保持工作台。
背景技术
关于加工晶片等板状物的磨削装置或切削装置、激光加工装置等各种加工装置,例如具有日本特开平5-23941号公报以及日本特开2008-140832号公报所公开的那样的保持工作台(卡盘工作台),该保持工作台具有用于吸引保持板状物的保持面。
将板状物吸引保持在保持工作台来实施各种的加工时,通过用保持工作台来保持板状物,在板状物的被保持面可能附着污染物。
板状物的被保持面附着有污染物时,附着的污染物可能污染搬送板状物的搬送单元或污染收纳有加工后的板状物的盒内部。使用一旦被污染了的搬送单元或盒来搬送或收纳没有附着污染物的板状物时,干净的板状物也具有被污染物污染的可能性。
另一方面,如日本特开2004-107606号公报所公开的那样,为了容易地对被加工物进行处理,存在经粘接剂或石蜡(wax)将板状被加工物粘贴到支撑板上的情况。另外,如日本特开平5-21763号公报所公开的那样,通过直接接合将被加工物粘贴到支撑板上的技术也被广泛利用。
现有技术文献
专利文献1:日本特开2004-107606号公报
专利文献2:日本特开平5-21763号公报
发明内容
但是,有时,当用保持工作台来对在支撑板上粘贴有被加工物的层叠被加工物的支撑板侧进行吸引保持时,会损伤支撑板。即使想再次使用损伤的支撑板,根据损伤的大小可能无法使用保持工作台来吸引保持。
另外,对粘贴于损伤的支撑板的被加工物实施伴随加热的处理时,还有支撑板以损伤为起点而破损,并损伤晶片的可能性。因此以往废弃使用过一次的支撑板,因为非常不经济,所以希望实现支撑板的再利用。
本发明是鉴于这样的情况而做出的,其目的在于提供一种能够降低污染物在吸引保持的板状物上的附着和损伤的可能性的保持工作台。
根据本发明,提供一种保持板状物的保持工作台,所述保持工作台的特征在于,具有:环状保持部,其具有保持板状物的外周部的环状保持面;以及中央凹部,其被所述环状保持部围绕,在所述环状保持部形成有:抽吸口,其开口于所述环状保持面;抽吸通路,其一端与所述抽吸口连通并且另一端连接于抽吸源;液体喷出口,其开口于所述抽吸口的外周侧的所述环状保持面;以及液体流路,其一端与所述液体喷出口连通并且另一端连接于液体供给源。
优选环状保持部由树脂形成。
在本发明的保持工作台中,因为通过环状保持部只保持支撑板的外周部,所以能够降低支撑板的损伤和附着污染物的可能性,能够防止污染搬送单元和收纳盒并且能够再利用支撑板。
附图说明
图1是具有本发明的保持工作台的切削装置的立体图。
图2是本发明实施方式的保持工作台的纵剖视图。
图3是吸引保持了支撑板的状态的保持工作台的纵剖视图。
图4是修剪(trimming)加工粘贴有支撑板的晶片的倒角部的状态的局部剖视侧视图。
标号说明
11 板状物(硅晶片)
13 支撑板
15 层叠板状物
18 保持工作台
20 基座
21,25 抽吸通路
22 环状保持部
22a 环状保持面
23,27 液体流路
25a 抽吸口
26 抽吸源
27a 液体喷出口
28 液体供给源
38 切削刀片
具体实施方式
以下,参照附图对本发明的实施方式详细地进行说明。参照图1,表示具有本发明实施方式的保持工作台(卡盘工作台)18的切削装置2的外观立体图。
在切削装置2的前表面侧设置有操作面板4,该操作面板4用于由操作员输入加工条件等对装置的指示。在装置上部设置有显示针对操作员的引导画面和通过摄像单元所拍摄的图像的CRT等显示单元6。
将多个(例如25个)晶片等板状被加工物收纳到收纳盒8中。收纳盒8装载于能够上下移动的盒升降机9上。在收纳盒8的后方设置有搬入搬出单元10,该搬入搬出单元10用于从收纳盒8搬出切削前的被加工物,并且将切削后的被加工物搬入收纳盒8中。
搬入搬出单元10具有夹紧装置11,夹紧装置11把持被加工物来将被加工物相对于收纳盒8搬出和搬入。搬入搬出单元10在Y轴方向直线移动。
