CN103361610A - Evaporating source and vacuum evaporation device employing the same - Google Patents
Evaporating source and vacuum evaporation device employing the same Download PDFInfo
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- CN103361610A CN103361610A CN2013100535083A CN201310053508A CN103361610A CN 103361610 A CN103361610 A CN 103361610A CN 2013100535083 A CN2013100535083 A CN 2013100535083A CN 201310053508 A CN201310053508 A CN 201310053508A CN 103361610 A CN103361610 A CN 103361610A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Abstract
The invention provides an evaporating source and vacuum evaporation device not only allowing evaporation material to enter the evaporating source, but also can prevent degradation of film quality, can obstacles cannot be generated to continuous operation and maintenance. The evaporating source and vacuum evaporation device comprises a crucible with a nozzle used for discharging evaporation material evaporated by heating up the sealed evaporation material, a heating member for heating the crucible, and heat isolation members configured around the crucible and the heating member. A floating evaporation object recycling member with low temperature kept by the heating member is arranged between the heat isolation member and the crucible or the heating member, and heat isolation members are arranged between the floating evaporation object recycling member and the crucible and the heating member.
Description
Technical field
The present invention relates under vacuum, deposition material be heated, make it produce the evaporation particle, form the vacuum deposition apparatus of the film of deposition material at substrate.
Background technology
General organic electroluminescent device (calling organic EL in the following text) is described simply.
Organic EL order according to anode, hole transporting layer, luminescent layer, electron supplying layer, electron injecting layer, negative electrode on substrate forms film, and is mobile and luminous between anode and negative electrode by making electric current.
Especially for from the hole transporting layer to the electron injecting layer, by vacuum evaporation or printing or smear and be formed with organic compounds or mineral compound, form laminated structure at anode.Have again, by vacuum evaporation or sputter at the metallic membrane that forms magnesium, silver, aluminium etc. on the laminated structure, negative electrode is set.Like this, form organic EL.
Use Fig. 2, the example of general vacuum deposition method is described.
In Fig. 2, vacuum deposition apparatus 1 possesses vacuum chamber 2, vacuum pump 3 and evaporation source 4.Vacuum chamber 2 becomes encloses container, within it section configuration evaporation source 4 and as the substrate 5 of evaporation object.In addition, the inside of vacuum chamber 2 is owing to need to keep 10 with respect to substrate 5 film forming the time
-3～10
-6The vacuum tightness of Pa, so, carry out vacuum exhaust by vacuum pump 3.At evaporation source 4 the deposition material heating is made it vaporization, and with respect to substrate 5 sprayings, carry out film forming.At this moment, with respect to the large shape of substrate 5, any one that makes substrate 5 rotation or make substrate 5 or evaporation source 4 moves to carry out film forming.
The example of general evaporation source structure is described simply, deposition material is sealing into inner crucible by heater heats.Accordingly, the deposition material vaporization, the gas of deposition material discharges towards substrate upward from the opening on the lid that is arranged on crucible.
Above-mentioned crucible is made of crucible main body and loam cake and middle cover.The crucible main body is supported by tectosome, by the well heater radiation heating as heater, and the deposition material evaporation.
Accordingly, be configured in crucible above substrate form film.For the output of control heater, by the bottom temp of thermocouple measurement crucible.Have, the peripheral part that constitutes at well heater arranges reverberator again, and the radiant heat from well heater is concentrated in the crucible.
Technical literature formerly
Patent documentation
Patent documentation 1: TOHKEMY 2008-24998 communique
In above-mentioned conventional art, move towards the direction of substrate from the great majority of the steam of the deposition material of the nozzle discharge of crucible.But, wherein produce the particle of the clearance leakage steam out of the sub or slave crucible main body of grain of the steam that enters towards the inside of evaporation source and loam cake.
Enter into the particle of steam of deposition material of inside of evaporation source with respect to the parts that are connected with the outside of reverberator, such as the terminal of structural member, well heater and thermopair etc. concentrated to the parts of the low temperature of evaporation source inside, and condensation is also separated out.
