KR20130111272A - Evaporation source and vacuum deposition device using the same - Google Patents

Abstract

PURPOSE: An evaporation source and a vacuum deposition device using the same are provided to prevent the degradation of a film by minimizing the separation of deposition materials in the evaporation source. CONSTITUTION: A floating deposit collecting member (45) is installed between a first insulating member and a crucible (22) or a heating member (44). The floating deposit collecting member is maintained at a lower temperature than the temperature of the heating member. The heating member generates heat by resistance heating. The heating member is integrated with the crucible or is installed in the crucible. A second insulating member is installed between the floating deposit collecting member and the crucible and between the floating deposit collecting member and the heating member.

Description

Evaporation source and vacuum evaporation apparatus using the same {EVAPORATION SOURCE AND VACUUM DEPOSITION DEVICE USING THE SAME}

The vacuum vapor deposition apparatus which heats a vapor deposition material under vacuum, produces | generates a vapor deposition particle, and forms the film of vapor deposition material on a board | substrate.

A general organic electroluminescent element (hereinafter referred to as "organic EL element") will be briefly described.

An organic EL element forms a film in order of an anode, a hole transporting layer, a light emitting layer, an electron transporting layer, an electron injection layer, and a cathode, and emits light by flowing a current between the anode and the cathode.

In particular, an organic compound or an inorganic compound is formed by vacuum vapor deposition, printing, or coating from the hole transport layer to the electron injection layer, and a laminated structure is formed on the anode. In addition, a metal film such as magnesium silver or aluminum is formed on the laminated structure by vacuum deposition or sputtering to form a cathode. In this way, an organic EL element is formed.

An example of a general vacuum deposition method is explained using FIG.

In FIG. 2, the vacuum vapor deposition apparatus 1 includes a vacuum chamber 2, a vacuum pump 3, and an evaporation source 4. The vacuum chamber 2 is a hermetically sealed container, in which an evaporation source 4 and a substrate 5 to be deposited are arranged. In addition, since the inside of the vacuum chamber 2 needs to maintain the vacuum degree of 10 <^{-3> -10} <^-6> Pa when it forms into a film with respect to the board | substrate 5, it vacuums by the vacuum pump 3. As shown in FIG. In the evaporation source 4, the vapor deposition material is heated and vaporized, and is sprayed onto the substrate 5 to form a film. In that case, about the enlargement of the board | substrate 5, film-forming is performed by rotating the board | substrate 5, or moving either the board | substrate 5 or the evaporation source 4.

Briefly explaining an example of a general evaporation source structure, the crucible enclosed with the vapor deposition material is heated by a heater. Thereby, vapor deposition material is vaporized and gas of vapor deposition material is discharge | released upward toward a board | substrate from the opening provided in the lid | cover of a crucible.

The crucible described above is composed of a crucible body, an upper cover and an intermediate cover. The crucible body is supported by the structure and radiated by a heater which is a heating means to evaporate the deposition material.

Thereby, a film is formed in the board | substrate arrange | positioned above the crucible. In order to control the output of the heater, the bottom temperature of the crucible is measured by a thermocouple. Moreover, a reflector is provided in the outer peripheral part of a heater, and it is comprised so that the radiant heat from a heater may concentrate in a crucible.

Japanese Patent Application Publication No. 2008-24998

In this prior art, the majority of the vapor of the deposition material released from the nozzle of the crucible moves towards the direction of the substrate. However, at the center, leakage occurs from the particles of steam entering toward the inside of the evaporation source or from the gap between the crucible body and the upper lid.

Particles of vapor of the vapor deposition material that enter the inside of the evaporation source are concentrated and condensed and precipitated on a member connected to the outside of the reflector, for example, a structural member, a terminal of a heater, a thermocouple, and the like, inside the evaporation source.

When the deposition material of the organic compound is precipitated, in organic deposition, it decomposes by receiving the heat of the heater for a long time, and impurities which affect the film quality are generated. Moreover, in the case of the vapor deposition material of an inorganic compound, the member with a vapor deposition material adhere | attaches, and it may become impossible to disassemble each member at the time of maintenance. In particular, when the metal material is a vapor deposition material, a short circuit may occur between the terminals of the heater. These problems have not been solved in the evaporation source of the prior art.

