CN102168251A - Evaporation source device - Google Patents
Evaporation source device Download PDFInfo
- Publication number
- CN102168251A CN102168251A CN 201010124409 CN201010124409A CN102168251A CN 102168251 A CN102168251 A CN 102168251A CN 201010124409 CN201010124409 CN 201010124409 CN 201010124409 A CN201010124409 A CN 201010124409A CN 102168251 A CN102168251 A CN 102168251A
- Authority
- CN
- China
- Prior art keywords
- crucible
- nozzle
- evaporation source
- source device
- hole nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001704 evaporation Methods 0.000 title claims abstract description 74
- 230000008020 evaporation Effects 0.000 title claims abstract description 72
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 9
- 230000008021 deposition Effects 0.000 description 20
- 230000004308 accommodation Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- Physical Vapour Deposition (AREA)
Abstract
An evaporation source device is provided to avoid overflow of evaporation material when a large-area substrate is manufactured, and improve the utilization rate of the evaporation material. The evaporation source device of the invention comprises a crucible and a nozzle cover body. The upper side of the crucible is provided with an inner step-shaped socket section which contains an evaporation material, and the molecules of the evaporation material are evaporated by heating the crucible. The nozzle cover body is arranged above the crucible and is provided with an inclined hole nozzle and a straight hole nozzle, and the inclined hole nozzle and the straight hole nozzle are connected with the crucible.
Description
[technical field]
The present invention is relevant for a kind of evaporation source, particularly can avoid the deposition material overflow when the large-area substrate manufacture about a kind of, improves the crucible structure of the utilization ratio of deposition material.
[background technology]
Evaporation processing procedure (evaporation process) has been subjected to using widely in semiconductor device fabrication, liquid crystal display assembly making or solar module making processes, for employed deposition material in the making processes is evenly coated substrate, it in the prior art opening top that substrate is arranged at crucible, relending by the heating crucible makes deposition material placed within evaporate, adhere to equably by opening and to be on the substrate, reach the effect of even coating.
Right when substrate size is increasing, the uniformity coefficient of its evaporated film is great challenge, how to make the uniform high quality plated film of thickness on large substrate, faces the challenge of maximum when being current evaporation processing procedure volume production always.
Be demand in response to the big area volume production, the large area film evaporation is to be that improve on the basis from traditional some evaporation source in early days, extended improvement have: change some evaporation source gas container opening a shape, increase the number of some evaporation source and the methods such as arrangement mode that change the some evaporation source.But these improved application are when small area and produced in small quantities, the evaporation mode of single-point or multiple spot evaporation source is also permitted provides plated film uniformly, but its defective is when intending carrying out large-area coating film and must mass production the time, still can meet with as all restrictions such as thickness inequality or deposition material utilization ratio are low.
So, further vapor deposition source is improved to the line evaporation source by an evaporation source in the prior art in response to large-area coating film and mass production.The line evaporation source is to carry out evaporation with scan mode, and the line evaporation source is fit to the production of big area formula, but its film uniformity is still not good, and its deposition material utilization ratio is still on the low side.
[summary of the invention]
Be the demand in response to big area and mass production processing procedure, the present invention proposes a kind of evaporation source, with when the large-area substrate manufacture, avoids the deposition material overflow, improves the utilization ratio of deposition material.
According to above-mentioned conception, the present invention proposes a kind of evaporation source of anti-overflow.This evaporation source comprises crucible and nozzle lid, this crucible upside sets stepped socket section in, is to hold a deposition material, makes the molecule evaporation of deposition material by radiant heating source heating crucible, crucible is configured to the tubular structure of top opening, and tubular structure is circular or square.The nozzle lid is arranged at the top of crucible, have inclined hole nozzle and straight hole nozzle, inclined hole nozzle and straight hole nozzle are connected in this crucible, and the nozzle lid has fitting portion, can embed in conjunction with the nozzle lid for this crucible one end barrel, the medullary ray of inclined hole nozzle and straight hole nozzle forms an angle.
Accept above-mentionedly, the invention provides a kind of evaporation source, comprise:
One crucible is equipped with stepped socket section in; And
One nozzle lid is fastened in this stepped socket section, has an inclined hole nozzle and reaches hole nozzle always, and this inclined hole nozzle and this straight hole nozzle are connected to this crucible.
Described evaporation source, it is characterized in that: this crucible is a tubular structure, this tubular structure is circular or square, this nozzle lid has a caulking groove, the barrel of this opening part of this crucible can be chimeric be gone into this caulking groove, has an angle between the medullary ray of the medullary ray of this inclined hole nozzle and this nozzle lid.
Described evaporation source is characterized in that: this angle is 3～40 degree angles, and this angle is 5～20 degree angles, and this angle is 8～15 degree angles.