在收纳盒8与搬入搬出单元10之间设有临时放置区域12,其中该临时放置区域12是暂时放置作为搬入搬出对象的被加工物的区域,在临时放置区域12配设有对被加工物进行定心的一对定位部件14。
临时放置区域12的附近配设有搬送单元16,通过搬送单元16吸附搬出到临时放置区域12的被加工物并搬送到保持工作台(卡盘工作台)18上,利用保持工作台18来吸引保持被加工物,其中所述搬送单元16具有吸附被加工物来进行搬送的回转臂。
保持工作台18构成为能够旋转且能够在X轴方向往复移动,在保持工作台18的X轴方向的移动路径的上方配设有校准(alignment)单元30,该校准单元30用于检测被加工物的应该切削的区域。
校准单元30具有摄像单元32,校准单元30能够根据拍摄而获得的图像,通过模式匹配(pattern matching)等图像处理来检测应该切削的区域,其中所述摄像单元32具有用于拍摄被加工物的表面的摄像元件和显微镜。将通过摄像单元32而获得的图像显示到显示单元6。
校准单元30的左侧配设有对保持于保持工作台18的被加工物实施切削加工的切削单元34。切削单元34与校准单元30一体地构成,两者联动地在Y轴方向和Z轴方向移动。
切削单元34构成为在能够旋转的主轴36的末端装配有切削刀片(blade)38,切削单元34能够在Y轴方向和Z轴方向移动。切削刀片38位于摄像单元32的X轴方向的延长线上。
标号40是搬送单元,其吸附结束了切削加工的被加工物并搬送到旋转清洗单元42,在旋转清洗单元42对被加工物进行旋转清洗和旋转干燥。
参照图2,表示本发明实施方式的保持工作台18的纵剖视图。保持工作台18包括:基座(base,框体)20,其由SUS(不锈钢)等金属形成;以及环状保持部22,其具有对粘贴在基座20上的被加工物进行保持的环状的保持面22a。保持工作台18还具有由环状保持部22环绕的中央凹部24。
优选由导电性树脂形成环状保持部22。通过由导电性树脂形成环状保持部22,能够防止由于静电使得污染物附着于环状保持部22。
本实施方式的保持工作台18不是整体都由树脂形成,而是由SUS等金属形成基座20,只有环状保持部22由树脂形成,由此能够保证保持工作台18的刚性。
在基座20形成有:抽吸通路21,其经未图示的电磁切换阀选择性地连接到抽吸源26;以及流体流路23,其经未图示的电磁切换阀选择性地连接到液体供给源28。
在环状保持部22形成有:与基座20的抽吸通路21连接的环状抽吸通路25、以及与流体流路23连接的环状流体流路27。在环状保持部22的环状保持面22a开口有与环状抽吸通路25连通的环状抽吸口25a、和与环状流体流路27连通的环状的液体喷出口27a。
也可以代替环状抽吸口25a,而在圆周方向形成分离的多个抽吸口,并代替环状的液体喷出口27a,而在圆周方向配设分离的多个液体喷出口。
参照图3,表示用保持工作台18来吸引保持层叠板状物15的状态下的保持工作台18的纵剖视图。通过粘接剂将板状物11粘接到支撑板13上从而形成层叠板状物15。
支撑板13由例如没有图案(pattern)的硅晶片形成,板状物11由例如在表面11a具有半导体器件的硅晶片形成。
在硅晶片11a的外周面形成有圆弧状的倒角部11c,在支撑板13的外周也形成有圆弧状的倒角部13c。支撑板13还可以由玻璃形成。
参照图4,表示修剪加工硅晶片等板状物11的倒角部11c的状态的局部剖视图侧视图,其中硅晶片等板状物11吸引保持在保持加工台18。在倒角部11c的修剪加工中使向箭头A方向高速旋转的切削刀片38以预定深度切入具有倒角部11c的板状物11的外周部,使保持工作台18向箭头B方向低速旋转,由此切掉形成于板状物11的外周的倒角部11c。