On the other hand, the evaporation source disclosed in patent document 1 does not disclose the solution regarding the problem of depositing vapor deposition material inside the evaporation source shown above.

An object of the present invention is to provide an evaporation source and a vacuum evaporation apparatus which prevent deterioration of film quality even when the evaporation material enters the evaporation source and do not interfere with continuous operation or maintenance.

In order to achieve the above object, the present invention provides a crucible having a nozzle for heating the enclosed deposition material to release the vaporized deposition material, a heating means for heating the crucible, and a vicinity of the crucible and the heating means. In the evaporation source constituted by the heat insulation means (the 1st heat insulation means) arrange | positioned, the floating deposit recovery means maintained at a lower temperature than this heating means is provided between the said heat insulation means and a crucible or a heating means, and this floating deposit recovery means And heat insulating means (second heat insulating means) are provided between the crucible and the heating means.

The heating means may be provided integrally with the crucible or inside the crucible.

The heating means may generate heat using resistance heating.

The heating means may be disposed outside the crucible and may use any one of resistance heating, induction heating, and infrared heating.

The first heat insulating means may be shaped to at least cover an opposing surface of the suspended deposit recovery means with respect to the crucible and heating means.

Moreover, in order to achieve the said objective, this invention becomes like this. Preferably, the said 1st heat insulation means should just be a structure which laminated | stacked the single number or the several plate.

In order to achieve the above object, the present invention preferably uses a plate formed of any one or a plurality of carbon, metal, and ceramics as the first heat insulating means.

Moreover, in order to achieve the said objective, this invention becomes like this. Preferably, the said 2nd heat insulation means should just be a structure which laminated | stacked the single number or the several plate.

In order to achieve the above object, the present invention preferably uses a plate formed of any one or a plurality of carbon, metal, and ceramics as the second heat insulating means.

Furthermore, in order to achieve the above object, the present invention is preferably provided with a removable cover around the suspended deposit recovery means, and the cover may be cooled by at least partially contacting the cooling means.

In addition, in order to achieve the above object, the present invention is preferably such that the suspended deposit recovery means is provided in addition to the surface having the nozzle of the crucible.

In addition, in order to achieve the above object, the present invention preferably, the suspended deposit recovery apparatus may be cooled by a circulating cooling medium.

In order to achieve the above object, the present invention preferably provides that the cooling medium circulates through the wall of the housing itself, while the housing and the suspended deposit recovery means are in thermal contact.

In addition, the configuration of the present invention for achieving the above object is a vacuum deposition apparatus using any one of the evaporation source.

According to the present invention, it is possible to provide a vacuum vapor deposition apparatus and an evaporation source which prevent the deterioration of film quality even when the evaporation material enters the evaporation source and do not interfere with continuous operation or maintenance.

1 is a schematic diagram of a basic configuration of a vacuum deposition apparatus according to an embodiment of the present invention.
2 is a schematic configuration diagram of a film forming apparatus by general vacuum deposition.
3 is a schematic configuration diagram of a vacuum deposition apparatus according to an embodiment of the present invention.
4 is a schematic configuration diagram of an organic EL device manufacturing apparatus according to an embodiment of the present invention.
5 is a view showing a cooling means of an evaporation source according to another embodiment of the present invention.
6 is a view showing a cooling means of an evaporation source according to another embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

Example 1

Best Mode for Carrying Out the Invention The best mode for carrying out the present invention will be described based on the drawings.

1 is a schematic diagram of a basic configuration of a vacuum deposition apparatus according to an embodiment of the present invention. The outline | summary of the vacuum vapor deposition apparatus which concerns on Example of this invention is demonstrated using FIG.