Described evaporation source is characterized in that: the medullary ray of this straight hole nozzle is parallel to the medullary ray of this nozzle lid.
Described evaporation source is characterized in that: the axes intersect of the axis of this inclined hole nozzle and this straight hole nozzle.
The present invention also provides a kind of evaporation source, comprises:
One crucible, its upside set stepped socket section in, and have one first accommodation space and one second accommodation space; And
One nozzle lid is arranged at this stepped socket section of this crucible, has an inclined hole nozzle and hole nozzle always, and this inclined hole nozzle and this straight hole nozzle are connected to this first accommodation space and this second accommodation space.
Described evaporation source is characterized in that: this one first accommodation space and this second accommodation space accommodate first evaporating materials and second evaporating materials respectively.
Described evaporation source is characterized in that: this crucible is a tubular structure, and this tubular structure is rectangle, or thin-and-long.
The present invention also provides a kind of evaporation source, and it comprises:
One crucible, its upside set stepped socket section in, and have one first accommodation space and one second accommodation space; And
One nozzle lid has a fitting portion, and this nozzle lid is connected with this stepped socket section fixing of this crucible via this fitting portion, and this nozzle lid also has several inclined hole nozzles and several straight hole nozzles.
Described evaporation source is characterized in that: this fitting portion has more a stepped socket section, and this fitting portion has more a caulking groove that is arranged with.
From the above, the evaporation source that the present invention carries when large-area substrate manufacture, is avoided the deposition material overflow, improves the utilization ratio of deposition material.
[description of drawings]
Fig. 1 is the crucible sectional view that shows evaporation source of the present invention;
Fig. 2 is the nozzle lid sectional view that shows the evaporation source of first embodiment of the invention;
Fig. 3 is crucible and the nozzle lid bonded sectional view that shows the evaporation source of first embodiment of the invention;
Fig. 4 is the sectional view that shows the A-A ' line of Fig. 3;
Fig. 5 is the sectional view that shows the A-A ' line of Fig. 3;
Fig. 6 is the spray nozzle part sectional view that shows two evaporation sources of second embodiment of the invention; And
Fig. 7 is crucible and the nozzle lid bonded sectional view that shows two evaporation sources of second embodiment of the invention.
10: crucible
20,40: the nozzle lid
30,30 ': accommodation space
60,60 ': deposition material
100: evaporation source
101: interior stepped socket section
201,401: body
202,402: the lid lip
203: caulking groove
204,404: the inclined hole nozzle
204 ', 404 ': the straight hole nozzle
402: the lid lip
403: stepped socket section
[embodiment]
Being described in detail as follows of embodiments of the invention, however except this was described in detail, the present invention can also be widely implements at other embodiment.That is scope of the present invention is not subjected to the restriction of the embodiment that proposed, and should be as the criterion with the claim that the present invention proposes.
Moreover for clearer description being provided and being more readily understood the present invention, each is not partly drawn according to its relative dimension in the diagram, and some size is compared with other scale dependent and exaggerated; Uncorrelated details is not partly drawn fully yet, and is succinct in the hope of diagram.
Fig. 1 is the crucible sectional view that shows evaporation source of the present invention, Fig. 2 is the nozzle lid sectional view that shows the evaporation source of first embodiment of the invention, and Fig. 3 is crucible and the nozzle lid bonded sectional view that shows the evaporation source of first embodiment of the invention.Evaporation source 100 of the present invention can determine the evaporation direction of deposition material 60, and this evaporation source 100 comprises crucible 10 and nozzle lid 20.
See also Fig. 1, these crucible 10 upsides set stepped socket section 101 in, system holds deposition material 60, by radiant heating source or other type of heating heating crucible 10 molecule of deposition material 60 is evaporated, crucible 10 is configured to the tubular structure of top opening, and tubular structure is a circular rectangle or square.See also Fig. 2, nozzle lid 20 is made up of body 201, lid lip 202 and nozzle 204, body 201 has bonded lid lip 202 downwards, the caulking groove 203 that lid lip 202 lower ends are arranged with can embed in conjunction with nozzle lid 20 for the barrel of the stepped socket section 101 of crucible 10 upsides, and nozzle 204 is connected in crucible 10.
As shown in Figure 2, inclined hole nozzle 204 can be one or several nozzles for regulating any structure of deposition material 30 emission directions.It is 3～40 degree angles that the centre line L of inclined hole nozzle 204 itself and nozzle lid 20 forms an angle theta, but does selection with the homogeneity of institute's evaporated film scope maximum best and evaporation, and its preferred angle is 5～20 degree angles, also or better angle be 8～15 degree angles.
See also Fig. 3, evaporation source 100 of the present invention can determine the evaporation direction of deposition material 60, and evaporation source 100 comprises crucible 10 and nozzle lid 20.The combination of its crucible 10 and nozzle lid 20 divided be set forth in before, this repeat no more as, so promptly form line style evaporation source 100.