该修剪加工中,优选一边从流体喷出口27a喷出纯水等流体29一边实施加工。进行修剪加工时会产生切削屑,但是通过喷出的流体29来冲洗该切削屑,从而抑制该切削屑附着于层叠板状物15以及保持工作台18。
图4所示的实施方式表示了对层叠板状物15进行修剪加工的状态,但是加工不限定于修剪加工,沿着分割预定线来切削板状物11的切削加工也能够使用保持工作台18。另外,还可以将保持工作台18作为激光加工装置的保持工作台来利用,并对板状物11实施激光加工。
因为上述的实施方式的保持工作台18通过环状保持部22只吸引保持支撑板13的外周部,所以能够减低对支撑板13造成损伤和附着污染物,能够防止污染搬送单元和收纳盒,并且能够实现支撑板13的再利用。
并且,不只是吸引保持支撑板13的情况,在直接吸引保持板状物11来实施加工时也可以利用本实施方式的保持工作台18。
Claims (2)
1.一种保持工作台,其是保持板状物的保持工作台,其特征在于,具有:
环状保持部,其具有保持板状物的外周部的环状保持面;以及
中央凹部,其被所述环状保持部围绕,
在所述环状保持部形成有:抽吸口,其开口于所述环状保持面;抽吸通路,其一端与所述抽吸口连通并且另一端连接于抽吸源;液体喷出口,其开口于所述抽吸口的外周侧的所述环状保持面;以及液体流路,其一端与所述液体喷出口连通并且另一端连接于液体供给源,
一边从所述液体喷出口喷出液体一边实施加工,通过喷出的液体来冲洗在该加工中产生的切削屑,抑制该切削屑附着于板状物以及保持工作台上。
2.根据权利要求1所述的保持工作台,其中,
所述环状保持部由树脂形成。
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JP5996382B2 (ja) * | 2012-11-06 | 2016-09-21 | 株式会社ディスコ | 切削装置のチャックテーブル |
JP2016095244A (ja) * | 2014-11-14 | 2016-05-26 | 株式会社ディスコ | チャックテーブルの汚れの判定方法 |
JP6627243B2 (ja) * | 2015-04-02 | 2020-01-08 | 日本電気硝子株式会社 | 基板の処理方法、及び基板の成膜方法 |
JP6887722B2 (ja) * | 2016-10-25 | 2021-06-16 | 株式会社ディスコ | ウェーハの加工方法及び切削装置 |
JP6920063B2 (ja) * | 2017-01-11 | 2021-08-18 | 株式会社ディスコ | 板状ワークの保持方法 |
US10632596B2 (en) * | 2017-05-30 | 2020-04-28 | James Alan Buckus | Apparatus for binding to a surface and method of use thereof |
JP7187112B2 (ja) * | 2018-08-13 | 2022-12-12 | 株式会社ディスコ | キャリア板の除去方法 |
JP7358222B2 (ja) * | 2019-12-06 | 2023-10-10 | 株式会社ディスコ | 板状物保持具 |
CN112938983B (zh) * | 2021-01-27 | 2023-01-24 | 中国科学院过程工程研究所 | 一种基于晶体硅切割废料制备的再生硅及其制备方法 |
CN115673907A (zh) * | 2022-11-29 | 2023-02-03 | 扬州韩思半导体科技有限公司 | 一种用于半导体晶圆生产的研磨装置 |
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