If the deposition material of organic compound is separated out, then in organic vapor deposition, decompose because of the heat that is subject to for a long time well heater, produce the membranous impurity that impacts.In addition, in the situation of deposition material that is mineral compound, also there is the parts adhesion of having adhered to deposition material, situation about when safeguarding, each parts can not be decomposed.If especially with metallic substance as deposition material, then also exist between the terminal of well heater and to wait the possibility that produces short circuit.These problem points are not solved in the evaporation source of conventional art.
To this, the evaporation source shown in the patent documentation 1 does not disclose and closes the solution of problem countermeasure that the deposition material shown in above-mentioned is separated out in evaporation source inside.
Summary of the invention
Enter evaporation source inside even the purpose of this invention is to provide a kind of deposition material, also prevent membranous deteriorated, can be to continuous operation, safeguard the evaporation source and the vacuum deposition apparatus that produce obstacle.
To achieve these goals, the present invention is a kind of evaporation source, described evaporation source is by the crucible with nozzle, the heater that is used for this crucible of heating, the heat insulating component (the first heat insulating component) that is configured in the periphery of above-mentioned crucible and above-mentioned heater consists of, said nozzle is used for discharging the deposition material heating that will be enclosed and the deposition material that evaporates, wherein, between above-mentioned heat insulating component and crucible or heater, setting is reclaimed member by the evaporation thing that swims that this heater remains low temperature, and reclaims between member and above-mentioned crucible and the above-mentioned heater at this evaporation thing that swims heat insulating component (the second heat insulating component) is set.
Also can be that above-mentioned heater and above-mentioned crucible are wholely set or are arranged on the inside of crucible.
Also can be that above-mentioned heater is to make to be heated by resistive the heater that generates heat.
Also can be, above-mentioned heater be configured in outside the above-mentioned crucible, and, make be heated by resistive, any one heater of induction heating, infrared heating.
Also can be that above-mentioned the first heat insulating component is to cover at least the shape with respect to the forward surface of above-mentioned crucible and heater that the above-mentioned evaporation thing that swims reclaims member.
In addition, to achieve these goals, the present invention also preferably above-mentioned the first heat insulating component be single or the structure of a plurality of plates of lamination.
In addition, to achieve these goals, the present invention also can be preferably above-mentioned the first heat insulating component use any one or a plurality of plate that forms by carbon, metal, pottery.
In addition, to achieve these goals, the present invention also preferably above-mentioned the second heat insulating component be single or lamination the structure of a plurality of plates.
In addition, to achieve these goals, the present invention also can be preferably above-mentioned the second heat insulating component use any one or a plurality of plate that forms by carbon, metal, pottery.
In addition, to achieve these goals, the present invention also can preferably arrange removable cover around the above-mentioned evaporation thing recovery member that swims, and this cover contacts partly with cooling component at least and is cooled.
In addition, to achieve these goals, the present invention also can preferably reclaim the above-mentioned evaporation thing that swims member and be arranged on beyond the face with nozzle of above-mentioned crucible.
In addition, to achieve these goals, the present invention is the preferably above-mentioned cooling medium cooling of evaporation thing retrieving arrangement by circulation of swimming also.
In addition, to achieve these goals, the present invention also can circulate at the wall of housing itself by preferred above-mentioned cooling medium, and above-mentioned housing and the above-mentioned evaporation thing recovery member thermo-contact of swimming.
In addition, the structure of the present invention that be used for to realize above-mentioned purpose is to have used any one vacuum deposition apparatus of above-mentioned evaporation source.
According to the present invention, even can provide a kind of deposition material to enter into evaporation source inside, also prevent membranous deteriorated, can be to continuous operation, safeguard the vacuum deposition apparatus and the evaporation source that produce obstacle.
Description of drawings
Fig. 1 is the synoptic diagram of basic structure of the vacuum deposition apparatus of relevant embodiments of the invention.
Fig. 2 is based on the schematic configuration diagram of the film deposition system of general vacuum evaporation.
Fig. 3 is the schematic configuration diagram of the vacuum deposition apparatus of relevant embodiments of the invention.
Fig. 4 is the schematic configuration diagram of the organic el device manufacture apparatus of relevant embodiments of the invention.
