CN100567556C - The evaporation coating device of evaporation source and this evaporation source of employing - Google Patents
The evaporation coating device of evaporation source and this evaporation source of employing Download PDFInfo
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- CN100567556C CN100567556C CNB2005100923737A CN200510092373A CN100567556C CN 100567556 C CN100567556 C CN 100567556C CN B2005100923737 A CNB2005100923737 A CN B2005100923737A CN 200510092373 A CN200510092373 A CN 200510092373A CN 100567556 C CN100567556 C CN 100567556C
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- 230000008020 evaporation Effects 0.000 title claims abstract description 160
- 238000001704 evaporation Methods 0.000 title claims abstract description 160
- 238000000576 coating method Methods 0.000 title claims abstract description 20
- 239000011248 coating agent Substances 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 69
- 239000007921 spray Substances 0.000 claims abstract description 68
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 238000009413 insulation Methods 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 5
- 239000012141 concentrate Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 230000005684 electric field Effects 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Abstract
A kind of evaporation source and evaporation coating device, this evaporation source is configured in one with crucible and heating part and spray nozzle part and divides the space, dwindles its size; Described evaporation coating device utilize described evaporation source with the evaporation material evaporation on substrate.Described evaporation source comprises: housing (110); In be located at crucible (120) in the described housing (110); In be located in the described housing (110), be used for heating crucible (120) and be located at its peripheral heating part; Spray nozzle part will be ejected on the substrate (220) that is positioned at housing (110) outside from the evaporation material of described crucible (120) evaporation via spray jet (140).
Description
Technical field
The present invention relates to the evaporation coating device of evaporation source and this evaporation source of employing, in more detail, relate to the evaporation coating device that to be located at an intravital evaporation source of shell in crucible and the spray nozzle part and this evaporation source is installed.
Background technology
Usually, evaporation unit is used for the film vapor deposition of various electronic components, particularly main the use in the film of electronic installation such as semi-conductor, LCD, organic electric-field display unit and display unit forms.
Described organic electric field light-emitting display device injects electronics and hole from electron injection electrode, hole injecting electrode respectively to luminescent layer inside respectively, and is luminous when the exciton (Exiton) that is combined with the electronics that is injected into and hole falls after rise to base state from excited state.
At this, in order to improve the luminous efficiency of organic electric field light-emitting display device, must carry hole and electronics swimmingly by luminescent layer, can between negative electrode and organic luminous layer, dispose electron supplying layer for this reason, between anode and organic luminous layer, dispose hole transporting layer.In addition, can between anode and hole transporting layer, dispose hole injection layer, between negative electrode and electron supplying layer, dispose electron injecting layer.
And,, have physical vapor deposition (PVD) such as vacuum vapour deposition, plating ion (Ion-plation) method and sputtering method and utilize the chemical vapor coating method (CVD) etc. of gas reaction as film forming general method on substrate.Wherein, in forming, the film of metallic membrane of organic electric-field light-emitting element etc. mainly utilizes vacuum vapour deposition.
As the employed evaporation source of this vacuum vapour deposition, use has the evaporation source of indirect heating mode (or induction heating mode), this indirect heating mode need be housed in the device of the evaporation material in the crucible with specified temperature when A1 (for example be 1200 ℃) heating, and this device has the spray nozzle part that is used to heat the well heater of described crucible and is used for spraying to substrate the evaporation material of emitting from heated crucible.In addition, for the elevated temperature heat that prevents to produce by described heating part to the phenomenon that the outside of evaporation source emits, spread all over evaporation source integral body a plurality of lagging materials be set.
But, structure according to such evaporation source, usually in the space of a division, dispose crucible and the heating part that will heat this crucible, in the space of another division, dispose spray nozzle part, this spray nozzle part is communicated with crucible, described crucible and spray nozzle part are provided with the lagging material that is used to interdict heat, and the bond sites of crucible and spray nozzle part is provided with the lagging material that is used to interdict heat similarly certainly.
Therefore, must increase the volume of vapor deposition source, the installation costs that is set to the lagging material on so big vapor deposition source increases, and in addition, the transfer device that is used for mobile this vapor deposition source also requires to have superpower.
As the document of the technology that records existing vacuum deposition apparatus and method thereof, have following patent documentation 1, it discloses vacuum deposition apparatus and the method thereof of utilizing easy-to-use linear evaporation and indirect heating in the evaporation of organism and inorganics.
Patent documentation 1: Korean Patent discloses the 2003-0024338 specification sheets
Summary of the invention
The present invention puts in view of the above problems and researches and develops, and its objective is to provide crucible and heating part and spray nozzle part are configured in the space of a division and dwindle the evaporation source of its size and utilize this evaporation source with the evaporation coating device of evaporation material evaporation on substrate.
