CN103379682B - 检查装置 - Google Patents

检查装置 Download PDF

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Publication number
CN103379682B
CN103379682B CN201310093674.6A CN201310093674A CN103379682B CN 103379682 B CN103379682 B CN 103379682B CN 201310093674 A CN201310093674 A CN 201310093674A CN 103379682 B CN103379682 B CN 103379682B
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CN
China
Prior art keywords
probe
detector
temperature
testing fixture
substrate
Prior art date
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CN201310093674.6A
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English (en)
Chinese (zh)
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CN103379682A (zh
Inventor
冈田章
秋山肇
山下钦也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN103379682A publication Critical patent/CN103379682A/zh
Application granted granted Critical
Publication of CN103379682B publication Critical patent/CN103379682B/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
CN201310093674.6A 2012-04-26 2013-03-22 检查装置 Active CN103379682B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-101421 2012-04-26
JP2012101421A JP5861557B2 (ja) 2012-04-26 2012-04-26 検査装置

Publications (2)

Publication Number Publication Date
CN103379682A CN103379682A (zh) 2013-10-30
CN103379682B true CN103379682B (zh) 2016-02-24

Family

ID=49464099

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310093674.6A Active CN103379682B (zh) 2012-04-26 2013-03-22 检查装置

Country Status (3)

Country Link
US (1) US9188624B2 (enExample)
JP (1) JP5861557B2 (enExample)
CN (1) CN103379682B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6213382B2 (ja) * 2014-06-04 2017-10-18 三菱電機株式会社 測定装置
JP6418118B2 (ja) * 2015-09-24 2018-11-07 三菱電機株式会社 半導体装置の評価装置及び評価方法
JP6222271B2 (ja) * 2016-04-21 2017-11-01 三菱電機株式会社 検査装置
US10001508B2 (en) * 2016-06-17 2018-06-19 International Business Machines Corporation Integrated self-coining probe
JP6575663B2 (ja) * 2018-10-24 2019-09-18 株式会社東京精密 プローブカード型温度センサ及びウエハチャック温度測定方法
CN110824339A (zh) * 2019-10-22 2020-02-21 苏州盛科科技有限公司 一种交换芯片老化筛选测试的恒温控制装置及方法
US11578925B2 (en) * 2019-11-15 2023-02-14 Tektronix, Inc. Thermal management system for a test-and-measurement probe
US12332277B1 (en) 2019-11-15 2025-06-17 Tektronix, Inc. Thermal management system for a test-and-measurement probe
JP7455015B2 (ja) * 2020-07-14 2024-03-25 東京エレクトロン株式会社 検査装置
CN214335132U (zh) * 2021-01-13 2021-10-01 迪科特测试科技(苏州)有限公司 探测系统及探测装置
CN116345250A (zh) * 2023-05-04 2023-06-27 昆山联滔电子有限公司 弹簧针模组及弹簧针温度控制方法
CN117250468B (zh) * 2023-11-17 2024-01-26 福建福碳新材料科技有限公司 一种三代半导体用等静压石墨衬底检验台

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101377536A (zh) * 2007-08-31 2009-03-04 东京毅力科创株式会社 检查装置和检查方法
CN101430361A (zh) * 2007-10-15 2009-05-13 东京毅力科创株式会社 检查装置

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JPS5318971A (en) * 1976-08-06 1978-02-21 Hitachi Ltd Multisensor of wafer prober
JPH02192749A (ja) * 1989-01-20 1990-07-30 Mitsubishi Electric Corp 耐熱型プローブカード
JPH03158764A (ja) * 1989-11-16 1991-07-08 Sumitomo Electric Ind Ltd プローブ装置
JPH0477674A (ja) * 1990-07-19 1992-03-11 Nec Corp プローブ
EP0538010A3 (en) 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
JPH06349909A (ja) * 1993-06-14 1994-12-22 Hitachi Ltd プローブ検査装置
JPH1056045A (ja) * 1996-08-09 1998-02-24 Hitachi Ltd 電子素子評価装置
JP2000138268A (ja) 1998-11-04 2000-05-16 Hitachi Chem Co Ltd 半導体回路の検査方法及び検査装置
JP2001033484A (ja) 1999-07-15 2001-02-09 Ibiden Co Ltd ウエハプローバ
JP2002022768A (ja) 2000-07-10 2002-01-23 Nec Eng Ltd 集積回路パッケージ検査用ポゴピン
DE10230196A1 (de) * 2002-07-05 2004-01-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Hochauflösender NMR-Probenkopf für geringe Probenvolumina sowie Verfahren zum Betrieb
JP2004227842A (ja) 2003-01-21 2004-08-12 Canon Inc プローブ保持装置、試料の取得装置、試料加工装置、試料加工方法、および試料評価方法
JP2005164537A (ja) 2003-12-05 2005-06-23 Matsushita Electric Ind Co Ltd 半導体装置の検査装置
JP4286182B2 (ja) * 2004-05-13 2009-06-24 富士通マイクロエレクトロニクス株式会社 電気的接続方法
JP4610289B2 (ja) * 2004-10-07 2011-01-12 日本電子材料株式会社 プローブ装置
DE102006020774B3 (de) * 2006-05-03 2008-02-07 Bruker Biospin Ag Gekühlter, kuppelbarer NMR-Probenkopf
JP2008103528A (ja) * 2006-10-19 2008-05-01 Matsushita Electric Ind Co Ltd 半導体装置の検査方法およびプローブカード
JP2008128838A (ja) * 2006-11-21 2008-06-05 Shinko Electric Ind Co Ltd プローブ装置
JP5021373B2 (ja) 2007-06-06 2012-09-05 株式会社日立ハイテクノロジーズ 検査装置、検査方法及び検査装置に用いるプローブユニット
JP2010169417A (ja) * 2009-01-20 2010-08-05 Denso Corp 検査用プローブ及びプリント基板検査装置
JP2011007671A (ja) * 2009-06-26 2011-01-13 Fujitsu Semiconductor Ltd 試験装置
JP2012021223A (ja) 2010-07-14 2012-02-02 Plasma Ion Assist Co Ltd プラズマ処理装置及びコンタクトプローブの表面改質方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101377536A (zh) * 2007-08-31 2009-03-04 东京毅力科创株式会社 检查装置和检查方法
CN101430361A (zh) * 2007-10-15 2009-05-13 东京毅力科创株式会社 检查装置

Also Published As

Publication number Publication date
JP2013229496A (ja) 2013-11-07
US20130285684A1 (en) 2013-10-31
CN103379682A (zh) 2013-10-30
JP5861557B2 (ja) 2016-02-16
US9188624B2 (en) 2015-11-17

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