Fig. 5 is the figure of cooling component of the evaporation source of the relevant other embodiments of the invention of expression.
Fig. 6 is the figure of cooling component of the evaporation source of the relevant other embodiments of the invention of expression.
Nomenclature
1: vacuum deposition apparatus; 2: the chamber; 3: vacuum pump; 4: evaporation source; 5: substrate; 6: the family of power and influence; 7: the vacuum conveying room; 8: substrate store holder chamber; 9: the vacuum carrier robot; 10: substrate; 11: evaporation source; 12: mask; 13: the substrate maintaining part; 14: family of power and influence's part; 16: the vacuum evaporation chamber; 21: evaporating materials; 22: crucible; 25: thermopair; 24: reverberator; 26: rate sensor; 27: housing; 28: the cooling block; 34: nozzle; 43: heat insulating component; 44: heater (well heater 23); 45: cooling component (the evaporation thing that swims reclaims member); 46: the thermal radiation heat insulating component; 50: terminal; 51: the water-cooled pipe arrangement; 52: cooling fluid; 52a: cooling liquid flowing through hole; 52b:U z bend section; 100: organic el device manufacture apparatus.
Embodiment
Below, based on figure explanation one embodiment of the invention.
With reference to the accompanying drawings, illustrate for implementing best mode of the present invention.
Fig. 1 is the synoptic diagram of basic structure of the vacuum deposition apparatus of relevant embodiments of the invention.Use Fig. 1, the summary of the vacuum deposition apparatus of relevant embodiments of the invention is described.
Among Fig. 1, vacuum deposition apparatus 1 has the chamber 2 as vacuum vessel, dispose therein discharging deposition material 21 steam evaporation source 4 and as by the substrate 5 of evaporation thing.For 2 inside, chamber being reached than 10 when the evaporation
-3The vacuum tightness that Pa is high is always carried out vacuum exhaust by the vacuum pump 3 that is connected with chamber 2.Here, substrate 5 is not only the parts that consist of vacuum deposition apparatus 1, also is the parts by vacuum deposition apparatus 1 film forming.
After beginning decompression, by heater 44 heating crucibles 22 of evaporation source 4.By this heating, deposition material 21 evaporations or distillation, the steam of generation deposition material 21, film forming on substrate 5.Substrate used herein 5 uses glass, pottery, metal, organic any one flat board.For example, when forming organic EL, the evaporation face at substrate 5 forms anode in advance.
Each of organic EL layer following such material of use.Hole injectability height, the metal that work function is large, the conductive compound of alloy such as anode preference such as ITO, gold, cupric iodide, stannic oxide.
As hole injection layer, for example use CuPc, m-MTDATA.As hole transporting layer, use for example α-NPD, TPD, PDA.As luminescent layer, for example substrate material uses rubrene, CBP, CDBP, Alq3, and dopant material uses coumarin 6, Ir(ppy) 3, FIrpic etc.As electron supplying layer, such as using Alq3, PBD, TAZ, BND, OXD etc.As such as use LiF, BCP, strontium etc. of electron injecting layer.As negative electrode, use Mg-Ag altogether vapor-deposited film, Al etc.
Evaporation is to use the evaporation source 4 that is made of crucible 22, heater 44, heat insulating component 43 to carry out evaporation.By crucible 22 heating that heater 44 will have been enclosed deposition material 21, produce the steam of deposition material 21.And, by carrying out film forming by the nozzle 34 that is arranged on the crucible 22 towards substrate 5 dischargings.These crucibles 22, heater 44, heat insulating component 43 etc. are incorporated in the housing 27.In addition, as long as heater 44 is because can heat the deposition material of crucible inside, so, also no problem in the inside of crucible.Also be same among the embodiment 2～3 below, no matter the inside and outside of crucible all can arrange in the position of heater 44.
The control of evaporation source 4 is in evaporation source 4 inside thermopair to be set, and adjusts the access electric power to heater 44, so that crucible 22, its envrionment temperature reach the temperature of regulation.Perhaps, also can be at the spatial placement rate sensor 26 that is arranged between evaporation source 4 and the substrate, adjust the access electric power of heater 44, so that reach the value of regulation to the evaporation speed of the time per unit of this rate sensor 26.The 25th, thermopair.The 50th, terminal.