1, the vacuum vapor deposition apparatus 1 has the chamber 2 which is a vacuum container, The evaporation source 4 which discharge | evaporates the vapor | steam of the vapor deposition material 21, and the board | substrate 5 which are to be deposited are arrange | positioned inside it, have. At the time of vapor deposition, in order to make the inside of the chamber 2 into a vacuum degree higher than ^10-3 Pa, it is always evacuated by the vacuum pump 3 connected to the chamber 2. Here, the substrate 5 is not formed of the vacuum vapor deposition apparatus 1, but is formed by the vacuum vapor deposition apparatus 1.

After starting pressure reduction, the crucible 22 is heated by the heating means 44 of the evaporation source 4. By this heating, the vapor deposition material 21 is evaporated or sublimed so that vapor of the vapor deposition material 21 is generated and formed on the substrate 5. As the board | substrate 5 used here, the plate of any one of glass, a ceramic, a metal, and an organic substance is used. For example, when forming an organic EL element, an anode is formed in advance on the vapor deposition surface of the board | substrate 5.

The following materials are used for each layer of organic electroluminescent element. The anode is preferably an electrically conductive compound of a metal or alloy having a high work function, having high hole injection capability such as ITO, gold, copper iodide, tin oxide, and the like.

As the hole injection layer, for example, CuPc or m-MTDATA is used. As the hole transport layer, for example, α-NPD, TPD, and PDA are used. As the light emitting layer, for example, rubrene, CBP, CDBP, Alq3 as the host material, coumarin 6, Ir (ppy) 3, FIrpic, etc. are used as the dopant material. As the electron transporting layer, for example, Alq3, PBD, TAZ, BND, OXD and the like are used. As the electron injection layer, for example, LiF, BCP, strontium or the like is used. Mg-Ag co-deposited film, Al, etc. are used as a cathode.

Vapor deposition is carried out using the evaporation source 4 constituted by the crucible 22, the heating means 44, and the heat insulating means 43. The crucible 22 which enclosed the vapor deposition material 21 is heated by the heating means 44, and the vapor | steam of the vapor deposition material 21 is generated. Then, film formation is performed by releasing toward the substrate 5 from the nozzle 34 provided in the crucible 22. These crucibles 22, the heating means 44, the heat insulation means 43, etc. are accommodated in the housing 27. As shown in FIG. In addition, since the heating means 44 should only be able to heat the vapor deposition material inside a crucible, it may be in the inside of a crucible. In the following Examples 2 to 3, the position of the heating means 44 can be installed regardless of the inside and outside of the crucible.

The control of the evaporation source 4 is to install a thermocouple inside the evaporation source 4 and to adjust the input power to the heating means 44 so that the crucible 22 and its atmosphere temperature become a predetermined temperature. Or the rate sensor 26 is provided in the space formed between the evaporation source 4 and the board | substrate, and the heating means 44 is thrown in so that the deposition rate per unit time to this rate sensor 26 may become a predetermined value. You may adjust electric power. 25 is a thermocouple. 50 is a terminal.

In order to increase the size of the substrate 5, the substrate 5 is rotated and fixed in a state where the evaporation source 4 is shifted from the rotational axis, or either the substrate 5 or the evaporation source 4 is perpendicular to the vapor ejection direction. Move it. In particular, in the latter case, the nozzle 34 may be aligned in the width direction of the substrate, and the substrate 5 or the evaporation source 4 may be moved in the direction perpendicular to the alignment direction.

In order to continuously deposit on another substrate 5, a gate valve 6 is provided in the chamber 2, and the processed substrate 5 is placed in a separate chamber 2 while the vacuum is maintained. It is good to move and carry in the unprocessed board | substrate 5, maintaining the vacuum degree similarly.

In this way, operation of a vapor deposition apparatus and an evaporation source is aimed at. Evaporation source 4 of the present invention can also be operated as described above.

EMBODIMENT OF THE INVENTION Hereinafter, the evaporation source of this invention is demonstrated using FIG.

In addition, although the figure shown in the present Example all shows the example of the form which processes the film-forming surface of the board | substrate 5 down, the present invention is applicable irrespective of the direction of a film-forming surface.

