CN103379751A - 组合印制电路板的制造方法、印制电路板及其制造方法 - Google Patents
组合印制电路板的制造方法、印制电路板及其制造方法 Download PDFInfo
- Publication number
- CN103379751A CN103379751A CN2012101299952A CN201210129995A CN103379751A CN 103379751 A CN103379751 A CN 103379751A CN 2012101299952 A CN2012101299952 A CN 2012101299952A CN 201210129995 A CN201210129995 A CN 201210129995A CN 103379751 A CN103379751 A CN 103379751A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- hole
- metallic plate
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 116
- 238000000034 method Methods 0.000 claims abstract description 66
- 239000011347 resin Substances 0.000 claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 230000008569 process Effects 0.000 claims abstract description 37
- 238000012545 processing Methods 0.000 claims abstract description 19
- 238000003475 lamination Methods 0.000 claims description 87
- 239000006071 cream Substances 0.000 claims description 25
- 238000004017 vitrification Methods 0.000 claims description 23
- 230000004888 barrier function Effects 0.000 claims description 18
- 238000009713 electroplating Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 36
- 229910052751 metal Inorganic materials 0.000 abstract description 36
- 238000005553 drilling Methods 0.000 abstract description 2
- 230000009477 glass transition Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 98
- 238000009740 moulding (composite fabrication) Methods 0.000 description 27
- 239000000758 substrate Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 239000007787 solid Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000931705 Cicada Species 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210129995.2A CN103379751B (zh) | 2012-04-27 | 2012-04-27 | 组合印制电路板的制造方法、印制电路板及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210129995.2A CN103379751B (zh) | 2012-04-27 | 2012-04-27 | 组合印制电路板的制造方法、印制电路板及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103379751A true CN103379751A (zh) | 2013-10-30 |
CN103379751B CN103379751B (zh) | 2016-07-13 |
Family
ID=49464148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210129995.2A Active CN103379751B (zh) | 2012-04-27 | 2012-04-27 | 组合印制电路板的制造方法、印制电路板及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103379751B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103841771A (zh) * | 2012-11-26 | 2014-06-04 | 北大方正集团有限公司 | 组合印制电路板和印制电路板的制造方法以及印制电路板 |
CN104144571A (zh) * | 2014-06-18 | 2014-11-12 | 四川深北电路科技有限公司 | 一种高密度互连集成电路板制作方法 |
CN104159392A (zh) * | 2014-07-16 | 2014-11-19 | 深圳崇达多层线路板有限公司 | 一种印制电路板及其制备方法 |
CN104684276A (zh) * | 2013-11-28 | 2015-06-03 | 深圳崇达多层线路板有限公司 | 印制线路板及其加工方法 |
CN104754871A (zh) * | 2013-12-27 | 2015-07-01 | 深南电路有限公司 | 一种电路板制作方法 |
CN107148171A (zh) * | 2017-06-27 | 2017-09-08 | 北大方正集团有限公司 | 多层电路板的压合方法 |
CN111337626A (zh) * | 2020-03-03 | 2020-06-26 | 浙江百岸科技有限公司 | 应用于氮氧传感器的孔处理方法 |
CN111542178A (zh) * | 2020-05-13 | 2020-08-14 | 上海泽丰半导体科技有限公司 | 一种多层电路板的制作工艺和多层电路板 |
CN113991004A (zh) * | 2021-10-26 | 2022-01-28 | 东莞市中麒光电技术有限公司 | Led基板制作方法、led基板、led器件制作方法及led器件 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040231141A1 (en) * | 2001-07-06 | 2004-11-25 | Masaru Nishinaka | Laminate and its producing method |
JP2005129884A (ja) * | 2003-10-20 | 2005-05-19 | Samsung Electro Mech Co Ltd | 層間電気接続が向上された多層印刷回路基板及びその作製方法 |
CN101272660A (zh) * | 2008-05-05 | 2008-09-24 | 上海美维电子有限公司 | 一种软硬结合印制电路板的制造方法 |
-
2012
- 2012-04-27 CN CN201210129995.2A patent/CN103379751B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040231141A1 (en) * | 2001-07-06 | 2004-11-25 | Masaru Nishinaka | Laminate and its producing method |