Corresponding to the situation of substrate 5 large shapes, make substrate 5 rotation, evaporation source 4 is fixed from the state that turning axle staggers, any one that perhaps makes substrate 5 or evaporation source 4 moves to the direction vertical with the steam emission direction.Especially in the situation that is the latter, as long as nozzle 34 is arranged at the width of substrate, substrate 5 or evaporation source 4 are got final product to moving with the rectangular direction of orientation.
In order continuously different substrate 5 to be carried out evaporation, as long as 2 the family of power and influence 6 is set in the chamber, the state that the substrate 5 that processing is finished is being kept vacuum moves to other chamber 2 unchangeably, untreated substrate 5 is transported into to get final product with keeping the vacuum constant equally.
Seek in this wise the utilization of evaporation coating device and evaporation source.Evaporation source 4 of the present invention also can use as described above equally.
Below, use Fig. 1, evaporation source of the present invention is described.
In addition, although the figure shown in the present embodiment is the example that has represented to make the mode that the film forming face of substrate 5 processes down,, using towards ground of film forming face can not depended in the present invention.
In Fig. 1, evaporation source 4 has deposition material 21 by inclosure, and have for the crucible 22 of the nozzle 34 of deposition material 21 discharging, be in the outside of crucible 22, be used for the heater 44 of crucible 22 heating, the heat insulating component (the first heat insulating component) 43 that is configured in the periphery of crucible 22 and heater 44 are consisted of.Have again, the cooling component 45(evaporation thing that swims is set between heat insulating component 43 and crucible 22 or heater 44 reclaims member).
Can by this cooling component 45, with inciding the particle trapping of the material steam in the evaporation source 4, make it to separate out selectively.Accordingly, will be reduced to inferior limit to separating out of parts all around.It is low-down temperature that the temperature of this cooling component 45 is compared with the temperature of deposition material evaporation, for example, if the deposition material of distillation then preferably remains on the following temperature of sublimation point, if the material of evaporation then preferably remains on the following temperature of fusing point.
On the other hand, cooling component 45 is being arranged in the situation of above-mentioned position, owing to absorb significantly the radiant heat of crucible 22 or heater 44, so the temperature of the deposition material in the crucible reduces, evaporation itself produces obstacle.In order to prevent this situation, thermal radiation heat insulating component (the second heat insulating component) 46 is set, make crucible 22 and heater 44 can not face cooling component 45 directly.
This thermal radiation heat insulating component 46 is close to or is not close to cooling component 45 and all can.As long as compare very highly with the temperature of cooling component 45 in the face of the most surperficial temperature of heater 44 or crucible 22, can not impact the evaporation of the deposition material 21 in the crucible 22 and get final product.In addition, also can be that the part of cooling component 45 is exposed to the structure in the zone that is surrounded by heat insulating component 43.
Fig. 3 (A) is that expression is as the heater 44(well heater 23 of electric resistor heating type) example that uses.
In Fig. 3 (A), if the heating element of well heater 23 is then easy with the countermeasure that insulate on every side below 700 ℃, so, still use sheathed heater preferred because of manageable quilt.Surpassing in 700 ℃ the situation, especially more than 1000 ℃ the time, also the metal wire of the metal such as Mo, Ta, W or its alloy can be wound on and consist of well heater on the ceramic frame.Material as the insulativity excellence under high temperature such as the material preferential oxidation aluminium of ceramic frame, SiC, boron nitride, aluminium nitride.Well heater 23 is constituted as the face round, up and down or about etc. 2 cut apart or cut apart more than 2 and all can.If crucible 22 and deposition material 21 can heat equably, then how to consist of well heater 23 and all can.As heater 44, except resistive heating, also can use induction heating, infrared heating.
In the zone that is surrounded by well heater 23, taken in crucible 22.In Fig. 3, crucible 22 and well heater 23 noncontacts, still, if not because of crucible 22 and well heater 23 directly or indirect contact produce short circuit, ground connection, then also can make it contact.