For achieving the above object, evaporation source of the present invention comprises: housing; In be located at crucible in the described housing; In be located in the described housing, and be used for heating crucible and be arranged on its peripheral heating part; To be ejected into spray nozzle part on the substrate that is positioned at hull outside from the evaporation material of described crucible evaporation via spray jet.
In addition, described heating part has more than or equal to one plate heater at least with heating crucible, described plate heater have certain unit wide cut and about alternately tortuous and constitute tabular.
In addition, described housing is the cooling jacket with cooling water channel, and it can evenly be configured in a successive tube bending the whole position of cooling jacket, and a plurality of pipes can be configured in the different sites of cooling jacket respectively.
In addition, evaporation source of the present invention also is included between described heating part and the housing to cutting off the insulation part that heat is provided with.
Described insulation part has independent one or with a plurality of stacked lagging materials, and its applicable graphite felt material, described insulation part also have the nozzle lagging material that covers spray jet and dispose.
Described insulation part also comprises thermal baffle, and the inner peripheral surface that it is arranged on jet hole is used to interdict the heat via the spray jet radiation.
Described spray jet is provided with arbitrary interval for guaranteeing in the substrate film forming uniformity coefficient, and its diameter is 5～15mm, the length of described relatively substrate and dispose 1～20.
Described thermal baffle also comprises: first thermal baffle, the periphery of the inner peripheral surface of its covering jet hole and a part of housing of jet hole periphery; Second thermal baffle, its outstanding formation on the periphery of housing is divided to comprise described first thermal baffle.
Employing has the evaporation coating device of the evaporation source of this spline structure, comprises the transfer portion that described evaporation source is provided with shifting described evaporation source.
Described transfer portion makes evaporation source move along guiding parts by the ball-screw that the power by motor rotates.
Arrange described a plurality of evaporation source, the evaporation material that sprays from each evaporation source of halted state concentrated in the certain limit of substrate, dispose obliquely each evaporation source spray jet so that evaporation material concentrate on the described substrate.
In addition, described evaporation source comprises: housing; In be located at the intravital crucible of described shell; In be located in the described housing, for heating crucible is arranged on its peripheral heating part; To be ejected into spray nozzle part on the substrate that is positioned at hull outside from the evaporation material of described crucible evaporation by spray jet.
The present invention according to above explanation, by dividing in the space crucible and heating part and spray nozzle part are set at one, compare with the existing evaporation source that disposes crucible and spray nozzle part in different separately spaces, small-sized and light weight, thereby the diameter and the number that limit spray jet are interdicted the radiation heat of emitting from evaporation source, evaporation evaporation material equably to greatest extent.
In addition, have following effect, that is, can also reduce the power of the transfer portion that is used for the moving evaporation source, arrange a plurality of evaporation sources and come the concentrated area to spray evaporation material, improve the quality of product.
Description of drawings
Fig. 1 is a stereographic map of roughly representing the evaporation source of best mode for carrying out the invention;
Fig. 2 is the sectional view along the A-A line of Fig. 1;
Fig. 3 is a stereographic map of representing crucible shown in Figure 2 individually;
Fig. 4 is the stereographic map of expression plate heater shown in Figure 2;
Fig. 5 is the housing of evaporation source of expression another embodiment of the present invention and the sectional view of insulation part;
Fig. 6 is the sectional view of heat insulation structural of the evaporation source of expression another embodiment of the present invention;
Fig. 7 is the sketch chart of evaporation coating device of roughly having represented to adopt the evaporation source of Fig. 1;
Fig. 8 is the stereographic map of an embodiment of presentation graphs 7 roughly;
Fig. 9 is the stereographic map of another embodiment of presentation graphs 7 roughly;
Figure 10 is the side elevational view of an embodiment of roughly representing the spray regime of the evaporation material that sprays to Fig. 8 and evaporation source shown in Figure 9 with from evaporation source;
Figure 11 is the side elevational view of another embodiment of roughly representing the spray regime of the evaporation material that sprays to Fig. 8 and evaporation source shown in Figure 9 with from evaporation source;
Embodiment
Below, describe evaporation source of the present invention with reference to the accompanying drawings in detail and adopt the evaporation coating device of this evaporation source.
Fig. 1 is a stereographic map of roughly representing the evaporation source of ideal embodiment of the present invention; Fig. 2 is the sectional view along the A-A line of Fig. 1.With reference to accompanying drawing, evaporation source 100 of the present invention comprises the crucible 120 of being located at housing 110 inside, have the well heater 130 that is used to heat this crucible 120 the heating part, have the insulation part of a plurality of lagging materials that cover this heating part and be communicated with described crucible 120 and have a spray nozzle part that is used for to the spray jet 140 of outer jet evaporation material.
