CN103260346B - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN103260346B
CN103260346B CN201310050910.6A CN201310050910A CN103260346B CN 103260346 B CN103260346 B CN 103260346B CN 201310050910 A CN201310050910 A CN 201310050910A CN 103260346 B CN103260346 B CN 103260346B
Authority
CN
China
Prior art keywords
pad
width
distal
narrow
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310050910.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN103260346A (zh
Inventor
大谷元彦
森内宣公
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN103260346A publication Critical patent/CN103260346A/zh
Application granted granted Critical
Publication of CN103260346B publication Critical patent/CN103260346B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CN201310050910.6A 2012-02-15 2013-02-08 电路板 Active CN103260346B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012030939A JP6396633B2 (ja) 2012-02-15 2012-02-15 回路基板
JP2012-030939 2012-02-15

Publications (2)

Publication Number Publication Date
CN103260346A CN103260346A (zh) 2013-08-21
CN103260346B true CN103260346B (zh) 2018-04-10

Family

ID=48944678

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310050910.6A Active CN103260346B (zh) 2012-02-15 2013-02-08 电路板

Country Status (4)

Country Link
US (1) US9113564B2 (https=)
JP (1) JP6396633B2 (https=)
KR (1) KR20130094235A (https=)
CN (1) CN103260346B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105828521B (zh) * 2015-01-08 2018-10-02 上海和辉光电有限公司 印刷电路板的布局方法及印刷电路板
US11195269B2 (en) * 2015-03-27 2021-12-07 Texas Instruments Incorporated Exposed pad integrated circuit package
JP2016192352A (ja) * 2015-03-31 2016-11-10 株式会社オートネットワーク技術研究所 ワイヤーハーネス及びワイヤーハーネスの製造方法
CN106455350A (zh) * 2016-09-29 2017-02-22 广东小天才科技有限公司 一种元器件的更换方法
US11569155B2 (en) * 2021-06-09 2023-01-31 Western Digital Technologies, Inc. Substrate bonding pad having a multi-surface trace interface
US11839031B2 (en) 2022-04-06 2023-12-05 Western Digital Technologies, Inc. Micro solder joint and stencil aperture design

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1264169A (zh) * 1999-02-02 2000-08-23 三星电子株式会社 用于检测集成电路封装引脚焊接的装置和方法
CN102314009A (zh) * 2011-09-09 2012-01-11 深圳市华星光电技术有限公司 液晶显示模组及液晶显示面板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217388A (ja) * 1990-12-19 1992-08-07 Mitsubishi Electric Corp 印刷配線板
US5303122A (en) * 1991-10-31 1994-04-12 Ford Motor Company Printed circuit board having a commonized mounting pad which different sized surface mounted devices can be mounted
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
JPH0718475U (ja) * 1993-09-09 1995-03-31 日本ビクター株式会社 印刷配線板
JPH07106745A (ja) * 1993-09-30 1995-04-21 Ibiden Co Ltd プリント配線板及びパッドへの半田皮膜形成方法
JP3948376B2 (ja) * 2002-09-05 2007-07-25 株式会社デンソー 電子装置の製造方法
JP2007281122A (ja) * 2006-04-05 2007-10-25 Denso Corp モールドパッケージの実装構造
JP2009141170A (ja) * 2007-12-07 2009-06-25 Fujitsu Component Ltd 基板のパッド構造
CN101568224B (zh) * 2008-04-22 2012-01-25 鸿富锦精密工业（深圳）有限公司 电路板及具有该电路板的电子装置
CN101656217B (zh) * 2008-08-18 2011-03-23 中芯国际集成电路制造(上海)有限公司 系统级封装的方法
JP5649788B2 (ja) * 2009-01-21 2015-01-07 富士通株式会社 プリント板、プリント板実装構造、およびプリント板実装方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1264169A (zh) * 1999-02-02 2000-08-23 三星电子株式会社 用于检测集成电路封装引脚焊接的装置和方法
CN102314009A (zh) * 2011-09-09 2012-01-11 深圳市华星光电技术有限公司 液晶显示模组及液晶显示面板

Also Published As

Publication number Publication date
JP2013168517A (ja) 2013-08-29
US20130206456A1 (en) 2013-08-15
JP6396633B2 (ja) 2018-09-26
CN103260346A (zh) 2013-08-21
US9113564B2 (en) 2015-08-18
KR20130094235A (ko) 2013-08-23

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