As the material of crucible 22, as metals such as the preferred Mo of metallic substance, Ta, W or contain their alloy.As stupalith, in addition preferential oxidation aluminium, SiC, boron nitride, aluminium nitride etc., also can use the materials such as carbon graphite.
In Fig. 3, alternate figures 1, heat insulating component 43 shown in Figure 2 have represented the so-called reverberator 24 that many reflectors 48 are separated respectively.This reflector 48 can use stainless steel, titanium material being below 700 ℃ the time.When being temperature band more than 700 ℃, can use the ceramic materials such as the metallic substance such as Au, Cu, Mo, Ta, W and alloy thereof, carbon, aluminum oxide, SiC, BN, AlN.The function of the reflections of electromagnetic wave such as thermal-radiating infrared rays will be propagated as long as guarantee.Therefore, in order to improve the reflectivity of infrared band, preferably mirror finish is carried out on the surface of reflector 48, have again, also can coating Ag, Au, the metals such as Cu, Al.
Also reverberator 24 be can substitute, ceramic plate or ceramic twice-laid sheet material little with thermal conduction more than at least one and that heat resisting temperature is high laid.In the situation of using ceramic plate, consider vacuum exhaust, can use the little ceramic plate of void content.In addition, also can share reverberator shown in Figure 3 24 and heat insulation material etc.
Fig. 3 (B) is the figure of the shape of expression well heater 23.
In Fig. 3 (B), the well heater 23a shown in (1) is integrally formed well heater, and the well heater 23b shown in (2) is two well heaters of cutting apart.The application of these well heaters is to select matchingly with the size of housing 27, the size of substrate 5.
Here, use Fig. 4, the production line structure that the simple declaration organic EL device is made.
Fig. 4 is the schematic configuration diagram of the organic el device manufacture apparatus of relevant embodiments of the invention.
In Fig. 4, organic el device manufacture apparatus 100 of the present invention is constituted as by same vacuum evaporation chamber 16 and calibrates and evaporation.Organic el device manufacture apparatus 100 is made the structure of the organic el device manufacture apparatus 100 of following cluster type: have the polygonal vacuum conveying room 7 of vacuum carrier robot 9 in central part configuration, and its periphery radially placement substrate store holder chamber 8, as the vacuum evaporation chamber 16 of filming chamber.Each vacuum evaporation chamber 16 has substrate maintaining part 13 and the mask 12 that keeps substrate 10.In addition, between vacuum evaporation chamber 16 and substrate store holder chamber 8 and vacuum conveying room 7, be provided with family of power and influence's part 14 with mutual vacuum insulation.Evaporation source 11 uses Fig. 1 or evaporation source 4 shown in Figure 3.
By such structure, vacuum carrier robot 9 is 8 taking-up substrates 10 from substrate store holder chamber, are transported into the substrate maintaining part 13 in vacuum evaporation chamber 16.And, in vacuum evaporation chamber 16, make the substrate 10 that is transported into over against mask 12 by substrate convolution member (not shown go out), calibrate (carrying out the contraposition of substrate and mask), evaporation source 11 is moved up and down, substrate 10 is carried out evaporation.Behind evaporation, make substrate 10 return horizontality.After this, by vacuum carrier robot 9 substrate 10 is transported from vacuum evaporation chamber 16, be transported into other vacuum evaporation chamber 16 or return substrate store holder chamber 8.
Transporting when being transported into of substrate 10 in carrying out such processing, family of power and influence's part 14 that control is relevant is not in order to can impact the processing in each vacuum evaporation chamber 16.
As mentioned above, in the present embodiment, cooling component 45 is arranged on crucible 22 and heater 44(well heater 23) the outside, and be arranged on by heat insulating component 44(reverberator 24) inboard in the zone that surrounds.Accordingly, because can make the leakage steam concentrated area of swimming be attached to cooling component 45, so, can prevent from carrying out above-mentioned adhering to extra position.
In addition and since from well heater 23 for the heat of cooling component 45 by radiant heat heat insulating component 46(reverberator 24) cut off, so, do not have cooling component 45 heated situations.Therefore, can carry out the capture of stable leakage steam.
[embodiment 2]
Fig. 5 represents the details of cooling component.