Straight hole nozzle 204 ' be can further comprise in the present embodiment, one or several nozzles can be, as shown in Figure 2.Straight hole nozzle 204 ' is equipped on the opposite side of the medullary ray of nozzle lid 20, is parallel to each other with the centre line L of nozzle lid 20, and forms an angle theta with inclined hole nozzle 204 '.
Fig. 4 and Fig. 5 are the sectional views of the A-A ' line of Fig. 3, show that the external form of the evaporation source spray nozzle part 20 of first embodiment of the invention can be circle or square, cooperate the external form of crucible 10 to get final product.The external form of the external form of said nozzle lid 20 or crucible 10 can adjust according to the actual functional capability demand, is not limited in the above-mentioned type.
Fig. 6 is the nozzle lid sectional view that shows two evaporation sources of second embodiment of the invention, and Fig. 7 is crucible and the nozzle lid bonded sectional view that shows two evaporation sources of second embodiment of the invention.The crucible 10 of two evaporation sources 100 of second embodiment of the invention is different from first embodiment, crucible 10 has one first accommodation space 30 and second accommodation space 30 ' is to hold similar and different deposition material 60,60 ', make deposition material 60 by radiant heating source heating crucible 10,60 ' molecule evaporation, crucible 10 is configured to the tubular structure of top opening, and tubular structure is circular, rectangle or square.Nozzle lid 40 is made up of body 401, lid lip 402, several inclined hole nozzles 404 and several straight hole nozzles 404 ' institute.Body 401 has bonded lid lip 402 downwards, and the outside, lid lip 402 lower ends sets stair-stepping socket section 403, can be for crucible 10 upper end barrel sockets in conjunction with nozzle lid 40, to form two evaporation sources 100.
The present invention with preferable embodiment explanation as above; only be used for so as to helping to understand the present invention's enforcement; non-in order to limit the present invention's spirit; and be familiar with this field skill person after comprehension the present invention's spirit; in not breaking away from the present invention's spiritual scope; when variations that can do a little change retouching and be equal to replaced, its scope of patent protection ought on claim and etc. same domain decide.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010124409 CN102168251A (en) | 2010-02-26 | 2010-02-26 | Evaporation source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010124409 CN102168251A (en) | 2010-02-26 | 2010-02-26 | Evaporation source device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102168251A true CN102168251A (en) | 2011-08-31 |
Family
ID=44489563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010124409 Pending CN102168251A (en) | 2010-02-26 | 2010-02-26 | Evaporation source device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102168251A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107326329A (en) * | 2017-08-31 | 2017-11-07 | 京东方科技集团股份有限公司 | Evaporation source and evaporation coating device |
| CN109666898A (en) * | 2019-01-03 | 2019-04-23 | 福建华佳彩有限公司 | A kind of crucible for evaporation source |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2150514Y (en) * | 1993-04-05 | 1993-12-22 | 樊庆芬 | Heat-pipe heat exchanger |
| JP2001252608A (en) * | 2000-03-13 | 2001-09-18 | Tokyo Electron Ltd | Coating device and coating method |
| CN1814854A (en) * | 2005-01-31 | 2006-08-09 | 三星Sdi株式会社 | Vapor deposition source and vapor deposition apparatus having the same |
| CN101445907A (en) * | 2007-11-27 | 2009-06-03 | 鸿富锦精密工业（深圳）有限公司 | Vapor deposition device |
| US20090229524A1 (en) * | 2006-07-03 | 2009-09-17 | Yas Co., Ltd. | Multiple Nozzle Evaporator for Vacuum Thermal Evaporation |
-
2010
- 2010-02-26 CN CN 201010124409 patent/CN102168251A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2150514Y (en) * | 1993-04-05 | 1993-12-22 | 樊庆芬 | Heat-pipe heat exchanger |
| JP2001252608A (en) * | 2000-03-13 | 2001-09-18 | Tokyo Electron Ltd | Coating device and coating method |
| CN1814854A (en) * | 2005-01-31 | 2006-08-09 | 三星Sdi株式会社 | Vapor deposition source and vapor deposition apparatus having the same |
| US20090229524A1 (en) * | 2006-07-03 | 2009-09-17 | Yas Co., Ltd. | Multiple Nozzle Evaporator for Vacuum Thermal Evaporation |
| CN101445907A (en) * | 2007-11-27 | 2009-06-03 | 鸿富锦精密工业（深圳）有限公司 | Vapor deposition device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107326329A (en) * | 2017-08-31 | 2017-11-07 | 京东方科技集团股份有限公司 | Evaporation source and evaporation coating device |
| CN109666898A (en) * | 2019-01-03 | 2019-04-23 | 福建华佳彩有限公司 | A kind of crucible for evaporation source |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110831 |