In FIG. 1, the evaporation source 4 includes a crucible 22 having a nozzle 34 for enclosing the vapor deposition material 21 and discharging the vapor deposition material 21, and outside the crucible 22, It is comprised by the heating means 44 for heating the crucible 22, the crucible 22, and the heat insulation means (1st heat insulation means) 43 arrange | positioned around the heating means 44. As shown in FIG. In addition, a cooling means 45 (floating deposit recovery means) is provided between the heat insulating means 43 and the crucible 22 or the heating means 44.

By this cooling means 45, the particle | grains of the material vapor which entered the evaporation source 4 can be trapped and selectively precipitated. Thereby, precipitation to the surrounding member is reduced to the minimum. The temperature of the cooling means 45 is preferably maintained at a temperature sufficiently lower than the temperature at which the vapor deposition material evaporates, for example, at or below the sublimation point if the vaporization material is a sublimation, or below the melting point if it is an evaporation material.

On the other hand, in the case where the cooling means 45 is provided at the above position, since the radiant heat of the crucible 22 or the heating means 44 is remarkably absorbed, the temperature of the vapor deposition material in the crucible is lowered, and the deposition itself is disturbed. Occurs. In order to prevent this, the heat radiation insulating means (second heat insulating means) 46 is provided so that the crucible 22 and the heating means 44 cannot directly face the cooling means 45.

Even if the heat radiation insulating means 46 is in close contact with the cooling means 45, it may be either. The temperature of the maximum surface facing the heating means 44 or the crucible 22 is sufficiently higher than the temperature of the cooling means 45 and does not affect the evaporation of the deposition material 21 in the crucible 22. . Moreover, what is necessary is just a structure in which a part of cooling means 45 is exposed inside the area | region enclosed by the heat insulation means 43. As shown in FIG.

The example used for FIG. 3A as a heating means 44 (heater 23) of resistance heating type | mold is shown.

In FIG. 3A, when the heating element of the heater 23 is 700 ° C. or less, since insulation measures against the surroundings are easy, management using a sheath heater is preferred. When it exceeds 700 degreeC, especially in 1000 degreeC or more, what is necessary is just to comprise a heater by wrapping the wire of metal, such as Mo, Ta, W, or its alloy, in a ceramic frame. As a material of a ceramic frame, the material excellent in insulation at high temperature, such as alumina, SiC, boron nitride, and aluminum nitride, is preferable. The heater 23 may be configured in a donut shape, or may be divided into two or more portions in up, down, left and right, and the like. If the crucible 22 and the vapor deposition material 21 can be heated evenly, you may comprise the heater 23 how. As the heating means 44, induction heating or infrared heating may be used in addition to resistance heating.

The crucible 22 is accommodated in the area | region enclosed by the heater 23. As shown in FIG. In FIG. 3, the crucible 22 and the heater 23 are not in contact with each other, but may be brought into contact with each other unless a short circuit or ground fault occurs due to direct or indirect contact between the crucible 22 and the heater 23.

As a material of the crucible 22, metal, such as Mo, Ta, and W, or an alloy containing them as a metal material is preferable. As a ceramic material, alumina, SiC, boron nitride, aluminum nitride, etc. are preferable, In addition, materials, such as carbon graphite, can also be used.

In FIG. 3, what is called the reflector 24 which spaced apart the some reflecting plate 48 as a substitute for the heat insulation means 43 shown in FIG. 1, FIG. 2 is shown. As for the reflecting plate 48, stainless steel or titanium material can be used at 700 degrees C or less. In the temperature range above, metal materials, such as Au, Cu, Mo, Ta, and W, its alloy, carbon, alumina, SiC, BN, AlN, and ceramic materials can be used. What is necessary is just to be able to maintain the function which reflects electromagnetic waves, such as an infrared ray which propagates thermal radiation. Therefore, in order to improve the reflectance of an infrared band, it is preferable to mirror-process the surface of the reflecting plate 48, and metals, such as Ag, Au, Cu, Al, may be plated.