JP2005129884A (ja) * | 2003-10-20 | 2005-05-19 | Samsung Electro Mech Co Ltd | 層間電気接続が向上された多層印刷回路基板及びその作製方法 |
CN101272660A (zh) * | 2008-05-05 | 2008-09-24 | 上海美维电子有限公司 | 一种软硬结合印制电路板的制造方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103841771A (zh) * | 2012-11-26 | 2014-06-04 | 北大方正集团有限公司 | 组合印制电路板和印制电路板的制造方法以及印制电路板 |
CN104684276A (zh) * | 2013-11-28 | 2015-06-03 | 深圳崇达多层线路板有限公司 | 印制线路板及其加工方法 |
CN104754871A (zh) * | 2013-12-27 | 2015-07-01 | 深南电路有限公司 | 一种电路板制作方法 |
CN104754871B (zh) * | 2013-12-27 | 2019-02-05 | 深南电路有限公司 | 一种电路板制作方法 |
CN104144571A (zh) * | 2014-06-18 | 2014-11-12 | 四川深北电路科技有限公司 | 一种高密度互连集成电路板制作方法 |
CN104159392A (zh) * | 2014-07-16 | 2014-11-19 | 深圳崇达多层线路板有限公司 | 一种印制电路板及其制备方法 |
CN107148171A (zh) * | 2017-06-27 | 2017-09-08 | 北大方正集团有限公司 | 多层电路板的压合方法 |
CN111337626A (zh) * | 2020-03-03 | 2020-06-26 | 浙江百岸科技有限公司 | 应用于氮氧传感器的孔处理方法 |
CN111542178A (zh) * | 2020-05-13 | 2020-08-14 | 上海泽丰半导体科技有限公司 | 一种多层电路板的制作工艺和多层电路板 |
CN111542178B (zh) * | 2020-05-13 | 2021-07-16 | 上海泽丰半导体科技有限公司 | 一种多层电路板的制作工艺和多层电路板 |
CN113991004A (zh) * | 2021-10-26 | 2022-01-28 | 东莞市中麒光电技术有限公司 | Led基板制作方法、led基板、led器件制作方法及led器件 |
Also Published As
Publication number | Publication date |
---|---|
CN103379751B (zh) | 2016-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103379751A (zh) | 组合印制电路板的制造方法、印制电路板及其制造方法 | |
US7152318B2 (en) | Method for manufacturing built-up printed circuit board with stacked type via-holes | |
US8580066B2 (en) | Method for manufacturing multilayer wiring substrate | |
JP4538486B2 (ja) | 多層基板およびその製造方法 | |
CN103456643A (zh) | Ic载板及其制作方法 | |
JP6795137B2 (ja) | 電子素子内蔵型印刷回路基板の製造方法 | |
CN102098883A (zh) | 用于制造基板的载体以及使用该载体制造基板的方法 | |
CN103841771A (zh) | 组合印制电路板和印制电路板的制造方法以及印制电路板 | |
CN103582320A (zh) | 多层线路板及其制作方法 | |
US10609824B2 (en) | Manufacturing method of a multi-layer circuit board | |
CN103442525A (zh) | 一种刚挠结合印制电路板及其制作方法 | |
CN104349610B (zh) | 印制电路板子板及印制电路板的制造方法和印制电路板 | |
KR100704920B1 (ko) | 범프기판을 이용한 인쇄회로기판 및 제조방법 | |
JP2017135357A (ja) | 印刷配線板およびその製造方法 | |
KR100782404B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
EP3435747A1 (en) | Printed wiring board and method for manufacturing same | |
CN109195363B (zh) | 一种z向互连的pcb的制作方法及pcb | |
CN103796450B (zh) | 组合印制电路板和印制电路板的制造方法 | |
CN104284530B (zh) | 无芯板工艺制作印制电路板的方法 | |
KR100734244B1 (ko) | 다층 인쇄회로기판 및 그 제조방법 | |
CN111356279B (zh) | 电路板及其制造方法 | |
KR101097504B1 (ko) | 다층 인쇄 회로 기판의 제조방법 | |
CN102196673B (zh) | 线路结构的制作方法 | |
US20120152595A1 (en) | Multilayer printed circuit board and method of manufacturing the same | |
KR20090085406A (ko) | 다층 회로기판 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: ZHUHAI FOUNDER PCB CO., LTD. FOUNDER INFORMATION I Free format text: FORMER OWNER: ZHUHAI FOUNDER PCB CO., LTD. Effective date: 20130923 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130923 Address after: 100871 Beijing, Haidian District into the house road, founder of the building on the 9 floor, No. 298 Applicant after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Applicant after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Applicant after: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. Address before: 100871 Beijing, Haidian District into the house road, founder of the building on the 9 floor, No. 298 Applicant before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Applicant before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20220914 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
|
TR01 | Transfer of patent right |