Described crucible 120 contains evaporation material, in order to heat this crucible 120, at its circumferential arrangement well heater 130, is provided with the reverberator (reflector that is used to interdict the elevated temperature heat that is produced by this well heater 130 at the periphery of well heater 130; 162).
Described well heater 130 can be provided with on whole of crucible 120 as required, also can be arranged on selected more than or equal on one the face.In addition, be used to spray from the front end of the spray jet 140 of the evaporation material of crucible 120 evaporations, be provided for interdicting first thermal baffle 180 of the heat of evaporation material, in the top and the bottom of this first thermal baffle 180, outstanding second thermal baffle 190 that is provided for preventing evaporation material diffusion and radiate heat diffusion on the periphery of housing 110.In addition, the side at evaporation source 100 is provided with the reflectogauge 142 of mensuration via the evaporation thickness of the evaporation material of described spray jet 140 injections.
Fig. 3 is the stereographic map of the crucible shown in Figure 2 of expression separately.
As shown in Figure 3, be located in the housing 110 in the described crucible 120, it is desirable to have the essentially rectangular of suitable receiving space, be installed in nozzle 140 on this crucible 120 in order to ensure film forming all once it is desirable in the substrate to be configured at interval arbitrarily.At this moment, in order farthest to interdict the radiate heat of emitting from crucible 120 via spray jet 140, importantly the area with spray jet 140 minimizes.
Therefore, the diameter of spray jet 140 it would be desirable 5～15mm, and this is because if the size of spray jet 140 less than 5mm, then can not be transmitted the evaporation material that is ejected on the substrate, equably evaporation fully.And, if the diameter of spray jet 140 is more than the 15mm, then emit the above radiate heat of regulation via spray jet 140, the temperature of substrate is risen.In addition, it is graphite that described spray nozzle part it is desirable to material, and described spray jet 140 it is desirable to dispose 1～20 with respect to the length 1m of described substrate.This is because transmit the evaporation material of evaporation by evaporation source 100 heating fully via spray jet 140 on substrate, and transmit the radiation heat of irreducible minimum from this spray jet 140.
Fig. 4 is the stereographic map of expression plate heater shown in Figure 2.
As shown in Figure 4, expression has the plate heater 130 that uses in order to heat orthogonal crucible 120, this plate heater 130 has certain wide cut and height and length on the whole, makes can cover crucible 120 1 lateral sizes at least, as required crucible 120 is contained in inside.
In addition, by diagram as can be known, plate heater 130 has the wide cut of regulation, about alternately tortuous and form.Such shape is to consider that thermal conduction and resistance etc. can produce the heat of maximum limit at same area.On the other hand, it is desirable to, in order to be provided with the electric wire that contacts with well heater 130 to 130 energisings of described plate heater and, framework 114 is set to surround the profile of described power suppling part for supply power safely to the power suppling part of this electric wire supply power.
Described housing 110 is cooling jackets, on its main body, form cooling water channel 112, this cooling water channel 112 configurable pipes and forming, at this moment, can be with a pipe crooked continuously and be that the whole position of housing 100 disposes equably at cooling jacket, perhaps can distinguish the top and side etc. of housing 100 and dispose pipe respectively.
Certainly, though diagram not obviously must be provided with chilled water tank and pump etc., can make the water coolant described cooling water channel 112 of coming in and going out.Inner face at described housing 110 disposes lagging material 160.Described lagging material 160 is local integrants of insulation part, is the parts that are used to interdict from the heat of crucible 120 and well heater 130 generations.At this moment, described lagging material 160 surrounds 110 whole configurations of described housing, and (Graphite felt) is made as with the graphite felt.
In addition, leading section at described spray jet 140 is provided with nozzle lagging material 170, described nozzle lagging material 170 coverings are located at the spray jet 140 of crucible 120 and are disposed, promptly can be configured in the periphery of spray jet 140 with lagging material 160 simultaneously, the integral body that also can spread all over housing 120 one sides is configured.Described nozzle lagging material 170 is used to prevent condensing of nozzle, it is desirable to make of the graphite felt.
In addition, on the jet hole of described spray jet 140, be provided for interdicting first thermal baffle 180 of the heat of evaporation material, second thermal baffle 190 be set in that the periphery of housing 110 is outstanding, to comprise this first thermal baffle 180 and to divide.This first, second thermal baffle 180,190 will make evaporation material concentrate spray certainly, also is used to prevent the diffusion of the radiation heat of together emitting with evaporation material.