Fig. 5 is the figure of cooling component of the evaporation source of the relevant other embodiments of the invention of expression.
Among Fig. 5, in the present embodiment, be the block 28 of for example making stainless steel as cooling component 45, make cooling fluid 52(use oil or water etc. as cooling medium from the outside of reverberator 24) structure of circulation.
That is to say, two cooling liquid flowing through hole 52a with chamber 2 and housing 27 perforations are set, and then the 52b of u turn section is set, so that two cooling liquid flowing through hole 52a are by cooling block 28 interflow.Cooling liquid flowing through hole 52a is connected to become continuous opening by pipe arrangement 51 respectively.
In addition, in the present embodiment, although by chamber 2, housing 27, will cool off the cooling liquid flowing through hole 52a that block 28 connects and consist of,, certainly be not limited to this structure, even consisted of by the pipe arrangement of U word shape, also can access same effect.
As mentioned above, according to present embodiment, by making cooling fluid 52 circulation in cooling block 28, because cooling block 28 can always remain low-temperature condition, so, can improve the capture effect of leaking steam.
[embodiment 3]
Fig. 6 is the figure of cooling component of the evaporation source of the relevant other embodiments of the invention of expression.
Among Fig. 6, in embodiment 2, make the structure that makes cooling medium circulation in cooling block 28, but at present embodiment, be to offer the hole at reverberator 24, be connected or integrated structure with the housing 27 of outside.In addition, make be connected with housing 27 or the situation of Construction integration under, also can only carry out water-cooled to case side.
That is to say, if use cooling block 28, then can absorb crucible 22 or heater 44(well heater 23 with keeping intact) thermal radiation, the temperature in the evaporation source is obviously reduced, evaporation produces obstacle.Therefore, such as Fig. 5 or shown in Figure 6, in cooling block 28, with heater 44 or 22 opposed in crucible radiant heat shut-off member 46 is being set.This radiant heat shut-off member 46 is reverberator 24 or heat insulation material etc., and which all can.
The temperature of wishing cooling block 28 is configured to which the low temperature all than the parts of the inboard of the reverberator 24 that is in evaporation source 4.In addition, the vaporization temperature that preferably sets into deposition material 21 is in a ratio of low-down temperature, for example, at deposition material 21 in the situation of melting class material, preferred settings in the situation for distillation class material, preferably sets below distillation beginning temperature near fusing point.Accordingly, the particle that invades the deposition material 21 the evaporation source 4 from nozzle next door can not be the component parts to evaporation source 4, and for example thermopair, reverberator 24 are concentrated, but concentrates and separate out to cooling block 28.
In addition, such as Fig. 5 or shown in Figure 6, also can Antisticking 29 be installed at cooling block 28.Wish that Antisticking 29 contacts with cooling block 28, is made by the material that heat conductivity is good.In addition, it is concavo-convex also can be that the face in the outside of Antisticking 29 has by sandblast etc., and the deposition material that adheres to can not come off.In addition, by dismounting Antisticking 29 easily, make it possible to easily safeguard.
And, in embodiment 2, the 52b of u turn section of cooling liquid flowing through hole 52a is arranged on the cooling block 28, and in the present embodiment, is arranged on the housing 27.Accordingly, indirectly cooled off through housing 27 owing to cool off block 28, so, can carry out the processing of cooling liquid flowing through hole 52a fairly simplely, can seek cost degradation.
In addition, as described above, also be to be consisted of by chamber 2, cooling liquid flowing through hole 52a that housing 27 is connected in the present embodiment, still, certainly be not limited thereto structure, even consisted of by the pipe arrangement of U word shape, also can access same effect.
As mentioned above, according to the present invention, cooling component is located at by in the middle of the heat insulating component covering, can be produced partly by cooling component and compare low-down temperature with the temperature of deposition material evaporation or reach part below the fusing point of deposition material, accordingly, can with the particle set that enters into the deposition material between crucible heating member and the heat insulating component at cooling component 45, make it to separate out.
In addition, by towards the part of heater or crucible heat insulating component being set at cooling component, can suppress the impact of evaporation operation.