Instead of the reflector 24, at least one sheet of a ceramic plate having a low thermal conductivity and high heat resistance temperature or a sheet made of ceramic fibers may be laid. In the case of using a ceramic plate, one having a small porosity may be used in consideration of vacuum exhaust. In addition, you may use together the reflector 24 shown in FIG. 3, a heat insulating material, etc.

3B illustrates the shape of the heater 23.

In FIG. 3B, the heater 23a shown in (1) is formed integrally, and the heater 23b shown in (2) is divided into two. The use of these heaters is selected according to the size of the housing 27 or the size of the substrate 5.

Here, the line structure of organic electroluminescent device manufacture is demonstrated using FIG.

4 is a schematic configuration diagram of an organic EL device manufacturing apparatus according to an embodiment of the present invention.

In FIG. 4, the organic electroluminescent device manufacturing apparatus 100 of this invention is comprised so that alignment and vapor deposition can be performed in the same vacuum deposition chamber 16. In FIG. The organic EL device manufacturing apparatus 100 includes a polygonal vacuum transfer chamber 7 having a vacuum transfer robot 9 at its center and a vacuum deposition chamber 16 that is a substrate stocker chamber 8 or a deposition chamber in a radial portion thereof. It consists of the structure of the cluster type organic electroluminescent device manufacturing apparatus 100 arrange | positioned. Each vacuum deposition chamber 16 has a substrate holding portion 13 and a mask 12 for holding the substrate 10. In addition, a gate valve 14 is provided between the vacuum deposition chamber 16, the substrate stocker chamber 8, and the vacuum transfer chamber 7 to isolate the vacuum from each other. As the evaporation source 11, the evaporation source 4 shown in FIG. 1 or 3 is used.

By this structure, the vacuum transfer robot 9 takes out the board | substrate 10 from the substrate stocker room 8, and carries it in to the board | substrate holding part 13 of the vacuum deposition chamber 16. As shown in FIG. In the vacuum deposition chamber 16, the loaded substrate 10 is aligned with the mask 12 by substrate turning means (not shown), and alignment is performed (aligning the substrate with the mask). Then, the evaporation source 11 is raised and lowered and deposited on the substrate 10. After deposition, the substrate 10 is returned to the horizontal state. Thereafter, the substrate 10 is carried out from the vacuum deposition chamber 16 by the vacuum transfer robot 9, and the substrate 10 is loaded into the other vacuum deposition chamber 16 or returned to the substrate stocker chamber 8.

In carrying in and out of the board | substrate 10 in such a process, the gate valve 14 which is related is controlled so that the process of each vacuum deposition chamber 16 may not be affected.

As described above, in the present embodiment, the cooling means 45 is provided outside the crucible 22 and the heating means 44 (heater 23), and the heat insulating means 44 (the reflector 24). It is installed inside the surrounding area. As a result, floating leakage vapor can be attached to the cooling means 45 intensively, so that the above attachment to an extra location can be prevented.

In addition, since the heat from the heater 23 to the cooling means 45 is blocked by the radiant heat insulating means 46 (the reflector 24), the cooling means 45 is not heated. Therefore, stable leakage vapor collection is possible.

[Example 2]

The detail of a cooling means is shown in FIG.

5 is a view showing a cooling means of an evaporation source according to another embodiment of the present invention.

In FIG. 5, in this embodiment, as the cooling means 45, it is set as the block 28 made from stainless steel, for example, and coolant 52 (oil or water, etc. as a cooling medium) is used from the exterior of the reflector 24. In FIG. It is a structure to circulate.

That is, the u-turn part 52b forms two coolant distribution holes 52a penetrating the chamber 2 and the housing 27, and the two coolant distribution holes 52a join in the cooling block 28. ) Is installed. The coolant flow holes 52a are connected to the pipe 51 so as to be continuous flow holes, respectively.

In addition, in this embodiment, although it consists of the coolant flow hole 52a which penetrates the chamber 2, the housing 27, and the cooling block 28, it is not limited to this structure, Even if it consists of U-shaped piping, It goes without saying that the same effect is obtained.