At this, the terminal configuration of described spray jet 140 contacts with housing 110 with described lagging material 160 for fear of the evaporation material and the heat of spraying from this spray jet 140 until the contact surface of nozzle lagging material 170, and first thermal baffle 180 is set.This first thermal baffle 180 is the hollow cone shape, outwardly-bent installation of its terminal part even contacting with blocking and heat outside the part of housing 110.
In addition, in order to support the well heater 130 of being located at described crucible 120 peripheries a plurality of well heater support slots 132 are set.Described well heater support slot 132 is provided with for supporting well heater 130 also insulate, and therefore, it is desirable to be made of ceramic material, also can be by boron nitride (BN) and aluminum oxide (Al
2O
3) the material formation.
Among the present invention, described well heater 130 and reverberator (reflector; 162) be center balanced configuration up and down with crucible 120, at top and the bottom heating crucible 120.In addition, be provided for the thermopair 116 of controlled temperature in the back of described housing 110.
Be not limited to an above-mentioned embodiment when on the other hand, the present invention constitutes described insulation part and heat insulation structural.That is, accompanying drawing 5 is the housing of evaporation source of expression the present invention another embodiment and the sectional view of insulation part; Fig. 6 is the sectional view of heat insulation structural of the evaporation source of expression the present invention another embodiment.Insulation part of the present invention can be made of first lagging material 350 and second lagging material 360.
At this moment, the closely inner face configuration of contact housing 310 of described first lagging material 350, second lagging material 360 is the medial surface configuration of contact first lagging material 350 closely.At this moment, described first lagging material 350 it is desirable to aluminum oxide (Al
2O
3) or mullite (mullite) making, second lagging material 360 it is desirable to make with the graphite felt.
In addition, described housing 310 is cooling jackets, forms cooling water channel 312 on the cooling jacket main body.Described cooling water channel 312 configurable pipes and constituting certainly, must be provided with chilled water tank and pump etc. so that water coolant is come in and gone out at described cooling water channel 312.
In addition, contact with housing 310 with first lagging material 350 and first insulation part 380 is set for fear of the evaporation material that sprays from described spray jet and heat, this first insulation part 380 is the hollow cylinder shape, can be communicated with the jet hole 372 that is formed at first lagging material 350 and housing 310, as shown in the figure, its terminal part is the shape of outside bending and the part outside that is mounted to housing 310, with blocking and hot contacting.
On the other hand, describe the evaporation coating device that the evaporation source with said structure is installed in detail with reference to accompanying drawing below.
Fig. 7 is the sketch chart of evaporation coating device of roughly representing to adopt the evaporation source of Fig. 1.
With reference to Fig. 7, evaporation coating device 200 of the present invention is provided with evaporation source 100 towards the substrate 220 that setting is disposed in the vacuum chamber 210, while this evaporation source 100 by transfer portion move back and forth up and down spray evaporation material and evaporation on substrate 220.
Described transfer portion is used for moving evaporation source 100, so utilize the ball-screw 232 by motor 230 rotations, evaporation source 100 moves along guiding parts 234.And, the mask 240 of evaporation shape of decision evaporation material is set on whole of substrate 220.
Fig. 8 and Fig. 9 are the stereographic maps of the embodiment of presentation graphs 7 roughly.As shown in Figure 8, two evaporation sources 100 horizontally can be provided with up or down; As shown in Figure 9, two evaporation sources, 100 arranged vertical move left and right ground can be provided with.At this, described evaporation source can be provided with a plurality of more than or equal to three as required.In addition, the horizontal or vertical arrangement position that specifically means spray jet 140 of evaporation source 100.
Figure 10 is the side elevational view of an embodiment of roughly representing the spray regime of the evaporation material that sprays to Fig. 8 and evaporation source shown in Figure 9 with from evaporation source; Figure 11 is the side elevational view of another embodiment of roughly representing the spray regime of the evaporation material that sprays to Fig. 8 and evaporation source shown in Figure 9 with from evaporation source.
As Figure 10 and shown in Figure 11, will be to substrate 220 and have certain overlapping scope from the evaporation material evaporation that sprays more than or equal to a plurality of evaporation sources 100 of two.In order to form so overlapping scope, as shown in figure 10, the spray jet 140 on the crucible 120 is located in configuration tiltably, disposes evaporation source 100 as shown in figure 11 obliquely.