Have again, can make deposition material to the terminal of heater (well heater), thermopair, crucible, supporting heater adhering to of tectosome be inferior limit, suppress in the past take deposition material to these parts separate out as rise thereby produce membranous deteriorated, to the obstacle of continuous operation or maintenance.
In addition, can install detachably by the part of separating out at the deposition material of cooling component, and the Antisticking of being made by the good material of heat conductivity is installed, can safeguard simply, can keep performance.
Claims (20)
1. evaporation source, described evaporation source is made of the crucible with nozzle, the heater that is used for this crucible of heating, the first heat insulating component that is configured in the periphery of above-mentioned crucible and above-mentioned heater, said nozzle is used for discharging the deposition material heating that will be enclosed and the deposition material that evaporates, it is characterized in that
Between above-mentioned the first heat insulating component and crucible or heater, the evaporation thing recovery member that swims that is remained low temperature by this heater is set, and
Reclaim between member and above-mentioned crucible and the above-mentioned heater at this evaporation thing that swims the second heat insulating component is set.
2. evaporation source as claimed in claim 1 is characterized in that,
Above-mentioned heater and above-mentioned crucible are wholely set or are arranged on the inside of crucible.
3. evaporation source as claimed in claim 2 is characterized in that,
Above-mentioned heater makes and is heated by resistive and generates heat.
4. evaporation source as claimed in claim 1 is characterized in that,
Above-mentioned heater is configured in outside the above-mentioned crucible, and, make be heated by resistive, any one heater of induction heating, infrared heating.
5. such as each the described evaporation source in the claim 1 to 4, it is characterized in that,
Above-mentioned the first heat insulating component is to cover at least the shape with respect to the forward surface of above-mentioned crucible and heater that the above-mentioned evaporation thing that swims reclaims member.
6. such as each the described evaporation source in the claim 1 to 4, it is characterized in that,
Above-mentioned the first heat insulating component is single or the structure of a plurality of plates of lamination.
7. such as each the described evaporation source in the claim 1 to 4, it is characterized in that,
Above-mentioned the first heat insulating component uses by any one of carbon, metal, pottery or a plurality of plate that forms.
8. such as each the described evaporation source in the claim 1 to 4, it is characterized in that,
Above-mentioned the second heat insulating component has structures single or a plurality of plates of lamination.
9. such as each the described evaporation source in the claim 1 to 4, it is characterized in that,
Above-mentioned the second heat insulating component uses by any one of carbon, metal, pottery or a plurality of plate that forms.
10. such as each the described evaporation source in the claim 1 to 4, it is characterized in that,
Around the above-mentioned evaporation thing recovery member that swims removable cover is set, this cover contacts partly with cooling component at least and is cooled.
11. each the described evaporation source as in the claim 1 to 4 is characterized in that,
The above-mentioned evaporation thing that swims is reclaimed member to be arranged on beyond the face with nozzle of above-mentioned crucible.
12. each the described evaporation source as in the claim 1 to 4 is characterized in that,
The above-mentioned cooling medium cooling of evaporation thing retrieving arrangement by circulation of swimming.
13. evaporation source as claimed in claim 12 is characterized in that,
Above-mentioned cooling medium circulates at the wall of housing itself, and
Above-mentioned housing and the above-mentioned evaporation thing that swims reclaim the member thermo-contact.
14. a vacuum deposition apparatus, described vacuum deposition apparatus possesses: the evaporation source of the steam of discharging deposition material; And vacuum chamber, this vacuum chamber keeps this evaporation source in reduced pressure atmosphere and the substrate of film forming is characterized in that via the steam that gives off from this evaporation source,
Above-mentioned evaporation source is made of the crucible with nozzle, the heater that is used for this crucible of heating, the first heat insulating component that is configured in the periphery of above-mentioned crucible and above-mentioned heater, said nozzle is used for discharging the deposition material heating that will be enclosed and the deposition material that evaporates
The evaporation thing recovery member that swims that is remained low temperature by this heater is set between above-mentioned the first heat insulating component and crucible or heater, and
Reclaim between member and above-mentioned crucible and the above-mentioned heater at this evaporation thing that swims the second heat insulating component is set.