As described above, according to the present embodiment, the coolant 52 is circulated to the cooling block 28 so that the cooling block 28 can always be kept at a low temperature, so that the effect of collecting leakage steam can be enhanced.

[Example 3]

6 is a view showing a cooling means of an evaporation source according to another embodiment of the present invention.

In FIG. 6, in the second embodiment, a cooling medium is circulated through the cooling block 28, but in the present embodiment, a hole is drilled through the reflector 24 to connect or integrate with an external housing 27. In addition, when connecting with the housing 27 or having an integral structure, only the housing side may be water-cooled.

That is, if the cooling block 28 is used as it is, the heat radiation of the crucible 22 or the heating means 44 (heater 23) will be absorbed, and the temperature in an evaporation source will be reduced remarkably, and vapor deposition will interfere. For this reason, as shown in FIG. 5 or FIG. 6, the radiant heat interruption means 46 is provided in the surface which opposes the heating means 44 or the crucible 22 in the cooling block 28. As shown in FIG. The radiant heat blocking means 46 may be any of a reflector 24 or a heat insulating material.

The temperature of the cooling block 28 is preferably set to a temperature lower than any of the members inside the reflector 24 of the evaporation source 4. In addition, it is preferable to set the temperature sufficiently lower than the evaporation temperature of the vapor deposition material 21, for example, near the melting point when the vapor deposition material 21 is a melt-based material and below the sublimation start temperature in the case of a sublimation-based material. As a result, the particles of the vapor deposition material 21 that have penetrated into the evaporation source 4 from the vicinity of the nozzle are concentrated in the cooling block 28 instead of the constituent members of the evaporation source 4, for example, the thermocouple or the reflector 24. Can be precipitated.

In addition, as shown in FIG. 5 or FIG. 6, the anti-glare plate 29 may be attached to the cooling block 28. The anti-glare plate 29 is in contact with the cooling block 28 and is preferably made of a material having good thermal conductivity. In addition, the outer surface of the anti-corrosion plate 29 may be provided with irregularities by sand blast or the like, so that the deposited vapor deposition material does not fall off. In addition, maintenance can be easily performed by allowing the anti-corrosion plate 29 to be easily attached or detached.

By the way, in Example 2, although the U-turn part 52b of the coolant flow hole 52a was provided in the cooling block 28, in the present Example, it is provided in the housing 27. As shown in FIG. As a result, the cooling block 28 is indirectly cooled via the housing 27, so that the coolant flow hole 52a can be relatively easily processed, and the cost can be reduced.

In addition, as mentioned above, although it comprised in the coolant flow-through hole 52a which penetrates the chamber 2 and the housing 27 also in this embodiment, it is not limited to this structure, Even if it is comprised by U-shaped piping, it is the same. Of course, the effect is obtained.

As described above, according to the present invention, the cooling means is provided in the middle covered with the heat insulating means, and the cooling means is used locally to provide a portion at a temperature sufficiently lower than the temperature at which the vapor deposition material evaporates or below the melting point of the vapor deposition material. By producing | generating, the particle | grains of the vapor deposition material which entered between the crucible heating means and the heat insulation means concentrate on the cooling means 45, and precipitate.

Moreover, by providing the heat insulation means in the part which a cooling means faces a heating means or a crucible, it becomes possible to suppress the influence of a vapor deposition process.

In addition, the deposition of the deposition material on the terminals of the heating means (heater), the thermocouple, the crucible or the structure supporting the heating means is minimized, and deterioration of the film quality which has conventionally been caused by deposition of the deposition material on these members. It is possible to suppress the disturbance to continuous operation or maintenance.

In addition, by attaching a barrier plate made of a material which is separable from the deposition material of the cooling means and which has a good thermal conductivity, maintenance can be easily performed and performance can be maintained.