Above with reference to description of drawings most preferred embodiment of the present invention, but described aspect only illustrates the present invention, does not limit the scope of the present invention that the meaning and interest field are put down in writing.Therefore, this area practitioner can carry out various changes and correction in the scope that does not break away from the technology of the present invention thought according to the above description.
Claims (22)
1. an evaporation source is characterized in that, comprising: housing; In be located at the intravital crucible of described shell; In be located in the described housing, and for heating crucible be located at the periphery the heating part; Spray nozzle part will be ejected on the substrate that is positioned at hull outside from the evaporation material of described crucible evaporation via spray jet; And thermal baffle, be arranged on the front end of described spray jet, be used to interdict heat by described evaporation material radiation, wherein said thermal baffle has a part of housing periphery of the inner peripheral surface that covers jet hole and jet hole periphery and first thermal baffle that disposes.
2. evaporation source as claimed in claim 1 is characterized in that, described heating part have at least more than or equal to one be used for heating crucible and the well heater that is provided with.
3. evaporation source as claimed in claim 2 is characterized in that, described well heater is tabular well heater.
4. evaporation source as claimed in claim 3 is characterized in that, and is alternately tortuous and constitute tabularly about described plate heater, and has a lateral size that covers described crucible at least.
5. evaporation source as claimed in claim 1 is characterized in that, described housing is the cooling jacket with cooling water channel.
6. evaporation source as claimed in claim 5 is characterized in that, described cooling water channel is configured in a successive tube bending the whole position of cooling jacket equably.
7. evaporation source as claimed in claim 5 is characterized in that, described cooling water channel is configured in a plurality of pipes respectively the different sites of cooling jacket.
8. evaporation source as claimed in claim 1 is characterized in that, also comprises being used for heat insulation and being configured in insulation part between described heating part and the housing.
9. evaporation source as claimed in claim 8 is characterized in that, described insulation part comprises one and a plurality of stacked lagging materials.
10. evaporation source as claimed in claim 9 is characterized in that, described lagging material is a graphite felt material.
11. evaporation source as claimed in claim 8 is characterized in that, described insulation part also comprises the nozzle lagging material that covers spray jet and dispose.
12. evaporation source as claimed in claim 8 is characterized in that, described insulation part also comprises the reverberator of being located at the well heater periphery.
13. evaporation source as claimed in claim 1 is characterized in that, the material of described spray nozzle part is a graphite.
14. evaporation source as claimed in claim 1 is characterized in that, the diameter of described spray jet is 5～15mm.
15. evaporation source as claimed in claim 1 is characterized in that, described spray jet disposes 1～20 with respect to the length 1m of described substrate.
16. evaporation source as claimed in claim 1 is characterized in that, described thermal baffle also has at outstanding second thermal baffle that forms to comprise first thermal baffle and to divide of the periphery of housing.
17. an evaporation coating device is characterized in that, comprises the transfer portion that evaporation source as claimed in claim 1 is provided with shifting described evaporation source.
18. evaporation coating device as claimed in claim 17 is characterized in that, described transfer portion by by the ball-screw of the power of motor rotation along guiding parts moving evaporation source.
19. evaporation coating device as claimed in claim 17 is characterized in that, arranges described a plurality of evaporation source, and the evaporation material that sprays from each evaporation source of halted state is concentrated in the certain limit of substrate.
20. evaporation coating device as claimed in claim 19 is characterized in that, the spray jet of each evaporation source of tilted configuration makes evaporation material concentrate to described substrate.
21. evaporation coating device as claimed in claim 19 is characterized in that, each evaporation source of tilted configuration makes evaporation material concentrate to described substrate.
22. evaporation coating device as claimed in claim 17 is characterized in that, described heating part have at least more than or equal to one be used for heating crucible and the well heater that is provided with.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050008793A KR100666574B1 (en) | 2005-01-31 | 2005-01-31 | Vapor deposition source |
| KR8793/05 | 2005-01-31 | ||
| KR31684/05 | 2005-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1814854A CN1814854A (en) | 2006-08-09 |
| CN100567556C true CN100567556C (en) | 2009-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100923737A Active CN100567556C (en) | 2005-01-31 | 2005-08-29 | The evaporation coating device of evaporation source and this evaporation source of employing |
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| Country | Link |
|---|---|
| KR (1) | KR100666574B1 (en) |
| CN (1) | CN100567556C (en) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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-
2005
- 2005-01-31 KR KR1020050008793A patent/KR100666574B1/en active IP Right Grant
- 2005-08-29 CN CNB2005100923737A patent/CN100567556C/en active Active
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| KR20060087917A (en) | 2006-08-03 |
| KR100666574B1 (en) | 2007-01-09 |
| CN1814854A (en) | 2006-08-09 |
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