15. vacuum deposition apparatus as claimed in claim 14 is characterized in that,
Above-mentioned the second heat insulating component has structures single or a plurality of plates of lamination.
16. vacuum deposition apparatus as claimed in claim 14 is characterized in that,
Above-mentioned the second heat insulating component uses by any one of carbon, metal, pottery or a plurality of plate that forms.
17. vacuum deposition apparatus as claimed in claim 14 is characterized in that,
Around the above-mentioned evaporation thing recovery member that swims removable cover is set, this cover contacts partly with cooling component at least and is cooled.
18. vacuum deposition apparatus as claimed in claim 14 is characterized in that,
The above-mentioned evaporation thing that swims is reclaimed member to be arranged on beyond the face with nozzle of above-mentioned crucible.
19. vacuum deposition apparatus as claimed in claim 14 is characterized in that,
The above-mentioned cooling medium cooling of evaporation thing retrieving arrangement by circulation of swimming.
20. vacuum deposition apparatus as claimed in claim 19 is characterized in that,
Above-mentioned cooling medium circulates at the wall of housing itself, and
Above-mentioned housing and the above-mentioned evaporation thing that swims reclaim the member thermo-contact.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-079803 | 2012-03-30 | ||
| JP2012079803A JP2013211138A (en) | 2012-03-30 | 2012-03-30 | Evaporation source and vacuum deposition device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103361610A true CN103361610A (en) | 2013-10-23 |
Family
ID=49363848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100535083A Pending CN103361610A (en) | 2012-03-30 | 2013-02-19 | Evaporating source and vacuum evaporation device employing the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013211138A (en) |
| KR (1) | KR20130111272A (en) |
| CN (1) | CN103361610A (en) |
| TW (1) | TW201339336A (en) |
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| CN103710667A (en) * | 2012-09-28 | 2014-04-09 | 株式会社日立高新技术 | Evaporation source, vacuum deposition apparatus, and method of manufacturing organic el display device |
| CN104213080A (en) * | 2014-08-20 | 2014-12-17 | 京东方科技集团股份有限公司 | Evaporator source device and evaporation equipment |
| CN105762278A (en) * | 2016-03-04 | 2016-07-13 | 苏州大学 | Vacuum evaporation device and method for preparing organic electroluminescent device through employing same |
| CN107254661A (en) * | 2017-08-01 | 2017-10-17 | 河源耀国电子科技有限公司 | Flexible OLED evaporated device and its technique |
| CN108624849A (en) * | 2018-07-19 | 2018-10-09 | 北京泰科诺科技有限公司 | A kind of thermal resistance evaporation device |
| WO2018214783A1 (en) * | 2017-05-23 | 2018-11-29 | 京东方科技集团股份有限公司 | Vapor deposition crucible, vapor deposition source, vapor deposition device, and vapor deposition method |
| CN109423611A (en) * | 2017-08-28 | 2019-03-05 | 佳能特机株式会社 | Evaporate source container and evaporation source |
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-
2012
- 2012-03-30 JP JP2012079803A patent/JP2013211138A/en active Pending
-
2013
- 2013-02-13 KR KR1020130015305A patent/KR20130111272A/en not_active Application Discontinuation
- 2013-02-18 TW TW102105598A patent/TW201339336A/en unknown
- 2013-02-19 CN CN2013100535083A patent/CN103361610A/en active Pending
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| CN103710667A (en) * | 2012-09-28 | 2014-04-09 | 株式会社日立高新技术 | Evaporation source, vacuum deposition apparatus, and method of manufacturing organic el display device |
| CN104213080A (en) * | 2014-08-20 | 2014-12-17 | 京东方科技集团股份有限公司 | Evaporator source device and evaporation equipment |
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| CN111621748A (en) * | 2019-02-27 | 2020-09-04 | 三星显示有限公司 | Deposition source evaporation equipment |
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| CN117702056A (en) * | 2024-02-06 | 2024-03-15 | 上海升翕光电科技有限公司 | Evaporation equipment of display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201339336A (en) | 2013-10-01 |
| JP2013211138A (en) | 2013-10-10 |
| KR20130111272A (en) | 2013-10-10 |
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Application publication date: 20131023 |