1: vacuum deposition apparatus
2: chamber
3: vacuum pump
4: evaporation source
5: substrate
6: gate valve
7: vacuum conveying chamber
8: substrate stocker room
9: vacuum transfer robot
10: substrate
11: evaporation source
12: mask
13: substrate holding part
14: gate valve
16: vacuum deposition chamber
21: evaporation material
22: Crucible
25: thermocouple
24: reflector
26: rate sensor
27: housing
28: cooling block
34: nozzle
43: heat insulation means
44: heating means [heater 23]
45 cooling means (floating deposit recovery means)
46 heat radiation insulation means
50: terminal
51: water cooling pipe
52: coolant
52a: coolant distribution hole
52b: U-turn part
100: organic EL device production apparatus.

Claims (20)

An evaporation source constituted by a crucible having a nozzle for discharging the deposited evaporation material by heating the enclosed evaporation material, a heating means for heating the crucible, and a first heat insulating means disposed around the crucible and the heating means. As
Between the first heat insulating means and the crucible or the heating means, a floating deposit recovery means kept at a lower temperature than this heating means,
A second heat insulating means is provided between the suspended deposit recovery means, the crucible, and the heating means. The method of claim 1,
The heating means is an evaporation source, characterized in that it is provided integrally with the crucible or inside the crucible. 3. The method of claim 2,
And the heating means generates heat using resistance heating. The method of claim 1,
The heating means is disposed outside the crucible and further uses any one of resistance heating, induction heating, and infrared heating. 5. The method according to any one of claims 1 to 4,
And the first heat insulating means is shaped to at least cover an opposing surface of the suspended deposit recovery means with respect to the crucible and heating means. 5. The method according to any one of claims 1 to 4,
The said 1st heat insulation means is an evaporation source characterized by the structure which laminated | stacked the single number or the several plate. 5. The method according to any one of claims 1 to 4,
The said 1st heat insulation means uses the board | substrate formed by any one or several of carbon, metal, and ceramics, The evaporation source characterized by the above-mentioned. 5. The method according to any one of claims 1 to 4,
The second heat insulating means has a structure in which a single or a plurality of plates are laminated. 5. The method according to any one of claims 1 to 4,
The said 2nd heat insulation means uses the board | substrate formed by any one or several of carbon, metal, and a ceramic, The evaporation source characterized by the above-mentioned. 5. The method according to any one of claims 1 to 4,
A removable cover is provided around said suspended deposit recovery means, said cover being cooled by at least partially contacting said cooling means. 5. The method according to any one of claims 1 to 4,
And the suspended deposit recovery means is provided in addition to the surface having the nozzle of the crucible. 5. The method according to any one of claims 1 to 4,
And the suspended deposit recovery device is cooled by a circulating cooling medium. The method of claim 12,
The cooling medium circulates through the wall of the housing itself,
And the housing and the suspended deposit recovery means are in thermal contact with each other. A vacuum evaporation apparatus comprising: an evaporation source for releasing vapor of vapor deposition material; and a vacuum chamber for holding a substrate formed by the evaporation source and the vapor discharged from the evaporation source in a reduced pressure atmosphere,
The evaporation source has a crucible having a nozzle for discharging the deposited vaporization material by heating the enclosed vapor deposition material, a heating means for heating the crucible, and first thermal insulation means disposed around the crucible and the heating means. Composed by
Between the first heat insulating means and the crucible or the heating means, a floating deposit recovery means kept at a lower temperature than this heating means,
A second vapor deposition means is provided between the suspended deposit recovery means, the crucible, and the heating means. 15. The method of claim 14,
And said second heat insulating means has a structure in which one or more plates are stacked. 15. The method of claim 14,
The said 2nd heat insulation means uses the board | substrate formed by any one or several of carbon, metal, and ceramics, The vacuum vapor deposition apparatus characterized by the above-mentioned. 15. The method of claim 14,
And a removable cover is provided around said suspended deposit recovery means, said cover being cooled by at least partially contacting said cooling means. 15. The method of claim 14,
And the suspended deposit recovery means is provided in addition to the surface having the nozzle of the crucible. 15. The method of claim 14,
And the suspended deposit recovery device is cooled by a circulating cooling medium. 20. The method of claim 19,
The cooling medium circulates through the wall of the housing itself,
And the housing and the suspended deposit recovery means are in thermal contact with each other.

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